KR101685244B1 - Polyamide resin, method for preparing the same, and article comprising the same - Google Patents

Abstract

The polyamide resin of the present invention comprises (a1) a dicarboxylic acid component (A) comprising an aromatic dicarboxylic acid component; And (b1) a diamine component (B) comprising 60 to 70 mol% of an aliphatic diamine component and 30 to 40 mol% of (b2) piperazine; and copolymerizing the dicarboxylic acid component (A) A carboxylic acid portion and a diamine portion derived from the diamine component (B) are repeated. The polyamide resin is excellent in workability, heat resistance and dimensional stability.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a polyamide resin, a method of producing the same,

TECHNICAL FIELD The present invention relates to a polyamide resin, a method for producing the same, and a product containing the same, and more specifically, to a high heat resistant copolymerized polyamide resin having excellent processability, heat resistance and dimensional stability, a method for producing the same, .

As the polyamide resin, aliphatic polyamide resins such as nylon 66 and nylon 6 are most well known. Although these aliphatic polyamide resins are widely used for automobile parts, electric appliances, electronic products, and machine parts, they do not have sufficient thermal stability to be applied to fields requiring high heat resistance characteristics.

The aromatic polyamide resin has a higher melting temperature and higher heat resistance than the aliphatic polyamide resin, but has a poor workability due to a high melting temperature and has been used for limited use.

Generally, in the case of high heat-resistant nylon, since it has a semi-crystalline structure and the heat-resistant temperature is considerably higher than that of general nylon, it can be used in various fields requiring high heat resistance characteristics. However, in the case of conventional products, the glass transition temperature (Tg) is 90 to 120 占 폚, which has a low glass transition temperature.

For example, in the case of polyamide (nylon) 6T, since the melting temperature is higher than the decomposition temperature, melt processing is impossible, and copolymerization is generally carried out to lower the processing temperature. Particularly, when an aliphatic monomer such as adipic acid is used as the copolymerizable monomer, it has a glass transition temperature of less than 100 占 폚.

In order to use high heat-resistant nylon as a UTH (under the hood) engine room material, high heat resistance is required due to the high temperature of the engine room. In the case of polymers, most of the physical properties are lowered from the glass transition temperature, so they should have a glass transition temperature higher than the product use temperature. The use of aliphatic diacid among polyamide 6T copolymers is not suitable for UTH due to its low glass transition temperature.

Therefore, it is necessary to develop a polyamide resin having a high glass transition temperature while improving melt processability.

An object of the present invention is to provide a high heat-resistant copolymerized polyamide resin excellent in workability, heat resistance and dimensional stability with a glass transition temperature of 130 ° C or higher.

Another object of the present invention is to provide a process for producing the polyamide resin.

It is still another object of the present invention to provide a product formed of the polyamide resin.

The above and other objects of the present invention can be achieved by the present invention described below.

One aspect of the invention relates to polyamide resins. The polyamide resin according to one embodiment of the present invention comprises (a1) a dicarboxylic acid component (A) containing an aromatic dicarboxylic acid component; And (b1) a diamine component (B) comprising 60 to 70 mol% of an aliphatic diamine component and 30 to 40 mol% of (b2) piperazine; and copolymerizing the dicarboxylic acid component (A) A carboxylic acid portion and a diamine portion derived from the diamine component (B) are repeated.

In an embodiment, the dicarboxylic acid component (A) further comprises less than 30 mol% of (a2) adipic acid, and the dicarboxylic acid component (A) and the diamine component (B) The total content of the adipic acid (a2) and the piperazine (b2) may be 15 to 30 mol%.

In an embodiment, the aromatic dicarboxylic acid component (a1) may include at least one aromatic dicarboxylic acid component having 8 to 20 carbon atoms.

In an embodiment, the aliphatic diamine component (b1) may include at least one aliphatic diamine component having 4 to 20 carbon atoms.

In an embodiment, the glass transition temperature (Tg) of the polyamide resin may be 130 ° C or higher.

In an embodiment, the crystallization temperature (Tc) of the polyamide resin may be 240 to 300 ° C, and the melting temperature (Tm) may be 300 to 350 ° C.

In an embodiment, the polyamide resin may have a water uptake of 3% or less after treatment at 50 DEG C and 90% relative humidity for 48 hours.

