KR101626890B1 - Apparatus and method for cutting tempered glass - Google Patents

Apparatus and method for cutting tempered glass Download PDF

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Publication number
KR101626890B1
KR101626890B1 KR1020140124297A KR20140124297A KR101626890B1 KR 101626890 B1 KR101626890 B1 KR 101626890B1 KR 1020140124297 A KR1020140124297 A KR 1020140124297A KR 20140124297 A KR20140124297 A KR 20140124297A KR 101626890 B1 KR101626890 B1 KR 101626890B1
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South Korea
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tempered glass
unit
laser beam
cutting
thermoelectric element
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KR1020140124297A
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Korean (ko)
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KR20160033841A (en
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박용규
신석호
이대영
신재영
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주식회사 필옵틱스
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Laser Beam Processing (AREA)
  • Thermal Sciences (AREA)

Abstract

The present invention relates to a tempered glass cutting apparatus and a cutting method, and more particularly, to a laser cutting apparatus and a cutting method, A scanner unit for irradiating a laser beam incident from the laser light source onto a tempered glass; A braking unit for applying thermal stress to the tempered glass by cooling or heating the tempered glass in contact with the tempered glass formed with the cutting lines made up of a plurality of fine through holes; And a controller for controlling operations of the laser light source unit, the scanner unit, and the braking unit.

Description

TECHNICAL FIELD [0001] The present invention relates to a tempered glass cutting apparatus,

The present invention relates to a tempered glass cutting apparatus and a cutting method. More particularly, the present invention relates to a tempered glass cutting apparatus and a cutting method using a laser beam to form a cutting line comprising a plurality of through holes in a tempered glass, To a tempered glass cutting apparatus and a cutting method for cutting tempered glass by separating cutting lines.

 Due to the rapid spread of smart phones, the use of touch screen panels centering on mobile displays has been rapidly expanding, and such touch screen panels have required high optical transparency and mechanical durability And the tempered glass is used as a cover glass or a cover window.

Toughened glass is produced by a physical strengthening method, commonly referred to as air-cooled reinforcement, applied to automotive safety glass, or by chemical strengthening methods, which can be usefully applied to sheet metal having a complex shape or thickness of about 2 mm or less . This chemical strengthening is a technique for improving the strength and hardness of glass by exchanging alkali ion (mainly Na ion) having a small ionic radius present inside the glass with a large alkali ion (mainly K ion) under a predetermined condition.

A compressive stress layer is formed on the surface of the glass by chemical strengthening and a tensile stress or a central tension layer is formed in the inside by reaction. The bending strength is increased by the high compressive stress of the surface, And the mechanical strength is increased.

On the other hand, tempered glass is difficult to mechanically cut and shape after reinforcement due to its characteristics and lack of processing technology, and is manufactured after cutting and processing the glass plate before strengthening and then strengthening. However, such a method has disadvantages in that it has a high production cost such as labor costs due to a large number of manual processes, and the productivity is low due to high breakage rate of semi-finished products. Moreover, since the size of the mobile display is getting larger recently, the importance of the production yield is increasing, and it is becoming more difficult to apply such a cutting and post-processing strengthening method to the mass production process of the product.

Mechanical glass cutting method, mechanical cutting method, and laser cutting method are used. The mechanical cutting method uses a diamond wheel or a sandblaster, and the wet cutting method is used as a chemical cutting method.

In the mechanical cutting method, fine cracks and particles are generated on the cut surface when tempered glass is cut. Since the chemical cutting method uses chemicals, environmental problems occur and the processing time is relatively long, . In addition, the method of cutting the laser beam by forming an initial crack, which is a conventional laser cutting method, by physically applying a shock to the scribing processing portion using a mechanical cutting device, that is, a braking device after spreading the crack by scribing the laser beam, There is a problem that product yield is lowered due to a problem that the cutting direction is bent due to the self stress of the glass substrate.

FIG. 1 is a schematic view for explaining a conventional tempering glass cutting method using a laser. Referring to FIG. 1, in order to cut a glass or tempered glass substrate using a conventional general laser, an initial crack generator 10 is first installed at a portion where cutting of the glass or tempered glass substrate 20 to be cut is started To form an initial crack 50.

