KR101564696B1 - Device and method for reverse engineering of pcb(printed circuit board) - Google Patents

Abstract

There is provided an apparatus and method for reverse designing a printed circuit board, the apparatus for reverse designing a printed circuit board includes a photographing unit for photographing a printed circuit board including a plurality of guide holes and a multi-layer pattern to provide a first image, A three-dimensional measuring unit for measuring coordinates of the guide hole, an image correcting unit for correcting the magnification of the first image using the coordinate values of the guide hole, and a multi- An image extraction unit for providing a plurality of separated second images, and an image conversion unit for converting the second image and providing the drawing data.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a reverse design apparatus and method for a printed circuit board (PCB)

An apparatus and method for reverse design of a printed circuit board are provided.

It is a series of tasks to generate design data so as to obtain digitized information from the shape of a real object, which is impossible to manufacture the same product because there is no design data, and to produce a product that performs the same function based on this information. In particular, the reverse design of a printed circuit board (PCB) is widely used when a printed circuit board used in military equipment and weapon systems is obsolete due to long use or needs to be replaced due to failure. In order to cope with the situation where the supply of the same printed circuit board is difficult due to the problems of bankruptcy, closure of the printed circuit board maker, discontinuation of parts, etc., and the printed circuit board can not be replaced, to be.

The printed circuit board includes a pattern, which is a copper thin film connected to enable the flow of an electric signal between the component hole and the component for fixing the electronic component.

The reverse design of a printed circuit board causes problems such as insufficient current capacity, signal interference, signal reflection, electromagnetic noise, etc. depending on the position of the components, the cross-sectional area of the wiring, the shape of the wiring, the distance between adjacent wirings, It is important to restore the pattern accurately.

Conventionally, the operator manually identifies the pattern of the printed circuit board, and manual patterning is performed manually. In order to prevent the conduction with other conductors, such a manual operation accurately identifies the pattern due to the insulating ink and the recognition mark applied on the pattern In the case of a printed circuit board including a multi-layer pattern, it is difficult to accurately separate and identify the overlapped layer pattern. Accordingly, analysis inhibiting elements of the printed circuit board are removed by removing the adhesive using a medicine or forcibly separating a multilayer printed circuit board using a mechanical device. However, this method is disadvantageous in that the structure of the printed circuit board is damaged or deformed The error rate is high when design data is generated, and it can take a lot of time and cost to analyze the printed circuit board. In addition, the multi-layer printed circuit board separated by the mechanical device has a great risk in that it can not be reused.

An object of the present invention is to provide an apparatus and method for inverse design of a printed circuit board capable of automatically analyzing a pattern using a pattern image of a printed circuit board obtained through a photographing apparatus and converting the pattern into drawing data .

According to an aspect of the present invention, there is provided an image forming apparatus comprising: a photographing section photographing a printed circuit board including at least one guide hole and a multilayer pattern to provide a first image in which images of the multilayer pattern are superimposed; An image correcting unit for correcting a magnification of the first image by using coordinate values of the guide holes, a second correcting unit for correcting magnification of the first correcting unit by the image correcting unit, An image extracting unit for identifying the multi-layer pattern from the image and providing a plurality of second images separated from each other, and an image converting unit for converting the second image to provide drawing data, do.

Here, the photographing unit may provide the first image through X-ray photographing.

The image corrector may correct the magnification of the first image and compensate the distortion according to the result of comparing the coordinate values of the guide hole and the guide hole in the first image.

In addition, the image extracting unit may separate each of the overlapped patterns using the brightness difference of the pattern of the multi-layer pattern in the magnification-corrected first image, and provide a plurality of second images.

In addition, the image conversion unit may include a vectorising program or a CAD program.

According to another aspect of the present invention, there is provided an image forming apparatus including: a photographing unit for photographing a printed circuit board including at least one guide hole and a multi-layer pattern to provide a plurality of first images, An image correcting unit for correcting a magnification of the first image by using coordinate values of the guide holes, and an image correcting unit for correcting magnification from the image correcting unit, And an image converting unit for converting the one image and providing the drawing data.

