KR101606488B1 - A method for producing a plastic film electrode - Google Patents

Abstract

A transparent plastic film containing a polymer resin; And a conductive metal layer formed on the upper surface of the transparent plastic film, wherein the upper surface of the conductive metal layer is not in direct contact with the guide roll, or the conductive metal layer further comprises a pinhole- A film electrode, a display product comprising the plastic film electrode, and a method of manufacturing the plastic film electrode.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a method of producing a plastic film electrode,

The present invention relates to a plastic film electrode, a method of manufacturing the same, and a display product including the same. More specifically, the present invention relates to a plastic film electrode, Type guide roll, a plastic film electrode with a pinhole prevention protective film, a method for manufacturing the same, and a display product including the same.

Currently, the display market has diverse product lines ranging from small touch displays such as smart phones and tablet PCs to large displays ranging from LCDs and PDPs to outdoor advertising (PIDs and DIDs), and a variety of technologies. Especially, in the touch panel market, small touch panel growth centered on smartphones has been dominant up to now, but it is expected that middle and large touch panel will continue to grow as it is gradually applied to notebooks and PCs.

Transparent electrodes having both transparency and conductivity in a touch panel structure are indispensable, and ITO that satisfies these requirements is widely used. However, indium contained in ITO is likely to be scarce by rare metals. In addition, as the display and the touch panel become larger, the required resistance value becomes lower and it is difficult to apply to a large area. Therefore, there is a growing need for a substitute material. Among alternative materials, metal materials such as silver, copper, aluminum and the like having good conductivity have been actively developed. Specifically, metal materials such as glass or plastic film are printed in a thin and narrow mesh form, .

In the latter method, when a metal such as silver, copper, or aluminum is thinly deposited on a plastic film in a roll-to-roll sputtering apparatus or the like, frictional resistance is not sufficient because the surface hardness of the metal thin film is weak. Due to such characteristics, pinholes and scratches are often caused by direct contact between the guide roll and the metal layer during the process, or the front and back surfaces of the film come into direct contact with each other during winding and storage, Pinholes are generated. This is disadvantageous in that, when the mesh is patterned in a post-process, the connection of the meshes is cut off and the mesh is not enough to serve as an electrode, and the yield is lowered and the productivity is lowered.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and it is an object of the present invention to provide a plastic film electrode which prevents direct contact of a metal layer to suppress scratches or pinholes on the surface thereof, And a display product including the same.

In order to solve the above problems, according to one aspect of the present invention,

A transparent plastic film containing a polymer resin; And

And a conductive metal layer formed on the upper surface of the transparent plastic film, wherein the plastic film electrode is manufactured using a guide roll,

The conductive metal layer has a surface portion that is not in direct contact with the guide roll or a plastic film electrode further comprising a pinhole preventing protective film on the conductive metal layer.

The conductive metal layer may have a surface portion that is not in direct contact with the guide roll, and the conductive metal layer may further include a pinhole preventing protective film.

Wherein the polymer resin is selected from the group consisting of polyethersulfone, polycarbonate, polyimide, polyarylate, polyethylene terephthalate, polyethylene naphthalate polyethylene terephthalate glycol, polycyclohexylenedimethylene terephthalate glycol, and cycloolefin copolymers Any one or a mixture of two or more thereof may be used.

The conductive metal layer may be a single layer or a plurality of layers including at least one selected from the group consisting of Au, Ag, Cu, Fe, Co, Ti, V and Al.

In the case where the conductive metal layer is a plurality of layers, one of the layers is made of AlOxNy (x is 0 to 2, y is 0 to 2, provided that x + y is not 0), CuOxNy (x is 0 to 2 , y is 0 to 3, provided that x + y is not 0) and MoOxNy, x is 0 to 3, y is 0 to 3, provided that x + y is not 0) And the like.

The conductive metal layer may have a thickness of 0.001 to 3 mu m.

The conductive metal layer may have a pinhole number of 300 or less per unit area (180 mm x 250 mm).

The average size of pinholes of the conductive metal layer may be 3 to 11 탆.

The number of pinholes having a size of 24 mu m or more per unit area (180 mm x 250 mm) of the conductive metal layer may be 0 to 20.

The conductive metal layer may have a surface resistance of 0.1 to 300? / Sq.

