KR101610308B1 - Method of manufacturing a valve plate for compressor using laser - Google Patents

Abstract

A method of manufacturing a valve plate for partitioning a suction chamber, a discharge chamber, and a cylinder, comprising the steps of: forming at least one suction port and at least one discharge port in the plate; And the first buffer groove is formed in the peripheral portion of each suction port where the lead portion of the first buffer groove abuts.
In addition, the laser processing may be performed by a scanning method or an objective method.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a valve plate using a laser,

The present invention relates to a method of manufacturing a valve plate for a compressor, and more particularly, to a suction port and a surface treatment method around a discharge port of a valve plate using a laser.

In general, a piston type compressor such as an inclined plate type compressor is formed by partitioning a cylinder, a suction chamber, and a discharge chamber with a valve plate interposed therebetween. A suction port is provided at a position facing the suction chamber in the valve plate, And discharge ports are respectively formed through the discharge ports. A suction valve is disposed on the cylinder-side surface of the valve plate, and a discharge valve is disposed on the suction chamber and the discharging chamber-side surface, respectively. The suction valve has a suction lead portion at a position corresponding to the suction port, And has a discharge lead portion at the position.

This is explained in more detail as follows.

1 is a view showing a configuration of a variable valve actuated variable displacement compressor equipped with a conventional valve plate.

1, the inclined plate type variable displacement compressor is fastened by the bolts 4 in a state where the front housing 1 and the rear housing 2 are joined to each other through the gasket 3, (5) is formed. A valve plate 8 and a valve plate 9 are formed in the rear housing 2 so as to be joined to the step 6, Is inserted. The suction chamber 12 and the discharge chamber 13 are partitioned by the partition 14 between the retainer forming plate 7 and the rear end wall 11 of the rear housing 2.

A cylinder 15 is fitted in the rear housing 2 so as to be joined to the valve-forming plate 10 and the rotary shaft 16 is rotatably supported on the cylinder 15 and the front housing 1 . One end of the rotary shaft 16 protrudes outward from the front housing 1 and is connected to a rotation drive source (not shown) such as an engine or a motor of the vehicle. A swash plate 18 is provided in the front housing 1 so that the rotary support 17 is fixed to the rotary shaft 16 and is engaged with the rotary support 17. [ The guide pin 19 protruding from the swash plate 18 is slidable in the guide hole 20 formed in the rotary support 17 in a state in which the swash plate 18 passes through the through hole formed at the center of the swash plate 18 And integrally rotates together with the rotation shaft 16 by the linkage of the guide pin 19 and the guide hole 20 and at the same time slidably and slidably movably in the axial direction of the rotation shaft 16 .

A plurality of cylinder bores 21 are arranged in the cylinder 15 around the rotary shaft 16 and a piston 22 is slidably received in each cylinder bore 21. Each piston 22 is engaged with the outer peripheral portion of the swash plate 18 through a shoe 23. When the swash plate 18 rotates together with the rotary shaft 16, (21) in the axial direction of the rotating shaft (16).

The refrigerant in the suction chamber 12 is sucked from the suction port 24 of the valve plate 9 by the return motion of the piston 22, that is, the retraction operation in the cylinder bore 21, And then flows into the cylinder bore 21. As shown in FIG. The refrigerant is discharged from the discharge port 25 of the valve plate 9 by the advance motion of the piston 22 in the cylinder bore 21 The lead portion is pushed and ejected to the discharge chamber 13. [ At this time, the discharge lead portion of the valve-forming plate 8 abuts against the retainer 26 of the retainer forming plate 7, thereby regulating the opening degree.

The discharge chamber 13 is communicated with the control pressure chamber 29 formed inside the front housing 1 through the passage 27 and the capacity control valve 28 and the control pressure chamber 29 is communicated with the control chamber 29 through the passage 30 And communicates with the suction chamber 12. When the capacity control valve 28 is opened, the refrigerant in the discharge chamber 13 flows into the control pressure chamber 29 through the passage 27 and the capacity control valve 28, . Incidentally, the inclination angle of the swash plate 18 is changed by the pressure in the control pressure chamber 29, and decreases when the pressure in the control pressure chamber 29 increases, and increases when the pressure in the control pressure chamber 29 decreases. That is, the inclination angle of the swash plate 18 is controlled by the operation of the capacity control valve 28. [

FIG. 2 shows a case in which seven cylinders bores 21 and seven pistons 22 are provided in the compressor of FIG. 1, and as shown in FIG. 2, Seven suction ports 24 are formed at intervals and seven discharge ports 25 are formed on the outside of these suction ports 24 at equal intervals.

