KR101594020B1 - Manufacturing method of led tunnel light having function of waterproof - Google Patents

Abstract

The present invention relates to a method for manufacturing an LED tunnel light having a waterproof function, which includes: a first step of manufacturing an LED lighting lamp frame (100), an inner cover (210) and an outer cover (230) with an aluminum material through molding, wherein the LED lighting lamp frame (100) comprises an LED module combining part (120) which has a power source part (110) at a center and has an LED module combining hole combined with an LED module at both sides of the power source part; and a second step of assembling an LED module to the LED module combining hole (121) of the frame (100), and electrically connecting the assembled LED module to a power source of the power source part. The inner cover (210) and the outer cover (230) manufactured in the first step are combined with a bottom plane of the LED module combining part (120) sequentially, and a filter (220) is installed in the inner cover (210). According to the present invention, air ventilation to cool high heat generated in a radiator of a tunnel lamp structure is done well and permeation of moisture into the LED tunnel light structure is prevented.

Description

TECHNICAL FIELD [0001] The present invention relates to a manufacturing method of a LED tunnel having a waterproof function,

The present invention relates to an LED tunnel having a waterproof function, and more specifically, to prevent deterioration of heat radiation efficiency due to corrosion of a heat sink due to falling water caused by the tunnel ceiling condensation phenomenon, To a method of manufacturing an LED tunnel or the like with a cover having a waterproof function while being good.

Street lights and security lights using LED light sources, which are called mecas of modern lighting, are being positioned as highly efficient lighting lamps, and tunnel lights are being replaced by LED lighting lamps.

However, in the conventional LED tunnels, the heat dissipation portion of the LED module is exposed toward the tunnel ceiling portion in order to maximize the heat dissipation effect of the LED module mounted on the frame such as the LED tunnels due to the nature of the tunnel, which is not affected by the external weather. )

Water droplets generated by tunnel condensation, water leakage, etc. fall on the heat sink attached to the LED module, so that corrosion of the heat sink due to moisture promotes solidification of the sulfur component contained in the soot, As well as accelerating the corrosion of powder coatings coated on equipment such as LED tunnels, thereby shortening the lifetime of LED tunnels and the like.

In addition, due to environmental characteristics in the tunnel, microbial propagation due to moisture is vigorous and microbes pressed on the heat sink and the lens cause a problem that the projection efficiency of the LED module lens is lowered and the heat radiation efficiency of the heat sink is lowered.

Therefore, in order to maximize optical efficiency, which is an advantage of LED tunnels, it is inevitable to develop a cover that does not interfere with heat dissipation while having a waterproof function against falling of a tunnel ceiling.

No. 10-1509500 entitled " Extended Array LED Tunnel Light Device "

Accordingly, it is an object of the present invention to provide a LED tunnel which has a waterproof function and does not reduce the heat radiation effect by providing a cover that protects the heat radiator, which is an essential component of the LED tunnel, from the dripping water falling from the tunnel, .

In order to achieve the above object, the present invention provides an LED module coupling part 120 having a power supply part 110 at the center and an LED module coupling hole 121, A first step of fabricating each of the lamp frame 100, the inner cover 210 and the outer cover 230 with an aluminum material and the LED module coupling hole 121 of the frame 100, A second step of electrically connecting the inner cover 210 and the outer cover 230 manufactured by the first step to the lower surface of the LED module coupling part 120, A LED 220 having a waterproof function is manufactured through three steps in which a filter 220 is mounted.

The LED module of the second stage forms a via hole 540 through the upper copper surface 520 of the PCB assembly 400 through the LED device heat sink bonding copper surface 522 and the lower copper foil surface 530 A step 2-b of forming the copper film 550 by copper plating and an inner diameter of the via hole 540 and a step of forming a silver (Au) film on the Sn chip in the via hole 540 in which the copper film 550 is formed, C) forming the heat transfer medium 600 of the LED module through the second-c step of forming the heat transfer medium 600 coated with Ag.

