KR101600307B1 - Rotating-type fume removing wafer storage - Google Patents

Rotating-type fume removing wafer storage Download PDF

Info

Publication number
KR101600307B1
KR101600307B1 KR1020150142492A KR20150142492A KR101600307B1 KR 101600307 B1 KR101600307 B1 KR 101600307B1 KR 1020150142492 A KR1020150142492 A KR 1020150142492A KR 20150142492 A KR20150142492 A KR 20150142492A KR 101600307 B1 KR101600307 B1 KR 101600307B1
Authority
KR
South Korea
Prior art keywords
wafer
module
rotation
rotating
storage
Prior art date
Application number
KR1020150142492A
Other languages
Korean (ko)
Inventor
이경주
서재용
구기승
김한제
Original Assignee
오션브릿지 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 오션브릿지 주식회사 filed Critical 오션브릿지 주식회사
Priority to KR1020150142492A priority Critical patent/KR101600307B1/en
Application granted granted Critical
Publication of KR101600307B1 publication Critical patent/KR101600307B1/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02046—Dry cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6732—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H01L2021/60007—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation involving a soldering or an alloying process
    • H01L2021/60022—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation involving a soldering or an alloying process using bump connectors, e.g. for flip chip mounting
    • H01L2021/60097—Applying energy, e.g. for the soldering or alloying process
    • H01L2021/60172—Applying energy, e.g. for the soldering or alloying process using static pressure
    • H01L2021/60187—Isostatic pressure, e.g. degassing using vacuum or pressurised liquid

Abstract

Rotary fume removal wafer storage is initiated.
The disclosed rotary fume removing wafer storage includes a fume removing case having an inlet through which a wafer is introduced; A wafer accommodating and rotating module rotatably installed in the fumigation case and capable of being stacked and accommodated while a plurality of wafers introduced through the inlet are spaced apart from each other; Rotating means capable of rotating the wafer housing rotation module in the fumigation case; And an air supply member installed in the fume removing case and capable of providing a gas for removing fume to the wafer in the wafer housing rotation module, The wafer holding rotation module is rotated in the direction toward the inlet by the rotation means and the wafer is taken into the wafer rotation rotation module and the fume removal for the wafer stored in the wafer rotation storage module is completed And when requested, the wafer accommodating and rotating module is moved to the air supply member by the rotating means so that the gas supplied by the air supply member can flow into the respective spaced spaces between the wafers accommodated in the wafer accommodating and rotating module To the direction of flow of the gas supplied by the < RTI ID = 0.0 > And that is characterized.
According to the disclosed rotary fume removal wafer storage, as the rotary fume removal wafer storage includes the fume removal case, the wafer storage rotation module, the rotation means, and the air supply member, When the wafer is taken in, the wafer storage rotation module is rotated in the direction toward the inlet by the rotation means, and the wafer is taken in the wafer storage rotation module and the fume And when the removal is required, the wafer accommodating and rotating module is rotated by the rotating means such that the gas supplied by the air supplying member can flow into the respective spaced spaces between the wafers accommodated in the wafer accommodating and rotating module, Of the gas supplied by the member The direction of the wafer housing rotation module can be changed when the wafer is taken in and when the wafer is removed from the wafer. Therefore, the fume removal can be performed in the vertical direction substantially perpendicular to the wafer drawing direction so as not to interfere with the wafer drawing It is possible to smoothly remove fumes from the stacked inter-wafer spaces, thereby facilitating removal of fumes from the wafers while achieving simple and quick introduction of the wafers.

Description

Rotating-type fume removing wafer storage < RTI ID = 0.0 >

The present invention relates to a rotary fume removal wafer storage.

The wafers, which have been processed in the process chamber during the semiconductor manufacturing process, are sequentially moved to and stacked on the wafer storage. The device in which a plurality of wafers can be stacked is wafer storage.

Examples of such wafer storage are the following patent documents.

In order to remove such fumes, a fume may be deposited on the surface of the wafer which is brought into the wafer storage and laminated. In order to remove such fumes, The apparatus is a fume removing apparatus for wafer storage, and an example thereof can be presented in the following Patent Registration No. 10-0678475.