At this time, when the valve plate 9 is formed, it is formed through press working as disclosed in Korean Patent No. 10-0536790. 3, the punch mold 43 having the front end face 42 formed in a lattice-like concavo-convex shape is set on the press machine 41, and the punch mold 43 is placed on the surface of the valve plate 9 And pressing the convexo-concave shape of the leading end face 42 is carried out.

The pressing method of FIG. 3 is advantageous in that, as compared with the existing shot blast method, there is no occurrence of cutting particles and no short particles are used, so that the foreign matter remains on the surface of the valve plate.

However, even in the case of such a pressing method, the ceramic ball is rubbed with high pressure to strike the surface.

Accordingly, since the pressing method requires manual operation, there is a great risk of being exposed to the risk of damage to the body during the work process, and there is a limit in productivity due to manual work.

Further, in the case of press working, there is a limit in machining holes having sharp shapes in hole machining, and press molds are fixed. Therefore, in order to adjust the depth, shape and arrangement of holes, press molds must be replaced whenever necessary. have.

Korea Patent No. 10-0536790

SUMMARY OF THE INVENTION It is an object of the present invention to provide a method of forming holes or grooves of a desired shape on a disk surface of a valve plate through laser processing, and a depth or arrangement thereof.

To this end, the present invention provides a method of manufacturing a valve plate for partitioning between a suction chamber, a discharge chamber and a cylinder, wherein at least one suction port and at least one discharge port are formed in the plate, And the first buffer groove is formed through laser processing at the peripheral portion of the first buffer groove.

A second buffer groove may be formed in the peripheral portion of each discharge port where the lead portion of the discharge valve is abutted by laser machining. Alternatively, a peripheral portion of both the suction port and the discharge port may be formed, Can be formed.

The laser processing is performed by a scanning method. In the case of the above-described scanning method, the number of times of processing is preferably four times or more.

In the objective method, the number of pulses of the laser is adjusted to 70 or more, the output power of the laser is 0.32 W or more to 2 W or less, or the output power 10 % Or more and 60% or less.

It is preferable that the suction port and the discharge port are formed by a scanning method, and the first buffer groove is formed by an objective method.

The present invention forms holes or grooves on the disk surface of the valve plate through laser machining, so that surface machining of the disk is easy, and in particular, it is possible to form holes or grooves having a depth of 35 mu m or less.

Further, it is possible to control process conditions such as the number of pulses of laser or energy (or output power) irradiated on the surface of the disk without replacing the press mold in the conventional press working, You can adjust the shape, the arrangement.

1 is a sectional view showing the configuration of an inclined plate type variable displacement compressor equipped with a conventional valve plate,
Fig. 2 is a plan view showing the valve plate in the compressor of Fig. 1,
3 is a view showing a conventional method of manufacturing a valve plate by press working,
4 shows a laser machining apparatus according to the present invention,
5 is a view showing a valve plate disk formed through a laser machining apparatus according to the present invention,
6A to 6D are optical microscope photographs showing changes in Rz value under laser processing conditions using a scanner of a laser machining apparatus according to the present invention,
FIG. 7A is a graph showing a change in the Rz value according to the variation of the pulse number according to the present invention, FIG. 7B is a graph showing a change in the Rz value according to the power change according to the present invention,
FIGS. 8A and 8B are optical microscope photographs showing (a) the surface of the valve plate disk processed in the conventional manner, and (b) optical microscope photographs showing the surface of the valve plate disk processed using the laser according to the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention, and how to accomplish it, will be described with reference to the embodiments described below in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments described herein but may be embodied in other forms. The embodiments are provided so that those skilled in the art can easily carry out the technical idea of the present invention to those skilled in the art.

In the drawings, embodiments of the present invention are not limited to the specific forms shown and are exaggerated for clarity. Also, the same reference numerals denote the same components throughout the specification.

The expression "and / or" is used herein to mean including at least one of the elements listed before and after. Also, singular forms include plural forms unless the context clearly dictates otherwise. Also, components, steps, operations and elements referred to in the specification as " comprises "or" comprising " refer to the presence or addition of one or more other components, steps, operations, elements, and / or devices.

