KR101608898B1 - Apparatus of etching a glass substrate - Google Patents

Abstract

A glass substrate etching apparatus is provided. The glass substrate etch apparatus includes a container for receiving an etchant, a first plate disposed in the container and horizontally seated with the glass substrate, and a flow portion disposed in the container to face the glass substrate and flowing the etchant above or below the first plate do.

Description

[0001] APPARATUS OF ETCHING A GLASS SUBSTRATE [0002]

The present invention relates to an etching apparatus, and more particularly, to a glass substrate etching apparatus.

The flat panel display includes a glass substrate made of silicon oxide. Since the weight of the glass substrate is the largest in the flat panel display, studies have been actively conducted to reduce the weight of the glass substrate as a part of the weight reduction and thinning of the flat panel display.

A typical example of a method of reducing the weight of a glass substrate is a thin plate making the glass substrate thinner. The thinning of the glass substrate requires that the surface be smooth after performing the etching process. That is, uniformity of the thickness of the glass substrate is important, and if the uniformity is not secured, defects may occur in the image quality of the flat panel display.

An object of the present invention is to provide a glass substrate etching apparatus capable of uniformly and efficiently etching a glass substrate.

A glass substrate etch apparatus according to an embodiment of the present invention includes a container for containing an etchant, a first plate disposed in the container, the first plate on which the glass substrate is horizontally mounted, and the first plate disposed in the container so as to face the glass substrate, And a flow portion for flowing the etchant above or below the plate.

The flow portion according to an embodiment of the present invention may include a second plate opposed to the first plate and a rotating blade attached to a lower surface of the second plate.

The flow unit according to an embodiment of the present invention further includes a driving unit for controlling the second plate, wherein the driving unit adjusts a distance between the first plate and the second plate, and adjusts a rotation speed of the second plate .

A glass substrate etching apparatus according to an embodiment of the present invention includes a sensor disposed on a side wall of a container adjacent to the first plate and configured to measure a thickness of the glass substrate and to transmit a driving signal to the driving unit The control unit may further include a control unit.

The glass substrate etching apparatus according to an embodiment of the present invention further includes a return pipe connected to a bottom surface of the container and discharging the etchant, wherein the etchant of the glass substrate is transferred to the return pipe Can reach.

A glass substrate etching apparatus according to an embodiment of the present invention includes a valve for controlling the flow of etchant in the return pipe, a filter for purifying the etchant passing through the valve, a supply pipe for supplying the etchant to the container, To the supply pipe.

The first plate and the second plate according to the embodiment of the present invention may have a circular shape in plan view.

The flow unit according to an embodiment of the present invention may horizontally move on the first plate to flow the etchant.

According to an embodiment of the present invention, the flow unit includes a body, a horizontal moving blade attached to the body, and a driving unit for controlling the operation of the body, wherein the driving unit adjusts a distance between the first plate and the body, The horizontal movement speed of the body can be adjusted.

The first plate according to the embodiment of the present invention may have a rectangular shape in a plan view.

A glass substrate etching apparatus according to an embodiment of the present invention includes a container for accommodating an etchant and a plate disposed in the container, the plate being horizontally seated, wherein the first plate is rotated to induce a relative flow of the etchant do.

The glass substrate etching apparatus according to an embodiment of the present invention further includes a driving unit for controlling the plate, wherein the driving unit can adjust the vertical movement of the plate and the rotation speed of the plate.

A glass substrate etching apparatus according to an embodiment of the present invention includes a sensor disposed on a side wall of a container adjacent to the plate and configured to measure a thickness of the glass substrate and to transmit a driving signal to the driving unit, As shown in FIG.

A glass substrate etching apparatus according to an embodiment of the present invention includes a flow portion moving in a horizontal direction. The etching rate of the glass substrate can be controlled. In addition, the etchant can be reused.