In an embodiment, the polyamide resin may be encapsulated with a terminal endblock selected from the group consisting of aliphatic carboxylic acids and aromatic carboxylic acids.

For example, the end-capping agent may be selected from the group consisting of acetic acid, propionic acid, butyric acid, valeric acid, caproic acid, caprylic acid, lauric acid, tridecanoic acid, myristic acid, palmitic acid, stearic acid, pivalic acid, Benzoic acid, toluic acid,? -Naphthalenecarboxylic acid,? -Naphthalenecarboxylic acid, and methylnaphthalenecarboxylic acid.

In addition, the polyamide resin according to another embodiment of the present invention is characterized in that a diamine component containing 30 to 40 mol% piperazine is copolymerized and has a glass transition temperature (Tg) of 140 ° C or more.

Another aspect of the present invention relates to a method for producing the polyamide resin. (B1) 60 to 70 mol% of an aliphatic diamine component and 30 to 40 mol% of (b2) piperazine, wherein the component (a1) comprises an aromatic dicarboxylic acid component (A) And (B) a diamine component.

In an embodiment, the dicarboxylic acid component (A) further comprises less than 30 mol% of (a2) adipic acid, and the dicarboxylic acid component (A) and the diamine component (B) The total content of the adipic acid (a2) and the piperazine (b2) may be 15 to 30 mol%.

Another aspect of the present invention relates to a molded article formed from the polyamide resin.

The present invention has the effect of providing a high heat-resistant copolymerized polyamide resin excellent in processability, heat resistance and dimensional stability with a glass transition temperature of 130 ° C or higher, a method for producing the same, and a product containing the same.

Hereinafter, the present invention will be described in detail.

The polyamide resin according to one embodiment of the present invention comprises (a1) a dicarboxylic acid component containing an aromatic dicarboxylic acid component and (b1) from 60 to 70 mol% of an aliphatic diamine component and (b2) (B) a diamine component comprising 30 to 40 mol% of piperazine is copolymerized to form a dicarboxylic acid moiety derived from the dicarboxylic acid component (A) and a diamine component derived from the diamine component (B) And a part is repeated.

The polyamide resin according to another embodiment of the present invention is formed by copolymerizing a diamine component containing 30 to 40 mol% piperazine and has a glass transition temperature (Tg) of 140 ° C or higher.

In the present specification, the term dicarboxylic acid component and the like includes dicarboxylic acid, an alkyl ester thereof (lower alkyl ester having 1 to 4 carbon atoms such as monomethyl, monoethyl, dimethyl, diethyl or dibutyl ester) Acid anhydride, and the like, and react with the diamine component to form a dicarboxylic acid moiety. Further, in the present specification, the dicarboxylic acid moiety and the diamine moiety are preferably such that when the dicarboxylic acid component and the diamine component are polymerized, the hydrogen atom, the hydroxyl group or the alkoxy group is removed, Residue. ≪ / RTI >

(A) a dicarboxylic acid component

The dicarboxylic acid component (A) used in the present invention includes a conventional (a1) aromatic dicarboxylic acid component used for producing a high heat-resistant polyamide resin (nylon).

The aromatic dicarboxylic acid component (a1) may include at least one aromatic dicarboxylic acid component having 8 to 20 carbon atoms, and examples thereof include terephthalic acid, isophthalic acid, 2,6-naphthalenedicarboxylic acid , 2,7-naphthalene dicarboxylic acid, 1,4-naphthalene dicarboxylic acid, 1,4-phenylenedioxyphenylenic acid, 1,3-phenylenedioxydiacetic acid, diphenic acid, 4'4'- Bis (benzoic acid), diphenylmethane-4,4'-dicarboxylic acid, diphenylsulfone-4,4'dicarboxylic acid, 4-4'-diphenylcarboxylic acid or a mixture thereof, For example, terephthalic acid, isophthalic acid or mixtures thereof, specifically terephthalic acid, or a mixture of terephthalic acid and isophthalic acid.

Further, the dicarboxylic acid component (A) may contain less than 30 mol% of (a2) adipic acid relative to the total dicarboxylic acid component (A) in order to further increase the processability of the polyamide resin. As shown in FIG.