The present invention provides a cover having a waterproof function for structurally preventing moisture from penetrating into a mechanism such as a tunnel, while ventilation for cooling high heat generated in a heat radiator of a tunnel or the like is well performed, thereby maximizing the efficiency of an LED tunnel or the like But also has an effect of extending the service life.

1 is a perspective view of an apparatus such as a conventional LED tunnel.
2 is a perspective view of the LED tunnel of the present invention.
3 is a block diagram of the LED tunnel of the present invention.
4 is a frame perspective view of the LED tunnel of the present invention.
5A is a perspective view of an inner cover of the LED tunnel of the present invention.
5B is a sectional view (A-A 'sectional view in FIG. 5A) of the inner cover of the LED tunnel of the present invention,
6 is a filter perspective view of the LED tunnel of the present invention.
7A is a perspective view of an outer cover of the LED tunnel of the present invention.
7B is a front view of an outer cover of the LED tunnel of the present invention.
8 is a structural view of a heat dissipation system including a heat transfer medium such as the LED tunnel of the present invention.
9 is a flowchart illustrating a method of manufacturing an LED tunnel according to an embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

In the present invention, the term 'LED module' refers to a light source device comprising a plurality of LED elements, which is an LED device mounted on a PCB, and is a light emitting means for effectively converting electrical energy into light energy by means of a light-

The 'LED tunnel' or the like includes a power unit for effectively emitting light emitted from a plurality of LED modules, assembling the LED modules to be assembled and supporting the LED modules, It is a lighting fixture that fixes the light to the tunnel ceiling to effectively illuminate the light emitted from the LED module on the road.

In a conventional LED lighting lamp, heat dissipating means is provided to effectively cool high heat generated in an LED element. In an LED tunnel installed in a tunnel, a heat dissipation means is usually exposed to the outside, It was set.

However, in such LED tunnels and the like, the heat dissipation means is corroded by water drops falling from the tunnel ceiling due to condensation or leakage, and the durability is reduced, and the efficiency of LED tunnels is lowered due to the deterioration of heat radiation efficiency.

In addition, the structure of conventional LED tunnels and the like expose the LED module to nitrogen oxides generated in automobile soot, thereby over-accelerating the corrosion of the LED module (particularly, the heat sink), thereby shortening heat dissipation efficiency and durability.

In order to solve the above problem, the present invention has a waterproof function to prevent the heat dissipating means, which is an essential component of the LED module installed in the LED tunnel or the like, from being exposed to water or soot while the ventilation for effective heat dissipation of the heat dissipating means It is equipped with a cover to prevent interference.

The overall structure of the LED tunnel 10 or the like with the cover is shown in Fig.

3 is a layout perspective view of a LED tunnel or the like having a waterproof cover. In the LED tunnel, a power supply unit 110 for supplying electric energy to the LED module is disposed at the center, and a plurality of LED modules can be connected to both sides of the power supply unit 110 And a cover 200 for preventing water from being flooded to the LED module is formed on the back surface of the LED module coupling part 120 of the frame 100 and the frame 100 on which the LED module coupling part 120 is located .

The cover 200 is coupled to the back side of the LED module, that is, the heat sink 700. The cover 200 includes an inner cover 210 and an outer cover 230, A filter 220 may be provided between the cover 230 and the upper surface of the inner cover 210 to prevent the intake of automobile soot into the LED tunnel or the like.

Referring to FIG. 3 through FIG. 7B, each of the components, such as the tunnel,

The lower surface of the power source unit 110 located at the center of the frame (hereinafter referred to as "lower surface" refers to the tunnel floor direction (road surface direction) The ceiling direction is referred to as a ceiling direction), a power supply cover 111 for repairing the power supply unit is coupled by a cover hinge 112.

The radiating fin 113 is formed on the upper surface of the power unit 110 for enhancing the mechanical strength of the radiating effect and the outer surface of the power unit and the radiating fin 113 is formed to be long in the road lane. The ventilation groove 233 of the outer cover 230 is aligned with the direction of the ventilation groove 233 of the outer cover 230 to improve the air permeability of the LED tunnel or the like.

