KR101638865B1 - Method of fabricating intaglio needle-shaped mold - Google Patents

Method of fabricating intaglio needle-shaped mold Download PDF

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Publication number
KR101638865B1
KR101638865B1 KR1020150146788A KR20150146788A KR101638865B1 KR 101638865 B1 KR101638865 B1 KR 101638865B1 KR 1020150146788 A KR1020150146788 A KR 1020150146788A KR 20150146788 A KR20150146788 A KR 20150146788A KR 101638865 B1 KR101638865 B1 KR 101638865B1
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KR
South Korea
Prior art keywords
mold
inner space
silicon
polymeric material
silicon substrate
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KR1020150146788A
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Korean (ko)
Inventor
김기남
김영수
이주범
이동욱
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한국과학기술원
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
    • B29C33/3842—Manufacturing moulds, e.g. shaping the mould surface by machining
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
    • B29C33/3807—Resin-bonded materials, e.g. inorganic particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
    • B29C33/3842—Manufacturing moulds, e.g. shaping the mould surface by machining
    • B29C33/3857—Manufacturing moulds, e.g. shaping the mould surface by machining by making impressions of one or more parts of models, e.g. shaped articles and including possible subsequent assembly of the parts
    • B29C33/3892—Preparation of the model, e.g. by assembling parts
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61M—DEVICES FOR INTRODUCING MEDIA INTO, OR ONTO, THE BODY; DEVICES FOR TRANSDUCING BODY MEDIA OR FOR TAKING MEDIA FROM THE BODY; DEVICES FOR PRODUCING OR ENDING SLEEP OR STUPOR
    • A61M37/00—Other apparatus for introducing media into the body; Percutany, i.e. introducing medicines into the body by diffusion through the skin
    • A61M37/0015—Other apparatus for introducing media into the body; Percutany, i.e. introducing medicines into the body by diffusion through the skin by using microneedles
    • A61M2037/0053—Methods for producing microneedles

Abstract

The present invention provides a method of manufacturing a mold having a microneedle shape in the shape of an obtuse angle, comprising a silicon substrate having a first inner space and a second inner space communicating with each other, wherein the first inner space and the second inner space have a lower The second internal space being connected to the first internal space and communicating with the exterior of the silicon substrate, the method comprising: a first step of providing a silicon mold; A second step of forming a relief replica mold realized by forming a polymer material layer on the silicon mold to fill the first inner space and the second inner space and separating the hard material from the silicon mold; And a third step of forming an engraved replica mold realized by forming a polymer material layer on the relief replica mold and separating the reinforcing replica mold from the relief replica mold after curing.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a method of fabricating intaglio needle-

The present invention relates to a method of manufacturing a needle-shaped mold, and more particularly, to a method of manufacturing a mold having a microneedle shape of a negative shape.

Conventionally, as a method of administering medicines or the like to the living body surface of a patient, that is, the surface of the skin or the mucous membrane, a method of applying mainly a liquid substance or a powdery substance has mostly been used. However, since the area where these medicines can be applied is limited to the surface of the skin, it is routinely experienced that the applied medicines peel off due to sweating, contact of foreign substances, etc., and effective administration of appropriate amounts of medicines and the like It was difficult.

In order to substitute for the application of a medicament against a living body surface, administration of a medicament in vivo by microneedles arranged at a predetermined density on a sheet body portion as a minute needle having a length of several hundreds of micrometers has been proposed.

The length of the microneedle is several hundred micrometers, so it is almost painless. Further, the microneedle portion is formed of a self-soluble material so that the human body will not be hindered even if the micronee needle remains in the skin when the sheet is removed from the skin.

Since the micro needle is inserted into the skin, the tip needs to be as sharp as possible. The micro needle is made by pouring the raw material of the needle into the manufactured stamp. Therefore, the bottom of the concave portion of the stamp (corresponding to the tip of the micro needle) into which the raw material flows should be a concave portion with a high degree of sharpness. However, there is a problem that it is not easy to form a recess having a high sharpness.