However, according to the conventional rotary fume removal wafer storage, gas is blown from the air curtain installed on the upper side of the wafer storage, the gas descends inside the wafer storage and then exits through the lower part of the wafer storage, In the wafer storage, a plurality of wafers are supplied in a direction from the top to the bottom in a direction perpendicular to the direction in which the wafers are stacked for convenience of wafer insertion and stacking, so that fumes on the periphery of the wafer However, since the gas is not properly transferred to the stacked inter-wafer space, the fumes in the stacked inter-wafer space can not be properly removed.

Open Patent No. 10-2001-0086857, Disclosure Date: Sep. 15, 2001, Title of the Invention: Wafer Storage Box Registered Patent No. 10-0678475, Date of Registration: Jan. 29, 2007, Title of the invention: Wafer cleaning boat and storage thereof Patent Document 10-2015-0087703, Publication Date: May 30, 2015. Title of the Invention: Wafer storage device having gas filling part and semiconductor manufacturing device using the same

It is an object of the present invention to provide a rotary fume removal wafer storage capable of smoothly removing fumes in a stacked inter-wafer space.

According to an aspect of the present invention, there is provided a rotary fume removal wafer storage comprising: a fume removal case having an inlet through which a wafer is introduced; A wafer accommodating and rotating module rotatably installed in the fumigation case and capable of being stacked and accommodated while a plurality of wafers introduced through the inlet are spaced apart from each other; Rotating means capable of rotating the wafer housing rotation module in the fumigation case; And an air supply member installed in the fume removing case and capable of providing gas for removing fumes toward the wafer in the wafer housing rotation module,

And when the wafer is drawn into the wafer accommodating and rotating module through the inlet, the wafer accommodating and rotating module is rotated in the direction toward the inlet by the rotating means,

Wherein when the wafer is received in the wafer housing rotation module and fume removal is requested for the wafer housed in the wafer housing rotation module, gas supplied by the air supply member is supplied to the wafer holding rotation module And the wafer accommodating and rotating module is rotated by the rotating means so as to flow in the direction of the flow of the gas supplied by the air supplying member so as to flow into the respective spacing spaces between the wafer accommodating and rotating modules.

According to one aspect of the present invention, there is provided a rotary fume removal wafer storage apparatus comprising a fume removal case, a wafer storage rotation module, a rotating means, and an air supply member, When the wafer is brought into the wafer accommodating and rotating module, the wafer accommodating and rotating module is rotated by the rotating means in the direction toward the inlet, and the wafer is taken into the wafer accommodating and rotating module and stored in the wafer accommodating and rotating module And when the fume removal is required for the wafer, the gas supplied by the air supply member is allowed to flow into the respective spaced spaces between the wafers housed in the wafer housing rotation module, Wherein the module is provided with the air supply member So that the direction of the wafer housing rotation module can be changed when the wafer is taken in and when the wafer is removed from the wafer. Therefore, the wafer holding rotation module can be rotated in the upward and downward directions It is possible to smoothly remove the fumes in the inter-wafer space even when the gas for removing the fumes is supplied to the wafer, .

1 is a perspective view of a rotary fume removal wafer storage according to an embodiment of the present invention.
2 is a perspective view illustrating major components applied to a rotary fume removal wafer storage according to an embodiment of the present invention;
FIG. 3 is a perspective view showing a wafer receiving rotation module and rotating means applied to a rotary fume removing wafer storage according to an embodiment of the present invention; FIG.
FIG. 4 is a perspective view showing a disassembled state of a wafer receiving rotation module applied to a rotary type fumment removing wafer storage according to an embodiment of the present invention; FIG.

Hereinafter, a rotary type fume removal wafer storage according to an embodiment of the present invention will be described with reference to the drawings.

FIG. 1 is a perspective view of a rotary fume removal wafer storage according to an embodiment of the present invention, FIG. 2 is a perspective view showing major components applied to a rotary fume removal wafer storage according to an embodiment of the present invention, 3 is a perspective view showing a wafer receiving rotation module and rotating means applied to a rotary type fume removal wafer storage according to an embodiment of the present invention. FIG. 6 is a perspective view showing a housed rotating module disassembled. FIG.