LED module coupling parts 120 having LED module coupling holes 121 to which LED modules are coupled are provided on both sides of the frame 100, that is, both sides of the power source part 110.

 Although four LED module coupling holes 121 are arranged in each of the LED module coupling portions 120, the number of the LED module coupling holes 121 may be changed as necessary.

In the LED module coupling hole 121, an LED module including a plurality of LED elements and a heat dissipator and converting and converting electric energy into light is assembled and coupled.

The LED module is a light emitting source using an LED element, a light distribution lens, a power conversion device for starting an LED element, etc. mounted on a PCB in a LED lighting lamp, and a conventional LED element having a heat dissipating body coupled to a back surface of the PCB.

 The cover 200 coupled to the back surface or upper surface of the LED coupler 120 includes an inner cover 210 and an outer cover 230.

As shown in FIGS. 5A and 5B, the inner cover includes an inner cover side surface 212 opened at a portion contacting the power source unit 110, an upper end portion of the inner cover side surface 212 and an inner cover upper surface And a central portion of the inner cover upper surface 211 is formed with an air vent 213 protruding at a height h higher than the inner cover upper surface 211. The air vent 213 is provided with a heat dissipation device A slit 214 for dissipating the heat radiated from the sieve to the outside is formed.

7A and 7B, the outer cover 230 includes an outer cover side surface 232, the outer cover side surface 232 and the outer cover upper surface 231, and the outer cover side surface 232 232 have side surface ventilation grooves 233 formed therein.

Here, the side surface ventilation grooves 233 are formed so that ventilation paths can be formed in the tunnel longitudinal direction, that is, in the road lane direction.

The LED module heat dissipating body 210 is disposed on the upper surface 211 of the inner cover 210 through the slits 214 formed in the inner cover 210, The heat is radiated to the outside through the side surface ventilation grooves 233 of the outer cover 230 in which the ventilation path is formed in the lane direction.

The air passage in the lane formed by the side surface ventilation grooves 233 formed in the outer cover 230 is formed between the fin and the fin of the radiating fin 113 formed in the lane on the upper surface of the power source unit 110 It is porous and permeable without clogging.

The air vent 213 formed at the center of the inner cover upper surface 211 protrudes at a height h more than the inner cover upper surface 211. This is because the water drops falling from the tunnel ceiling on the outer cover 230 230 formed on the top surface 211 of the inner cover to prevent penetration into the LED module through the slit 214 formed in the vent 213 of the inner cover upper surface 211, It is preferable that the base portion 213 is formed so as to protrude from the cover upper surface 211 by a predetermined height h and the projecting height is 1 to 3 mm. However, considering the normal tunnel environment such as wind velocity in the tunnel, It is more preferable for smooth ventilation.

A filter 220 may be mounted on the inner cover 210 to prevent the soot in the tunnel from being sucked into the LED module coupling portion.

By providing the filter 220, it is possible to prevent the LED module, particularly the heat sink, from being corroded by the sulfur component contained in the soot.

The filter 220 is made of a steel material having a good thermal conductivity and is made of a filter material capable of transferring internal heat to the outside while filtering out the sulfur components of the soot by superposing the iron wires in a cross- Is more preferable.

Further, in order to effectively dissipate heat of the LED tunnel of the present invention, the heat generated from the LED element is efficiently dissipated through the heat transfer medium 600 between the LED element heat dissipation point 19 and the heat dissipation body 700.

The heat transfer medium 600 penetrates between the LED element heat dissipation point bonded copper surface 522 of the upper copper surface 520 of the PCB assembly 400 and the FR-4 material intermediate layer 510 and the lower copper surface 530 A copper film 550 is formed on the inside diameter of the via hole 540 by Cu plating and the tin (Sn) is filled in the center of the via hole where the copper film is formed, (610).

The copper film 550 formed in the via hole 540 is electrically connected to the LED element heat dissipation point bonding copper surface 522 of the upper copper foil surface 520 of the PCB assembly 400 by the heat conductive means, And conveys the heat accumulated between the upper side of the assembly 400 and the globe to the heat sink 700 coupled to the lower copper surface 530 of the PCB assembly 400.