Published Patent Application No. 10-2004-0074167 (Aug. 23, 2004) Japanese Patent Application Laid-Open No. 10-2013-0058012 (Mar.

It is an object of the present invention to provide a method of manufacturing a needle-like needle-shaped mold having a concave portion with high sharpness. However, these problems are exemplary and do not limit the scope of the present invention.

A method of manufacturing a needle-like needle-shaped mold according to an aspect of the present invention is provided. The method of manufacturing an intaglio needle-shaped mold includes a silicon substrate having a first inner space and a second inner space communicated with each other, wherein the first inner space and the second inner space have a cross-sectional area And the second inner space is connected to the first inner space to communicate with the outside of the silicon substrate, the method comprising: a first step of providing a silicon mold; A second step of forming a relief replica mold realized by forming a first polymer material layer on the silicon mold to fill the first inner space and the second inner space, separating the first polymer material layer from the silicon mold after curing; And a third step of forming an engraved replica mold realized by forming a second polymer material layer on the embossing replica mold and separating the second polymer material layer from the relief replica mold after hardening.

In the method of manufacturing the intaglio-shaped needle-like mold, the first step includes forming a release surface treatment layer on the surface of the silicon mold including the sidewalls of the first inner space and the second inner space can do.

In the method of manufacturing the intaglio-shaped needle-like mold, the second step includes: injecting a first polymer material onto the silicon mold; Removing the first internal space and the air in the second internal space by holding the silicon mold in which the first polymer material is charged for a predetermined time in the vacuum chamber to remove the air from the first internal space and the second internal space, 1 < / RTI > polymer material to form the first polymeric material layer on the silicon mold; Curing the first polymeric material layer; And separating the cured first polymeric material layer from the silicon mold.

In the method of manufacturing the intaglio-shaped needle-like mold, the second step includes: injecting a first polymer material onto the silicon mold; The method may further include holding the first polymer material in the vacuum chamber for a predetermined time to remove air bubbles in the first polymer material.

Wherein the third step comprises maintaining the second polymeric material in the vacuum chamber for a predetermined time to remove air bubbles in the second polymeric material; Forming the second polymeric material layer by providing the second polymeric material on the embossed replica mold; Curing the second polymeric material layer; And separating the cured second polymeric material layer from the relief replica mold.

In the method of manufacturing an intaglio-shaped needle-like mold, the cross-sectional area of the first inner space and the second inner space do not increase at least as they go down, and the cross-sectional area of the second inner space may decrease as they go downward .

In the method of manufacturing the hollow-shaped needle-like mold, the first inner space may have a cylindrical shape, and the second inner space may have a horn shape having a sharp bottom end.

In the method of manufacturing the intaglio-shaped needle-like mold, the first step may include: preparing the silicon substrate; Forming a hard mask pattern on the silicon substrate; Etching the silicon substrate exposed to the hard mask pattern, comprising: a first step of etching the silicon substrate to form the first inner space in the silicon substrate; And etching the silicon substrate exposed to the hard mask pattern, wherein the silicon substrate is etched to form the second internal space at a lower portion of the first internal space, the second internal space having a cross- Wherein the step of first etching the silicon substrate and the step of secondarily etching the silicon substrate comprise at least one of the following conditions: a relative ratio of the etching gas, at least one of process pressure and source / May be different.

In the method of manufacturing the intaglio-shaped needle-like mold, the relative ratio of the SF 6 gas to the He gas and / or the relative ratio of the O 2 gas to SF 6 , as the relative ratio of the etching gas, The second etching step may be lower than the second etching step.

In the method of manufacturing the intaglio needle-shaped mold, the process pressure may be higher in the second etching step than in the first etching step.

In the method of manufacturing the intaglio needle-shaped mold, the source / bias power may be lower in the second etching step than in the first etching step.

According to an embodiment of the present invention as described above, it is possible to provide a method of manufacturing a negative-shaped needle-like mold having a concave portion with high sharpness. However, these problems are exemplary and do not limit the scope of the present invention.