Hereinafter, a method of manufacturing a valve plate disk using a laser according to a preferred embodiment of the present invention will be described in detail.

4 is a view showing a laser machining apparatus 100 according to the present invention. FIG. 5 is a cross-sectional view of the laser machining apparatus 100 of FIG. 4, Valve plate disk 200 according to an embodiment of the present invention.

For example, in the case of a picosecond laser, the pulse width is 10 ps, the fundamental wavelength is 1064 nm, the pulse repetition rate is 8.2 MHz at the maximum, The maximum output power is 15W.

4, when a valve plate disk is manufactured through the laser machining apparatus 100 according to the present invention, a processing method using a scanner (hereinafter referred to as a 'scan method') and an objecctive (Hereinafter, referred to as an " objective method "). In the case of the scan method, the speed can be controlled at a high speed to enable mass production, whereas in the case of the objective method, It is possible to improve the accuracy in comparison with the scanning method.

For example, in the case of the scanning method, by using a pico-second laser or a femtosecond laser and the scanner processing system of Fig. 4, a laser beam is projected onto the periphery of the suction port 230 of the valve plate disk 200 of Fig. 5 at a scanning speed of 20 mm / The buffer groove 235 can be formed as a cotton region. On the other hand, in the case of the object system, a synchronous out signal of several to several tens of kHz pulses irradiated by a picosecond laser or a femtosecond laser is synchronized with a motion controller (PMAC motion controller) The switching is controlled using a Pockels-cell, and the objective lens of a predetermined magnification is condensed around the suction port 230 of the valve plate disk 200 of FIG. . In particular, when the buffer groove 235 is formed according to the laser processing method, a pattern can be realized. In the buffer groove 235, a pattern of a line shape, a sphere shape, an ellipse shape, a dot shape, or a dot superposition type can be implemented.

At this time, a suction port 230 is formed at a position facing the suction chamber, and a discharge port 240 is formed at a position facing the discharge chamber. A suction valve is disposed on the cylinder-side surface of the valve plate, and a discharge valve is disposed on the suction chamber and the discharge chamber side surface. The suction valve has a suction lead portion at a position corresponding to the suction port, and the discharge valve corresponds to the discharge port (See Fig. 1).

5, the suction port 230 is formed in a trapezoidal shape, and a buffer groove 235 is formed along a trapezoidal three-sided surface except the base along the suction port 230 using a scanning method or an objective method. The groove 235 serves as a space for accommodating the lubricating oil that has lost a place to escape when the suction reed portion of the valve plate 200 contacts the periphery of the suction port 230. [ That is, the valve plate 200 serves as a partition for a valve that is opened and closed several times per second by providing a channel for suction / discharge of the refrigerant gas through the refrigerant gas holes and the flow compartments in the air compressor for an automobile, The oil is processed to prevent noise on the surface of the buffer groove 235. The groove 235 having a size of several micrometers is used so that the oil formed in the buffer groove 235 serves as a buffer. In addition, when forming a convex pattern of dot-type or dot-overlap type in the buffer groove 235, the buffer groove 235 and the convex pattern portion (not shown) The peelability of the lead portion can be improved, and the amount of deterioration of noise and pulsation can be reduced.

5, grooves 235 are formed along the three sides of the trapezoidal suction port 230 except for the base, but the present invention is not limited thereto, and it is possible to form a buffer groove surrounding the entire periphery of the suction port 230 have.

Here, the depth of the grooves 235 forms a roughness value Rz of 8 to 15 占 퐉 as compared with the disk surface of the valve plate 200, and a depth of this depth is sufficient to secure the lubricating oil holding function . The Rz value is a value with respect to the depth measured by the illuminance measuring device. The Rz value is an average depth of the five machined surfaces having the highest surface among the machined grooves 235, It represents the degree of processing as a value for measuring the height difference of the average depth.

In addition, a buffer groove (not shown) may be formed around the discharge port 240 in the same manner on the rear surface of the valve plate 200. A first buffer groove is formed in the front surface of the suction port 230 A second buffer groove can be formed in the periphery of the discharge port 240 on the rear surface.

In addition, buffering grooves can be formed on the entire surface of the valve plate 200 as roughened regions on both the periphery of the suction port 230 and the periphery of the discharge port 240.

