KR101581687B1 - 3-dimentional laminate dielectric resonator assembly duplexer - Google Patents

Abstract

The present invention relates to a dielectric duplexer of a three-dimensional laminated structure, comprising a first dielectric resonator group and a second dielectric resonator group in which a plurality of dielectric blocks are stacked, a first dielectric resonator group in which each dielectric resonator group is symmetrically positioned, A connection dielectric block for connecting the uppermost dielectric block of the block and the second dielectric resonator group, a connection terminal for attaching a signal to the lower end of each dielectric resonator group and the upper end of the connection dielectric block to transmit a signal, And a coupling window connecting the uppermost dielectric block of each dielectric resonator group and the coupling dielectric block, thereby miniaturizing the dielectric duplexer that can be used at high power.

Description

The present invention relates to a three-dimensional laminate dielectric resonator assembly duplexer,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a dielectric duplexer having a three-dimensional laminated structure, and more particularly, to a dielectric duplexer for high frequency use having a plurality of dielectric blocks stacked in a three-dimensional structure and having excellent insertion characteristics and attenuation characteristics.

As the information and communication technology has developed dramatically, the demand for the high frequency band wide area communication system is increasing rapidly. Accordingly, there is a demand for a small duplexer that can operate at high power and has high temperature stability of frequency.

The waveguide dielectric duplexer is a filter using the resonance characteristics of a waveguide resonator and is widely used as a component of an RF (radio frequency) device such as a communication device and a repeater because it is very suitable for such a requirement. The waveguide dielectric duplexer has a resonance characteristic even at a high frequency as compared with a filter using a general LC circuit, has high temperature stability of frequency, and is able to withstand high operating power.

A commonly used dielectric duplexer uses the simplest TEM mode, resulting in a lower quality factor Q and lower insertion characteristics. Moreover, it is difficult to withstand high output, and is used only for low power applications of 1 W or less and has a problem of a large radiation loss.

In order to solve this problem, a dielectric ceramic duplexer has appeared. However, there is still a problem that the insertion characteristic and the attenuation characteristic of the duplexer are remarkably deteriorated due to the field emission between the electrode and the microstrip line at the center and both ends of the dielectric ceramic duplexer Remains. Also, when the size of the input / output signal is large, for example, the electrode is liable to be damaged from being detached from the dielectric duplexer.

Under these circumstances, market trends are moving toward requiring dielectric duplexers that are small in weight for high power and maintain insertion and attenuation characteristics.

 MICROWAVE AND RF DESIGN OF WIRELESS SYSTEMS, David M. Pozar, Wiley. 2004.

A first object of the present invention is to provide a dielectric duplexer of a three-dimensional laminated structure having excellent insertion characteristics and damping characteristics, which can be used for high power, and is simple in shape and small in size.

A second problem to be solved by the present invention is to provide a communication relay apparatus using the dielectric duplexer of the three-dimensional laminated structure.

According to an aspect of the present invention, there is provided a dielectric duplexer comprising: a first dielectric resonator group and a second dielectric resonator group which are formed by stacking a plurality of dielectric blocks; A connection dielectric block connecting the uppermost dielectric block of the first dielectric resonator group and the uppermost dielectric block of the second dielectric resonator group such that the first dielectric resonator group and the second dielectric resonator group are symmetrically located; A connection terminal connected to a lower end of each of the dielectric resonator groups and an upper end of the connection dielectric block to transmit a signal; And a coupling window connecting between the dielectric blocks of each dielectric resonator group and between the top dielectric block of each dielectric resonator group and the connection dielectric block.

The connection terminal of the dielectric duplexer according to another embodiment of the present invention has a cylindrical hole structure having a predetermined depth and the inside of the hole structure may be coated with a conductive material to form a hole electrode .

The dielectric duplexer according to another embodiment of the present invention is divided into a conductive coating layer and an uncoated region. The conductive coating layer is formed on the outer surfaces of all the dielectric blocks constituting the dielectric duplexer except for the portion forming the hole electrode, And the non-coated region may be formed between the hole electrode and the conductive coating layer.

The connection terminal of the dielectric duplexer according to another embodiment of the present invention can determine the depth of the cylindrical hole according to the pass bandwidth of the signal.