Here, the photographing unit measures the X-ray transmission amount of the multi-layer pattern in the printed circuit board through computed tomography and detects the X-ray transmission amount of the multi-layer pattern in the printed circuit board based on the X- A plurality of first images can be provided.

The image corrector may correct the magnification of the first image and compensate the distortion according to the result of comparing the coordinate values of the guide hole and the guide hole in the first image.

In addition, the image conversion unit may include a vectorising program or a CAD program.

According to another aspect of the present invention, there is provided a method of manufacturing a printed circuit board, comprising the steps of: photographing a printed circuit board including at least one guide hole and a multilayer pattern to provide a first image in which an image of the multilayer pattern is superimposed; Dimensional coordinate of the guide hole to provide a coordinate value of the guide hole; correcting the magnification of the first image using the coordinate value of the guide hole; identifying the multi-layer pattern included in the magnified first image Providing a plurality of second images separately from each other, and converting the second image into drawing data.

Here, the first image providing step may provide the first image through X-ray photographing.

The magnification correction step may correct the magnification of the first image according to a result of comparing the coordinate values of the guide hole and the guide hole in the first image.

The magnification correction step may compensate the distortion of the first image according to a result of comparing the coordinate values of the guide hole and the guide hole in the first image.

In addition, the second image providing step may separate each of the overlapped patterns using the brightness difference of the pattern of the multi-layer pattern in the magnification-corrected first image, and provide the plurality of second images.

In addition, the step of converting the drawing data may include arranging the plurality of second images based on the guide holes, setting an attribute of the second image, and setting the position of the second image .

The step of transforming the drawing data may further include inserting a coordinate value into the plurality of second images.

According to the embodiment of the present invention, the reverse design accuracy of the printed circuit board can be improved by solving the pattern analysis inhibiting factors without damaging the printed circuit board. In addition, it can automate pattern analysis to reduce the time and cost of multi-layer pattern analysis and reverse engineering of printed circuit boards.

FIG. 1 is a simplified structure of an apparatus for designing an inverse printed circuit board according to an embodiment of the present invention.
2 is a detailed configuration of an apparatus for designing a PCB in accordance with an embodiment of the present invention.
3 is a method of designing a printed circuit board in accordance with an embodiment of the present invention.
4 is a first magnification-corrected image according to an embodiment of the present invention.
5 is a second image according to an embodiment of the present invention.
6 is a drawing data conversion method of a second image according to an embodiment of the present invention.
FIG. 7 is a method of arranging a second image according to an embodiment of the present invention on a guide hole basis.
8 is a method for setting attributes of a second image according to an embodiment of the present invention.
9 is a method of positioning a second image according to an embodiment of the present invention.
10 is a method of positioning a second image according to another embodiment of the present invention.
11 is data of a PCB design drawing according to an embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In order to clearly illustrate the present invention in the drawings, parts not related to the description are omitted.

Throughout the specification, the terms first, second and third, etc. are used to describe various parts, components, regions, layers and / or sections, but are not limited thereto. These terms are only used to distinguish any moiety, element, region, layer or section from another moiety, moiety, region, layer or section. Therefore, the first image or the first guide hole described below may be referred to as the second image or the second guide hole within the scope of the present invention.

Whenever a component is referred to as "including" an element throughout the specification, it is to be understood that the element may include other elements, not the exclusion of any other element, unless the context clearly dictates otherwise.

Throughout the specification, the terms "part," " module, "and the like refer to a unit that processes at least one function or operation, which may be implemented in hardware or software or a combination of hardware and software.

Throughout the specification, the term "guide hole" refers to a hole included in a printed circuit board, and may be inserted into a protrusion provided on the component so that the printed circuit board is accurately positioned at a specific position of the component.