According to another aspect of the present invention, there is provided a display product comprising the plastic film electrode.

According to another aspect of the present invention,

Preparing a transparent plastic film containing a polymer resin; And

And forming a conductive metal layer on the upper surface of the transparent plastic film,

Transporting the transparent plastic film formed with the conductive metal layer using a protruding guide roll to prevent direct contact between the conductive metal layer and the guide roll, or

And a step of attaching a pinhole preventing protective film to the upper surface of the conductive metal layer.

The step of transferring the transparent plastic film on which the conductive metal layer is formed by using the protruding guide roll may further include the step of attaching the pinhole preventing protective film to the upper surface of the conductive metal layer.

Transferring the transparent plastic film on which the conductive metal layer is formed using a protruding guide roll and attaching the pinhole preventive protective film to the upper surface of the conductive metal layer may be performed as a continuous process or a separate process.

Also in the step of forming the conductive metal layer, a protruding guide roll can be used.

The step of forming the conductive metal layer may be performed by a method such as low pressure chemical vapor deposition (LPCVD), plasma enhanced chemical vapor deposition (PECVD), atmospheric pressure chemical vapor deposition (APCVD), thermal evaporation deposition, inductive thermal evaporation deposition, An electron beam evaporation deposition method, a sputtering method, a molecular beam epitaxy method, or an atomic layer deposition method.

The protruding guide roll may have a protrusion height of 0.1 to 200 mm, a width of 0.1 to 200 mm, and 2 to 5 protrusions in one guide roll.

According to an embodiment of the present invention, in the step of forming the conductive metal layer on the transparent plastic film, the pinhole occurrence can be suppressed by applying the projecting guide roll and the pinhole prevention protective film, It is possible. At this time, it is possible to manufacture a plastic film electrode having improved pinholes by a continuous roll-to-roll continuous process at a high production yield, thereby ensuring high productivity and economical efficiency.

1 is a schematic view of a plastic film electrode according to an embodiment of the present invention.
Figure 2 is a schematic diagram of a dual-mode machine with a roll-to-roll sputter system with six coating zones.
3 is an actual view of a pinhole on the surface of the plastic film electrode of Example 3. Fig.
4 is a schematic view of a protruding guide roll.
5 is a schematic view of film transport through a protruding guide roll.
Fig. 6 is an actual view of pinholes on the surface of the plastic film electrode of Comparative Example 1. Fig.
7 is an SEM photograph of pinholes on the surface of the plastic film electrode of Comparative Example 1. Fig.
8 is a graph showing distribution of pinhole sizes of Comparative Example 1 and Example 1. FIG.
9 is a schematic view for patterning a plastic film electrode according to an embodiment of the present invention.
10 is a schematic view for patterning a plastic film electrode according to a conventional technique.

Hereinafter, the present invention will be described in detail. Prior to this, terms and words used in the present specification and claims should not be construed as limited to ordinary or dictionary terms, and the inventor should appropriately interpret the concepts of the terms appropriately It should be construed in accordance with the meaning and concept consistent with the technical idea of the present invention based on the principle that it can be defined.

A plastic film electrode according to one aspect of the present invention includes: a transparent plastic film including a polymer resin; And

And a conductive metal layer formed on the upper surface of the transparent plastic film, wherein the plastic film electrode is manufactured using a guide roll,

The conductive metal layer may have a surface portion that is not in direct contact with the guide roll, or may include a pinhole preventing protective film on the conductive metal layer.

1, a plastic film electrode according to an embodiment of the present invention includes a transparent plastic film 1, a conductive metal layer 2 formed on a top surface of the transparent plastic film, And a protective film (3).

The transparent plastic film can be used as long as it has optical characteristics suitable for a display substrate. For example, the polymeric resin used for the transparent plastic film may be a polycarbonate (PC), a polyimide (PI), a polyethersulfone (PES), a polyarylate (PAR), a polyethylene It is well known that thermoplastic polymer resins such as polyethylene naphthalate (PEN), polyethylene terephthalate (PET), cycloolefin copolymer and the like and thermosetting polymer resins such as epoxy and unsaturated polyester can be selected have.

The thickness of the transparent plastic film may be 10 to 300 占 퐉, or 50 to 200 占 퐉. When the thickness of the transparent plastic film satisfies this range, it is possible to secure the required mechanical strength and flexibility at the same time.