After the initial crack 50 is formed at the portion where the tempered glass substrate 20 starts to be cut as described above, the glass substrate 20 is heated by using a heating optical mechanism (not shown) The laser beam 11 is sequentially irradiated from the portion of the initial crack 50 where the cutting of the tempered glass substrate 20 is started to the portion of the tempered glass substrate 20 where the cutting of the tempered glass substrate 20 is finished, The scribing line 13 is sequentially formed from the crack 50 to the portion where the cutting of the tempered glass substrate 20 is finished. The scribing line 13 is sequentially formed from the initial crack 200 where the cutting of the tempered glass substrate 20 is started to the end of cutting of the tempered glass substrate 20 as described above, Is cooled sequentially along the scribing line (13) heated by the laser beam (11) using a quenching nozzle (12) from the crack (50) portion to the end of cutting of the tempered glass substrate A material is injected and the laser beam 11 is irradiated to cool a portion where the scribing line 13 is formed to form a crack in the tempered glass substrate 20 along the scribing line 13, (20).

However, in the conventional method for cutting a tempered glass substrate, the scribing line 13 is sequentially formed from the initial crack 50 of the tempered glass substrate 20 to the end of cutting, It is difficult to propagate a crack by a desired length in the case of cutting the tempered glass and it is difficult to keep the crack propagation direction in a desired direction .

Korean Patent No. 10-1258403

SUMMARY OF THE INVENTION The present invention has been made to overcome the above-described problems of the prior art, and it is an object of the present invention to provide a method of manufacturing a tempered glass by forming a cutting line comprising a plurality of through holes in a tempered glass using a laser beam, And to provide a tempered glass cutting apparatus and a cutting method for cutting a tempered glass by separating cutting lines by applying thermal stress.

According to an exemplary embodiment of the present invention, there is provided a laser processing apparatus comprising: a laser light source unit for generating and outputting a laser beam; A scanner unit for irradiating a laser beam incident from the laser light source onto a tempered glass; A braking unit for applying thermal stress to the tempered glass by cooling or heating the tempered glass in contact with the tempered glass formed with the cutting lines made up of a plurality of fine through holes; And a control unit for controlling operations of the laser light source unit, the scanner unit, and the braking unit.

The laser light source unit and the scanner unit intermittently irradiate the laser beam along a line along which the cell is to be cut in the tempered glass according to a control signal of the control unit to form a plurality of micro through holes to form a cut line in the tempered glass.

Each of the fine through-holes is formed to be spaced apart from each other by a predetermined distance.

The laser light source unit generates and outputs an ultrahigh-frequency pulse laser beam or a microwave pulse laser beam.

A pick-up unit for picking up the cells separated along the cutting line; And a transfer unit for transferring the picked-up cell.

The braking unit includes a thermoelectric element unit for converting electrical energy into heat energy; And a plate unit for providing the space in which the thermoelectric element unit is to be disposed and supporting the thermoelectric element unit.

The braking unit further includes an up / down unit connected to the plate unit and driving the plate unit to move up or down on the stage.

According to another aspect of the present invention, Irradiating a laser beam along a line along which the substrate is to be cut on the tempered glass; Forming a cutting line made up of a plurality of fine through-holes; Applying thermal stress to the tempered glass through a breaking portion comprised of a thermoelectric element unit; There is provided a tempered glass cutting method comprising the steps of: picking up a cell separated along a cutting line by using a pick-up unit, and then transporting the picked-up glass.

The step of irradiating the laser beam includes intermittently irradiating the microwave pulse laser beam or the microwave pulsed laser beam along a line along which the cell is to be cut.

The step of applying thermal stress to the tempered glass through the braking part includes contacting the tempered glass with a breaking part including a plurality of thermoelectric element units and then cooling the tempered glass using the thermoelectric element.

The step of applying thermal stress to the tempered glass through the braking part includes contacting the tempered glass with a breaking part including a plurality of thermoelectric element units, and then heating the tempered glass using the thermoelectric element.

As in the present invention, after a cutting line composed of a plurality of through holes is formed in a tempered glass using a laser beam, thermal stress is applied to the tempered glass by using a thermoelectric element to separate the cut lines and cut the tempered glass, The quality of the tempered glass cut surface is improved, and the effect of reducing the tempered glass cut time can be obtained.