1 is a view for explaining a glass substrate etching apparatus according to a first embodiment of the present invention.
FIG. 2 is a view showing details of a shape of a container and a plate of the glass substrate etching apparatus according to the first embodiment of the present invention.
3 is a view showing a plate and a rotary blade in detail according to a first embodiment of the present invention.
4 is a view for explaining a glass substrate etching apparatus according to a second embodiment of the present invention.
5 is a view for explaining a glass substrate etching apparatus according to a third embodiment of the present invention.
FIG. 6 is a view showing details of a container, a plate, and a flow portion of a glass substrate etching apparatus according to a third embodiment of the present invention.
7 is a view for explaining a glass substrate etching apparatus according to a fourth embodiment of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS The above and other objects, features, and advantages of the present invention will become more readily apparent from the following description of preferred embodiments with reference to the accompanying drawings. However, the present invention is not limited to the embodiments described herein but may be embodied in other forms. Rather, the embodiments disclosed herein are provided so that the disclosure can be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.

In this specification, when an element is referred to as being on another element, it may be directly formed on another element, or a third element may be interposed therebetween. The same reference numerals denote the same elements throughout the specification.

Embodiments described herein will be described with reference to cross-sectional views and / or perspective views that are ideal illustrations of the present invention. In the drawings, therefore, the forms of the illustrations can be modified by manufacturing techniques and / or tolerances.

Although the terms first, second, third, etc. in the various embodiments of the present disclosure are used to describe various components, these components should not be limited by these terms. These terms have only been used to distinguish one component from another. The embodiments described and exemplified herein also include their complementary embodiments.

The terminology used herein is for the purpose of illustrating embodiments and is not intended to be limiting of the present invention. In the present specification, the singular form includes plural forms unless otherwise specified in the specification. The terms "comprises" and / or "comprising" used in the specification do not exclude the presence or addition of one or more other elements.

1 is a view for explaining a glass substrate etching apparatus according to a first embodiment of the present invention. 2 is a perspective view showing details of a shape of a container and a plate of the glass substrate etching apparatus according to the first embodiment of the present invention. 3 is a view showing a plate and a rotary blade in detail according to a first embodiment of the present invention.

1 to 3, a glass substrate etching apparatus 100 according to a first embodiment of the present invention includes a container 110 for containing an etchant 115, a substrate 110 disposed in the container 110, And a flow part 130 disposed in the container 110 and flowing the etching solution 115 on the first plate 120. The first plate 120 is mounted horizontally.

The glass substrate 125 may be seated on the first plate 120 by a vacuum adsorption method. The number of the glass substrates 125 mounted on the first plate 120 may be plural. The plurality of glass substrates 125 can be made thin at the same time, thereby reducing manufacturing costs. The etchant 115 may include a fluoride salt, a sulfate, a nitrate, a sulfonate, a hydrofluoric acid, a sulfuric acid, or a nitric acid. The etchant 115 may be heated to increase the etch rate. The glass substrate 125 may be used in a display device, for example, a touch screen panel.

The moving part 130 may include a second plate 132 opposed to the first plate 120 and a rotating blade 135 attached to a lower surface of the second plate 132. The first plate 120 and the second plate 132 may have a circular shape in plan view. The container 110 may be cylindrical.

The moving unit 130 may further include a driving unit 138 for controlling the second plate 132. The driving unit 138 may move the second plate 132 in a vertical direction. The second plate 132 is moved in the vertical direction to adjust the distance L between the second plate 132 and the first plate 120. [ In addition, the driving unit 138 may adjust the rotational speed of the second plate 132. The vane 135 can create a vortex and the vortex can affect the flow of the etchant 115 in contact with the glass substrate 125.

The driving unit 138 may adjust the etching speed of the glass substrate 125 by controlling the vertical movement and rotation speed of the second plate 132. The driving unit 138 can move the etching liquid 115 at a predetermined speed using the rotary vane 135 and can etch one surface of the glass substrate 125.

The glass substrate etching apparatus 100 may further include a sensor 140 disposed on a side wall of the container 110 adjacent to the first plate 120 and measuring the thickness of the glass substrate 125. The sensor 140 may be a laser sensor. The sensor 140 can measure the thickness of the glass substrate 125 by the reflected signal. The glass substrate etching apparatus 100 may further include a controller 145 that receives a signal from the sensor 140 and transmits a driving signal to the driving unit 130. The etched thickness of the glass substrate 125 may be measured by the sensor 140 and the driving unit 130 may control the etch rate using the driving signal of the controller 145. The glass substrate 125 may be etched to a small thickness, for example, about 0.02 mm, by using the sensor 140, the driving unit 130, and the control unit 145. [ Since the glass substrate 125 has a small thickness, it is possible to reduce the thickness and weight of a display device (for example, a substrate of a touch screen panel, a substrate of a liquid crystal display element, or a substrate of an organic electroluminescent element). The glass substrate 125 has a thin thickness and can be bent. The glass substrate 125 can be applied to, for example, a flexible display.

