KR101557540B1 - Copolymerized polyamide resin, method for preparing the same, and article comprising the same - Google Patents

Abstract

The copolymer polyamide resin of the present invention comprises (A) a dicarboxylic acid moiety derived from a dicarboxylic acid; And (B) a diamine portion derived from a diamine, wherein the dicarboxylic acid (A) is (a1) a dicarboxylic acid comprising a diphenylenether unit; And (a2) an aromatic dicarboxylic acid, and the diamine (B) comprises (b1) an aromatic diamine and (b2) an aliphatic diamine. The copolymer polyamide resin is excellent in thermal stability and dimensional stability.

Description

TECHNICAL FIELD [0001] The present invention relates to a copolymerized polyamide resin, a method for producing the same, and a molded article comprising the same. BACKGROUND OF THE INVENTION < RTI ID = 0.0 > COPOLYMERIZED POLYAMIDE RESIN, METHOD FOR PREPARING THE SAME, AND ARTICLE COMPRISING THE SAME &

TECHNICAL FIELD The present invention relates to a copolymerized polyamide resin, a method for producing the same, and a product containing the same. More specifically, the present invention relates to a high heat resistant copolymerized polyamide resin having a glass transition temperature of 140 ° C or more and excellent thermal stability and dimensional stability, And a molded article comprising the same.

Generally, high heat-resistant nylon has a semi-crystalline structure and can be used in a variety of fields such as LED reflector, connector, and automobile material, which requires a high heat resistance characteristic because the heat-resistant temperature is much higher than that of ordinary nylon. However, in the case of conventional products, the glass transition temperature (Tg) is in the range of 90 to 120 占 폚 and has a low glass transition temperature. For example, in the case of polyamide (nylon) 6T, since the melting temperature is very high and the decomposition temperature is lower than the processing temperature, it is difficult to use it alone, and copolymerization is generally performed to lower the processing temperature.

Especially, when high heat-resistant nylon is used as an automobile UTH (under the hood) engine room material, high heat resistance characteristics are required due to high engine room temperature. Here, the most important physical properties are glass transition temperature, and conventional high heat-resistant nylon such as polyamide 6T copolymer has low glass transition temperature and is difficult to use.

Further, in order to compensate for insufficient physical properties of high heat-resistant nylon, a compound product of compounding polyamide and another resin is widely used. For example, PPE / PA, which is a mixture of polyamide (PA) and polyphenylene ether (PPE), can be used for PPE because of its excellent thermal stability, dimensional stability and low hygroscopicity and chemical resistance and impact resistance And is widely used as a compound product having physical properties.

Conventional PPE / PA is a type in which PPE particles are distributed on a matrix of PA through an alloy method. Due to the compatibility problem between PA and PPE, this type may cause deterioration of physical properties when dispersion is poor. In order to solve this problem, methods for increasing the compatibility of PPE with PA using maleic acid, citric acid, etc. have been studied, but additional reaction is required in the process and improvement in terms of cost There is a lot of room.

Accordingly, the development of a copolymerized polyamide resin having a high glass transition temperature for complementing insufficient physical properties such as thermal stability and dimensional stability of a polyamide and compatibility with an automobile UTH (under the hood) engine room without compatibility problems need.

An object of the present invention is to provide a high heat-resistant copolymerized polyamide resin excellent in thermal stability and dimensional stability with a glass transition temperature of 140 ° C or higher.

Another object of the present invention is to provide a process for producing the polyamide resin.

It is still another object of the present invention to provide a molded article formed from the polyamide resin.

The above and other objects of the present invention can be achieved by the present invention described below.

One aspect of the present invention relates to a copolymerized polyamide resin. The copolymerized polyamide resin is a mixture of (A) a dicarboxylic acid; Wherein the dicarboxylic acid (A) comprises (a1) a dicarboxylic acid containing a diphenylene ether unit and (a2) an aromatic dicarboxylic acid, wherein the diamine ( B) is characterized by containing (b1) an aromatic diamine and (b2) an aliphatic diamine.

