KR101556695B1 - System of sensing high temperatrue by device of high voltage distributing board, low voltage distributing board, distributing board, motor contorl board using multi-array infrared sensor - Google Patents

Abstract

A degradation sensing system of the present invention comprises: a multi array infrared ray sensor which senses temperatures according to a power device of a high voltage distribution board, a low voltage distribution board and a motor control board; an initial temperature memory which stores an initial temperature of the power device; a reference temperature memory which stores a reference temperature range in advance to judge degradation according to the power device; a degradation judgment module which judges degradation according as a difference between the temperature of the power device sensed by the multi array infrared ray sensor and the initial temperature of the corresponding power device stored in the initial temperature memory is within a reference temperature range of the corresponding power device stored in the reference temperature memory; and a warning module for outputting a warning signal according to the judgment result of the degradation judgment module. By the degradation sensing system per device of the high voltage distribution board, the low voltage distribution board and the motor control board using the multi array infrared ray sensor, the present invention has the effect of being able to judge degradation state per individual part accurately instead of the prior method, by configuring the system to perform the judgment individually by setting each temperature range as to the degradation state or a warning state according to various power devices comprised in the high voltage distribution board, the low voltage distribution board and the motor control board. Also, in case of a three-phase transformer, the system can judge accurate degradation and degradation possibility accurately, by coping with temperature variation per phase.

Description

TECHNICAL FIELD [0001] The present invention relates to a system for detecting deterioration of a high-voltage switchboard, a low-voltage switchboard, a distribution board, and a motor control panel using a multi-array infrared sensor, ARRAY INFRARED SENSOR}

The present invention relates to a deterioration monitoring system for a high-voltage switchboard, a low-voltage switchboard, a distribution board, a motor control board, and the like.

The switchboard is used to convert high-pressure power to low pressure and supply it to a wide range of power consumers such as residential areas, buildings, schools, factories, ports, airports, water supply and sewage treatment plants, substations, heavy industrial plants, subways, chemical complexes, It is installed in the water distribution system and is used for power monitoring, control and protection.

The switchboard can lead to the aging of the equipment or the fire due to the arc or deterioration. In the case of existing switchgear, it is configured to detect deterioration through an infrared sensor or various sensors.

Conventionally, when the temperature rises by the sensor, it is judged as deterioration.

However, since there are various power devices such as a transformer, a cable, a breaker, and a switch inside the switchgear, the power devices have a variety of materials such as synthetic resin and metal, Should be judged.

However, in the conventional switching and monitoring temperature monitoring system, deterioration judgment is very uniform by judging deterioration based on a specific critical temperature. Depending on the kind of material, it may cause various state changes such as rapid deterioration at specific temperature and deterioration.

Therefore, there is a need for a more specific means for predicting the deterioration possibility or determining the deterioration in advance depending on whether a specific material is sensitive to a temperature change or the like.

Korean Patent No. 0763648 (2007.09.27)

It is an object of the present invention to provide an apparatus-specific deterioration detection system for a high-voltage switchboard, a low-voltage switchboard, a distribution board, and a motor control panel using a multi-array infrared sensor.

The apparatus for each of the high voltage switchboard, the low voltage switchboard, the distribution board, and the motor control panel using the multi-array infrared sensor according to the present invention comprises a high voltage switchboard, a low voltage switchboard, a distribution board, Array infrared sensor; An initial temperature memory for storing an initial temperature of the power device; A reference temperature memory for storing in advance a reference temperature range for determining deterioration for each power device; It is determined whether or not the difference between the temperature of the power device detected by the multi-array infrared sensor and the initial temperature of the corresponding power device stored in the initial temperature memory is within the reference temperature range of the corresponding power device stored in the reference temperature memory A degradation determination module And a warning module for outputting a warning signal according to the determination result of the deterioration determination module.

At this time, the reference temperature range may be a predetermined temperature range for each power device.

If the surface temperature of the non-molded transformer is less than 95 ° C, the deterioration judgment module judges that it is in an abnormal state. If the surface temperature of the mold transformer is not less than 95 ° C and less than 110 ° C, It is judged that it is in an abnormal state when it is less than 120 ° C. and when it is less than 120 ° C. and less than 140 ° C. and when it is judged that the epoxy surface of the mold transformer is more than 70 ° C. and less than 80 ° C., It is determined that the temperature difference between the outer surface of the GLS and the GLS is less than or equal to 15 ° C. If the IV cable is less than 60 ° C. and less than 80 ° C., ° C to less than 100 ° C and the HIV cable is determined to be in an abnormal state when the HIV cable is less than 75 ° C to less than 100 ° C and the abnormal state is determined when the CV cable is less than 90 ° C to less than 110 ° C .

The deterioration judgment module judges that the temperature of one of the three-phase transformers is in a normal state when a temperature difference between 0 ° C and 5 ° C is generated as a result of comparing the temperature of the transformer with the temperature of the other two phases of the transformer. It is judged that the temperature difference is less than ~ 10 ° C, and it is judged that it is in the abnormal state when the temperature difference is more than 10 ° C ~ 20 ° C.