The material usable for the conductive metal layer includes any one selected from the group consisting of silver, copper, gold, aluminum, tungsten, iron, platinum, lead, mercury, nickel and chromium or a mixture of two or more thereof.

At present, a surface resistance of 0.1 to 500? / Sq is required for use as an electrode of a touch panel or a display. The surface resistance of the conductive metal layer is determined depending on the thickness. If the thickness is thin, the surface resistance is high. If the thickness is too thick, the process speed may be lowered. Therefore, the thickness of the conductive metal layer may be 0.001 to 3 mu m and 0.01 to 1 mu m. At this time, the conductive metal layer may have a surface resistance of 0.1 to 300? / Sq.

In addition, the conductive metal layer may be a single layer, or may be a plurality of layers made of the same or different kinds of metals.

Particularly, when the conductive metal layer is a plurality of layers, one of the layers is made of AlOxNy (x is 0 to 2, y is 0 to 2, provided that x + y is not 0), CuOxNy (x is 0 to 2 , y is 0 to 3, provided that x + y is not 0) and MoOxNy, x is 0 to 3, y is 0 to 3, provided that x + y is not 0) And the like. Such a blackening layer can minimize the reflected light and improve the optical characteristics of the plastic film electrode.

When a metal such as silver, copper, aluminum or the like is thinly deposited on a plastic film by a roll-to-roll sputtering apparatus or the like in the production of a conventional plastic film electrode, the surface of the metal thin film is weak, Pinholes such as scratches and scratches are often caused by direct contact between the guide roll and the metal layer.

According to one embodiment of the present invention, by employing a protruding guide roll or the like instead of the conventional guide roll, the upper surface of the conductive metal layer is not in direct contact with the guide roll at the time of transporting the transparent plastic film having the conductive metal layer formed thereon .

The protruding guide roll has a protruding portion in the guide roll to prevent physical contact between the conductive metal layer and the guide roll.

The protruding portion can be manufactured as a protruding type when the guide roll is manufactured, and can be assembled to the general guide roll in the form of an additional jig. When the film is transported over the protruding guide roll, the protruded portion makes direct physical contact with the film. However, the film which is transported by the non-protruding portion can avoid direct contact with the guide roll, The shape, size and material of the guide roll can be changed according to the material, thickness and size of the transparent plastic film, but it can be applied to any general guide roll material such as aluminum, SUS, rubber, and alloy.

For example, the protruding guide roll may have a protrusion height of 0.1 to 200 mm, a width of 0.1 to 200 mm, and 2 to 5 protrusions in one guide roll.

In addition, the pinhole prevention protective film has an effect of preventing pinholes and scratches by preventing contact between the films, which may occur when the film is wound and stored, after the metal layer process, before the product is wound in roll form. The pinhole protection film may be applied to any general protective film, and may be changed depending on the material of the metal layer to be used, the material and thickness of the transparent plastic film to be used, the size, and the intended use.

The plastic film electrode according to an embodiment of the present invention may have a surface portion in which the conductive metal layer is not in direct contact with the guide roll, and may further include a pinhole prevention protective film on the conductive metal layer.

As a result, in the plastic film electrode according to an embodiment of the present invention, the generation of pinholes in the conductive metal layer is remarkably suppressed and the size of the generated pinhole is considerably reduced. For example, May have a pinhole number of 300 or less, preferably 250 or less, more preferably 10 to 250, per area (180 mm x 250 mm). In this case, the term 'pinhole' refers to a phenomenon in which a light source is caused to pass through the conductive metal layer when the produced plastic film electrode is illuminated from the back surface of the LED surface light source in the dark room, Surface defects, scratches, and the like.

In addition, in the plastic film electrode according to an embodiment of the present invention, not only the number of pinholes of the conductive metal layer is reduced, but also the average size of pinholes produced inevitably becomes very small. For example, Lt; / RTI >

In addition, relatively small ones (for example, 4 mu m or less) in the distribution of the pinhole sizes produced in the conductive metal layer can be generated more than the large ones. The number of pinholes having a size of 24 mu m or more per unit area (180 mm x 250 mm) of the conductive metal layer may be, for example, 0 to 20, preferably 0 to 20, more preferably 1 to 15.