1 to 4 together, the rotary type fume removal wafer storage 100 according to the present embodiment includes a fume removal case 110, a wafer storage rotation module 140, a rotation means 135, Member 105 as shown in FIG.

The fumen removal case 110 has the wafer storage rotation module 140 installed on the inner upper side and the air supply member 105 on the upper side of the outer side. Respectively.

The rotating means 135 can rotate the wafer housing rotation module 140 in the fumigation case 110, and a hydraulic motor or the like can be given as an example thereof.

The wafer receiving and rotating module 140 is rotatably installed in the fume removing case 110 and a plurality of wafers introduced through the inlet 101 are separated from each other and stacked.

The rotary type fume removal wafer storage 100 may include a rotation rail 130 formed in the fume removal case 110 and guiding rotation of the wafer storage rotation module 140.

The rotary rails 130 are formed in the form of a circular ring around the rotary shaft 136 of the rotary means 135 and are arranged on both sides of the wafer housing rotation module 140.

A rail groove 131 is formed on each inner surface of the rotary rail 130 facing the wafer housing rotation module 140 and a rotary roller 145 of a rotary roller member 144, The rotary roller member 144 can be moved along the rail groove 131 with the insertion of the rotary roller member 144 in the state shown in FIG.

When the wafer storage rotation module 140 is rotated by operating the rotation unit 135 as described above, the rotation roller member 144 is moved along the rotation rail 130, The wafer receiving and rotating module 140 can be rotated stably and smoothly around the rotating shaft 136 of the rotating means 135. [

The wafer storage and rotation module 140 includes a rotation connection member 141 connected to the rotation shaft 136 of the rotation unit 135 and connected to the rotation connection member 141, And a rotating roller member 130 for guiding the rotation of the rotation connecting member 141 and the wafer receiving member 150 while being rotated in engagement with the rotating rail 130 144).

The rotation connecting members 141 are formed as a pair and are disposed on both sides of the wafer receiving member 150, respectively. The rotation connecting member 141 is formed in a plate shape elongated in the vertical direction and is disposed on both sides of the wafer receiving member 150 in a vertical direction along each side of the wafer receiving member 150.

The rotating unit 135 is disposed on at least one side of the rotation linking member 141. The rotating unit 135 is fixed to the fume removing case 110 and the rotating unit 135 is rotated, (136) is connected to the rotation linking member (141). When the rotation shaft 135 of the rotation unit 135 is rotated according to the operation of the rotation unit 135, the rotation connection member 141 is rotated, so that the wafer rotation rotation module 140 So that it can be rotated as a whole.

The upper and lower portions of the pair of rotation linking members 141 are connected by an upper linking member 142 and a lower linking member 143 formed in a plate shape of a predetermined area, Both sides of the wafer receiving member 150 and the upper and lower portions of the wafer receiving member 150 are enclosed by the rotation connecting member 141, the upper connecting member 142 and the lower connecting member 143, Is opened.

The wafer receiving member 150 includes a laminated body 152 having a plurality of horizontally elongated gaps of a plurality of layers so that the wafers can be stacked and housed in the upper and lower portions while supporting the front corner of the laminated body 152 A front supporting body 151 connected to the respective front portions of the upper connecting member 142 and the lower connecting member 143 and an upper supporting member 151 supporting the rear corner of the laminated body 152, And a rear support 153 connected to the respective rear portions of the upper link member 142 and the lower link member 143, respectively.

A plurality of gaps formed in the stacked body 152 can be held by the front support 151 and the rear support 153 and the wafers can be accommodated in the gaps.

The rotating roller member 144 is disposed on at least one of the rotation linking member 141, the upper linking member 142 and the lower linking member 143 and the rotating roller 145 is rotatably connected The rotation roller 145 can be moved along the rail groove 131 while being inserted into the rail groove 131 of the rotary rail 130. Thus, When the wafer storage rotation module 140 is rotated, the rotation roller member 144 is rotated along the rotation rail 130 so that the rotation of the wafer storage rotation module 140 can be stably and smoothly performed do.