The dielectric duplexer according to another embodiment of the present invention may further include a microstrip line substrate coupled to a bottom surface side of the lowermost dielectric block of each of the dielectric resonator groups, And the conductive coating layer may be electrically connected to the ground of the microstrip line substrate.

The dielectric duplexer according to another embodiment of the present invention may further include a conductive pin inserted into the hole electrode to electrically connect the hole electrode and the microstrip line.

The connection terminal of the dielectric duplexer according to another embodiment of the present invention may be deformed into a straight line or a curved line.

The coupling windows of the dielectric duplexer according to another embodiment of the present invention may have different positions of adjacent coupling windows.

The dielectric duplexer according to another embodiment of the present invention may be a ceramic dielectric duplexer.

In order to solve the second problem, a communication repeater including the dielectric duplexer of the three-dimensional laminated structure according to an embodiment of the present invention is provided.

According to the present invention, the dielectric duplexer having a three-dimensional laminated structure formed by mutually coupling two dielectric resonator groups and a plurality of dielectric resonator blocks each having a plurality of dielectric blocks stacked has the center of the dielectric block and the input / It is possible to solve the radiation problem and provide very excellent insertion characteristics and attenuation characteristics.

1A is a diagram illustrating a coaxial dielectric duplexer.
1B is a cross-sectional view taken along line 1B-1B of FIG. 1A.
2 is a diagram illustrating a dielectric ceramic duplexer.
3 is a perspective view illustrating a dielectric duplexer of a three-dimensional laminated structure according to an embodiment of the present invention.
4 is a diagram showing a connection relationship between a plurality of dielectric blocks in the embodiment of FIG.
5 is an experimental example of a frequency characteristic graph of a transmission terminal measured using the dielectric duplexer of FIG.
6 is an experimental example of a frequency characteristic graph of a receiving end measured using the dielectric duplexer of FIG.

Prior to describing the embodiments of the present invention, the characteristics and problems of the duplexer utilized in the prior art dielectric duplexer technology are discussed, and technical solutions adopted by the embodiments of the present invention are broadly described I want to introduce.

FIG. 1A is a diagram illustrating a coaxial dielectric duplexer 10 used in the technical field of the present invention, and FIG. 1B is a sectional view 20 taken along line 1B-1B of FIG. 1A. Since the coaxial dielectric duplexer 10 implements coupling between the resonators by the capacitance (capacitance) formed between the upper surface electrode patterns 16 on the upper surface, the distance between the upper surface electrode patterns 16 is small, The power handling capacity is small because insulation breakdown of the capacitor occurs. That is, since this type of coaxial dielectric duplexer uses the simplest TEM mode, it has a low quality factor Q and low insertion characteristics, and is difficult to withstand high output, and is used only for low power applications of 1 W or less. In order to compensate for this, the radiation loss is still large even if a metal can is installed.

2 is a diagram illustrating a dielectric ceramic duplexer 100 used in the technical field of the present invention. The dielectric ceramic duplexer 100 includes a substrate 102, a dielectric waveguide type filter (hereinafter referred to as a transmission filter) 110, a reception dielectric waveguide type filter (hereinafter referred to as a reception filter) 150, (Not shown). Since the transmission filter 110 and the reception filter 150 use different frequencies, the transmission filter 110 and the reception filter 150 must be spatially separated from each other. Therefore, the transmission filter 110 and the reception filter 150 are arranged in parallel and connected by the power supply part 132 as shown in the figure. Although the disadvantages of the coaxial dielectric duplexer of FIG. 1 have been overcome to some extent in accordance with the structural features of such a dielectric ceramic duplexer, there still remains a problem with insertion characteristics and attenuation characteristics. Particularly, because there is field emission between the electrode and the microstrip line at the center and both ends of the dielectric ceramic duplexer, the insertion characteristics and attenuation characteristics of the duplexer are significantly reduced. Further, when the size of the input / output signal becomes large, for example, the electrode tends to fall from the dielectric duplexer and the like.

Therefore, the embodiments of the present invention, which will be described below, propose a three-dimensional laminated dielectric duplexer which is used in the TE mode and which can be miniaturized and which has excellent insertion and damping characteristics while being capable of withstanding high output.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. It will be apparent to those skilled in the art, however, that these examples are provided to further illustrate the present invention, and the scope of the present invention is not limited thereto.