In an embodiment, the content of the dicarboxylic acid (a1) in the dicarboxylic acid (A) is from 5 to 95 mol%, the content of the aromatic dicarboxylic acid (a2) The content may be from 5 to 95 mol%.

In an embodiment, the content of the aromatic diamine (b1) in the diamine (B) may be 5 to 95 mol%, and the content of the aliphatic diamine (b2) may be 5 to 95 mol%.

In an embodiment, the aromatic dicarboxylic acid (a2) is a compound containing at least one aromatic dicarboxylic acid having 8 to 20 carbon atoms other than the dicarboxylic acid (a1) containing the diphenylene ether unit. .

In an embodiment, the aromatic diamine (b1) may be a compound containing at least one aromatic diamine having 6 to 30 carbon atoms.

In an embodiment, the aliphatic diamine (b2) may be a compound containing at least one aliphatic diamine having 4 to 20 carbon atoms.

In an embodiment, the dicarboxylic acid moiety derived from the dicarboxylic acid (a1) comprising the diphenylene ether unit may be represented by the following formula (1): < EMI ID =

[Chemical Formula 1]

R ₁ and R ₂ are each independently a hydrocarbon group having 1 to 10 carbon atoms, a halogen group, a hydroxyl group or an alkoxy group having 1 to 5 carbon atoms, and a and b are each independently an integer of 0 to 4.

In an embodiment, the diamine moiety derived from the aromatic diamine (b1) may be represented by the formula (2)

(2)

Wherein R ₃ and R ₄ are each independently a single bond or an alkylene group having 1 to 10 carbon atoms and R ₅ is a hydrocarbon group having 1 to 10 carbon atoms, a halogen group, a hydroxyl group, or an alkoxy group having 1 to 5 carbon atoms N is an integer of 0 to 3, and c is an integer of 0 to 4 + 2n.

In an embodiment, the dicarboxylic acid (A) may further comprise (a3) an aliphatic dicarboxylic acid.

In an embodiment, the glass transition temperature (Tg) of the copolymer polyamide resin may be 140 ° C or higher.

In an embodiment, the copolymer polyamide resin may have a water absorption rate of 5% or less after being treated at 50 DEG C and 90% relative humidity for 48 hours.

In an embodiment, the intrinsic viscosity of the copolymer polyamide resin may be 0.8 to 1.0 dL / g.

In an embodiment, the copolymerized polyamide resin may be encapsulated with a terminal endblock selected from the group consisting of aliphatic carboxylic acids and aromatic carboxylic acids.

Preferably, the endblocking agent is selected from the group consisting of acetic acid, propionic acid, butyric acid, valeric acid, caproic acid, caprylic acid, lauric acid, tridecanoic acid, myristic acid, palmitic acid, stearic acid, pivalic acid, Benzoic acid, toluic acid,? -Naphthalenecarboxylic acid,? -Naphthalenecarboxylic acid, and methylnaphthalenecarboxylic acid.

Another aspect of the present invention relates to a method for producing the copolymer polyamide resin. The method comprises: (A) copolymerizing a dicarboxylic acid and (B) a diamine, wherein the dicarboxylic acid (A) is (a1) a dicarboxylic acid containing a diphenylene ether unit; And (a2) an aromatic dicarboxylic acid, and the diamine (B) comprises (b1) an aromatic diamine and (b2) an aliphatic diamine.

In an embodiment, the content of the dicarboxylic acid (a1) in the dicarboxylic acid (A) is from 5 to 95 mol%, the content of the aromatic dicarboxylic acid (a2) The content may be from 5 to 95 mol%.

In an embodiment, the content of the aromatic diamine (b1) in the diamine (B) may be 5 to 95 mol%, and the content of the aliphatic diamine (b2) may be 5 to 95 mol%.

In an embodiment, the dicarboxylic acid (A) may further comprise (a3) an aliphatic dicarboxylic acid.

In an embodiment, the glass transition temperature (Tg) of the copolymer polyamide resin may be 140 ° C or higher.

Another aspect of the present invention relates to a molded article formed from the copolymer polyamide resin.

The present invention has the effect of providing a high heat-resistant copolymerized polyamide resin having a glass transition temperature of 140 ° C or more and excellent in thermal stability and dimensional stability, a method for producing the same, and a molded article comprising the same.