Figs. 1A to 1H are sectional views sequentially illustrating a method of manufacturing a negative-shaped needle-like mold according to an embodiment of the present invention.
FIGS. 2A to 2D are photographs illustrating a process of sequentially forming a first polymer material layer on a silicon mold in a method of manufacturing a negative-shaped needle-like mold according to an embodiment of the present invention.
FIGS. 3A to 3K are cross-sectional views sequentially illustrating a method of manufacturing a silicon mold in a method of manufacturing a needle-shaped needle-shaped mold according to an embodiment of the present invention.
4 is an enlarged cross-sectional view of a concave portion of a silicon mold in a manufacturing method of a needle-like needle-shaped mold according to an embodiment of the present invention.
FIG. 5 is a photograph of a section of a silicon mold realized in a method of manufacturing a needle-shaped needle-shaped mold according to an embodiment of the present invention.
6 is a photograph of a cross section of a relief replica mold realized in a method of manufacturing a relief type needle-like mold according to an embodiment of the present invention.
FIG. 7 is a photograph of a cross section of an engraved replica mold realized in a method of manufacturing a needle-shaped needle-shaped mold according to an embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. It should be understood, however, that the invention is not limited to the disclosed embodiments, but may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, Is provided to fully inform the user. Also, at least some of the components may be exaggerated or reduced in size for convenience of explanation. Like numbers refer to like elements throughout the drawings.

It is to be understood that throughout the specification, when an element such as a layer or a region is referred to as being "on" another element, the element may be directly "on" It will be understood that there may be other intervening components. On the other hand, when an element is referred to as being "directly on" another element, it is understood that there are no other elements intervening therebetween.

Figs. 1A to 1H are sectional views sequentially illustrating a method of manufacturing a negative-shaped needle-like mold according to an embodiment of the present invention.

1A, there is shown a silicon mold 112 including a silicon substrate 12 having an internal space 26, wherein the lower portion of the internal space 26 has a region where the cross sectional area decreases. The silicone mold 112 can also be understood as a silicon micro needle stamp. The method of manufacturing the silicon mold 112 will be described later.

The cross-sectional area of the inner space 26 does not increase at least as it goes downward. For example, the cross-sectional area of the inner space 26 may gradually decrease toward the bottom. As another example, the inner space 26 may include an upper region where the cross-sectional area is constant and a lower region where the cross-sectional area gradually decreases.

The modified surface treatment layer 32 may be formed on the surface of the silicon mold 112 including the sidewalls of the inner space 26. The modified surface treatment layer 32 may include a thermal oxidation layer. In this case, although not shown in FIG. 1A, a thermal oxidation layer may be formed on the upper surface of the silicon mold 112 as well as on the lower surface. On the other hand, as another example, the release surface treatment layer 32 may be realized by forming a carbon polymer layer.

 1B to 1D, the first polymeric material layer 40 is formed on the silicon mold 112 so as to fill the internal space 26 of the silicon mold 112, and after the first polymeric material layer 40 is cured To form the embossed replica mold 140 implemented by separating from the silicon mold 112. That is, a polymer material such as resin is filled in the silicone mold 112 and cured by ultraviolet rays or heat. Then, a peeling off process is performed from the silicon mold 112 to form the embossing replica mold 140 . The embossed tip portion 42 of the embossing replica mold 140 corresponds to the inner space 26 formed in the silicon mold 112.

The material of the resin may comprise polydimethylsiloxane (PDMS). PDMS, which is a polymer resin, is a transparent inactive polymer, has very low surface energy, is easy to change its shape, and has hydrophobic properties as follows.