The glass substrate etching apparatus 100 includes a supply pipe 160 for supplying the etching solution 115 to the container 110, a recovery pipe 175 connected to the bottom surface of the container 110 for discharging the etching solution 115 And an outlet 150 between the first plate 120 and the container 110. [ Alternatively, the outlet 150 may be formed to pass through the first plate 120. The etchant 115 supplied by the supply pipe 160 flows by the flow unit 130 and can reach the return pipe 175 via the discharge port 150. The glass substrate 125 is etched by the flow of the etchant 115, which can be called fluid flow grinding.

The glass substrate etching apparatus 100 includes a valve 172 for controlling the flow of the etching liquid 115 in the recovery pipe 175, a filter 174 for purifying the etching liquid 115 passing through the valve 172, And a pump 176 for delivering the etchant 115 purified by the filter 174 to the supply pipe 160. The filter 174 can filter the etched material 127 of the glass substrate 125. The etchant 115 may be circulated by the return pipe 175, the filter 174, the pump 176, and the supply pipe 160. Thus, the etchant 115 can be reused.

4 is a view for explaining a glass substrate etching apparatus according to a second embodiment of the present invention. The technical features described in the first embodiment with reference to Figs. 1 to 3 will be omitted for the sake of simplicity of explanation.

4, a glass substrate etch apparatus 200 according to a second embodiment of the present invention includes a container 210 containing an etchant 215, a glass substrate 225 disposed within the container 210, A first plate 220 being horizontally pressed and a moving part 230 disposed in the container 210 and flowing the etching liquid 215 under the first plate 220.

The glass substrate 225 may be seated on the first plate 220 by a vacuum adsorption method. The glass plate 225 may be adsorbed on the lower surface of the first plate 220. The glass substrate 225 may be used in a display device, for example, a touch screen panel.

The moving part 230 may include a second plate 232 facing the first plate 220 and a rotating blade 235 attached to the upper surface of the second plate 232. The first plate 220 and the second plate 232 may have a circular shape in plan view. The container 210 may be cylindrical.

The moving unit 230 may further include a driving unit 238 for controlling the second plate 232. The driving unit 238 may move the second plate 232 in a vertical direction. The second plate 232 may be moved in the vertical direction to adjust the distance L between the second plate 232 and the first plate 220. [ In addition, the driving unit 238 can adjust the rotational speed of the second plate 232.

The driving unit 238 may adjust the etching speed of the glass substrate 225 by controlling the vertical movement and rotation speed of the second plate 232. The exposed surface of the glass substrate 225 can be etched by the flow of the etching liquid 215.

The glass substrate etching apparatus 200 may further include a sensor 240 disposed on a side wall of the container 210 adjacent to the first plate 220 and measuring the thickness of the glass substrate 225. The sensor 240 may be a laser sensor. The sensor 240 can measure the thickness of the glass substrate 225 based on the reflected reception signal. The glass substrate etching apparatus 200 may further include a controller 245 for receiving a received signal from the sensor 240 and transmitting a driving signal to the driving unit 230. The etched thickness of the glass substrate 225 may be measured by the sensor 240 and the driving unit 230 may control the etch rate using the driving signal of the control unit 245.

The glass substrate etching apparatus 200 includes a supply pipe 260 for supplying the etching solution 215 to the container 210, a recovery pipe 275 connected to the bottom surface of the container 210 for discharging the etching solution 215 And an outlet 250 between the first plate 220 and the container 210. [ Alternatively, the outlet 250 may be formed to pass through the first plate 220.