Hereinafter, the present invention will be described in detail.

The copolymerized polyamide resin according to the present invention comprises (A) a dicarboxylic acid; Wherein the dicarboxylic acid (A) comprises (a1) a dicarboxylic acid containing a diphenylene ether unit and (a2) an aromatic dicarboxylic acid, wherein the diamine ( B) is characterized by containing (b1) an aromatic diamine and (b2) an aliphatic diamine.

In the present specification, the term dicarboxylic acid and the like includes dicarboxylic acids, alkyl esters thereof (lower alkyl esters having 1 to 4 carbon atoms, such as monomethyl, monoethyl, dimethyl, diethyl or dibutyl esters) Acid anhydride, and the like, and react with a diamine to form a dicarboxylic acid moiety. Further, in the present specification, the dicarboxylic acid moiety and the diamine moiety are preferably a dicarboxylic acid moiety and a diamine moiety. When a dicarboxylic acid and a diamine are polymerized, a hydrogen atom, a hydroxyl group or an alkoxy group is removed, residue.

(A) dicarboxylic acid

The dicarboxylic acid (A) used in the present invention includes (a1) a dicarboxylic acid containing a diphenylene ether unit and (a2) an aromatic dicarboxylic acid.

(a1) a dicarboxylic acid containing a diphenylene ether unit

The dicarboxylic acid (a1) containing the diphenylene ether unit is a monomer having a structure similar to that of polyphenylene ether (PPE) in the main chain. The polyamide resin has thermal stability, Dimensional stability and the like as a form of comonomer for incorporation without compatibility problems. Examples of the dicarboxylic acid containing the diphenylene ether unit include, but are not limited to, 4'4'-oxybis (benzoic acid) and the like. Preferably, a substituted or unsubstituted 4'4'-oxybis (benzoic acid) can be used.

In one embodiment, the dicarboxylic acid moiety derived from the dicarboxylic acid (a1) comprising the diphenylene ether unit may be represented by the following formula (1).

[Chemical Formula 1]

R ₁ and R ₂ are each independently a hydrocarbon group having 1 to 10 carbon atoms, preferably 1 to 5 carbon atoms, a halogen group, a hydroxyl group or an alkoxy group having 1 to 5 carbon atoms, a and b are each independently Lt; / RTI >

In the present specification, the term "hydrocarbon group" means a linear, branched or cyclic saturated or unsaturated hydrocarbon radical. In the specification of the present invention, "substituted" means that a hydrogen atom is substituted by a substituent such as an alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, a halogen group, or a combination thereof. The substituent may preferably be an alkyl group having 1 to 6 carbon atoms, more preferably an alkyl group having 1 to 3 carbon atoms.

The content of the dicarboxylic acid (a1) containing the diphenylene ether unit may be 5 to 95 mol%, preferably 10 to 90 mol%, based on the dicarboxylic acid (A). Within the above range, the copolymer polyamide resin is excellent in thermal stability and dimensional stability.

(a2) aromatic dicarboxylic acid

As the aromatic dicarboxylic acid (a2), at least one aromatic dicarboxylic acid having 8 to 20 carbon atoms other than the dicarboxylic acid (a1) containing the diphenylene ether unit may be used. For example, terephthalic acid, isophthalic acid, 2,6-naphthalene dicarboxylic acid, 2,7-naphthalene dicarboxylic acid, 1,4-naphthalene dicarboxylic acid, diphenylmethane-4,4'-dicar Diphenylsulfone-4,4'-dicarboxylic acid, 4-4'-diphenylcarboxylic acid, and mixtures thereof, but are not limited thereto. Preferably, terephthalic acid, isophthalic acid or a mixture thereof, more preferably terephthalic acid, or a mixture of terephthalic acid and isophthalic acid.

The content of the aromatic dicarboxylic acid (a2) may be 5 to 95 mol%, preferably 10 to 90 mol%, based on the dicarboxylic acid (A). Within the above range, the copolymer polyamide resin is excellent in heat resistance and crystallinity.