A heat transfer medium 600 filled with tin (Sn) interposed in the space of the copper film 550 and coated on the tin surface with a silver (Ag) film is disposed between the heat dissipation point 19 of the LED device and the PCB assembly 400 And is connected between the heat sinks 700 coupled to the lower copper foil surface 530 to conduct the high heat generated in the LED devices to the heat sink 700. [

The heat transfer medium 600 will be described in detail.

8, two via holes 540 each having a diameter of 0.7 to 0.9 mm are formed on the upper copper surface 520 of the PCB assembly 400 in order to form the heat transfer medium 600, And is formed so as to pass between the LED element heat dissipation point bonding copper surface 522 and the lower copper surface 530.

In order to form two via holes 540, it is preferable to form two via holes 540 on the condition of the LED chip mounted on the circuit pattern formed on the PCB assembly 400, and it is preferable that the diameter is 0.8 mm (See FIG. 8).

 Two via holes 540 having a diameter of 0.8 mm are formed at each place where the LED element 10 as a light source is located, considering that the thermal conductivity of the via hole 540 depends on the surface area of the heat conduction medium due to the characteristics of heat conduction. It is preferable to form two via holes 540 smaller than one large via hole 540 in the area of the heat sink bonding copper surface 522 of the LED element 10 on the upper copper surface 520 of the PCB assembly 400, This is because the efficiency is high.

The components of the heat transfer medium 600 will be described in detail.

The copper film 550 is formed on the via hole 540 by copper plating so that the copper film 550 is electrically connected to the LED element heat radiation point bonding copper surface 522 of the upper copper foil surface 520 of the PCB assembly 400, The surface 530 is a heat conduction means.

In addition, in addition to the heat dissipation point 19 of the LED element contacting the LED element heat dissipation point junction copper surface 522 of the upper copper surface 520 of the PCB assembly 400 and the heat dissipator body 700 are inserted into the space of the copper film 550 of the via hole 540 to form an effective and economical heat conduction means by inserting the silver-coated tin or the thermal conduction medium 600 thereinto.

It is preferable that the copper film 550 formed on the via hole 540 is formed to a thickness of 25 to 35 탆, preferably 30 탆.

This is because the copper plating for forming the copper film in the via hole 540 and the cream solder composed of tin (Sn) and silver (Ag) filled in the inner space of the copper film 550 of the via hole 540 are melted and fixed by high heat The condition that the silver (Ag) film is effectively coated on the surface of the tin (Sn) is taken into consideration.

Hereinafter, a process of forming the heat transfer medium 600 on the PCB assembly 400 will be described.

 The via hole 540 is formed by a press punching machine or the like between the copper chip bonding surface 522 and the lower copper bonding surface 530 of the copper chip surface 520 on the PCB assembly 400.

A copper film 550 is formed on the inside of the through-hole 540 by copper plating.

The process of forming silver (Ag) coated tin (Sn) inside the via hole 540 in which the copper film is formed is as follows.

A tin (Sn) chip coated with a silver film is formed by plating a tin (Sn) chip corresponding to the size of the via hole 540 formed with the copper film 550 with silver (Ag) (Sn) chip coated with a silver film is interposed in the via hole 540 by inserting the copper film 540 into the via hole 540 in which the copper film 550 is formed.

On the other hand, cream solder formed by mixing 4% of tin (Sn) and 96% of silver (Ag) is filled in the inner space of the via hole 540 where the copper film 550 is formed.

When silver (Ag) component having a high thermal conductivity and a low occupancy rate is fused to the copper film 550 by applying heat at a constant temperature to the copper film 550 filled with the cream solder, silver (Ag) having low attraction at the time of melting So that tin (Sn) is melted and embedded in the silver (Ag) coating. That is, when the cream solder filled in the copper film 550 is melted by heating, the outer surface of the tin (Sn) is coated with the silver (Ag) to fix the tin (Sn) chip to the shape .