When the wafer is received in the wafer receiving and rotating module 140 through the inlet 101, the front of the wafer receiving member 150 is exposed to the inlet 101, The wafer receiving and rotating module 140 is rotated along the rotating rail 130 by the rotating means 135 so that the respective openings of the laminated body 152 are oriented in the direction toward the inlet port 101, 101 so that the wafers can be housed in the respective gaps of the stacked body 152.

When the wafer is received in the wafer housing rotation module 140 and the removal of the fumes from the wafer stored in the wafer housing rotation module 140 is requested, The wafer receiving and rotating module 140 is rotated along the rotating rail 130 such that the wafer receiving and rotating module 140 is opposed to the air supplying member 105 so that the gaps of the laminated body 152 are separated by the air supplying member 105 The gas supplied from the air supply member 105 can flow into the respective gaps of the stacked body 152 so as to face the air supply member 105 so as to face the flow direction of the supplied gas, The gas supplied by the air supply member 105 flows into each of the spaced spaces between the wafers accommodated in the wafer housing rotation module 140 so that the gas accommodated in each of the gaps of the stacked body 152 Each The fume-stained in Hyper is possible to be smoothly removed.

The air supply member 105 may be installed at an upper end of the outer side of the fumigation case 110 to provide gas for removing fumes downward toward the wafer in the wafer storage rotation module 140.

The rotary fume removal wafer storage 100 is provided with an exhaust hole member 120 (not shown) which is supplied by the air supply member 105 and through which the wafer containing rotation module 140 is passed, And an exhaust fan member 125 for exhausting gas through the exhaust hole member 120. [

The exhaust hole member 120 is disposed at a lower portion of the wafer housing rotation module 140 so that the gas supplied from the air supply member 105 disposed at the upper portion of the wafer housing rotation module 140, The fume attached to the wafer stored in the wafer housing rotation module 140 can be removed while being blown across the rotation module 140 and discharged to the outside through the exhaust hole member 120.

The exhaust fan member 125 forms a negative pressure in the exhaust hole member 120 so that the exhaust hole member 120 is smoothly exhausted.

The rotary type fume removal wafer storage 100 includes a temperature and humidity sensing member 160 capable of sensing temperature and humidity in the wafer storage rotation module 140.

The temperature and humidity sensing member 160 is installed in the wafer receiving and rotating module 140 so that the temperature and humidity in the wafer receiving and rotating module 140 can be sensed smoothly. And the like.

The temperature and humidity of the gas can be controlled by the air supply member 105 according to the temperature value and the humidity value sensed by the temperature / humidity sensing member 160 and supplied to the wafer storage rotation module 140. Thus, damage to the wafer, which may occur, for example, when the temperature difference between the gas applied in the air supply member 105 and the wafer in the wafer housing rotation module 140 is large, can be prevented.

For this operation, the air supply member 105 may include a temperature control means such as a heater and a humidity control means such as a humidifier.

Hereinafter, the operation of the rotary fume removing wafer storage 100 will be described with reference to the drawings.

When the wafer is brought into the wafer receiving and rotating module 140 for lamination, the wafer receiving and rotating module 140 is rotated in one direction by the rotating unit 135 to rotate the wafer holding rotation module 140 So that the respective openings are directed to the inlet (101). In this state, the wafer introduced through the inlet 101 is stacked in each of the gaps of the stacked body 152.

When the removal of the fume from the wafer is required after the completion of the stacking, the wafer storage rotation module 140 is rotated in the other direction by the rotation means 135 so that each gap of the stacked body 152 is separated from the air And is directed to the supply member 105. In this state, when the air supply member 105 is operated, the gas supplied from the air supply member 105 can be introduced into the gaps of the stacked body 152, As shown in FIG.