In this case, the content of the aromatic dicarboxylic acid component (a1) in the dicarboxylic acid component (A) may be more than 70 mol%, for example, from 75 to 95 mol%, specifically from 75 to 90 mol% , And the content of the adipic acid (a2) may be less than 30 mol%, for example, 5 to 25 mol%, specifically 10 to 25 mol%. Within the above range, a polyamide resin excellent in physical properties such as heat resistance and processability can be obtained.

(B) a diamine component

The diamine component (B) used in the present invention necessarily contains the piperazine (b2) as a copolymerizable monomer together with the aliphatic diamine component (b1) in order to produce a polyamide resin having high heat resistance.

The aliphatic diamine component (b1) may include at least one aliphatic diamine component having 4 to 20 carbon atoms, for example, 1,4-butanediamine, 1,6-hexanediamine (hexamethylenediamine) ), 1,7-heptanediamine, 1,8-octanediamine, 1,10-decanediamine, 2-methyl-1,5-pentanediamine, 2,2,4-trimethyl- (Ethylamine), bis (3-aminopropyl) ether, ethylene glycol bis (3-ethylhexylamine) -Aminopropyl) ether (EGBA), 1,7-diamino-3,5-dioxoheptane, mixtures thereof, and the like, but is not limited thereto. For example, 1,4-butanediamine, 1,6-hexanediamine, and mixtures thereof. Specifically, 1,6-hexanediamine can be used.

The piperazine (b2) has a hexagonal ring structure containing two nitrogen atoms, and when it is copolymerized, a polyamide resin having a high glass transition temperature (Tg) of 140 ° C or more can be produced. The cyclic secondary amine may degrade the crystallinity and the crystallization rate due to the high heat resistance characteristic attributed to the structure during polymerization and the lack of hydrogen atoms in the amide bond. In this case, during the production of the polyamide resin, the adipic acid (a2) may be copolymerized to compensate for the decrease in the crystallinity and crystallization rate.

Wherein the content of the aliphatic diamine component (b1) in the diamine component (B) is 60 to 70 mol%, for example 61.5 to 68.5 mol%, specifically 62.5 to 67.5 mol%, and the content of the piperazine (b2) Is 30 to 40 mol%, for example, 31.5 to 38.5 mol%, specifically 32.5 to 37.5 mol%. When the content of the aliphatic diamine component (b1) is less than 60 mol% or the content of the piperazine (b2) is more than 40 mol%, the crystallinity and workability of the polyamide resin may be deteriorated. When the content of the diamine component (b1) exceeds 70 mol%, or when the content of the piperazine (b2) is less than 30 mol%, the heat resistance of the polyamide resin may decrease.

When the adipic acid (a2) is used, the adipic acid (a2) and the piperazine (b2) are added to the entire dicarboxylic acid component (A) and the diamine component (B) ) May be from 15 to 30 mol%, for example from 17 to 28 mol%. Within the above range, a polyamide resin having excellent properties such as crystallinity, workability and heat resistance can be obtained.

In the polyamide resin of the present invention, the ratio (molar ratio ratio: diamine component (B) / dicarboxylic acid component (A)) of the dicarboxylic acid component (A) and the diamine component (B) 0.93 to 1.07, for example, 0.97 to 1.03. Within the above range, deterioration of physical properties due to unreacted monomers can be prevented.

The polyamide resin of the present invention may be encapsulated with an end capping agent whose terminal group is selected from the group consisting of aliphatic carboxylic acid and aromatic carboxylic acid.

Examples of the end-capping agent include acetic acid, propionic acid, butyric acid, valeric acid, caproic acid, caprylic acid, lauric acid, tridecanoic acid, myristic acid, palmitic acid, stearic acid, pivalic acid, isobutylic acid, ,? -naphthalenecarboxylic acid,? -naphthalenecarboxylic acid, methylnaphthalenecarboxylic acid, and mixtures thereof, but are not limited thereto.

The end-capping agent may be contained in an amount of 0 to 5 molar parts, for example, 0.01 to 3 molar parts, per 100 molar parts of the dicarboxylic acid component (A) and the diamine component (B).

The glass transition temperature (Tg) of the polyamide resin according to the present invention may be 130 ° C or higher, for example, 140 ° C or higher, specifically 145-170 ° C. Within the above range, it may have high heat resistance, thermal refractility, etc. for use in automobile engine room parts and the like.