The dicarboxylic acid (A) of the present invention may further comprise (a3) an aliphatic dicarboxylic acid in order to further increase the processability of the copolymerized polyamide resin. As the preferred example of the aliphatic dicarboxylic acid (a3), adipic acid may be used, but it is not limited thereto. The aliphatic dicarboxylic acid (a3) may further contain up to 40 mol%, preferably from 1 to 35 mol%, more preferably from 5 to 25 mol%, of the total dicarboxylic acid (A). Within the above range, a copolymerized polyamide resin having better processability can be obtained.

(B) diamine

The diamine (B) used in the present invention comprises (b1) an aromatic diamine and (b2) an aliphatic diamine.

(b1) an aromatic diamine

As the aromatic diamine (b1), at least one aromatic diamine having 6 to 30 carbon atoms may be used. Examples thereof include phenylenediamine compounds such as m-phenylenediamine and p-phenylenediamine, xylenediamine compounds such as m-xylenediamine and p-xylenediamine, But the present invention is not limited thereto. Preferably, a xylylenediamine compound can be used.

In one embodiment, the diamine moiety derived from the aromatic diamine (b1) may be represented by the following formula (2).

(2)

Wherein R ₃ and R ₄ are each independently a single bond or an alkylene group having 1 to 10 carbon atoms, preferably 1 to 3 carbon atoms, and R ₅ is an alkylene group having 1 to 10 carbon atoms, preferably 1 to 5 carbon atoms A halogen group, a hydroxyl group or an alkoxy group having 1 to 5 carbon atoms, n is an integer of 0 to 3, and c is an integer of 0 to 4 + 2n.

The content of the aromatic diamine (b1) may be 5 to 95 mol%, preferably 10 to 90 mol%, based on the diamine (B). Within the above range, the copolymer polyamide resin is excellent in heat resistance and crystallinity.

(b2) aliphatic diamines

As the aliphatic diamine (b2), at least one aliphatic diamine having 4 to 20 carbon atoms may be used. For example, there can be mentioned 1,4-butanediamine, 1,6-hexanediamine (hexamethylenediamine), 1,7-heptanediamine, 1,8-octanediamine, 1, 5-pentanediamine, 2,2,4-trimethyl-1,6-hexanediamine, 2,4,4-trimethyl-1,6-hexanediamine, , 2-oxybis (ethylamine), bis (3-aminopropyl) ether, ethylene glycol bis (3-aminopropyl) ether (EGBA), 1,7-diamino-3,5-dioxoheptane And mixtures thereof. However, the present invention is not limited thereto. Preferably, 1,4-butanediamine, 1,6-hexanediamine, or a mixture thereof can be used, and more preferably 1,6-hexanediamine can be used.

The content of the aliphatic diamine (b2) may be 5 to 95 mol%, preferably 10 to 90 mol%, of the diamine (B). Within the above range, the processability and the like of the copolymerized polyamide resin are excellent.

In the copolymer polyamide resin of the present invention, the ratio (molar ratio ratio: diamine (B) / dicarboxylic acid (A)) of the dicarboxylic acid (A) to the diamine (B) is, for example, from 0.85 to 1.05 , Preferably 0.90 to 1.03. Within the above range, deterioration of physical properties due to unreacted monomers can be prevented.

The copolymer polyamide resin of the present invention may be encapsulated with an end capping agent whose terminal group is selected from the group consisting of aliphatic carboxylic acid and aromatic carboxylic acid.

Wherein the end-capping agent is selected from the group consisting of acetic, propionic, butyric, valeric, caproic, caprylic, lauric, tridecanoic, myristic, palmitic, stearic, pivalic, isobutyl, ,? -naphthalenecarboxylic acid,? -naphthalenecarboxylic acid, and methylnaphthalenecarboxylic acid, but the present invention is not limited thereto.

The terminal endblock may be contained in an amount of, for example, 0.01 to 5 moles, preferably 0.1 to 3 moles, per 100 moles of the dicarboxylic acid (A) and the diamine (B).

The glass transition temperature (Tg) of the copolymerized polyamide resin according to the present invention may be 140 占 폚 or higher, preferably 150 占 폚 or higher, and more preferably 150 to 170 占 폚. Within the above range, it may have high heat resistance, thermal refractility, etc. for use in automobile engine room parts and the like.