The glass substrate etching apparatus 200 includes a valve 272 for controlling the flow of the etching liquid 215 in the recovery pipe 275, a filter 274 for purifying the etching liquid 215 passing through the valve 272, And a pump 276 for transferring the etchant 215 purified by the filter 274 to the supply pipe 260. The filter 274 may filter the etchings 227 of the glass substrate 225. The etchant 215 may be circulated by the return pipe 275, the filter 274, the pump 276, and the supply pipe 260. Thus, the etchant 215 can be reused.

5 is a view for explaining a glass substrate etching apparatus according to a third embodiment of the present invention. FIG. 6 is a view showing details of a container, a plate, and a flow portion of a glass substrate etching apparatus according to a third embodiment of the present invention. The technical features described in the first embodiment with reference to Figs. 1 to 3 will be omitted for the sake of simplicity of explanation.

5 and 6, a glass substrate etch apparatus 300 according to a third embodiment of the present invention includes a container 310 for receiving an etchant 315, a glass substrate 325 disposed in the container 310, And a flow portion 330 disposed in the container 310 and flowing the etchant 315 on the first plate 320. The first plate 320 includes a first plate 320 and a second plate 330,

The glass substrate 325 may be seated on the first plate 320 in a vacuum adsorption manner. The glass substrate 325 may be seated on the upper surface of the first plate 320. The glass substrate 325 may be used in a touch screen panel.

The moving unit 330 may include a body 332 on the first plate 320 and a horizontal moving blade 335 attached to a lower surface of the body 332. The first plate 320 may have a rectangular shape in a plan view.

The moving unit 330 may further include a driving unit 338 for controlling the movement of the body 232. The driving unit 338 may move the body 332 in a vertical direction. The body 332 is moved in the vertical direction to adjust the distance L between the body 332 and the first plate 320. [ In addition, the driving unit 338 may adjust the horizontal moving speed of the first body 332.

The driving unit 338 may adjust the etching speed of the glass substrate 325 by controlling the vertical movement and the horizontal movement speed of the body 332. The exposed surface of the glass substrate 325 can be etched by the flow of the etchant 315.

The glass substrate etch apparatus 300 may further include a sensor 340 disposed on a sidewall of the container 310 adjacent to the first plate 320 and measuring the thickness of the glass substrate 325. The sensor 340 may be a laser sensor. The sensor 340 can measure the thickness of the glass substrate 325 by the reflected reception signal. The glass substrate etching apparatus 300 may further include a controller 345 for receiving a received signal from the sensor 340 and transmitting a driving signal to the driving unit 330. The etched thickness of the glass substrate 325 is measured by the sensor 340 and the driving unit 330 can adjust the etch rate using the driving signal of the control unit 345.

The glass substrate etching apparatus 300 includes a supply pipe 360 for supplying the etching solution 315 to the container 310, a recovery pipe 375 connected to the bottom surface of the container 310 for discharging the etching solution 315 And an outlet 350 between the first plate 320 and the container 310. [ Alternatively, the outlet 350 may be formed to pass through the first plate 320.

The glass substrate etching apparatus 300 includes a valve 372 for controlling the flow of the etching liquid 315 in the recovery pipe 375, a filter 374 for cleaning the etching liquid 315 passing through the valve 372, And a pump 376 for transferring the etchant 315 purified by the filter 374 to the supply pipe 360. The filter 374 may filter the etchant 327 of the glass substrate 325. The etchant 315 may be circulated by the return pipe 375, the filter 374, the pump 376, and the supply pipe 360. Thus, the etchant 315 can be reused.

According to the third embodiment of the present invention, the glass substrate etching apparatus 300 can etch the glass substrate 325 to a thin thickness. In addition, since the glass substrate etching apparatus 300 has the moving part 330 that moves horizontally, uniformity can be secured and the glass substrate 325 can be etched to the same thickness.

7 is a view for explaining a glass substrate etching apparatus according to a fourth embodiment of the present invention.

7, a glass substrate etch apparatus 400 according to a fourth embodiment of the present invention includes a container 410 that receives an etchant 415 and a second substrate 410 that is disposed in the container 410 and has a horizontal As shown in FIG. The plate 420 may be rotated to induce a relative flow of the etchant 415.