PDMS stably adheres to a relatively large substrate area, which is equally satisfactory for non-planar surfaces. And since PDMS has low interfacial free energy, adhesion with other polymers does not occur during molding. In addition, PDMS has homogeneous isotropic property and is very durable, so that degradation of properties does not occur even if cured for a very long time. The PDMS, which is an elastic body, is uniformly in contact with the surface of the silicon mold 112 and thus is excellent in adhesion. Further, since the surface energy is low, the adhesive force to the surface of the silicon mold 112 is small, and the silicon mold 112 can be easily separated from the surface. However, the material of the resin according to the embodiment of the present invention is not limited to PDMS, and any material that can be molded using a mold, has a property of being firmly adhered to the silicone mold 112 while being easily separated It is possible.

Meanwhile, in the modified embodiment of the present invention, in order to impart appropriate viscosity to the PDMS, it is possible to use a dissolved form using an organic solvent such as xylene or toluene, A material such as DMAP (dymethoxy phenyl acetophenone) may be used as a curing agent to perform polymerization.

FIGS. 2A to 2D are photographs illustrating a process of sequentially forming a first polymer material layer on a silicon mold in a method of manufacturing a negative-shaped needle-like mold according to an embodiment of the present invention.

Referring to FIG. 2A, a silicon mold (the wafer 112 in FIG. 1A, the wafer in FIG. 2A) may be fixed to a jig in a vacuum chamber connected to a vacuum pump.

Referring to FIG. 2B, when the first polymer material is injected into the silicon mold and the vacuum pump is turned on, the first polymer material 40 is coated on the silicon substrate 12 as shown in FIG. 1B , The air in the inner space 26 can not escape and is trapped. Failure to remove the air inside can cause problems such as breakage of the end of the needle and uniformity of the large area.

Referring to FIG. 2C, when the vacuum pump is operated and maintained for a predetermined time (for example, several tens of minutes), trapped air in the internal space 26 is released in a bubble form.

Referring to FIG. 2D, the configuration of FIG. 1C can be implemented as the first polymer material 40 fills the inner space 26 while the air in the inner space 26 is exhausted. Subsequently, the first polymer material layer 40 can be cured by ultraviolet or thermal methods.

On the other hand, before the silicon mold is fixed to the jig, the first polymer material 40 is left in the vacuum chamber for a predetermined time (for example, several tens of minutes) to remove the air of the first polymer material 40 itself, Lt; / RTI > In this case, the vacuum chamber used for removing the air of the first polymer material 40 itself and the vacuum chamber used for removing the air trapped in the inner space 26 may be the same, but need not be limited thereto , And may be different from each other in some cases.

1D and 1E, an engraved replica mold 150 implemented by forming and curing a second layer of polymeric material 50 on a relief replica mold 140 and separating from the relief replica mold 140 is formed do.

That is, a high molecular material such as resin is filled in the embossing replica mold 140 and cured by ultraviolet rays or heat, and then a peeling off process is performed from the embossing replica mold 140 to form the engraving replica mold 150 ) Can be formed. The material of the resin may comprise polydimethylsiloxane (PDMS). The inner space 52 of the engraved replica mold 150 corresponds to the inner space 26 formed in the silicon mold 112 and the embossed tip portion 42 of the embossed replica mold 140, respectively.

In order to remove air bubbles in the second polymeric material before the second polymeric material such as resin is applied to the embossing replica mold 140, the second polymeric material is introduced into the vacuum chamber for a predetermined time May be preceded.

The engraved replica mold 150 is a needle-like needle-like mold, which corresponds to a final engraved needle shape frame for forming a microneedle structure.

1F and 1 H, a microneedle structure 160 implemented by forming a material layer 60 comprising a medicament on an engraved replica mold 150 and separating it from the engraved replica mold 150 after curing, .

A method of manufacturing a needle-like needle-shaped mold according to an embodiment of the present invention has been described.

Generally, in the case of producing a primary mold using a silicon master, in order to secure the strength of the mold, it is generally made of metal by electroplating. However, when the depth is as deep as several hundreds 탆 m, , There is a problem in that it is difficult to remove the air bubbles inside, and there is a problem that it is difficult to secure the problem of breakage of the needle end due to the current applied during plating and uniformity of the 8 inch large area.