BRIEF DESCRIPTION OF THE DRAWINGS The above and other features and advantages of the present invention will become more apparent from the following detailed description of the present invention when taken in conjunction with the accompanying drawings, It is to be noted that components are denoted by the same reference numerals even though they are shown in different drawings, and components of different drawings can be cited when necessary in describing the drawings. In the following detailed description of the principles of operation of the preferred embodiments of the present invention, it is to be understood that the present invention is not limited to the details of known functions and configurations thereof, and that other matters may unnecessarily obscure the present invention. A detailed explanation is omitted.

3 is a perspective view showing a dielectric duplexer 300 of a three-dimensional laminated structure according to an embodiment of the present invention. The dielectric duplexer 300 includes a plurality of dielectric blocks 310, a connection terminal 320, and a coupling window 330. 4 is a diagram showing a connection relationship between a plurality of dielectric blocks 310 in the embodiment of FIG. Referring to FIG. 4, it can be seen that the first dielectric resonator group 311, the second dielectric resonator group 312, and the connection dielectric block 313 are formed of the dielectric block 310.

A plurality of dielectric blocks 310 are stacked to form a first dielectric resonator group 311 and a second dielectric resonator group 312, respectively. The number of dielectric blocks 310 stacked on each of the dielectric resonator groups 311 and 312 may be determined according to a resonance frequency characteristic of a signal passing through the dielectric duplexer 300. The dielectric block 310 may be formed in the form of a rectangular waveguide as in the present embodiment, but other types of dielectric blocks may be used. It is possible to form a dielectric duplexer having a three-dimensional laminated structure different from that of the above embodiment by making the shape of the dielectric block different. Also, the dielectric resonator group may be one or more depending on the type of the dielectric duplexer. Accordingly, in one embodiment according to the present invention, a simple type dielectric duplexer is implemented as a group of two dielectric resonators.

The connection dielectric block 313 is arranged such that the first dielectric resonator group 311 and the second dielectric resonator group 312 are symmetrically located such that the top dielectric block 310 and the second dielectric resonator group 311 of the first dielectric resonator group 311 are symmetrically positioned. 0.0 > 310 < / RTI >

The connection terminals 320 are attached to the lower ends of the dielectric resonator groups 311 and 312 and the upper end of the connection dielectric block 313, respectively, and serve to transmit signals. The connection terminal 320 may be deformed into a linear shape or a curved shape.

The connection terminal 320 has a cylindrical hole structure having a predetermined depth and the inside of the hole is coated with a conductive material to form a hole electrode. This hole electrode can extend to the bottom surface of the dielectric block 310 near the hole. Also, the depth of the hole of the connection terminal 320 can be determined according to the pass bandwidth of the signal passing through the dielectric duplexer 300.

The dielectric duplexer 300 is divided into a conductive coating layer and an uncoated region. The conductive coating layer is formed by coating the outer surface of all the dielectric blocks 310 except for the portion constituting the Hall electrode composed of the connection terminal 320 with a conductive material . At this time, an uncoated region is formed between the hole electrode and the conductive coating layer so that they are not electrically connected to each other. For example, the conductive material is a material having high conductivity such as silver (Ag) or aluminum (Al). In addition, a conductive material may be coated on the outer surface of the dielectric block 310 by vacuum deposition or the like to form a conductive coating layer.

There is a coupling window 330 for connecting between the dielectric blocks 310 of each dielectric resonator group 311 and 312 and between the top dielectric block 310 and the connection dielectric block 313 of each dielectric resonator group 311 and 312 . The coupling window 330 connects the dielectric blocks 310 and transmits a signal through the dielectric material. The coupling window 330 may be implemented in a '?' Pattern as in the embodiment of the present invention. Further, the size and the pattern of the coupling window 330 can be variously implemented.

The plurality of coupling windows 330 of the dielectric duplexer may differ in the position of each adjacent coupling window. This forms a structural form for minimizing interference since there is room for interference when the coupling window 330 is positioned facing. Referring to FIG. 3, it can be seen that adjacent coupling windows 330 are not located at the same position, and are located at distant locations, thereby minimizing interference.