Throughout the specification, "first image" means an image in which a multilayer pattern image of a printed circuit board is superimposed, and "second image " means an image obtained by distinguishing the multilayered pattern from the first image.

FIG. 1 is a simplified structure of an apparatus for designing an inverse printed circuit board according to an embodiment of the present invention.

As shown in FIG. 1, the image of the printed circuit board 10 is obtained by photographing the printed circuit board 10 through the X-ray photographing apparatus 20. At this time, the printed circuit board 10 includes a multilayered pattern and at least one guide hole.

2 is a detailed configuration of an apparatus for designing a PCB in accordance with an embodiment of the present invention.

2 includes an X-ray photographing unit 20, a three-dimensional measuring unit 30, an image correcting unit 40, an image extracting unit 50, and an image converting unit 60 .

The X-ray photographing unit 20 photographs a patterned surface of the printed circuit board 10 to provide a first image of the printed circuit board 10. For example, when the printed circuit board 10 is a double-sided board, the front and back surfaces of the printed circuit board 10 are photographed using the X-ray photographing unit 20, 1 image with respect to the backside of the printed circuit board 10. In addition, when the printed circuit board 10 is a multilayer board, it is possible to provide a plurality of photographed images for each surface including a pattern on a printed circuit board.

The three-dimensional measuring unit 30 measures x-axis coordinates and y-axis coordinates of one or more guide holes of the printed circuit board 10 and provides the measured coordinates. In this case, the three-dimensional measuring unit 30 measures the dimensions and shape of the object, that is, the lateral direction of the printed circuit board 10 is the x axis, the front and rear directions are the y axis, and the vertical direction is the z axis. , A contact type three-dimensional measuring device, a non-contact type three-dimensional measuring device (OGP), and the like.

The image correcting unit 40 corrects the magnification of the first image provided from the X-ray photographing unit 20 based on the x-axis coordinate and the y-axis coordinate of one or more guide holes provided from the three-dimensional measuring unit 30, It serves to compensate. At this time, the image correction unit 40 may be realized by conventional graphic editing software, for example, a photoshop or an illustrator.

As a result, when a photographing result of the printed circuit board 10, a distorted image or a magnification error image of the printed circuit board 10 is generated, it can be corrected.

The image extracting unit 50 serves to identify a multi-layer pattern in the first image and to provide a plurality of second images in which the respective patterns are separated from the first image.

The image extracting unit 50 may separate each of the overlapped patterns by using the brightness difference of each pattern of the multi-layer pattern in the first image. This is based on the characteristic that, when the inside of the object is photographed by the X-ray photographing unit 20, the brightness becomes darker as the object moves away from the X-ray photographing unit 20.

The image extracting unit 50 may be realized by the same graphic editing software as the image correcting unit 40. For example, the image extracting unit 50 may be implemented as a photoshop or an illustrator.

When the image extracting unit 50 is implemented by graphic editing software, by adjusting the brightness of the first image, the brightness contrast between the patterns is maximized, so that the overlapped patterns can be easily separated.

The image converting unit 60 converts a plurality of second images provided from the image extracting unit 50 into drawing data having coordinate values. At this time, the image converting unit 60 may be implemented as a drawing creating program such as a vectorizing program and a CAD program in order to convert a pixel-based image into a vector-based image.

3 is a method of designing a printed circuit board in accordance with an embodiment of the present invention.

First, the X-ray radiographing section 20 is used to provide a first image of a printed circuit board 10 including at least one guide hole and a multilayer pattern (S10), and a three-dimensional measurement section 30 The coordinate values of the guide holes are measured in the printed circuit board 20 (S20). At this time, a specific portion of the printed circuit board 20 is set as an origin through the three-dimensional measuring unit 30, and x-coordinate value and y-coordinate value of the guide hole can be provided based on the set origin.