In addition, the suction port 230 and the discharge port 240 can be easily formed through laser processing. In the case of the suction port 230 and the discharge port 240, And in the case of the buffer groove 235, an objective system is preferable as a precision control.

As described above, when the buffer groove is formed by using the microwave pulse laser and the scanner processing system or the objective lens, the effect of replacing the conventional pressing process can be obtained. That is, when the discharge reed is closed, a sealing surface is provided so as to seal the valve. A buffer groove is formed in the periphery of the suction port 230 and the discharge port 240 of the valve plate, It increases the damping effect and reduces the noise.

Further, in the conventional pressing process, there is a problem that the shape, size and position of the hole or groove are limited by the press mold during the process of forming the hole. However, by using the laser system according to the present invention, Shape, size, and position control.

Hereinafter, process conditions through laser processing according to the present invention will be described in detail. First, as shown in FIGS. 6A to 6D, process conditions in laser processing according to a scanner method according to the present invention will be described, The Rz value according to the number of machining was examined at the same position using the scanner in the formation of the buffer groove.

 Accordingly, referring to FIG. 6A, the size of the buffer groove is 140 mu m and the Rz value is 3.39 mu m at the time of one machining operation. Referring to FIG. 6B, the result of the second machining operation corresponds to a groove size of 140 mu m and an Rz value of 5.58 mu m. Referring to FIG. 6C, the result of the third machining operation corresponds to a groove size of 140 mu m and an Rz value of 7.30 mu m. Referring to FIG. 6D, the results of four machining operations correspond to a groove size of 142 mu m and an Rz value of 8.80 mu m.

Therefore, it can be seen that the Rz value is increased while maintaining the size of the groove to approximately 140 탆 as the number of machining using the scanner is increased. Especially, the Rz value is 8 to 15 탆 in the conventional process, It can be seen that the Rz value can be controlled as well as replacing the existing process conditions at the fourth time or more.

With reference to Figs. 7A and 7B, in the laser machining method according to the present invention, the buffer groove processing conditions of the valve plate using the objective method will be described.

First, referring to Table 1 and FIG. 7A,

Table 1 shows that the repetition rate (rep. Rate) is 50 kHz, the wavelength is 1064 nm, the processing speed is 10 mm / s, the peak power is fixed at 15 W, and the number of pulses is varied. 100 × 100 Hole was processed to measure the Rz value, and the illuminance measurement result (Rz value) for comparison with specific experimental conditions and characteristics is shown in Table 1.

Count Pulse () Rz (占 퐉) One 500 34.5 2 250 19.8 3 100 17.1 4 50 6.77

In the case of 500 pulses, the hole size is 30 mu m and the Rz value is 34.5 mu m. In the case of 250 pulses, the hole size is 40 mu m and the Rz value is 19.8 mu m. When the number of pulses is 100 Hole Size is 27 탆 and Rz value is 17.1 탆. When the number of pulses is 50, the hole size is 24 탆 and the Rz value is 6.77 탆.

FIG. 7A is a graph showing a change in the Rz value according to the variation of the number of pulses. Referring to Table 1 and FIG. 7A, it can be seen that as the number of laser pulses increases at the same laser output power, the processing depth Rz deepens. (70 or more in FIG. 7A), the conventional process condition Rz value (8 μm or more) was satisfied. In other words, the condition satisfying the Rz value (8 μm or more) of the conventional press process was found at more than 100 pulses. Thus, using the ultrashort pulse laser can replace the existing process, You can control shape and position.

Table 2 shows the machining characteristics according to the change of output power.

In Table 2, the repetition rate (Rep.Rate) was fixed to 50 kHz, the wavelength was 1064 nm, the processing speed was 10 mm / s, and the number of pulses was 1000, and the output power was varied while proceeding. Table 2 shows the illuminance measurement results (Rz values) for comparison with specific experimental conditions and characteristics.