The dielectric duplexer according to another embodiment of the present invention may further include a microstrip line substrate coupled to a bottom surface side of the lowermost dielectric block of each dielectric resonator group. The microstrip line substrate is electrically connected to each connection terminal attached to the lowermost dielectric block of each dielectric resonator group, and the conductive coating layer is electrically connected to the ground of the microstrip line substrate.

The conductive pin may further include a conductive pin in the embodiment including the microstrip line substrate, and the conductive pin may be inserted into the hole electrode to electrically connect the hole electrode and the microstrip line.

The height of the dielectric block of the dielectric duplexer can be varied according to the size of the entire dielectric duplexer. As a result, miniaturized dielectric duplexers can be manufactured and integrated in a semiconductor circuit.

The dielectric duplexer may be a ceramic dielectric duplexer. Ceramic is used to withstand a high output due to its high dielectric constant. In the embodiment of the present invention, a dielectric duplexer is implemented using ceramic having a dielectric constant of 37.

The dielectric duplexer may further include a coaxial connector. The coaxial connector is fixed to the bottom of the bottom dielectric block and the connecting dielectric block of each dielectric resonator group, and is electrically connected to the Hall electrode, respectively. In this case, the conductive connector pin formed on the lower part of the coaxial connector is inserted into the hole electrode, so that the hole electrode and the coaxial connector are electrically connected.

A conductive material may be filled in the hole electrode into which the conductive connector pin of the coaxial connector is inserted. Further, a microstrip line substrate may be further disposed between the coaxial connector and the dielectric block, in which case the coaxial connector may be electrically connected to the hole electrode of the dielectric block through a pin hole formed on the microstrip line substrate . For example, the coaxial connector may be an SMA and an MCX connector.

According to the embodiments of the present invention described above, the center of the dielectric block and the input / output electrodes are not exposed to the outside in the dielectric duplexer of the three-dimensional laminated structure. Therefore, there is no problem that the field is radiated from the center electrode and the input / output electrode. Therefore, the dielectric duplexer according to the present invention can obtain excellent insertion characteristics and attenuation characteristics. Further, even if the input / output signal becomes large due to the structure of the hole electrode, the damage such as the electrode dropping from the dielectric block hardly occurs. Therefore, the dielectric duplexer of the three-dimensional laminated structure according to the present invention can be used for high power. Furthermore, it is possible to fabricate a dielectric duplexer that minimizes the size of the dielectric duplexer and provides various frequencies according to the number and type of dielectric block size and height.

FIG. 5 is an experimental example of a frequency characteristic graph of a transmission terminal measured using the dielectric duplexer of FIG. 3, and FIG. 6 is an experimental example of a frequency characteristic graph of a receiving terminal measured by using the dielectric duplexer of FIG. The x-axis of the graph shown in Fig. 5 and Fig. 6 represents the frequency (MHz), and the y-axis represents the magnitude (dB) of the signal. The signal is weakened as '-' increases with '0'.

The graph shown in FIG. 5 represents a transmitting end frequency. A bandpass filter (bandpass) having a bandwidth of 20 MHz at a center frequency of 2680 MHz, passing a signal received from the antenna end from 2670 MHz to 2690 MHz, filter, BPF). Also, the graph of the frequency characteristic of the transmitter shown in Fig. 5 shows that the insertion loss is -2 dB, the ripple is -0.8 dB, and the RL is -15 dB.

The graph shown in FIG. 6 shows a receiving end frequency, and a band-pass filter having a bandwidth of 30 MHz at a center frequency of 2575 MHz and passing signals received from an antenna end through 2560 MHz to 2690 MHz and blocking the remaining frequency band is shown . Also, the graph of the frequency characteristic of the receiving end shown in FIG. 6 shows that the insertion loss is -2 dB, the ripple is -0.8 dB, and the RL is -14 dB.