The crystallization temperature (Tc) of the polyamide resin may be 240 to 300 ° C, for example, 250 to 290 ° C, and the melting temperature (Tm) may be 300 to 350 ° C, for example, 305 to 340 ° C. Within the above range, it has a heat-resistant property suitable for UTH product use.

The polyamide resin may have a water absorption rate of 3% or less, for example, 2.2% or less, specifically 1.1 to 2.0% after being treated at 50 ° C and 90% RH for 48 hours. In the above range, long-term use under automobile antifreeze (H ₂ O + EG) may be possible as automobile engine room parts and the like.

The water absorption rate was 100 mm in length, 100 mm in width and 3 mm in thickness. The specimen was vacuum dried at 120 ° C. for 4 hours, and the weight (W 0) of the dried specimen was measured. The dried specimen was then heated at 50 ° C. , Relative humidity (RH) of 90% for 48 hours, and then the weight (W1) of the specimen is measured and can be calculated according to the following equation.

Water Absorption Rate (%) = | W1-W0 | / W0 * 100

The polyamide resin may have a measured intrinsic viscosity [] of 0.15 to 1 dL / g using a Ubbelodhde viscometer at 25 ° C using a 98% sulfuric acid solution or o -chlorophenol, but is not limited thereto Do not.

The polyamide resin may have a strength retention ratio of 82% or more, for example, 85 to 95%. The strength retention rate can be measured by the ratio of the tensile strength after treatment to the tensile strength before treatment for 24 hours at 80 ° C and a relative humidity of 95% in a thermo-hygrostat. The tensile strength can be measured according to ISO 527 (23 캜, 5 mm / min).

Another aspect of the present invention relates to a method for producing the polyamide resin. The process for producing a polyamide according to the present invention comprises reacting a dicarboxylic acid component (A) comprising the aromatic dicarboxylic acid component (a1) and from 60 to 70 mol% of the aliphatic diamine component (b1) ) And 30 to 40 mol% of a diamine component (B).

In an embodiment, the dicarboxylic acid component (A) may further contain less than 30 mol% of (a2) adipic acid, and the dicarboxylic acid component (A) and the diamine component , The total content of the adipic acid (a2) and the piperazine (b2) may be 15 to 30 mol%.

In the method for producing a polyamide resin, the copolymerization may be carried out according to a conventional copolymerization method, and may be carried out, for example, by a melt polymerization method or the like.

In the copolymerization, the polymerization temperature may be 80 to 300 ° C, for example, 80 to 280 ° C, and the polymerization pressure may be 10 to 40 kgf / cm ² , but is not limited thereto.

In one embodiment, the polyamide resin is prepared by filling the reactor with the dicarboxylic acid component (A), the diamine component (B), the catalyst and water, stirring at 80 to 150 ° C for 0.5 to 2 hours, Maintaining at a temperature of 200 to 280 DEG C and a pressure of 20 to 40 kgf / cm2 for ² to 4 hours, then lowering the pressure to 10 to 20 kgf / cm < ² > for 1 to 3 hours (copolymerization) And solid state polymerization of the obtained polyamide at a temperature between the glass transition temperature (Tg) and the melting temperature (Tm) in a vacuum state for 10 to 30 hours.

A catalyst may be used for the copolymerization reaction. As the catalyst, a phosphorous-based catalyst may be used. For example, phosphoric acid, phosphorous acid, hypophosphorous acid or a salt or derivative thereof may be used. As a more specific example, phosphoric acid, phosphorous acid, hypophosphorous acid, sodium hypophosphate, sodium hypophosphonate and the like can be used.

The catalyst may be used in an amount of 0 to 3 parts by weight, for example, 0.001 to 1 part by weight, particularly 0.01 to 0.5 part by weight, based on 100 parts by weight of the total monomers ((A) + (B) But is not limited thereto.

In addition, in the method for producing the polyamide resin, the end encapsulant may be used in the above amount, and the viscosity of the synthesized polyamide resin can be controlled by controlling the content of the end encapsulant.

Another aspect of the present invention relates to a product (molded article). The product according to the invention is formed (made) from the polyamide resin. For example, the polyamide resin may be made of an automotive UTH (under the hood) engine room material requiring a high glass transition temperature, but is not limited thereto. The product can be easily formed by a person having ordinary skill in the art to which the present invention belongs.

Hereinafter, the present invention will be described in more detail by way of examples, but these examples are for illustrative purposes only and should not be construed as limiting the present invention.