Count Output power (%) Rz (占 퐉) One 100% 35.8 2 80% 34.2 3 60% 35.7 4 40% 14.1 5 20% 13.9 6 10% 9.34 7 5% 6.17 8 One% 3.1

In the case of an output power of 3 W, the size of the buffer groove can not be confirmed, the Rz value corresponds to 35.8 μm, the groove size can not be confirmed when the output power is 2.5 W, the Rz value corresponds to 34.2 μm, In the case of W, the groove size corresponds to 30 mu m and the Rz value corresponds to 35.7 mu m. In the case of the output power of 1.27 W, the groove size corresponds to 30 mu m and the Rz value corresponds to 14.1 mu m. When the output power is 0.64 W, And the Rz value corresponds to 13.9 mu m. When the output power is 0.32 W, the groove size is 30 mu m and the Rz value is 9.34 mu m. When the output power is 0.16 W, the groove size is 26 mu m and the Rz value Corresponds to 6.17 mu m, and when the output power is 0.03 W, the groove size is 20 mu m and the Rz value is 3.1 mu m.

FIG. 7B is a graph showing the change of Rz value according to the power change. Referring to Table 2 and FIG. 7B, the change of the Rz value is most abrupt between 40% and 60% At power 0.32W or more (output power 10% or more), Rz value satisfying the conventional process condition was obtained.

In addition, it can be confirmed that the change of 2W or more is insignificant within 5%, and that an output of 2W or more is not necessary. That is, when the maximum output power of the laser is 60%, the Rz measurement value is about 35 μm, and the best result is obtained.

Through the above experiments, it can be seen that the use of microwave pulsed laser of 2W or less (picosecond or pemtosecond) can replace the existing process.

FIGS. 8A and 8B are graphs showing the surface comparison using the optical microscope and the Rz value for the performance comparison with the conventional press method, respectively. FIG. 8A and FIG. It is a photograph.

As shown in Fig. 8A, the position at which the ceramic ball is struck in the conventional manner can not be predicted, as shown in Fig. 8A, so that it has an irregular machined surface, while the result of the laser machining is regular, It can be processed as it is and better results can be obtained.

Further, referring to FIG. 8A, the surface of the valve plate disk processed in the conventional manner does not maintain a circular shape, and has a non-uniform groove having an Rz value of 8 to 15 占 퐉. On the other hand, by irradiating the surface of the disk with the pulsed laser pulse in the manner of the present invention, the depth, shape, and arrangement of holes or grooves, which were the limits of the ceramic ball method, can be controlled.

For example, it can be seen in FIG. 7A that the index Rz value indicating the machining depth gradually increases as the number of pulses is sequentially increased. Likewise, when the energy is sequentially increased, the Rz value increases as shown in FIG. 7B.

As described above, in the case of the conventional press processing method, the shapes and the shapes of the punch molds must be changed in accordance with the requirements for the shapes and depths of the desired holes. In the case of the laser machining according to the present invention, The desired depth, shape, and arrangement can be adjusted according to the adjustment amount of the condition (amount, pulse number, output power, etc.).

However, the present invention is not limited to this, and it is possible to form a pattern of a desired depth in various metal materials by appropriately adjusting the number and energy of pulses irradiated by the laser beam.

Thus, according to the laser processing method of the present invention, grooves having a depth of 35 mu m or less can efficiently be processed into a disk by appropriately adjusting the number of pulses and energy of the laser beam. In particular, it can be applied to various microfabrication fields (100 μm or less), and furthermore, when it is applied to electronic parts, a desired fine pattern can be formed, so that it can meet the market trend.

While the invention has been shown and described with respect to the specific embodiments thereof, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention as defined by the appended claims. Anyone with it will know easily.

Claims (9)

A manufacturing method of a valve plate for partitioning a suction chamber, a discharge chamber and a cylinder through a single laser processing machine having a scanner and an objective lens,
Forming one or more suction ports and at least one discharge port in the plate by laser processing through the scanner,
A first buffer groove is formed in the peripheral portion of each suction port where the lead portion of the suction valve abuts, by laser processing through the objective lens,
The depth of the first cushioning groove is controlled to be 70 to 500, so that the depth of the first cushion groove is in the range of 8 탆 or more to 35 탆 or less as compared with the disk surface of the valve plate, Wherein an output power of the laser is set to 0.32W or more to 2W or less, or the output power is set to 10% or more to 60% or less. The method according to claim 1,
Wherein a second buffer groove is formed in the peripheral portion of each discharge port where the lead portion of the discharge valve contacts with laser processing through the objective lens. 3. The method of claim 2,
Wherein a convex pattern is formed in the first buffer groove or the second buffer groove. The method according to claim 1,
Wherein the suction port is a trapezoidal hole and a first cushioning groove is formed along three trapezoidal shapes except for a base along the suction port. delete delete delete delete delete

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