As described above, since the rotatable fume removal wafer storage 100 includes the fume removal case 110, the wafer storage rotation module 140, the rotation means 135 and the air supply member 105, When the wafer is brought into the wafer receiving and rotating module 140 through the inlet 101 of the wafer receiving and rotating unit 110, the wafer receiving and rotating module 140 is rotated by the rotating means 135 in the direction toward the inlet 101 And when the wafer is received in the wafer housing rotation module 140 and the removal of the fumes from the wafer stored in the wafer housing rotation module 140 is requested, the air is supplied by the air supply member 105 And the wafer receiving and rotating module 140 is rotated by the rotating means 135 so that gas can flow into the respective spaced spaces between the wafers housed in the wafer receiving rotation module 140. [ The rotation direction of the wafer receiving rotation module 140 can be changed when the wafer is taken in and when the wafer is removed from the wafer, Even if the gas for removing the fumes is supplied in the vertical direction substantially perpendicular to the wafer drawing direction, the fumes in the stacked inter-wafer space can be smoothly removed, and the fumes deposited on the wafers Removal can be smoothly performed.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the following claims And can be changed. However, it is intended that the present invention covers the modifications and variations of this invention provided they come within the scope of the appended claims and their equivalents.

According to one aspect of the present invention, fumments in a stacked wafer-to-wafer space can be smoothly removed by the rotary-type fume removal wafer storage, and thus the industrial applicability is high.

100: Rotary Fume Removal Wafer Storage
105: Air supply member
110: Fume removal case
120: Exhaust hole member
125: exhaust fan member
130: rotating rail
135: rotating means
140: wafer holding rotation module

Claims (7)

A fume removing case in which an inlet through which a wafer is introduced is formed;
A wafer accommodating and rotating module rotatably installed in the fumigation case and capable of being stacked and accommodated while a plurality of wafers introduced through the inlet are spaced apart from each other;
Rotating means capable of rotating the wafer housing rotation module in the fumigation case; And
And an air supply member installed in the fumigation case and capable of providing gas for removing fumes toward the wafer in the wafer housing rotation module,
And when the wafer is drawn into the wafer accommodating and rotating module through the inlet, the wafer accommodating and rotating module is rotated in the direction toward the inlet by the rotating means,
Wherein when the wafer is received in the wafer housing rotation module and fume removal is requested for the wafer housed in the wafer housing rotation module, gas supplied by the air supply member is supplied to the wafer holding rotation module Housed rotary module is rotated by the rotating means so as to be directed to the direction of the flow of the gas supplied by the air supply member so as to flow into the respective spaced spaces between the wafer storage rotary modules. The method according to claim 1,
The rotary fume removal wafer storage
And a rotation rail formed on the fume removing case and guiding rotation of the wafer storage rotation module,
The wafer storage rotation module
A rotation connecting member connected to the rotating shaft of the rotating means and rotatable,
A wafer accommodating member connected to the rotation linking member and rotatable together, the wafer accommodating member being capable of stacking the wafer,
And a rotating roller member for rotating the rotating connection member and the wafer receiving member while being rotated in engagement with the rotating rail. 3. The method of claim 2,
Wherein the rotary rails are formed in the form of a circular ring around the rotary shaft of the rotary means and are formed as a pair on both sides of the wafer storage rotary module. The method of claim 3,
Wherein the rotation connecting members are disposed on both sides of the wafer receiving member,
The upper and lower portions of the pair of rotation linking members are connected to each other by the upper linking member and the lower linking member such that the front and rear sides of the wafer accommodating member are opened while both side surfaces and the upper and lower portions of the wafer accommodating member are surrounded. Rotary Fume Removal Wafer Storage. 5. The method of claim 4,
And when the wafer is drawn into the wafer storage rotation module through the inlet, the wafer storage rotation module is rotated along the rotation rail such that the front of the wafer storage member faces the inlet,
When the wafer has been drawn into the wafer housing rotation module and the removal of the fumes from the wafer stored in the wafer housing rotation module is required, the front side of the wafer housing member is brought into contact with the air supply member Wherein the module is rotated along the rotating rail. 6. The method of claim 5,
The rotary fume removal wafer storage
An exhaust hole member which is supplied by the air supply member and through which the wafer containing rotation module is passed to exhaust gas containing fumes; And
And an exhaust fan member for exhausting gas through the exhaust hole member. The method according to claim 1,
The rotary fume removal wafer storage
And a temperature and humidity sensing member capable of sensing temperature and humidity in the wafer storage rotary module.
KR1020150142492A 2015-10-13 2015-10-13 Rotating-type fume removing wafer storage KR101600307B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020150142492A KR101600307B1 (en) 2015-10-13 2015-10-13 Rotating-type fume removing wafer storage

