KR101566076B1 - 조절 가능한 통기 개구부를 갖는 ｍｅｍｓ 구조물 - Google Patents

조절 가능한 통기 개구부를 갖는 ｍｅｍｓ 구조물 Download PDF

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Publication number
KR101566076B1
KR101566076B1 KR1020130072115A KR20130072115A KR101566076B1 KR 101566076 B1 KR101566076 B1 KR 101566076B1 KR 1020130072115 A KR1020130072115 A KR 1020130072115A KR 20130072115 A KR20130072115 A KR 20130072115A KR 101566076 B1 KR101566076 B1 KR 101566076B1
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KR
South Korea
Prior art keywords
membrane
vent opening
adjustable vent
delete delete
adjustable
Prior art date
Application number
KR1020130072115A
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English (en)
Korean (ko)
Other versions
KR20140000173A (ko
Inventor
알폰스 데헤
마티아스 프리드리히 헤르만
율리크 크룸바인
스테판 바르첸
볼프강 프리차
볼프강 클라인
마틴 부르체르
Original Assignee
인피니언 테크놀로지스 아게
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US13/531,373 external-priority patent/US9002037B2/en
Application filed by 인피니언 테크놀로지스 아게 filed Critical 인피니언 테크놀로지스 아게
Publication of KR20140000173A publication Critical patent/KR20140000173A/ko
Application granted granted Critical
Publication of KR101566076B1 publication Critical patent/KR101566076B1/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0009—Structural features, others than packages, for protecting a device against environmental influences
    • B81B7/0029—Protection against environmental influences not provided for in groups B81B7/0012 - B81B7/0025
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0018—Structures acting upon the moving or flexible element for transforming energy into mechanical movement or vice versa, i.e. actuators, sensors, generators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0035—Constitution or structural means for controlling the movement of the flexible or deformable elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0257—Microphones or microspeakers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/01—Suspended structures, i.e. structures allowing a movement
    • B81B2203/0127—Diaphragms, i.e. structures separating two media that can control the passage from one medium to another; Membranes, i.e. diaphragms with filtering function
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/003—Mems transducers or their use

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Signal Processing (AREA)
  • Acoustics & Sound (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • General Health & Medical Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Micromachines (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
KR1020130072115A 2012-06-22 2013-06-24 조절 가능한 통기 개구부를 갖는 ｍｅｍｓ 구조물 KR101566076B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/531,373 US9002037B2 (en) 2012-02-29 2012-06-22 MEMS structure with adjustable ventilation openings
US13/531,373 2012-06-22

Related Child Applications (2)

Application Number Title Priority Date Filing Date
KR1020150031388A Division KR101607806B1 (ko) 2012-06-22 2015-03-06 조절 가능한 통기 개구부를 갖는 ｍｅｍｓ 구조물
KR1020150031387A Division KR101548481B1 (ko) 2012-06-22 2015-03-06 조절 가능한 통기 개구부를 갖는 ｍｅｍｓ 구조물

Publications (2)

Publication Number Publication Date
KR20140000173A KR20140000173A (ko) 2014-01-02
KR101566076B1 true KR101566076B1 (ko) 2015-11-04

Family

ID=49713893

Family Applications (3)

Application Number Title Priority Date Filing Date
KR1020130072115A KR101566076B1 (ko) 2012-06-22 2013-06-24 조절 가능한 통기 개구부를 갖는 ｍｅｍｓ 구조물
KR1020150031387A KR101548481B1 (ko) 2012-06-22 2015-03-06 조절 가능한 통기 개구부를 갖는 ｍｅｍｓ 구조물
KR1020150031388A KR101607806B1 (ko) 2012-06-22 2015-03-06 조절 가능한 통기 개구부를 갖는 ｍｅｍｓ 구조물

Family Applications After (2)

Application Number Title Priority Date Filing Date
KR1020150031387A KR101548481B1 (ko) 2012-06-22 2015-03-06 조절 가능한 통기 개구부를 갖는 ｍｅｍｓ 구조물
KR1020150031388A KR101607806B1 (ko) 2012-06-22 2015-03-06 조절 가능한 통기 개구부를 갖는 ｍｅｍｓ 구조물