Example

Examples 1-3 and Comparative Examples 1-6

(HMDA) as a dicarboxylic acid component (Diacid), terephthalic acid (TPA) and adipic acid (AA) and a diamine component (Diamine) according to the composition shown in Tables 1 and 2, 2-methylpentanediamine (MPD) and piperazine (PIP) were added to 100 molar parts of the above dicarboxylic acid component and diamine component, 1.5 molar parts of acetic acid as an endcapping agent, 100 parts by weight of the above dicarboxylic acid component and diamine component , 0.1 part by weight of sodium hyphaphosphonate as a catalyst and 40 parts by weight of water were charged into a 1 liter autoclave and filled with nitrogen. At 130 ℃ and stirred for 60 minutes, and reacted for After raising for 2 hours in 250 ℃, and reacted for 3 hours while maintaining the 25 kgf / cm ^2, and then, was reduced to 15 kgf / cm ² 1 hours, polyamide A prepolymer was prepared. The prepared polyamide prepolymer was subjected to solid phase polymerization at 230 DEG C for 8 hours to obtain a polyamide resin.

Monomer (mol%) Example One 2 3 Diacid TPA 100 100 100 AA - - - Diamine HMDA 70 65 60 MPD - - - PIP 30 35 40 Mole defense [Diamine] /
[Diacid] 1.015

Monomer (mol%) Comparative Example One 2 3 4 5 6 Diacid TPA 100 65 55 100 85 75 AA - 35 45 - 15 25 Diamine HMDA 100 100 100 70 50 100 MPD - - - 30 - - PIP - - - - 50 - Mole defense [Diamine] /
[Diacid] 1.015

Experimental Example

The melting temperature, the heat of fusion, the crystallization temperature, the crystallization heat, the glass transition temperature, the intrinsic viscosity, the flowability, the strength retention and the water absorption rate of the polyamide resin prepared in the above Examples and Comparative Examples were evaluated in the following manner, Are shown in Tables 3 and 4 below.

Property evaluation method

(1) Melting temperature, crystallization temperature and glass transition temperature (unit: 占 폚): The polyamide resin obtained after the solid phase polymerization in the examples and comparative examples was measured using a differential scanning calorimeter (DSC). The DSC was measured under the conditions of a nitrogen atmosphere, a temperature range of 30 to 400 占 폚, a temperature raising rate of 10 占 폚 / min, and a cooling rate of 10 占 폚 / min. At this time, the crystallization temperature was the maximum point of the exothermic peak during cooling, and the melting temperature was determined as the maximum point of the endothermic peak at the second temperature rise. The glass transition temperature was determined as the temperature measured at the second heating.

(2) Heat of fusion and crystallization heat (unit: J / g): The heat of fusion was determined by the area ratio of the endothermic peak at the second heating, and the crystallization heat by the area ratio of the exothermic peak during the first cooling.

(3) Intrinsic viscosity (unit: dL / g): Measured using a 97% sulfuric acid solution and a Ubbelodhde viscometer at 25 ° C.

(4) Fluidity (unit: mm): Sumitomo injection molding machine SG75H-MIV was used. The cylinder temperature and mold temperature were set at 320 ° C and the injection pressure was set at 15 MPa to measure the flow distance.

(5) Water Absorption Rate (unit:%): A specimen having a length of 100 mm, a width of 100 mm and a thickness of 3 mm was prepared and vacuum-dried at 120 ° C for 4 hours. The weight (W0) of the dried specimen was measured, and the dried specimen was treated in a thermo-hygrostat at 50 DEG C and 90% RH for 48 hours, and then the weight (W1) of the specimen was measured. The water absorption rate was calculated according to the following formula.

Water Absorption Rate (%) = | W1-W0 | / W0 * 100

(6) Strength retention ratio (unit:%): The strength retention ratio was obtained by measuring the ratio of tensile strength after treatment to tensile strength before treatment for 24 hours at a temperature of 80 ° C and a relative humidity of 95% in a thermo-hygrostat. The tensile strength was measured according to ISO 527 (23 캜, 5 mm / min).