The technical idea of the present invention is a duplicating technique for mass production of stamps of a negative-shaped micro needle structure, which forms a micro needle structure with a negative shape through a semiconductor exposure and a dry etching process on a silicon wafer, and uses this as a master stamp. By using the master stamp of this engraved master stamp, it is possible to remove the air bubbles through the vacuum during the manufacturing process by manufacturing the first copying process through the spin coating method using the polyurethane solvent as the raw material, It is possible to manufacture a primary mold in which the uniformity of the needle shape and the thickness are maintained while maintaining a certain degree of strength. The microstructure of the embossed micro needle first embossed mold can be used to stamp the final embossed needle structure by secondary replication using polymer and resin. When the final replicated embossed needle stamp is filled with cosmetic raw materials and pharmaceutical raw materials, cosmetic and pharmaceutical products of micro needle structure can be manufactured for each raw material.

Hereinafter, a method of forming the silicon mold 112 provided to manufacture a needle-shaped needle-shaped mold will be described.

FIGS. 3A to 3K are sectional views sequentially illustrating a method of manufacturing a silicon micro needle stamp according to an embodiment of the present invention, and FIG. 4 is a cross-sectional view of a silicon micro needle stamp realized by a manufacturing method according to an embodiment of the present invention. Fig. 5 is a cross-sectional view illustrating the recessed portion of Fig.

Referring to FIG. 3A, after the silicon substrate 12 is prepared, a thermal oxidation process is performed on the surface of the silicon substrate 12 to form the thermal oxidation layer 22. The thickness of the thermal oxidation layer 22 may be, for example, about 1 micrometer.

Referring to FIGS. 3B and 3C, a photomask pattern 24 is formed on the thermally oxidized layer 22. The photomask pattern 24 may be formed by completely coating a photomask layer on the thermal oxidation layer 22 and then removing a predetermined portion by a photolithography process (exposure and etching process). Accordingly, the photomask pattern 24 includes an open space 25a corresponding to the predetermined portion, and a part of the thermal oxidation layer 22 can be exposed by the open space 25a.

Subsequently, the thermally oxidized layer 22 is formed by etching the thermally oxidized layer 22 exposed by the open space 25a using the photomask pattern 24 as an etching shielding film. The present inventors etched the thermal oxidation layer 22 using a process gas of CF 4 , CHF 3 , Ar, and O 2 while applying a capacitive coupled plasma (CCP) source using dual frequency (27 MHz / 2 MHz).

The photomask pattern 24 and thermal oxide layer pattern 22 thus implemented may function as a hard mask pattern for etching the silicon substrate 12 in a subsequent process.

3D and 4, the silicon substrate 12 exposed by the open space 25b of the hard mask pattern composed of the photomask pattern 24 and the thermal oxidation layer pattern 22 is etched to form the silicon substrate 12, Thereby forming a first internal space 26a.

The first internal space 26a may have a shape in which the cross-sectional area (the cross-sectional area cut in the transverse direction in the drawing) does not increase at least toward the bottom.

For example, the first internal space 26a may have a frustum shape in which the cross-sectional area gradually decreases from the upper portion of the silicon substrate 12 to the lower portion thereof. In this case, the angle formed between the side wall of the first inner space 26a and the horizontal plane (angle? Shown in FIG. 4) may be 85 degrees or more and less than 90 degrees.

In another example, the first internal space 26a may have a cylindrical cylinder shape having a constant transverse sectional area from the upper portion of the silicon substrate 12 to the lower portion thereof. In this case, the angle formed by the side wall of the first inner space 26a and the horizontal plane (angle? Shown in FIG. 4) may be 90 degrees.

Although the cross-sectional shape of the first internal space 26a has been assumed to be circular in the foregoing example, the embodiment of the present invention is not limited thereto and may have various cross-sectional shapes. For example, an elliptical, polygonal, It can have an irregular shape.

3E and 4, the exposed silicon substrate 12 is etched using the hard mask pattern composed of the photomask pattern 24 and the thermal oxidation layer pattern 22 to form a second inner space (not shown) in the silicon substrate 12, (26b). The second inner space 26b is characterized in that the cross sectional area thereof is narrower than the first inner space 26a.