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020150142492A KR101600307B1 (en) 2015-10-13 2015-10-13 Rotating-type fume removing wafer storage

Publications (1)

Publication Number Publication Date
KR101600307B1 true KR101600307B1 (en) 2016-03-08

Family

ID=55534499

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150142492A KR101600307B1 (en) 2015-10-13 2015-10-13 Rotating-type fume removing wafer storage

Country Status (1)

Country Link
KR (1) KR101600307B1 (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010086857A (en) 2000-03-03 2001-09-15 윤종용 Wafer storage box
KR100678475B1 (en) 2005-03-16 2007-02-02 삼성전자주식회사 Wafer cleaning boat and storage having the same
KR20110041445A (en) * 2011-02-07 2011-04-21 우범제 Fume elimination apparatus and to use andsemiconductor manufacturing apparatus
KR20140088406A (en) * 2013-01-02 2014-07-10 (주) 세츠 Side storage chamber having fume disposal system
KR20150087703A (en) 2014-01-22 2015-07-30 삼성전자주식회사 Wafer storage apparatus having gas charging units and semiconductor manufacturing apparatus using the same

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010086857A (en) 2000-03-03 2001-09-15 윤종용 Wafer storage box
KR100678475B1 (en) 2005-03-16 2007-02-02 삼성전자주식회사 Wafer cleaning boat and storage having the same
KR20110041445A (en) * 2011-02-07 2011-04-21 우범제 Fume elimination apparatus and to use andsemiconductor manufacturing apparatus
KR20140088406A (en) * 2013-01-02 2014-07-10 (주) 세츠 Side storage chamber having fume disposal system
KR20150087703A (en) 2014-01-22 2015-07-30 삼성전자주식회사 Wafer storage apparatus having gas charging units and semiconductor manufacturing apparatus using the same

Similar Documents

Publication Publication Date Title
JP6679906B2 (en) EFEM
US20220246449A1 (en) Wafer treatment device
JP4560575B2 (en) Substrate processing apparatus and semiconductor device manufacturing method
KR102059725B1 (en) Substrate processing method and substrate processing apparatus
JP4634495B2 (en) Substrate processing apparatus and semiconductor device manufacturing method
KR101290980B1 (en) Substrate processing apparatus and method of manufacturing a semiconductor device
TWI670782B (en) Substrate liquid processing device
CN102738048A (en) Substrate processing apparatus
KR101894438B1 (en) Substrate liquid processing apparatus, exhaust switching unit and substrate liquid processing method
JP5370785B2 (en) Load port device
KR102407530B1 (en) Substrate liquid processing apparatus
JP2009010009A (en) Substrate processing apparatus and fabrication process of semiconductor device
KR102422391B1 (en) Substrate processing apparatus
CN105990196A (en) Clamp apparatus, substrate carry-in/out apparatus, and substrate processing apparatus
TW201533271A (en) Apparatus for treating surfaces of wafer-shaped articles
JP2015162531A (en) Pod and purge system using the pod
JP6679907B2 (en) Load port device and method for introducing cleaning gas into container in load port device
TWI651779B (en) Apparatus for treating surfaces of wafer-shaped articles
JP2008300444A (en) Semiconductor manufacturing apparatus
KR101600307B1 (en) Rotating-type fume removing wafer storage
JP5923197B2 (en) Substrate processing apparatus and semiconductor device manufacturing method
WO2014127499A1 (en) Processing system
JP5953951B2 (en) Vertical heat treatment apparatus and operation method of vertical heat treatment apparatus
JP2009004642A (en) Device for treating substrate
JP2008270266A (en) Substrate treatment equipment

Legal Events

Date Code Title Description
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20181211

Year of fee payment: 4

FPAY Annual fee payment

Payment date: 20191210

Year of fee payment: 5