Example One 2 3 Melting temperature (캜) 333 321 315 Heat of fusion (J / g) 39 32 26 Crystallization temperature (캜) 290 266 255 Crystallization heat (J / g) 41 28 25 Glass transition temperature (캜) 163 165 166 Intrinsic viscosity (dL / g) 0.20 0.20 0.18 Flowability (mm) 90 94 95 Strength retention (%) 90 88 87 Water Absorption Rate (%) 2.0 2.0 1.9

Comparative Example One 2 3 4 5 6 Melting temperature (캜) 365 322 307 327 - 343 Heat of fusion (J / g) - 57 45 58 - 29 Crystallization temperature (캜) 338 290 275 302 - 308 Crystallization heat (J / g) - 52 42 40 - 27 Glass transition temperature (캜) - 99 90 143 161 147 Intrinsic viscosity (dL / g) 0.23 0.20 0.21 0.19 0.17 0.19 Flowability (mm) 85 94 102 97 - 75 Strength retention (%) 85 86 85 88 - 81 Water Absorption Rate (%) 1.6 2.1 2.8 2.1 - 1.9

From the results shown in Tables 3 and 4, it can be seen that the polyamide resins (Examples 1 to 3) according to the present invention have excellent heat resistance and excellent moldability from the results of melting temperature, crystallization temperature and fluidity. Further, it can be seen that the water absorption rate is low and the strength retention rate is high.

On the other hand, the polyamide resins of Comparative Examples 1 to 3, in which piperazine is not used as a comonomer, have a glass transition temperature of less than 100 占 폚, which is poor in heat resistance or decomposes due to a high melting temperature and has a glass transition temperature, And the polyamide resin of Comparative Example 4 using MPD as the comonomer instead of piperazine as the comonomer may inhibit the molecular weight increase during solid phase polymerization due to the cyclization reaction of MPD. In the case of Comparative Example 6 in which the content of piperazine is less than 30 mol%, it is not suitable for UTH applications because of its relatively high melting temperature and low crystallinity. In the case of Comparative Example 5 in which the content of piperazine exceeds 40 mol% and the content of comonomer (adipic acid, piperazine) exceeds 30 mol% based on the total dicarboxylic acid component and diamine component, It became amorphous and thermal characteristics other than Tg could not be confirmed.

It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

Claims (13)

(a1) an aromatic dicarboxylic acid component; And
(b1) a diamine component comprising 60 to 70 mol% of an aliphatic diamine component and 30 to 40 mol% of (b2) piperazine;
A dicarboxylic acid moiety derived from the aromatic dicarboxylic acid component (a1) and a diamine moiety derived from the diamine component (B) are repeated,
Wherein the glass transition temperature (Tg) is not lower than 163 占 폚, the crystallization temperature (Tc) is from 255 to 300 占 폚, and the melting temperature (Tm) is from 315 to 350 占 폚.
delete The polyamide resin according to claim 1, wherein the aromatic dicarboxylic acid component (a1) comprises at least one aromatic dicarboxylic acid component having 8 to 20 carbon atoms.
The polyamide resin according to claim 1, wherein the aliphatic diamine component (b1) comprises at least one aliphatic diamine component having 4 to 20 carbon atoms.
delete delete The polyamide resin according to claim 1, wherein the polyamide resin has a moisture absorption rate of 3% or less after being treated at 50 ° C and 90% relative humidity for 48 hours.
The polyamide resin according to claim 1, wherein the polyamide resin is encapsulated with a terminal end group selected from the group consisting of an aliphatic carboxylic acid and an aromatic carboxylic acid.
9. The composition of claim 8, wherein the endblocking agent is selected from the group consisting of acetic acid, propionic acid, butyric acid, valeric acid, caproic acid, caprylic acid, lauric acid, tridecanoic acid, myristic acid, palmitic acid, stearic acid, pivalic acid, Wherein the polyamide resin comprises at least one of an acid, benzoic acid, toluic acid,? -Naphthalenecarboxylic acid,? -Naphthalenecarboxylic acid and methylnaphthalenecarboxylic acid.
delete (B) a diamine component comprising (a1) an aromatic dicarboxylic acid component, and (b1) 60 to 70 mol% of an aliphatic diamine component and (b2) 30 to 40 mol%
Wherein the glass transition temperature (Tg) is not lower than 163 占 폚, the crystallization temperature (Tc) is from 255 to 300 占 폚, and the melting temperature (Tm) is from 315 to 350 占 폚.
delete 10. A molded article formed from the polyamide resin according to any one of claims 1, 3, 4, and 7 to 9.