Thereafter, the magnification of the first image is corrected on the basis of the coordinate value of the guide hole provided from the three-dimensional measurement unit 30 using the image correction unit 40 (S30). At this time, the magnification of the first image can be adjusted by matching the guide hole in the first image with the coordinate value of the guide hole provided from the three-dimensional measurement unit 30. [

4 is a first magnification-corrected image according to an embodiment of the present invention.

4, the first image 31 includes three guide holes, and each of the three guide holes has a coordinate value measured through the three-dimensional measurement unit 30. [ For example, the first through third guide holes may have coordinate values as shown in Table 1 below, and the magnification may be corrected by extending or reducing the first image 31 according to the coordinate values shown in Table 1 below .

The first guide hole 31-A The second guide hole (31-B) The third guide hole (31-C) x (mm) 115 110 50 y (mm) 60 10 20

Thereafter, the image extracting unit 50 is used to identify the multi-layer pattern included in the magnified first image and to separate the identified patterns to provide a plurality of second images (S40).

Finally, the plurality of second images are converted into the drawing data including the coordinate values through the image converting unit 60 (S50).

5 is a second image according to an embodiment of the present invention.

5, the multi-layer pattern of the first image 31 is identified to extract four single pattern images 51-1, 51-2, 51-3 and 51-4 for each layer, .

The method of converting the single pattern images extracted from the first image into the drawing data will be described in detail below with reference to Figs. 6 to 11. Fig.

6 is a drawing data conversion method of a second image according to an embodiment of the present invention.

First, a plurality of second images extracted from the first image are arranged on the guide hole basis through the image converting unit 60 (S51).

FIG. 7 is a method of arranging a second image according to an embodiment of the present invention on a guide hole basis.

In FIG. 7, the second image is arranged on the basis of the guide hole coordinate values of the printed circuit board measured through the three-dimensional measuring unit 30.

Then, an attribute of the second image is set (S52). At this time, the attribute may be a material or a type of the pattern.

8 is a method for setting attributes of a second image according to an embodiment of the present invention.

In FIG. 8, the attribute of the second image arranged on the basis of the coordinate value of the guide hole is set to copper.

Then, the position of the second image in which the attribute is set is set (S53), and the reverse design of the printed circuit board is completed (S54). At this time, the position may mean a superposition relationship or a layer relationship between the plurality of second images.

9 is a method of positioning a second image according to an embodiment of the present invention.

In Fig. 9, the position of the second image including the brown pattern is set to the top (component surface).

10 is a method of positioning a second image according to another embodiment of the present invention.

In Fig. 10, the position of the second image including the green pattern is set to BOTTOM (bottom surface).

Thus, when the brown pattern and the green pattern are overlapped, the brown pattern having the position set to the front is located at the top, that is, the component surface, and the green pattern positioned at the rear is positioned at the bottom, that is, the bottom.

9 to 10 illustrate a method of setting the positions of two patterns. For example, when there are four second images including a single pattern, the position of each of the second images is referred to as TOP, layer-1, 2, and BOTTOM. In addition, it is possible to repeat step S51 of arranging the second image for each of the four second images, step S52 of setting the attribute, and step S53 of setting the position.

11 is data of a PCB design drawing according to an embodiment of the present invention.

Referring to the drawing data of FIG. 11, it can be seen that the overlapping pattern of the plurality of second images set in the positions in FIGS. 9 and 10 is designed to be the same as that of an actual printed circuit board. At this time, although not shown in FIG. 11, the drawing data of FIG. 11 may include coordinate values.

The method of designing a PCB according to an embodiment of the present invention includes arranging the arrangement, attribute, and position of a second image through a user interface, but the present invention is not limited thereto. The image extracting unit 50 ), The pattern identification attribute value is separately stored in the process of extracting the second image from the first image, and the layout, attribute, and attribute of the second image are automatically determined using the pattern identification attribute value stored separately in the image conversion unit 60 And can be implemented to set the position.