Country Status (3)

Country Link
KR (3) KR101566076B1 (zh)
CN (1) CN103517169B (zh)
DE (1) DE102013211943B4 (zh)

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DE102014108740B4 (de) 2014-06-23 2016-03-03 Epcos Ag MEMS-Mikrofon mit verbesserter Empfindlichkeit und Verfahren zur Herstellung
JP6445158B2 (ja) * 2014-08-27 2018-12-26 ゴルテック．インク バルブ機構付きのｍｅｍｓデバイス
US10142718B2 (en) * 2014-12-04 2018-11-27 Invensense, Inc. Integrated temperature sensor in microphone package
GB2533410B (en) 2014-12-19 2017-03-01 Cirrus Logic Int Semiconductor Ltd MEMS devices and processes
CN104891418B (zh) * 2015-05-29 2016-09-21 歌尔股份有限公司 Mems压力传感器、mems惯性传感器集成结构
US9794661B2 (en) * 2015-08-07 2017-10-17 Knowles Electronics, Llc Ingress protection for reducing particle infiltration into acoustic chamber of a MEMS microphone package
KR101863540B1 (ko) * 2016-06-09 2018-06-01 부전전자 주식회사 고막 보호 진동판
KR101916052B1 (ko) 2016-09-09 2018-11-07 현대자동차 주식회사 마이크로폰, 이의 제조 방법 및 제어 방법
US10609463B2 (en) 2017-10-30 2020-03-31 Taiwan Semiconductor Manufacturing Co., Ltd. Integrated microphone device and manufacturing method thereof
US10771904B2 (en) 2018-01-24 2020-09-08 Shure Acquisition Holdings, Inc. Directional MEMS microphone with correction circuitry
CN109379684B (zh) * 2018-10-09 2020-05-29 歌尔股份有限公司 麦克风和电子设备
CN111107455B (zh) * 2019-12-27 2021-07-13 思必驰科技股份有限公司 用于智能语音设备的防风处理方法、防风结构及具有该结构的智能语音设备
US11323797B2 (en) * 2020-07-11 2022-05-03 xMEMS Labs, Inc. Acoustic transducer, wearable sound device and manufacturing method of acoustic transducer
US12088988B2 (en) 2020-07-11 2024-09-10 xMEMS Labs, Inc. Venting device and venting method thereof
US12022253B2 (en) 2020-07-11 2024-06-25 xMEMS Labs, Inc. Venting device
US11972749B2 (en) 2020-07-11 2024-04-30 xMEMS Labs, Inc. Wearable sound device
US11884535B2 (en) 2020-07-11 2024-01-30 xMEMS Labs, Inc. Device, package structure and manufacturing method of device
US12028673B2 (en) 2020-07-11 2024-07-02 xMEMS Labs, Inc. Driving circuit and wearable sound device thereof
CN111954138A (zh) * 2020-08-19 2020-11-17 苏州礼乐乐器股份有限公司 一种带音梁及音隧的全频段硅麦

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JP2007321986A (ja) 2000-09-14 2007-12-13 Research Triangle Inst マイクロ電気機械システムバルブ及びその製造方法
JP2012039272A (ja) 2010-08-05 2012-02-23 Funai Electric Co Ltd マイクロホンユニット

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JP2004032019A (ja) 2002-06-21 2004-01-29 Star Micronics Co Ltd コンデンサマイクロホン
JP2012039272A (ja) 2010-08-05 2012-02-23 Funai Electric Co Ltd マイクロホンユニット

Also Published As

Publication number Publication date
KR20150030691A (ko) 2015-03-20
KR20140000173A (ko) 2014-01-02
KR20150035916A (ko) 2015-04-07
DE102013211943B4 (de) 2021-03-11
CN103517169A (zh) 2014-01-15
CN103517169B (zh) 2017-06-09
DE102013211943A1 (de) 2013-12-24
KR101607806B1 (ko) 2016-03-30
KR101548481B1 (ko) 2015-08-28

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