According to another aspect of the present invention, there is provided a method of manufacturing a plastic film electrode,

Preparing a transparent plastic film containing a polymer resin; And

And forming a conductive metal layer on the upper surface of the transparent plastic film,

Transferring the transparent plastic film formed with the conductive metal layer using a protruding guide roll to prevent direct contact between the conductive metal layer and the guide roll or attaching a pinhole protection film to the upper surface of the conductive metal layer .

The method of manufacturing the plastic film electrode will be described in detail below.

First, a transparent plastic film is prepared.

As described above, the transparent plastic film can be used as long as it has optical characteristics suitable for a display substrate, and various kinds of reinforcing materials such as glass fiber can be incorporated.

Materials usable as the conductive metal layer are as described above.

The forming of the conductive metal layer on the hard coat layer may be performed by a low pressure chemical vapor deposition (LPCVD) method, a plasma enhanced chemical vapor deposition (PECVD) method, an atmospheric pressure chemical vapor deposition (APCVD) method, A thermal evaporation deposition method, an inductive thermal evaporation deposition method, an electron beam evaporation deposition method, a sputtering method, a molecular beam epitaxy method, and an atomic layer deposition method.

Specifically, Figure 2 schematically illustrates a dual-mode machine with a roll-to-roll sputter system with six coating zones. The step of forming the conductive metal layer and attaching the pinhole protection protective film according to an embodiment of the present invention will be described below with reference to the case where the step of attaching the protective film is performed by using the dual mode device of the roll-to-roll sputtering method.

First, the transparent plastic film wound on the un-winder 7 is conveyed to the coating drum 9 having six coating zones through the guide rolls 8a and 8b. The first coating zone 11 and the second coating zone 12 are equipped with a conductive metal target, and argon gas or the like is injected at 1 to 500 sccm, and a pressure of 0.001 to 100 mTorr and a pressure of 0.1 At a speed of 50 m / min to deposit a conductive metal layer on a transparent plastic film having a hard coat layer formed thereon.

Optionally, depending on the thickness of the conductive metal layer to be formed, the remaining third through sixth coating zones 13, 14, 15, 16 may be further actuated to introduce a thicker metal layer into the plastic film electrode have. After the formation of the metal layer, the pinhole protection film 18 passes through the protruding guide roll 8c and is adhered to the conductive metal layer using the ply roll 17. Thereafter, the finally produced plastic film is wound using the rewinder 10.

At this time, the guide rolls 8a and 8b may not necessarily be of a protruding type but may be coated with an additional metal layer other than the sixth coating zone 16 by changing the rotating direction of the coating drum 9 when forming the conductive metal layer A protruding guide roll may be used.

According to an embodiment of the present invention, the step of transferring the transparent plastic film having the conductive metal layer formed thereon by using the protruding guide roll may further include the step of attaching the pinhole protection film to the upper surface of the conductive metal layer can do. In this case, the conductive metal layer also prevents direct contact with the guill roll, and also prevents contact between the transparent plastic film and the conductive metal layer at the time of roll winding, thereby minimizing defects on the conductive metal layer, Surface characteristics can be obtained.

At this time, the step of transferring the transparent plastic film having the conductive metal layer formed thereon by using the protruding guide roll, and the step of attaching the pinhole preventing protective film to the upper surface of the conductive metal layer, All of which are individually performed can be employed.

The production method, shape, size and material of the protruding guide roll are as described above.

Referring to FIG. 3, the protruding guide roll 20 according to an embodiment of the present invention may be configured to have a guide roll 21 and a protrusion 22 formed near both ends of the guide roll.

As a result, referring to FIG. 4, in the case of using the protruding guide roll 30 according to the embodiment of the present invention, the transparent plastic film 33 on which the conductive metal layer is formed is in direct contact with the guide roll 31 And only the protruding portion 32 having a limited surface is brought into contact with the conductive metal layer. Thus, it can be seen that the generation of pinholes caused by the direct contact between the conductive metal layer and the guiding roll can be minimized.

According to another aspect of the present invention, there is provided a display product comprising the plastic film electrode. Such display products may include small touch display products such as smart phones and tablet PCs, or large display products such as LCDs, PDPs, or outdoor advertising (PID, DID).

Hereinafter, the present invention will be described in detail with reference to the following examples. However, the present invention is not limited by these examples.

