KR101566076B1 - 조절 가능한 통기 개구부를 갖는 mems 구조물 - Google Patents

조절 가능한 통기 개구부를 갖는 mems 구조물 Download PDF

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Publication number
KR101566076B1
KR101566076B1 KR1020130072115A KR20130072115A KR101566076B1 KR 101566076 B1 KR101566076 B1 KR 101566076B1 KR 1020130072115 A KR1020130072115 A KR 1020130072115A KR 20130072115 A KR20130072115 A KR 20130072115A KR 101566076 B1 KR101566076 B1 KR 101566076B1
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KR
South Korea
Prior art keywords
membrane
vent opening
adjustable vent
delete delete
adjustable
Prior art date
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KR1020130072115A
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English (en)
Korean (ko)
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KR20140000173A (ko
Inventor
알폰스 데헤
마티아스 프리드리히 헤르만
율리크 크룸바인
스테판 바르첸
볼프강 프리차
볼프강 클라인
마틴 부르체르
Original Assignee
인피니언 테크놀로지스 아게
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Priority claimed from US13/531,373 external-priority patent/US9002037B2/en
Application filed by 인피니언 테크놀로지스 아게 filed Critical 인피니언 테크놀로지스 아게
Publication of KR20140000173A publication Critical patent/KR20140000173A/ko
Application granted granted Critical
Publication of KR101566076B1 publication Critical patent/KR101566076B1/ko

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0009Structural features, others than packages, for protecting a device against environmental influences
    • B81B7/0029Protection against environmental influences not provided for in groups B81B7/0012 - B81B7/0025
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0018Structures acting upon the moving or flexible element for transforming energy into mechanical movement or vice versa, i.e. actuators, sensors, generators
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0035Constitution or structural means for controlling the movement of the flexible or deformable elements
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/02Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00Electrostatic transducers
    • H04R19/04Microphones
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00Specific applications of microelectromechanical systems
    • B81B2201/02Sensors
    • B81B2201/0257Microphones or microspeakers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00Basic microelectromechanical structures
    • B81B2203/01Suspended structures, i.e. structures allowing a movement
    • B81B2203/0127Diaphragms, i.e. structures separating two media that can control the passage from one medium to another; Membranes, i.e. diaphragms with filtering function
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48135Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909Post-treatment of the connector or wire bonding area
    • H01L2224/8592Applying permanent coating, e.g. protective coating
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00Electrostatic transducers
    • H04R19/005Electrostatic transducers using semiconductor materials
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/003Mems transducers or their use

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Signal Processing (AREA)
  • Acoustics & Sound (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • General Health & Medical Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Micromachines (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
KR1020130072115A 2012-06-22 2013-06-24 조절 가능한 통기 개구부를 갖는 mems 구조물 KR101566076B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/531,373 US9002037B2 (en) 2012-02-29 2012-06-22 MEMS structure with adjustable ventilation openings
US13/531,373 2012-06-22

Related Child Applications (2)

Application Number Title Priority Date Filing Date
KR1020150031388A Division KR101607806B1 (ko) 2012-06-22 2015-03-06 조절 가능한 통기 개구부를 갖는 mems 구조물
KR1020150031387A Division KR101548481B1 (ko) 2012-06-22 2015-03-06 조절 가능한 통기 개구부를 갖는 mems 구조물

Publications (2)

Publication Number Publication Date
KR20140000173A KR20140000173A (ko) 2014-01-02
KR101566076B1 true KR101566076B1 (ko) 2015-11-04

Family

ID=49713893

Family Applications (3)

Application Number Title Priority Date Filing Date
KR1020130072115A KR101566076B1 (ko) 2012-06-22 2013-06-24 조절 가능한 통기 개구부를 갖는 mems 구조물
KR1020150031387A KR101548481B1 (ko) 2012-06-22 2015-03-06 조절 가능한 통기 개구부를 갖는 mems 구조물
KR1020150031388A KR101607806B1 (ko) 2012-06-22 2015-03-06 조절 가능한 통기 개구부를 갖는 mems 구조물

Family Applications After (2)