FIG. 1 is a schematic view for explaining a conventional tempering glass cutting method using a laser.
2 is a schematic functional block diagram of a tempered glass cutting apparatus according to an embodiment of the present invention.
3 is a schematic functional block diagram of the braking unit shown in Fig.
4 is a schematic configuration diagram of the thermoelectric element unit.
5A to 9 are views illustrating a tempered glass cutting process using a tempered glass cutting apparatus according to an embodiment of the present invention.
10 is a flowchart illustrating a tempered glass cutting method according to an embodiment of the present invention.
11 is a flowchart illustrating a tempered glass cutting method according to another embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Fig. 2 is a schematic functional block diagram of a tempered glass cutting apparatus according to an embodiment of the present invention, Fig. 3 is a schematic functional block diagram of the breaking portion shown in Fig. 2, Fig. 4 is a schematic configuration diagram of the thermoelectric element unit to be.

2, the tempered glass cutting apparatus according to the present embodiment includes a laser light source unit 100, a scanner unit 200, a stage 300, a breaking unit 400, a pickup unit 500, a transfer unit 600, And a control unit 700.

The laser light source unit 100 generates and outputs a laser beam. The laser light source unit 100 according to the present embodiment generates a pulsed laser beam, and preferably generates and outputs a microwave pulse laser beam or an ultrashort or ultrafast pulse laser beam. At this time, the microwave pulsed laser may be a picosecond (ps) laser such as Nd: YVO4 and a femtosecond (fs) laser such as Ti: Sapphire laser (wavelength 820 nm).

The scanner unit 200 irradiates the laser beam incident from the laser light source unit 100 along the line along which the cell is to be cut, on the tempered glass loaded on the stage.

The scanner unit 200 adjusts the vertical displacement and the horizontal displacement of the laser beam incident from the laser light source unit 100 and reflects the laser light onto the reinforced glass in a desired pattern shape. At this time, the scanner unit 200 is driven along the line along which the material is to be cut on the tempered glass according to the control signal of the control unit.

The stage 300 performs the function of supporting the tempered glass.

The laser light source unit 100 and the scanner unit 200 intermittently irradiate a laser beam along a line along which the cell is to be cut in the tempered glass according to a control signal of the control unit to form a plurality of micro through holes to form a cut line in the tempered glass do. At this time, the fine through-holes are spaced apart from each other by a predetermined distance.

The breaking portion 400 functions to apply thermal stress to the tempered glass by cooling or heating the tempered glass in contact with the tempered glass having a cut line formed of a plurality of fine through holes. The thermal stress applied to the tempered glass through the braking portion 400 separates the cells along the cutting line.

The pickup unit 500 performs a function of picking up the separated cells.

The transfer unit 600 performs a function of transferring the picked-up cells.

The control unit 700 controls operations of the laser light source unit 100, the scanner unit 200, the stage 300, the braking unit 400, the pickup unit 500, and the transfer unit 600.

Referring to FIGS. 3 and 4, the braking unit 400 includes a plate unit 410, a thermoelectric element unit 420, and an up / down unit 430.

The plate unit 410 provides a space in which the thermoelectric element unit 420 is disposed and supports the thermoelectric element unit 420. The plate unit 410 is disposed on the stage 300 and functions to raise or lower the stage 300 via the lifting unit 430 to contact or separate the tempered glass loaded on the stage 300 .

The thermoelectric element unit 420 functions to convert electric energy into heat energy. When a DC voltage is applied to both ends of two different elements, heat is absorbed from one side according to the direction of current, and Peltier ) Effect.

A plurality of the thermoelectric element units 420 are disposed on the plate unit 410, and the plate unit 410 functions to uniformly cool or heat the tempered glass.

The thermoelectric element unit 420 constitutes a PN junction composed of a p-type semiconductor 421 and an n-type semiconductor 422. An electrical conduction plate 423 is formed on the upper and lower sides of the semiconductor, A ceramic plate 424 is formed on the upper part, and power is supplied through the power applying part 425.

As in the present invention, a plurality of thermoelectric element units are provided on a plate unit, and the plate unit is cooled or heated by the heat or heat generating operation of the thermoelectric element unit, and the cooled or heated plate unit is brought into contact with the tempered glass Cooling or heating the glass can provide more uniform thermal stress to the tempered glass, which cleans the separation surface of the cell along the cutting line and improves the tempered glass cutting quality.

5A to 9 are views illustrating a tempered glass cutting process using a tempered glass cutting apparatus according to an embodiment of the present invention.

Figs. 5A to 5C show a process of forming a cutting line composed of a plurality of fine through-holes by irradiating a laser beam onto a tempered glass loaded on a stage along a line along which a cell is to be cut.