The second inner space 26b communicating with the first inner space 26a may have a shape in which the cross-sectional area decreases as it goes downward. For example, the second inner space 26b may have a horn-like shape with a lower end. Here, the pointed end may include a case where the cross-sectional diameter of the end portion is, for example, 5 micrometers or less.

The inner space 26 in the silicon substrate 12 implemented by the present inventor has a diameter of 30 to 120 탆 in the first inner space 26a and an angle formed by the side wall of the second inner space 26b is an angle between 85 degrees and 90 degrees and the height h1 of the first inner space 26a and the height h1 of the second inner space 26a are between 23 degrees and 35 degrees, 26b is 50 占 퐉 to 700 占 퐉.

A step S1 of etching the silicon substrate 12 to form a first internal space 26a in the silicon substrate 12 and a step S2 of etching the silicon substrate 12 to form the internal space 26 having the above- (S2) of the second step of etching the silicon substrate 12 to form the second internal space 26b in the substrate 12 are set to be different from each other. For example, the relative ratio of the etching gas, the process pressure And source / bias power are set to be different from each other.

Specifically, as a relative ratio of the etching gas, the relative ratio of the SF 6 gas to the He gas and / or the relative ratio of the O 2 gas to the SF 6 gas is greater than the second etching rate (S2), the process pressure is higher in the second etching step (S2) than in the first etching step (S1) and / or when the source / bias power is higher in the second etching step It has been confirmed that the internal space 26 having the shape described above can be realized when the second etching step S2 is lower than the first etching step S1.

More specifically, the process conditions of the step S1 of firstly etching the silicon substrate 12 to form the first internal space 26a in the silicon substrate 12 are the same as the process conditions of the chuck ) Was set at 0 to 20 캜, and the process pressure was set at 30 to 65 mTorr. Further, the flow rate of the process gas was set to 450 sccm for He gas, 80 to 130 sccm for SF 6 gas, 40 to 130 sccm for O 2 gas, source / bias power of the inductive coupled plasma (ICP) And 20 to 50 W was applied to the lower part. Further, it has been confirmed that the angle? Formed by the side wall of the first inner space 26a and the horizontal plane can be controlled by the ratio of the O 2 gas as the process gas.

The process conditions of the second etching step S2 for secondarily etching the silicon substrate 12 so as to form the second internal space 26b in the silicon substrate 12 are the same as the process conditions of the chuck in which the silicon substrate 12 is mounted The temperature was set at 0 to 20 DEG C, and the process pressure was set at 90 to 100 mTorr. Further, the flow rate of the process gas was set to 450 sccm for the He gas, 60 to 110 sccm for the SF 6 gas and 40 sccm for the O 2 gas, and the source / bias power for the inductive coupled plasma (ICP) 9 to 13W was applied to the lower part.

The sidewall inclination of the second inner space 26b in the second etching step S2 of the second step of etching the silicon substrate 12 to form the second inner space 26b in the silicon substrate 12 can be kept constant and can be etched The amount of non-volatile etching by-products increases in the etch depth direction under certain conditions (temperature / pressure / gas ratio) of the etching mechanism, thereby increasing the sidewall passivation ratio of the sidewall and increasing the ion scattering Ion Scattering and differential charging of microstructures to maximize the trenching effect due to ion deflection and can be etched while maintaining the inclination. The etching process can be stopped at the point where the end of the second inner space 26b meets.

Since the above processes for etching the silicon substrate 12 are not a so-called BOSCH-type etching process, portions where the cross-sectional area of the internal space 26 is reduced and increased are not shown. That is, the cross-sectional area of the inner space 26 implemented by the above-described etching process does not increase at least at the lower portion. For example, the cross-sectional area may gradually decrease toward the lower portion. The first feature of the present invention provides a smooth implementation of a process of separating a mold composed of the resin from a silicone microneedle stamp after a resin or the like is applied and cured using a silicone microneedle stamp as a frame.