The cream solder is first injected onto the double-sided board 500 using a metal mask before mounting the LED chip.

The heating means may have various forms, but it is preferable that the heating means is a reflow used for soldering the PCB assembly 400.

The reason why the cream solder is composed of tin (Sn) 96% silver (Ag) 4% is that when the copper and silver components of the silver (Ag) to be formed on the surface of the tin chip of the heat transfer medium 600, As shown in Fig.

The heat transfer medium 600 coated with the silver (Ag) film on the tin (Sn) chip is formed of tin and silver, and forms a good thermal conductive silver on the surface of the heat transfer medium in which heat conduction and heat dissipation occur. .

If the heat transfer material 600 is formed only of tin (Sn), the tin is melted due to the high temperature of the LED chip heat dissipation point due to the physical properties of the tin having a low melting point and flows out of the via hole 540, It can damage the characteristics.

However, since the heat transfer medium 600 coated with a silver (Ag) film on the tin (Sn) chip forms a film of silver (Ag) having a melting point higher than that of tin (Sn) on the outer surface of the structure, Even when the tin component of the medium 600 melts, the tin component of the heat transfer medium 600 does not flow out of the via hole due to the silver (Ag) film formed on the outer surface with a high melting point, The electrical circuit characteristics of the semiconductor device 400 are prevented from being damaged.

The high heat generated from the LED light source is transmitted to the lower copper (Cu) foil 530 of the PCB assembly 400 by the heat transfer medium 600 contacting the heat dissipation point 19 of the LED chip, The heat generated by the LED chip is conducted to the heat sink 700 through the heat transfer medium 600 by being conducted to the heat sink 700 and dissipated.

The high heat generated in the LED element conducted to the heat sink 700 is radiated to the outside by the convection action. The upper surface vent 213 of the inner cover 210 and the side ventilation grooves 233 of the outer cover 230 It is a flow that flows out to the outside.

Fig. 9 shows a flow chart illustrating a manufacturing method such as a LED tunnel having a waterproof function.

Referring to FIG. 9, in a manufacturing method such as a LED tunnel having a waterproof function,

An LED lighting module frame 100 and an inner cover 210 having a LED module coupling part 120 formed with a power module 110 at the center and an LED module coupling hole 121 formed at both sides of the power module, And the outer cover 230 are made of an aluminum material,

A second step of assembling the LED module to the LED module coupling hole 121 of the frame 100 and electrically connecting the LED module to the power source,

The inner cover 210 and the outer cover 230 manufactured in the first step are sequentially connected to the upper surface of the LED module coupling part 120 and the filter 220 is mounted on the inner cover 210 And LED tunnels with waterproof function.

The structure of the frame 100, the inner cover 210, and the outer cover 230 manufactured in the first step has been described in detail above. Since the mold making method using the same structure is a general mold making method, Is omitted.

The LED module of the second stage after the first stage penetrates the upper copper surface 520 of the PCB assembly 400 through the LED element heat dissipation point bonding copper surface 522 and the lower copper surface 530 to form the via hole 540, 2-a < / RTI >

A step 2-b for forming the copper film 550 by copper plating on the inner diameter of the via hole 540 formed between the copper chip bonding surface 522 of the upper copper foil surface 520 and the lower copper foil surface 530 ,

A step 2-c of forming a heat transfer medium 600 coated with a silver (Ag) film on a tin (Sn) chip in a via hole 540 in which the copper film 550 is formed to manufacture an LED tunnel having a waterproof function, You may.

The formation of the heat transfer medium 600 in the step 2-c is performed by filling cream solder mixed with tin (Sn) and silver (Ag) in a via hole 540 in which the copper film 550 is formed and heating.

The number of the via holes 540 formed through the upper copper face 520 of the PCB assembly 400 between the LED element heat dissipating point bonding copper face 522 and the lower copper face 530 is two, The thickness of the copper film 550 in the via hole 540 is 25 to 35 占 퐉 and the thickness of the silver (Ag) film of the heat transfer medium 600 is 3 to 5 占 퐉.