According to another embodiment of the present invention, the communication repeater may use the dielectric duplexer of the three-dimensional laminated structure. A communication relay device is a device that receives a communication signal in one direction or both directions when it performs long-distance communication, amplifies the signal, and shapes and transmits the communication signal. The communication relay device may be composed of an antenna, a duplexer, a multiplexer, a duplexer splitter, a combiner, and an amplifier. Receives a signal from a base station or a terminal, distinguishes the signal, amplifies and shapes the signal, and transmits the signal to a destination of the signal. A dielectric duplexer of a three-dimensional laminated structure can be used for a duplexer or a multiplexer of a communication relay apparatus. A structure similar to or similar to the structure of the intermediate relay apparatus using a dielectric duplexer apparent to those skilled in the art. A more detailed structure of the communication repeater including the dielectric duplexer of the three-dimensional laminated structure is unnecessary to explain the essential technical features of the present invention.

The size of the duplexer may be smaller than the size of the duplexer, so that the size of the communication repeater can be reduced. Therefore, manufacturing of a miniaturized communication relay device can reduce the cost of raw materials and provide price competitiveness.

Further, the communication relay device using the dielectric duplexer of the three-dimensional laminated structure can withstand a high output, maintain excellent insertion characteristics and attenuation characteristics, and manufacture a high-power communication relay device, and thus can be used in various ways.

As described above, the present invention has been described with reference to particular embodiments, such as specific elements, and specific embodiments and drawings. However, it should be understood that the present invention is not limited to the above- And various modifications and changes may be made thereto by those skilled in the art to which the present invention pertains.

Accordingly, the spirit of the present invention should not be construed as being limited to the embodiments described, and all of the equivalents or equivalents of the claims, as well as the following claims, fall within the scope of the technical idea of the present invention something to do.

300: dielectric duplexer with three-dimensional laminated structure
310: dielectric block 311: first dielectric resonator group
312: second dielectric resonator group 313: connection dielectric block
320: Connection terminal
330: Coupling window

Claims (14)

A first dielectric resonator group and a second dielectric resonator group in which a plurality of dielectric blocks are stacked;
A connection dielectric block connecting the uppermost dielectric block of the first dielectric resonator group and the uppermost dielectric block of the second dielectric resonator group such that the first dielectric resonator group and the second dielectric resonator group are symmetrically located;
A connection terminal connected to a lower end of each of the dielectric resonator groups and an upper end of the connection dielectric block to transmit a signal; And
A plurality of dielectric resonators connected in series between the dielectric block of each dielectric resonator group and a connection dielectric block of the dielectric resonator group, A dielectric duplexer including a ring window. The method according to claim 1,
The connection terminal includes:
Wherein a hole having a cylindrical shape having a predetermined depth is formed in the hole structure, and the hole structure is coated with a conductive material to form a hole electrode. 3. The method of claim 2,
The dielectric duplexer is divided into a conductive coating layer and an uncoated region,
The conductive coating layer is formed by coating an outer surface of all the dielectric blocks constituting the dielectric duplexer except a portion forming the hole electrode with a conductive material, and the non-coated region is formed between the hole electrode and the conductive coating layer And a dielectric duplexer. 3. The method of claim 2,
Wherein a depth of the cylindrical hole is determined according to a pass bandwidth of the signal. The method of claim 3,
Further comprising a microstrip line substrate coupled to a bottom surface side of the lowermost dielectric block of each dielectric resonator group,
Wherein the microstrip line substrate is electrically connected to the connection terminals attached to the lowermost dielectric block of each dielectric resonator group,
Wherein the conductive coating layer is electrically connected to the ground of the microstrip line substrate. 6. The method of claim 5,
And a conductive pin inserted in the hole electrode to electrically connect the hole electrode and the microstrip line. The method according to claim 1,
Wherein a height of the dielectric block is variable according to a size of the dielectric duplexer. The method according to claim 1,
Wherein the number of the dielectric blocks stacked in each dielectric resonator group is determined according to a resonance frequency characteristic of the signal. The method according to claim 1,
Wherein the dielectric block is formed in the form of a rectangular waveguide. The method according to claim 1,
Wherein the connection terminal is deformable in a linear shape or a curved shape. delete The method according to claim 1,
Wherein the center frequency of the receiving part of the signal is 2575 MHz and the center frequency of the transmitting part is 2680 MHz. The method according to claim 1,
Wherein the dielectric duplexer is a ceramic dielectric duplexer. A communication relay device comprising the dielectric duplexer according to any one of claims 1 to 10, 12 and 13.

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