The crystallization temperature (Tc) of the copolymer polyamide resin may be 250 to 300 占 폚, preferably 260 to 290 占 폚, and the melting temperature (Tm) may be 300 to 340 占 폚, preferably 305 to 320 占 폚. Within this range, the copolymerized polyamide resin is excellent in crystallinity, workability and the like.

The copolymerized polyamide resin may have a water absorption rate of 5% or less, preferably 0.1 to 2% after being treated at 50 캜 for 48 hours at a relative humidity of 90%. Within this range, there is an advantage that the hygroscopicity is low.

The water absorption rate was 100 mm in length, 100 mm in width, and 3 mm in thickness. The specimen was vacuum dried at 120 ° C. for 4 hours, and the weight (W ₀ ) of the dried specimen was measured. ℃, it is possible to measure the weight (W ₁₎ of the specimen after the treatment for 48 hours at 90% RH, and calculating according to the following formula.

Water Absorption Rate (%) = | W ₁ -W ₀ | / W ₀ * 100

The copolymerized polyamide resin may have an intrinsic viscosity [?] Of 0.8 to 1.2 dL / g, preferably 0.85 to 0.95 dL / g, as measured by a Ubbelodhde viscometer at 25 ° C using a 98% sulfuric acid solution .

The copolymerized polyamide resin may have a weight average molecular weight of 10,000 to 15,000 g / mol as measured by GPC.

The copolymer polyamide resin may have a strength retention ratio of 80% or more, preferably 85 to 95%. The strength retention rate can be measured by the ratio of the tensile strength after treatment to the tensile strength before treatment for 24 hours at 80 ° C and a relative humidity of 95% in a thermo-hygrostat. The tensile strength can be measured according to ISO 527 (23 캜, 5 mm / min).

Another aspect of the present invention relates to a method for producing the polyamide resin. The process for producing a polyamide according to the present invention comprises copolymerizing the dicarboxylic acid (A) and the diamine (B).

The copolymerization can be carried out according to a conventional copolymerization method, for example, by a melt polymerization method or the like, and the polymerization temperature may be 80 to 300 ° C, preferably 90 to 280 ° C, The polymerization pressure may be 10 to 40 kgf / cm < ² >, but is not limited thereto.

In one embodiment, the polyamide resin is prepared by filling the reactor with the dicarboxylic acid (A), the diamine (B), the catalyst and water, stirring at 80 to 150 ° C for 0.5 to 2 hours, Maintaining at a temperature of 280 DEG C and a pressure of 20 to 40 kgf / cm2 for ² to 4 hours, then lowering the pressure to 10 to 20 kgf / cm < ² > for 1 to 3 hours (copolymerization) And then subjecting the obtained polyamide to a solid state polymerization at a temperature between the glass transition temperature (Tg) and the melting temperature (Tm) in a vacuum state for 10 to 30 hours.

A catalyst may be used for the copolymerization reaction. As the catalyst, a phosphorous-based catalyst may be used. For example, phosphoric acid, phosphorous acid, hypophosphorous acid or a salt or derivative thereof may be used. As a more specific example, phosphoric acid, phosphorous acid, hypophosphorous acid, sodium hypophosphate, sodium hypophosphonate and the like can be used.

The catalyst may be used in an amount of 0 to 3 parts by weight, preferably 0.001 to 1 part by weight, more preferably 0.01 to 0.5 parts by weight, based on 100 parts by weight of the total monomers ((A) + (B) But is not limited thereto.

In addition, in the method for producing the polyamide resin, the end encapsulant may be used in the above amount, and the viscosity of the synthesized polyamide resin can be controlled by controlling the content of the end encapsulant.

Another aspect of the present invention relates to a molded article. The molded article according to the present invention is formed from the copolymerized polyamide resin. For example, the polyamide resin may be made of an automotive UTH (under the hood) engine room material requiring a high glass transition temperature, but is not limited thereto. The molded article can be easily formed by a person having ordinary skill in the art to which the present invention belongs.