Example  One

Preparation of transparent plastic film

As the transparent plastic film to be used as the substrate, a 125 μm thick film was used as a polyethylene terephthalate (PET) film (model name U43R) manufactured by Kolon Corporation.

Installing the protruding guide roll

The protruding guide roll shown in Fig. 3 was applied to the dual-mode equipment of the roll-to-roll sputtering machine with six coating zones shown in Fig. The protrusions used were assembled into a guide roll and used as a jig. They were made of aluminum material with a height of 3 cm, a width of 4 cm and two per guide roll.

Formation of conductive metal layer and protective layer

Next, an aluminum target was mounted on the first coating zone and the second coating zone using a roll-to-roll sputtering apparatus dual mode equipment having six coating zones shown in FIG. 2, and argon (Ar) gas was injected at 200 sccm, / Cm < 2 > power at a rate of 1 M / min to deposit an aluminum conductive metal layer on the hard coat layer. The thickness of the aluminum conductive metal layer was found to be 100 nm when observed with an SEM.

Attachment of pinhole protection film

Next, using a dual-mode equipment equipped with six coating zones shown in FIG. 2, a Sun-A PET protective film was attached to the top of the metal layer using a twin roll before rewinding. Thereafter, it was rewound and wound in roll form.

In this manner, a protruding guide roll was used to produce a conductive film with a pinhole protection film.

At this time, an actual inspection of the pinhole on the surface of the obtained plastic film electrode is shown in Fig. Referring to FIG. 5, it is confirmed that there is almost no pinhole because a protruding guide roll is used and a pinhole prevention protective film is provided.

Example 2

A plastic film electrode was produced in the same manner as in Example 1, except that a general guide roll was used instead of the protruding guide roll in forming the metal layer.

Example 3

A plastic film electrode was prepared in the same manner as in Example 1, except that a pinhole preventing protective film was not attached after the formation of the metal layer.

Comparative Example 1

A plastic film electrode was prepared in the same manner as in Example 1, except that a general guide roll was used instead of the protruding guide roll, and a protective film for preventing pinholes was not used. At this time, an actual inspection of the pinhole on the surface of the obtained plastic film electrode is shown in Fig. 6, and an SEM photograph of the pinhole is shown in Fig. Referring to FIG. 6, it can be seen that a considerable number of pinholes are formed as compared with the first embodiment.

The plastic film electrodes of Examples 1 to 3 and Comparative Example 1 produced by the above-mentioned method were measured for pinhole number, sheet resistance, adhesion, and the like according to the following evaluation method, and the results are shown in Table 1.

1) Number of pinholes: The plastic film electrodes of the examples and comparative examples prepared above were cut into 180 mm x 250 mm, and the number of pinholes was counted visually using a LED surface light source in a dark room.

2) Average size of pinholes: The size of all pinholes of the unit area (180 mm x 250 mm) of the plastic film electrodes of the examples and comparative examples were measured using SEM, the number of pinholes corresponding to each pinhole size was multiplied, Was calculated using the following equation in a manner of dividing the total number of pinholes by the total number of pinholes:

Pinhole average size _{= ΣS i N i / ΣN i} (S i: pinhole size, N _i: the number of pinholes)

4) Number of pinholes of size over 24 μm: The size of all pinholes of the unit area (180 mm × 250 mm) of the plastic film electrodes of the examples and the comparative examples were measured using SEM and the number of pinholes of 24 μm or more was calculated Respectively.

4) Surface Resistance: The surface resistance was determined using a 4-point-probe surface resistor (model name 100HA) manufactured by ACITECH CORPORATION.

5) Adhesion: Adhesion was evaluated according to the degree of detachment when the tape was adhered and then peeled vertically after making 100 chambers by X-cutting the coating surface according to ASTM D3359-02 (5B: 0%, 4B: Less than 5%, 3B: 5-15%, 2B: 15-35%, 1B: 35-65%, 0B: 65% or more).

Item unit Comparative Example 1 Example 1 Example 2 Example 3 Al thickness nm 100 100 100 100 Number of pinholes dog 500 70 120 250 Pinhole average size ㎛ 12 7 9 11 Pinhole number greater than 24 μm dog 40 One 6 13 Surface resistance Ω / sq 0.7 0.7 0.7 0.7 Attachment 5B 5B 5B 5B

Table 2 below shows distribution of pinhole sizes of Comparative Example 1 and Example 1, and is shown in the graph of FIG.