Referring to Figs. 5A to 5C, tempered glass 900 is loaded on a stage 300. Fig. The tempered glass 900 is composed of an inner extension layer 920 and a surface compression layer 910 formed at the top and bottom of the inner extension layer. The tempered glass substrate 900 is chemically reinforced by an ion-exchange process to produce a surface compressive layer 910 and an inner elongation layer 920. Such glass substrates include, but are not limited to, soda lime silicate glass including ion-exchanged borosilicate, aluminosilicate glass and aluminoborosilicate glass, borosilicate glass, aluminosilicate glass, and aluminoborosilicate glass Can be formed from various glass compositions. The tempered glass substrate 900 includes two surface compression layers 910 and an inner extension layer 920 therebetween. The surface compression layer 910 is maintained in a compressive stress state that provides high strength to the tempered glass substrate 900. The inner elongate layer 920 is under tensile stress to compensate the compressive stress of the surface compressive layer so as to maintain a balance of forces with each other so that the tempered glass substrate 900 is not broken.

The laser light source unit 100 and the scanner unit 200 intermittently irradiate the laser beam along the line along which the substrate is to be cut PL of the tempered glass according to the control signal of the control unit. At this time, the laser beam irradiates a microwave or microwave pulse laser beam.

As a result, a plurality of micro-through-holes h are formed along the line along which the cells are to be cut PL, and the micro-via-holes h are spaced apart from each other by a predetermined distance. The plurality of micro through-holes form a cutting line CL.

6 is a view showing a state in which a cutting line composed of a plurality of fine through holes is formed in tempered glass loaded on a stage.

7 is a view illustrating a process of applying thermal stress to the tempered glass using a braking unit.

7, the plate unit 410 on which the thermoelectric element unit 420 is disposed is lowered through the ascending / descending unit 430. As shown in FIG. The thermoelectric element unit 420 operates to heat or heat the plate unit 410 to cool or generate heat. In the case of this embodiment, the thermoelectric element unit 420 performs the heat absorbing operation and cools the plate unit 410. [

The lowered plate unit 410 is brought into contact with the tempered glass having the cutting line formed therein, and the tempered glass is also cooled by the plate unit 410 cooled by the thermoelectric element unit 420. As a result, the cells are separated along the cutting line by the thermal stress applied to the tempered glass.

FIG. 8 is a view illustrating a process of picking up a cut-off cell, and FIG. 9 is a diagram illustrating a process of transferring a picked-up cell.

Referring to FIGS. 8 and 9, the pick-up unit 500 descends to pick up the separated cells, and is transported by a transport unit (not shown).

10 is a flowchart illustrating a tempered glass cutting method according to an embodiment of the present invention.

Referring to FIG. 10, a tempered glass cutting method according to an embodiment of the present invention will be described. First, a tempered glass is prepared (S110).

A laser beam is irradiated along the line along which the substrate should be cut on the tempered glass (S120). The laser beam is intermittently irradiated along the line along which the cell is to be cut. At this time, the laser beam irradiates a microwave or microwave pulse laser beam.

A cutting line composed of a plurality of fine through holes is formed (S130). At this time, the adjacent through holes are spaced apart from each other by a predetermined distance.

After the cutting line is formed, a process of cooling the tempered glass through the braking unit constituted by the thermoelectric element units is performed (S140). After contacting the tempered glass with a breaking portion comprising a plurality of thermoelectric element units, the tempered glass is uniformly cooled using a thermoelectric element.

The thermal stress transferred to the tempered glass through the cooling of the thermoelectric element unit causes the cell to be separated along the cutting line (S150).

Then, the separated cells are picked up using the pick-up unit and then transported using the transport unit (S160).

11 is a flowchart illustrating a tempered glass cutting method according to another embodiment of the present invention.

Referring to FIG. 11, a tempered glass cutting method according to an embodiment of the present invention will be described. First, a tempered glass is prepared (S210).

A laser beam is irradiated along the line along which the substrate is to be cut on the tempered glass (S220). The laser beam is intermittently irradiated along the line along which the cell is to be cut. At this time, the laser beam irradiates a microwave or microwave pulse laser beam.

A cutting line composed of a plurality of fine through holes is formed (S230). At this time, the adjacent through holes are spaced apart from each other by a predetermined distance.