Hereinafter, the present invention will be described in more detail by way of examples, but these examples are for illustrative purposes only and should not be construed as limiting the present invention.

Example

Example  1-4 and Comparative Example  1-6

(OBA), terephthalic acid (TPA), adipic acid (AA) and diamine as 4'4'-oxybis (benzoic acid) (OBA), diamine as a dicarboxylic acid Xylenediamine (MXDA) and 1,6-hexamethylenediamine (HMDA) were added to 100 molar parts of the above dicarboxylic acid and diamine, 1.1 molar parts of acetic acid as a terminal endblocker and 100 molar parts of the above-mentioned dicarboxylic acid and diamine , 0.1 part by weight of sodium highphosphonate as a catalyst and 74 parts by weight of water were charged into a 1 liter autoclave and filled with nitrogen. At 130 ℃ and stirred for 60 minutes, and reacted for After raising for 2 hours in 230 ℃, and reacted for 3 hours while maintaining the 25 kgf / cm ^2, and then, was reduced to 15 kgf / cm ² 1 hours, polyamide A prepolymer was prepared. The prepared polyamide prepolymer was solid-phase-polymerized at 250 DEG C for 5 hours to obtain a copolymerized polyamide resin.

Monomer (mol%) Example Comparative Example One 2 3 4 One 2 3 4 5 6 Diacid OBA 5 95 15 20 - - - 35 - - TPA 95 5 35 55 95 90 65 65 55 55 AA - - - 25 5 10 35 - 45 45 Diamine MXDA 5 95 10 - 5 10 15 100 100 - HMDA 95 5 40 100 95 90 85 - - 100 Mole defense [Diamine] / [Diacid] 1.015

Experimental Example

The melting temperature, the heat of fusion, the crystallization temperature, the crystallization heat, the glass transition temperature, the intrinsic viscosity, the flowability, the strength retention and the water absorption rate of the polyamide resin prepared in the above Examples and Comparative Examples were evaluated in the following manner, The results are shown in Table 2 below.

Property evaluation method

(1) Glass transition temperature (unit: 占 폚): The polyamide resin obtained after solid phase polymerization in the examples and comparative examples was measured using a differential scanning calorimeter (DSC). The DSC was measured under the conditions of a nitrogen atmosphere, a temperature range of 30 to 400 占 폚, a temperature raising rate of 10 占 폚 / min, and a cooling rate of 10 占 폚 / min. The glass transition temperature was determined as the temperature measured at the second heating.

(2) Intrinsic viscosity (unit: dL / g): Measured using a 97% sulfuric acid solution and a Ubbelodhde viscometer at 25 ° C.

(3) Water Absorption Rate (unit:%): A specimen having a length of 100 mm, a width of 100 mm and a thickness of 3 mm was prepared and vacuum-dried at 120 ° C for 4 hours. The weight (W ₀ ) of the dried specimen was measured, and the dried specimen was treated in a thermo-hygrostat at 50 ° C and RH 90% for 48 hours, and the weight (W ₁ ) of the specimen was measured. The water absorption rate was calculated according to the following formula.

Water Absorption Rate (%) = | W ₁ -W ₀ | / W ₀ * 100

Example Comparative Example One 2 3 4 One 2 3 4 5 6 Glass transition temperature (캜) 142 149 164 137 113 118 121 126 102 95 Intrinsic viscosity (dL / g) 0.82 0.89 0.91 0.87 0.78 0.81 0.76 0.91 0.83 0.88 Water Absorption Rate (%) 1.7 1.5 1.0 1.3 2.3 3.1 3.7 2.4 2.5 3.1

From the results shown in Table 2, it can be seen that the copolymerized polyamide resin (Examples 1 to 7) according to the present invention has a high glass transition temperature and a low water absorption rate, and is excellent in thermal stability and dimensional stability. On the other hand, in Comparative Examples 1 to 6, the glass transition temperature was low and the water absorption rate was high, and it was found that thermal stability and dimensional stability were insufficient for application to various fields such as use for automobile engine room parts.