Pinhole size Comparative Example 1 Example 1 4 탆 41 37 8 탆 131 19 12 탆 193 6 16 탆 63 5 20 탆 32 2 24 탆 20 One 28 탆 9 0 32 탆 4 0 36 탆 3 0 40 탆 2 0 44 탆 One 0 56 탆 One 0 Total number 500 70 24 ㎛ or more 40 One

Referring to Tables 1 and 2, in the case of Examples 1 to 3, the number of pinholes was basically reduced significantly compared with Comparative Example 1, and the number of pinholes (for example, pinholes of 24 μm or more) And it was confirmed that the average size was greatly reduced.

Fig. 9 schematically shows a plastic film electrode according to an embodiment of the present invention (Examples 1 to 3), Fig. 10 schematically shows a plastic film electrode formed by patterning a conventional plastic film electrode (Comparative Example 1) .

The plastic film electrodes (Examples 1 to 3) (40) according to the embodiment of the present invention use protruding guide rolls so that the upper surface of the conductive metal layer is not in direct contact with the guide roll, By further including the protective film, there is almost no pinhole 42 on the metal layer 41, and the size is also extremely small. As a result, the pinhole size is relatively smaller than the line width of the pattern formed on the patterned plastic film electrode 44, so that the pattern will be normally formed.

On the other hand, since the conventional plastic film electrode (Comparative Example 1) 50 does not use the protruding guide roll or the pinhole preventing protection film, the number of the pinholes 52 on the metal layer 51 is large And the diameter of the pinhole is considerably large. Therefore, the size of the pinhole is much larger than the line width of the pattern in the patterned plastic film electrode 54, and as a result, a large number of patterns will be broken and defects will occur.

1: transparent plastic film 2: conductive metal layer 3: pinhole-preventing protective film layer
7: unwinder 8a, 8b: guide roll, 8c: protruding guide roll
9: Coating drum 10: Rewinder
11: first coating zone 12: second coating zone 13: third coating zone 14: fourth coating zone
15: fifth coating zone 16: sixth coating zone 17: laminating roll 18: pinhole protection film
20: protruding guide roll, 21: guide roll, 22: protrusion
30: protruding guide roll, 31: guide roll, 32:
33: Transparent plastic film formed with conductive metal layer
40: plastic film electrode, 41: metal layer, 42: pinhole
44: patterned plastic film electrode, 43: pattern
50: plastic film electrode, 51: metal layer, 52: pinhole
54: Patterned plastic film electrode, 53: Disconnection part of pattern

Claims (13)

Preparing a transparent plastic film containing a polymer resin; And
And forming a conductive metal layer on the upper surface of the transparent plastic film,
Transferring the transparent plastic film having the conductive metal layer formed thereon by using a protruding guide roll in order to prevent direct contact between the conductive metal layer and the guide roll, and attaching a pinhole protection film to the upper surface of the conductive metal layer Further comprising:
Wherein the protruding guide roll has protrusions and non-protrusions,
Wherein when the transparent plastic film is transported on the protruding guide roll, the protruding portion directly contacts the transparent plastic film, and the transparent plastic film transported by the non-protruding portion is not in direct contact with the guide roll. delete The method according to claim 1,
The step of transferring the transparent plastic film on which the conductive metal layer is formed using a protruding guide roll and the step of attaching the pinhole preventive protective film to the upper surface of the conductive metal layer are carried out by a continuous process or a separate process A method for manufacturing a plastic film electrode. The method according to claim 1,
Wherein a protruding guide roll is also used in the step of forming the conductive metal layer. The method according to claim 1,
The step of forming the conductive metal layer may be performed by a method such as low pressure chemical vapor deposition (LPCVD), plasma enhanced chemical vapor deposition (PECVD), atmospheric pressure chemical vapor deposition (APCVD), thermal evaporation deposition, inductive thermal evaporation deposition, Wherein the film is formed by an electron beam evaporation deposition method, a sputtering method, a molecular beam epitaxy method, or an atomic layer deposition method. The method according to claim 1,
Wherein the protruding guide roll has a protrusion height of 0.1 to 200 mm, a width of 0.1 to 200 mm, and 2 to 5 protrusions in one guide roll. delete delete delete delete delete delete delete

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