The glass substrate 425 may be seated on the plate 420 in a vacuum adsorption manner. The glass substrate 425 may be seated on the upper surface of the plate 420. The glass substrate 425 may be used in a touch screen panel.

The glass substrate etching apparatus 400 may further include a driving unit 430 for controlling the plate 420. The driving unit 430 may adjust the rotational speed of the plate 420. In addition, the driving unit 430 may move the plate 420 in a vertical direction.

The driving unit 430 may adjust the etching speed of the glass substrate 425 by controlling the movement and rotation speed of the plate 420 in the vertical direction. The exposed surface of the glass substrate 425 can be etched by the relative flow of the etchant 415.

The glass substrate etcher 400 may further include a sensor 440 disposed on a side wall of the container 410 adjacent to the plate 420 and measuring the thickness of the glass substrate 425. The sensor 440 may be a laser sensor. The glass substrate etching apparatus 400 may further include a controller 445 for receiving a received signal from the sensor 440 and transmitting a driving signal to the driving unit 430. The etched thickness of the glass substrate 425 may be measured by the sensor 440 and the driving unit 430 may control the etch rate using the driving signal of the control unit 445.

The glass substrate etching apparatus 400 includes a supply pipe 460 supplying the etching solution 415 to the container 410, a recovery pipe 475 connected to the bottom surface of the container 410 to discharge the etching solution 415 And an outlet 450 between the plate 420 and the vessel 410. [ Alternatively, the outlet 450 may be formed to pass through the plate 420.

The glass substrate etching apparatus 400 includes a valve 472 for controlling the flow of the etching liquid 415 in the recovery pipe 475, a filter 474 for cleaning the etching liquid 415 passing through the valve 472, And a pump 476 for transferring the etchant 415 purified by the filter 474 to the supply pipe 460. The filter 474 can filter the etchings 427 of the glass substrate 425. The etchant 415 may be circulated by the return pipe 475, the filter 474, the pump 476, and the supply pipe 460. Thus, the etchant 415 can be reused.

Table 1 is a table for comparing the thicknesses of glass substrates according to Examples of the present invention and Comparative Examples. S1 is a comparative example in which the glass substrate is simply immersed in an etchant for etching, and S2 is a case of using a glass substrate etcher according to an embodiment of the present invention.

As shown in the table below, the thickness can be reduced to about 1/10 of that of the comparative example. In addition, the glass substrate manufactured according to the embodiment of the present invention was excellent in plasticizability and the radius of curvature was measured to be about 10 cm.

S1 S2 One 0.213 mm 0.019 mm 2 0.201 mm 0.020 mm 3 0.199 mm 0.021 mm 4 0.208 mm 0.018 mm 5 0.219 mm 0.022 mm 6 0.188 mm 0.021 mm Average 0.205 mm 0.020 mm

110: container 120: first plate
130: Fluid portion 132: Second plate
135: rotating blade 138:
145:

Claims (6)

A container for containing the etchant;
A first plate disposed in the vessel, the first plate on which the glass substrate is horizontally seated; And
And a flow portion disposed in the vessel to face the glass substrate and flowing the etchant above or below the first plate,
Wherein the flow portion horizontally moves on the first plate to flow the etchant. The method according to claim 1,
The flow unit includes a body, a horizontal moving blade attached to the body, and a driving unit for controlling operation of the body,
Wherein the driving unit adjusts a distance between the first plate and the body, and adjusts the horizontal movement speed of the body. The method of claim 2,
Wherein the first plate has a rectangular shape in plan view. The method of claim 2,
A sensor disposed on a side wall of the container adjacent to the first plate, the sensor measuring the thickness of the glass substrate; And
And a control unit for receiving a received signal from the sensor and transmitting a driving signal to the driving unit. The method according to claim 1,
And a recovery pipe connected to a bottom surface of the container for discharging the etchant,
Wherein the etchant of the glass substrate reaches the return pipe by the flow of the etchant. The method of claim 5,
A valve for regulating the flow of the etchant in the return pipe;
A filter for purifying the etchant passing through the valve;
A supply pipe for supplying the etchant to the vessel; And
Further comprising a pump for delivering the etchant purified in the filter to the supply tube.

Images