It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

Claims (20)

(A) a dicarboxylic acid; And (B) a diamine,
Wherein the dicarboxylic acid (A) comprises 5 to 95 mol% of a dicarboxylic acid containing a (a1) diphenylene ether unit and 5 to 95 mol% of an aromatic dicarboxylic acid (a2)
Wherein said diamine (B) comprises 5 to 95 mol% of (b1) aromatic diamine and 5 to 95 mol% of (b2) aliphatic diamine.
delete delete The aromatic dicarboxylic acid (a2) according to claim 1, wherein the aromatic dicarboxylic acid (a2) comprises at least one aromatic dicarboxylic acid having 8 to 20 carbon atoms other than the dicarboxylic acid (a1) Wherein the polyamide resin is a compound.
The copolymerized polyamide resin according to claim 1, wherein the aromatic diamine (b1) is a compound containing at least one aromatic diamine having 6 to 30 carbon atoms.
The copolymerized polyamide resin according to claim 1, wherein the aliphatic diamine (b2) is a compound containing at least one aliphatic diamine having 4 to 20 carbon atoms.
The copolymerized polyamide resin according to claim 1, wherein the dicarboxylic acid moiety derived from the dicarboxylic acid (a1) containing the diphenylene ether unit is represented by the following formula (1)
[Chemical Formula 1]

R ₁ and R ₂ are each independently a hydrocarbon group having 1 to 10 carbon atoms, a halogen group, a hydroxyl group or an alkoxy group having 1 to 5 carbon atoms, and a and b are each independently an integer of 0 to 4.
The copolymerized polyamide resin according to claim 1, wherein the diamine part derived from the aromatic diamine (b1) is represented by the following formula (2)
(2)

Wherein R ₃ and R ₄ are each independently a single bond or an alkylene group having 1 to 10 carbon atoms and R ₅ is a hydrocarbon group having 1 to 10 carbon atoms, a halogen group, a hydroxyl group, or an alkoxy group having 1 to 5 carbon atoms N is an integer of 0 to 3, and c is an integer of 0 to 4 + 2n.
The copolymer polyamide resin according to claim 1, wherein the dicarboxylic acid (A) further comprises (a3) an aliphatic dicarboxylic acid.
The copolymerized polyamide resin according to claim 1, wherein the copolymerized polyamide resin has a glass transition temperature (Tg) of 140 ° C or higher.
The copolymerized polyamide resin according to claim 1, wherein the copolymerized polyamide resin has a water absorption rate of 5% or less after being treated at 50 ° C and 90% relative humidity for 48 hours.
The copolymerized polyamide resin according to claim 1, wherein the copolymer polyamide resin has an intrinsic viscosity of 0.85 to 0.95 dL / g.
The copolymerized polyamide resin according to claim 1, wherein the copolymerized polyamide resin is end-capped with an end-capping agent selected from the group consisting of an aliphatic carboxylic acid and an aromatic carboxylic acid.
14. The method of claim 13, wherein the endblocking agent is selected from the group consisting of acetic acid, propionic acid, butyric acid, valeric acid, caproic acid, caprylic acid, lauric acid, tridecanoic acid, myristic acid, palmitic acid, stearic acid, pivalic acid, And at least one of an acid, a benzoic acid, a toluic acid, an alpha -naphthalenecarboxylic acid, a beta -naphthalenecarboxylic acid and a methylnaphthalenecarboxylic acid.
(A) a dicarboxylic acid, and (B) a diamine,
Wherein the dicarboxylic acid (A) is a dicarboxylic acid containing 5 to 95 mol% of (a1) diphenylene ether units; And 5 to 95 mol% of (a2) aromatic dicarboxylic acid,
The diamine (B) comprises 5 to 95 mol% of (b1) an aromatic diamine; And (b2) 5 to 95 mol% of an aliphatic diamine.
delete delete 16. The method for producing a copolymerized polyamide resin according to claim 15, wherein the dicarboxylic acid (A) further comprises (a3) an aliphatic dicarboxylic acid.
The method for producing a copolymerized polyamide resin according to claim 15, wherein the copolymerized polyamide resin has a glass transition temperature (Tg) of 140 ° C or higher.
A molded article formed from the copolymerized polyamide resin according to any one of claims 1 to 14.