The method of designing a printed circuit board according to an embodiment of the present invention separates the multi-layer patterns in the first image provided through the X-ray photographing through the difference in brightness per pattern to provide a plurality of second images. However, the present invention is not limited thereto. The X-ray transmission amount of the multi-layer pattern in the printed circuit board may be measured using a computed tomography (CT) The first image may be divided into a plurality of first images.

While the present invention has been particularly shown and described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, Belongs.

10: printed circuit board (PCB) 20: X-ray photographing unit
30: three-dimensional measuring unit 40: image correcting unit
50: image extracting unit 60: image converting unit

Claims (16)

A photographing section photographing a printed circuit board including at least one guide hole and a multilayer pattern to provide a first image in which the images of the multilayer pattern are superimposed,
A three-dimensional measurement unit for measuring the printed circuit board to provide coordinate values of the guide holes,
An image corrector for correcting the magnification of the first image using coordinate values of the guide holes,
An image extracting unit for identifying the multi-layer pattern from the first image whose magnification is corrected by the image correcting unit and providing a plurality of second images respectively separated from each other;
An image converting unit for converting the second image and providing drawing data,
And an inverter circuit for inverting the printed circuit board. The method of claim 1,
Wherein the photographing unit provides the first image through X-ray imaging. The method of claim 1,
Wherein the image correction unit corrects magnification of the first image and compensates for distortion according to a result of comparing coordinate values of the guide hole and the guide hole in the first image. The method of claim 1,
Wherein the image extracting unit separates the overlapped patterns from each other using the brightness difference of each pattern of the multi-layer pattern in the first image subjected to the magnification correction or the distortion compensation from the image correction unit and provides a plurality of second images, Device. The method of claim 1,
Wherein the image conversion unit includes a vectorising program or a CAD program. A photographing unit photographing a printed circuit board including at least one guide hole and a multi-layer pattern to provide a plurality of first images,
A three-dimensional measurement unit for measuring the printed circuit board to provide coordinate values of the guide holes,
An image corrector for correcting magnification of the first image and compensating for distortion according to a result of comparing coordinate values of the guide holes and the guide holes in the first image,
An image converting unit for converting the first image provided from the image correcting unit and providing drawing data,
And an inverter circuit for inverting the printed circuit board. The method of claim 6,
Wherein the photographing unit measures an X-ray transmission amount of the multilayered pattern in the printed circuit board through computed tomography, and calculates the X-ray transmittance of the plurality of the multilayered patterns in the printed circuit board based on the X- An apparatus for reverse design of a printed circuit board providing a first image. delete The method of claim 6,
Wherein the image conversion unit includes a vectorising program or a CAD program. Capturing a printed circuit board including at least one guide hole and a multilayered pattern to provide a first image in which the images of the multilayered pattern are superimposed,
Measuring the printed circuit board three-dimensionally to provide coordinate values of the guide holes,
Correcting the magnification of the first image using coordinate values of the guide holes,
Identifying and separating the multi-layered patterns contained in the magnified first image to provide a plurality of second images, and
Converting the second image into drawing data
Wherein said method comprises the steps of: 11. The method of claim 10,
Wherein the providing of the first image provides the first image through X-ray imaging. 11. The method of claim 10,
Wherein the magnification correction step corrects magnification of the first image according to a result of comparing coordinate values of the guide hole and the guide hole in the first image. 11. The method of claim 10,
Wherein the magnification correction step compensates distortion of the first image according to a result of comparing coordinate values of the guide hole and the guide hole in the first image. 11. The method of claim 10,
Wherein the second image providing step separates the overlapped patterns from each other using the brightness difference of the pattern of the multi-layer pattern in the magnification-corrected first image, and provides the plurality of second images. 11. The method of claim 10,
Wherein the step of converting the drawing data comprises the steps of placing the plurality of second images with reference to the guide holes, setting an attribute of the second image, and setting the position of the second image A method of reverse design of a substrate. 16. The method of claim 15,
Wherein the step of transforming the drawing data further comprises inserting a coordinate value into the plurality of second images.

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