After the cutting line is formed, a process of heating the tempered glass through the braking unit constituted by the thermoelectric conversion unit is performed (S240). After contacting the tempered glass with a breaking portion comprising a plurality of thermoelectric element units, the tempered glass is uniformly heated using a thermoelectric element.

The thermal stress transferred to the tempered glass through the heating of the thermoelectric element unit causes the cell to be separated along the cutting line (S250).

Then, the separated cells are picked up using the pick-up unit and then transported using the transport unit (S260).

It is to be understood that the present invention is not limited to the above-described embodiment, and that various modifications and variations of the present invention are possible in light of the above teachings. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

100: laser light source part
200: scanner part
300: stage
400: breaking portion
410: Plate unit
420: thermoelectric element unit
430: Up / down unit
500: Pickup unit
600:
700:

Claims (11)

In a tempered glass cutting apparatus,
A laser light source unit for generating and outputting a laser beam;
A scanner unit for irradiating a laser beam incident from the laser light source onto a tempered glass;
A braking unit for applying thermal stress to the tempered glass by cooling or heating the tempered glass in contact with the tempered glass formed with the cutting lines made up of a plurality of fine through holes;
A pick-up unit for picking up the cells separated along the cutting line;
A transfer unit for transferring the picked-up cells; And
And a controller for controlling operations of the laser light source unit, the scanner unit, and the braking unit.
The method according to claim 1,
Wherein the laser light source unit and the scanner unit intermittently irradiate the laser beam along a line along which the cell is to be cut by the laser beam according to a control signal of the control unit to form a plurality of micro through holes to form a cut line in the tempered glass Tempered glass cutting device.
3. The method of claim 2,
And the fine through-holes are spaced apart from each other by a predetermined distance.
3. The method of claim 2,
Wherein the laser light source unit generates and outputs a microwave pulse laser beam or microwave pulse laser beam.
delete The method according to claim 1,
The braking unit includes:
A thermoelectric element unit for converting electrical energy into heat energy; And
And a plate unit for providing a space in which the thermoelectric element unit is to be disposed, and for supporting the thermoelectric element unit.
The method according to claim 6,
The braking unit includes:
Further comprising an elevating and lowering unit connected to the plate unit and driving the plate unit to move up or down on the stage.
A tempered glass cutting method using the tempered glass cutting apparatus according to any one of claims 1, 2, 3, 4, 6, and 7,
Preparing a tempered glass;
Irradiating a laser beam along a line along which the substrate is to be cut on the tempered glass;
Forming a cutting line made up of a plurality of fine through-holes;
Applying thermal stress to the tempered glass through a breaking portion comprised of a thermoelectric element unit;
And picking up the cells separated along the cutting line using the pickup unit, and then transferring the cells.
9. The method of claim 8,
Wherein the step of irradiating the laser beam comprises:
Intermittently irradiating the microwave pulse laser beam or the microwave pulse laser beam along a line along which the cell is to be cut.
9. The method of claim 8,
Wherein the step of applying thermal stress to the tempered glass through the braking step comprises:
And cooling the tempered glass using a thermoelectric element after contacting the tempered glass with a breaking portion comprising a plurality of thermoelectric element units.
9. The method of claim 8,
Wherein the step of applying thermal stress to the tempered glass through the braking step comprises:
And heating the tempered glass using a thermoelectric element after contacting the tempered glass with a breaking portion comprising a plurality of thermoelectric element units.
KR1020140124297A 2014-09-18 2014-09-18 Apparatus and method for cutting tempered glass KR101626890B1 (en)

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003238180A (en) * 2002-02-14 2003-08-27 Nippon Electric Glass Co Ltd Dividing method of work
JP2008168304A (en) * 2007-01-09 2008-07-24 Murata Mfg Co Ltd Laser cutting method

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101130702B1 (en) * 2009-08-17 2012-04-02 한양대학교 산학협력단 Device for cutting glass plate using thermal stresses and method therefor
KR101258403B1 (en) 2011-12-09 2013-04-30 로체 시스템즈(주) Method for cutting tempered glass substrate
KR20140022983A (en) * 2012-08-14 2014-02-26 (주)하드램 Laser cutting apparatus and method using laser beam absorption unit

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003238180A (en) * 2002-02-14 2003-08-27 Nippon Electric Glass Co Ltd Dividing method of work
JP2008168304A (en) * 2007-01-09 2008-07-24 Murata Mfg Co Ltd Laser cutting method

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