Referring to FIGS. 3F and 3G, a strip process and a cleaning process are performed to remove the photomask pattern 24, and further, an etching solution (for example, HF solution) is used The silicon micro needle stamp can be realized by removing the thermal oxidation layer pattern 22.

3H and 3I, a thermal oxidation layer 31 is formed and removed on the surface of the silicon micro needle stamp including the side wall of the inner space 26 constituting the silicon micro needle stamp, The surface roughness can be alleviated. For example, the thermal oxidation layer 31 is first formed on the silicon substrate 12 including the sidewalls of the inner space 26, and the thermal oxidation layer 31 is removed using an etching solution (for example, HF solution) The surface roughness of the side wall of the inner space 26 constituting the silicon micro needle stamp can be relaxed. The relaxation of the surface roughness may mean that the ruggedness of the surface is relaxed to further smoothness. It was confirmed that the surface roughness of the side wall forming the inner space 26 of the silicon substrate 12 was improved in the process of forming and removing the thermal oxidation layer 31.

3J or 3K, in order to smoothly perform the process of separating the mold made of the resin from the silicon micro needle stamp after coating the resin with the silicone micro needle stamp as a frame and curing the resin, (32, 33) can be formed. 3J, the release surface treatment layer can be realized by forming the thermal oxidation layer 32 on the surface of the silicon substrate 12 including the inner space 26. [ Referring to FIG. 3K, a release surface treatment layer can be realized by forming a C-polymer layer 33 on the upper surface of the silicon substrate 12 including the inner space 26.

This second feature provides a smooth implementation of the process of separating the mold composed of the resin from the silicone microneedle stamp after application of the resin or the like with the silicone microneedle stamp as a frame and curing. The micro needle can be formed by injecting a drug that can be put into the living body onto the mold made of the resin.

On the other hand, the first method for alleviating the surface roughness described with reference to Figs. 3H and 3i and the second method for introducing the modified surface treatment layer described with reference to Figs. 3J and / or 3K in order to implement the silicon micro needle stamp However, in the modified example, any one of the methods may be performed. For example, only one of the first method and the second method may be performed.

 FIG. 5 is a photograph of a cross section of a silicon mold realized in a method of manufacturing a needle-shaped needle-shaped mold according to an embodiment of the present invention, and FIG. 6 is a cross- FIG. 7 is a photograph of a cross-section of an engraved replica mold realized in a method of manufacturing a needle-shaped mold according to an embodiment of the present invention . In FIGS. 5 to 7, (a) on the left side is a relatively low magnification photograph and (b) on the right side is a relatively high magnification photograph. 5 to 7, the molds actually realized by the above-described manufacturing method can be confirmed. In particular, the shape of the inner space shown in Figs. 5 and 7 is almost the same as the shape described with reference to Fig. 4 can confirm.

While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the invention. Accordingly, the true scope of the present invention should be determined by the technical idea of the appended claims.

12: silicon substrate
22: thermal oxide layer pattern
24: Photomask pattern
26a: first inner space
26b: the second inner space
32: Release type surface treatment layer
112: Silicone mold
140: Embossed Replacement Mold
150: engraving mold
160: Micro needle structure

Claims (11)