The heating means in step 2-c heats through reflow (REFLOW) for PCB assembly 400 solder.

While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments. Therefore, the scope of the present invention should not be limited by the described embodiments, but should be determined by the scope of claims and equivalents thereof.

100: frame 110:
111: power supply cover 112: cover hinge
113: radiating fin 120: LED module connecting part
121: LED module coupling hole 200: cover
210: inner cover 211: inner cover upper surface
222: inner cover side surface 223:
224: Slit 220: Filter
230: outer cover 231: outer cover upper surface
232: outer cover side surface 233: side surface vent groove
400: PCB assembly 500: double-sided board
510: intermediate layer of FR-4 material 520: upper copper foil surface
522: LED chip heat sink bonding copper surface 530: lower copper surface
540: via hole 550: copper film
600: heat transfer medium 610: silver (Ag) film
620: tin 700: heat sink

Claims (12)

In a manufacturing method such as a LED tunnel having a waterproof function,
And a LED module coupling part 120 having a LED module coupling hole 121 in which a power source unit 110 is disposed at the center and LED modules are coupled to both sides of the power source unit, And the outer cover 230 are made of an aluminum material,
A second step of assembling the LED module to the LED module coupling hole 121 of the frame 100 and electrically connecting the LED module to the power source,
The inner cover 210 and the outer cover 230 manufactured in the first step are sequentially connected to the upper surface of the LED module coupling part 120 and the filter 220 is mounted on the inner cover 210 Lt; / RTI >
The inner cover 210 includes an inner cover side surface 212 having one side opened and a slit 214 provided on the inner cover upper surface 211 which is bent and connected to the upper end of the inner cover side surface 212, (213) is formed,
The outer cover 230 includes an outer cover side surface 232, an outer cover side surface 232 and a curved outer cover upper surface 231, And a side surface ventilation groove (233) is formed in the surface of the side wall surface (231).
delete The method according to claim 1,
Wherein the vent portion (213) protrudes from the inner cover upper surface (211).
The method of claim 3,
Wherein the side surface ventilation groove (233) is formed in a lane in the tunnel.
5. The method of claim 4,
Wherein the ventilation part (213) formed on the inner cover upper surface (211) is protruded 2 mm higher than the inner cover upper surface (211).
6. The method of claim 5,
Wherein the filter (220) is formed of an iron material.
The method according to claim 6,
Wherein the heat radiating fins (113) are formed on the upper surface of the power supply unit (110) in the lane of the tunnel.
8. The method of claim 7,
Wherein a power supply cover (111) is formed on a lower surface of the power supply unit (110) by a cover hinge (112) so as to be openable and closable.
10. The method according to any one of claims 1 to 9,
The LED module of the second stage is a member for forming a via hole 540 through the upper copper surface 520 of the PCB assembly 400 between the LED element heat dissipation point junction copper surface 522 and the lower copper surface 530 2-a step,
A second-b step of forming a copper film 550 by copper plating on the inner diameter of the via hole 540,
And a second-c step of forming a heat transfer medium 600 coated with a silver (Ag) film on a tin (Sn) chip in a via hole 540 in which the copper film 550 is formed. .
10. The method of claim 9,
In the formation of the heat transfer medium 600 in the second-c stage, the cream solder mixed with tin (Sn) and silver (Ag) is filled in the via hole 540 formed with the copper film 550 and heated during soldering through reflow Wherein the light emitting diode is formed by a light emitting diode.
11. The method of claim 10,
The number of the via holes 540 formed to penetrate between the LED element heat dissipation point bonding copper surface 522 and the lower copper foil surface 530 of the PCB assembly 400 is 2, the diameter of the via hole 540 is 0.8 m, Wherein the thickness of the copper film (550) in the second dielectric layer (540) is 25 to 35 占 퐉.
12. The method of claim 11,
Wherein a thickness of the silver (Ag) film of the heat transfer medium (600) is 3 to 5 占 퐉.

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