Application Number Title Priority Date Filing Date
KR1020150031387A KR101548481B1 (ko) 2012-06-22 2015-03-06 조절 가능한 통기 개구부를 갖는 mems 구조물
KR1020150031388A KR101607806B1 (ko) 2012-06-22 2015-03-06 조절 가능한 통기 개구부를 갖는 mems 구조물

Country Status (3)

Country Link
KR (3) KR101566076B1 (zh)
CN (1) CN103517169B (zh)
DE (1) DE102013211943B4 (zh)

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DE102014108740B4 (de) 2014-06-23 2016-03-03 Epcos Ag MEMS-Mikrofon mit verbesserter Empfindlichkeit und Verfahren zur Herstellung
JP6445158B2 (ja) * 2014-08-27 2018-12-26 ゴルテック.インク バルブ機構付きのmemsデバイス
US10142718B2 (en) * 2014-12-04 2018-11-27 Invensense, Inc. Integrated temperature sensor in microphone package
GB2533410B (en) 2014-12-19 2017-03-01 Cirrus Logic Int Semiconductor Ltd MEMS devices and processes
CN104891418B (zh) * 2015-05-29 2016-09-21 歌尔股份有限公司 Mems压力传感器、mems惯性传感器集成结构
US9794661B2 (en) * 2015-08-07 2017-10-17 Knowles Electronics, Llc Ingress protection for reducing particle infiltration into acoustic chamber of a MEMS microphone package
KR101863540B1 (ko) * 2016-06-09 2018-06-01 부전전자 주식회사 고막 보호 진동판
KR101916052B1 (ko) 2016-09-09 2018-11-07 현대자동차 주식회사 마이크로폰, 이의 제조 방법 및 제어 방법
US10609463B2 (en) 2017-10-30 2020-03-31 Taiwan Semiconductor Manufacturing Co., Ltd. Integrated microphone device and manufacturing method thereof
US10771904B2 (en) 2018-01-24 2020-09-08 Shure Acquisition Holdings, Inc. Directional MEMS microphone with correction circuitry
CN109379684B (zh) * 2018-10-09 2020-05-29 歌尔股份有限公司 麦克风和电子设备
CN111107455B (zh) * 2019-12-27 2021-07-13 思必驰科技股份有限公司 用于智能语音设备的防风处理方法、防风结构及具有该结构的智能语音设备
US11323797B2 (en) * 2020-07-11 2022-05-03 xMEMS Labs, Inc. Acoustic transducer, wearable sound device and manufacturing method of acoustic transducer
US12088988B2 (en) 2020-07-11 2024-09-10 xMEMS Labs, Inc. Venting device and venting method thereof
US12022253B2 (en) 2020-07-11 2024-06-25 xMEMS Labs, Inc. Venting device
US11972749B2 (en) 2020-07-11 2024-04-30 xMEMS Labs, Inc. Wearable sound device
US11884535B2 (en) 2020-07-11 2024-01-30 xMEMS Labs, Inc. Device, package structure and manufacturing method of device
US12028673B2 (en) 2020-07-11 2024-07-02 xMEMS Labs, Inc. Driving circuit and wearable sound device thereof
CN111954138A (zh) * 2020-08-19 2020-11-17 苏州礼乐乐器股份有限公司 一种带音梁及音隧的全频段硅麦

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JP2007321986A (ja) 2000-09-14 2007-12-13 Research Triangle Inst マイクロ電気機械システムバルブ及びその製造方法
JP2012039272A (ja) 2010-08-05 2012-02-23 Funai Electric Co Ltd マイクロホンユニット

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JP2012039272A (ja) 2010-08-05 2012-02-23 Funai Electric Co Ltd マイクロホンユニット

Also Published As

Publication number Publication date
KR20150030691A (ko) 2015-03-20
KR20140000173A (ko) 2014-01-02
KR20150035916A (ko) 2015-04-07
DE102013211943B4 (de) 2021-03-11
CN103517169A (zh) 2014-01-15
CN103517169B (zh) 2017-06-09
DE102013211943A1 (de) 2013-12-24
KR101607806B1 (ko) 2016-03-30
KR101548481B1 (ko) 2015-08-28

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