Wherein the first inner space and the second inner space do not increase in cross-sectional area as they go downward, and the second inner space has a first inner space and a second inner space communicated with each other, And a silicon mold connected to the inner space to communicate with the outside of the silicon substrate,
Preparing a silicon substrate;
Forming a hard mask pattern on the silicon substrate;
Etching the silicon substrate exposed in the hard mask pattern, the silicon substrate is patterned to have a process pressure of 30 to 65 mTorr, a flow rate of He gas of 450 sccm, a flow rate of SF 6 gas A first etching step in which the source / bias power of the inductively coupled plasma (ICP) is applied in the range of 450 to 600 W in the upper portion and 20 to 50 W in the lower portion, the flow rate of the O 2 gas is 40 to 130 sccm, ; And
Etching the silicon substrate exposed in the hard mask pattern so that the silicon substrate is etched to form a second inner space having a smaller cross sectional area than the first inner space at a lower portion of the first inner space, The flow rate of the SF 6 gas is 60 to 110 sccm, the flow rate of the O 2 gas is 40 to 50 sccm, the source / bias power of the inductively coupled plasma (ICP) is 350 to 500 W, Lt; RTI ID = 0.0 > 13W, < / RTI >
Was lower in the step of the second etch than the steps of the relative ratio of the O 2 gas etching the first car for the relative ratio and said SF 6 gas of the SF 6 gas to the He gas, the process pressure Wherein the source / bias power of the inductively coupled plasma (ICP) is higher in the second etching step than in the first etching step, and the source / Performing a first and a second etching at lower conditions to provide the silicon mold;
A second step of forming a relief replica mold realized by forming a first polymer material layer on the silicon mold to fill the first inner space and the second inner space, separating the first polymer material layer from the silicon mold after curing; And
And a third step of forming an engraved replica mold realized by forming a second polymer material layer on the embossing replica mold and separating it from the relief replica mold after hardening. The method according to claim 1,
Wherein the first step comprises forming a release surface treatment layer on the surface of the silicon mold including the sidewalls of the first inner space and the second inner space. The method according to claim 1,
The second step
Introducing a first polymeric material onto the silicon mold;
Removing the first internal space and the air in the second internal space by holding the silicon mold in which the first polymer material is charged for a predetermined time in the vacuum chamber to remove the air from the first internal space and the second internal space, 1 < / RTI > polymer material to form the first polymeric material layer on the silicon mold;
Curing the first polymeric material layer; And
Separating the cured first polymeric material layer from the silicon mold;
Wherein the needle-like shaped mold is formed of a resin. The method of claim 3,
The second step comprises:
Introducing a first polymeric material onto the silicon mold; Further comprising: maintaining the first polymeric material in the vacuum chamber for a predetermined period of time to remove air bubbles in the first polymeric material. The method according to claim 1,
In the third step,
Maintaining the second polymeric material in the vacuum chamber for a predetermined time to remove air bubbles in the second polymeric material;
Forming the second polymeric material layer by providing the second polymeric material on the embossed replica mold;
Curing the second polymeric material layer; And
Separating the cured second polymeric material layer from the relief replica mold;
Wherein the needle-like shaped mold is formed of a resin. The method according to claim 1,
Wherein the first internal space and the second internal space have a transverse sectional area that does not increase at least to the lower portion while the second internal space has a reduced transverse sectional area toward the lower portion. The method according to claim 6,
Wherein the first inner space has a cylindrical shape and the second inner space has a horn shape with a lower end portion having a sharp horn shape. delete delete delete delete
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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20040074167A (en) 2003-02-17 2004-08-23 학교법인 포항공과대학교 Method for preparing polymer micro needle array
JP2008029386A (en) * 2006-07-26 2008-02-14 Toppan Printing Co Ltd Method for manufacturing plate for needle-like body and method for manufacturing needle-like body
JP2008086360A (en) * 2006-09-29 2008-04-17 Toppan Printing Co Ltd Method of manufacturing needle-like body and needle-like body
KR20130058012A (en) 2010-04-28 2013-06-03 킴벌리-클라크 월드와이드, 인크. Injection molded microneedle array and method for forming the microneedle array

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20040074167A (en) 2003-02-17 2004-08-23 학교법인 포항공과대학교 Method for preparing polymer micro needle array
JP2008029386A (en) * 2006-07-26 2008-02-14 Toppan Printing Co Ltd Method for manufacturing plate for needle-like body and method for manufacturing needle-like body
JP2008086360A (en) * 2006-09-29 2008-04-17 Toppan Printing Co Ltd Method of manufacturing needle-like body and needle-like body
KR20130058012A (en) 2010-04-28 2013-06-03 킴벌리-클라크 월드와이드, 인크. Injection molded microneedle array and method for forming the microneedle array

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