The multi-array infrared sensor may be configured to detect a multi-array of 16 X 4, respectively.

According to the device-specific deterioration detection system of the high-voltage switchboard, the low-voltage switchboard, the distribution board and the motor control panel using the above-described multi-array infrared sensor, the deterioration state or the state of attention of various power devices provided in the high voltage switchboard, low voltage switchboard, It is possible to accurately determine the deteriorated state of each individual part unlike the conventional method.

Further, even in the case of a three-phase transformer, it is possible to precisely judge the precise deterioration and the possibility of deterioration by preparing a temperature change for each phase.

1 is a block diagram of an apparatus-specific deterioration detection system for a high-voltage switchboard, a low-voltage switchboard, a distribution board, and a motor control panel using a multi-array infrared sensor according to an embodiment of the present invention.
2 is a block diagram of a high-voltage switchboard, a low-voltage switchboard, a distribution board, and a motor control panel using a multi-array infrared sensor according to an embodiment of the present invention.
3 is a circuit diagram of an infrared temperature sensor and a microcontroller according to an embodiment of the present invention.
4 is a difference chart showing a signal for reading data of an infrared temperature sensor according to an embodiment of the present invention.
5 is a flow chart for determining whether or not the complex electrical equipment is abnormal according to an embodiment of the present invention.
6 is a conceptual diagram for temperature sensing of a device-dependent deterioration detection system of a high-voltage switchboard, a low-voltage switchboard, a distribution board, and a motor control panel using a multi-array infrared sensor according to an embodiment of the present invention.
7 is a temperature sensing interface screen of a device-dependent deterioration detection system of a high-voltage switchboard, a low-voltage switchboard, a distribution board, and a motor control panel using a multi-array infrared sensor according to another embodiment of the present invention.
8 is an alarm screen of a high-voltage switchboard, a low-voltage switchboard, a distribution board, and a motor control panel using a multi-array infrared sensor according to an embodiment of the present invention.
9 is a communication status screen of a high-voltage switchboard, a low-voltage switchboard, a distribution board, and a motor control panel using a multi-array infrared sensor according to an embodiment of the present invention.
10 is a timing chart showing a transmission / reception sequence of a multi-array infrared sensor according to an embodiment of the present invention.
11 is a pixel table according to an embodiment of the present invention.

While the invention is susceptible to various modifications and alternative forms, specific embodiments thereof are shown by way of example in the drawings and will herein be described in detail to the concrete inventive concept.

It should be understood, however, that the invention is not intended to be limited to the particular embodiments, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention.

Like reference numerals are used for like elements in describing each drawing.

The terms first, second, A, B, etc. may be used to describe various elements, but the elements should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component. And / or < / RTI > includes any combination of a plurality of related listed items or any of a plurality of related listed items.

It is to be understood that when an element is referred to as being "connected" or "connected" to another element, it may be directly connected or connected to the other element, .

On the other hand, when an element is referred to as being "directly connected" or "directly connected" to another element, it should be understood that there are no other elements in between.

The terminology used in this application is used only to describe a specific embodiment and is not intended to limit the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise.

In the present application, the terms "comprises" or "having" and the like are used to specify that there is a feature, a number, a step, an operation, an element, a component or a combination thereof described in the specification, But do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or combinations thereof.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs.

Terms such as those defined in commonly used dictionaries are to be interpreted as having a meaning consistent with the contextual meaning of the related art and are to be interpreted as either ideal or overly formal in the sense of the present application Do not.

Hereinafter, preferred embodiments according to the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a block diagram of a device-dependent deterioration detection system for a high-voltage switchboard, a low-voltage switchboard, a distribution board, and a motor control panel using a multi-array infrared sensor according to an embodiment of the present invention. A low-voltage switchboard, a distribution board, and a motor control panel using a multi-array infrared sensor according to an embodiment of the present invention.

Referring to FIGS. 1 and 2, a device-specific deterioration detection system (hereinafter, referred to as 'device-dependent deterioration detection system') of a high-voltage switchboard, a low-voltage switchboard, a distribution board, and a motor control panel using a multi-array infrared sensor according to an embodiment of the present invention 100 may be configured to include a multi-array infrared sensor 110, an initial temperature memory 120, a reference temperature memory 130, a deterioration determination module 140, and a warning module 150.

The device-specific deterioration detection system 100 is configured to determine the deterioration state of various power devices provided in a high-voltage switchboard, a low-voltage switchboard, a distribution board, and a motor control panel.

The device-specific deterioration detection system 100 is configured to set the reference temperature range for deterioration differently according to the material of the power equipment and the type thereof, and thus the deterioration can be accurately determined.

In addition, even in the case of a three-phase transformer, it is possible to easily and accurately recognize the deterioration of each phase by judging the temperature difference between phases.

Hereinafter, the detailed configuration will be described.

The multi-array infrared sensor 110 may be configured to detect the temperature of each power device of the high-voltage switchboard, the low-voltage switchboard, the distribution board, and the motor control panel.

Here, the electric power equipment refers to various electric power equipment such as a cable, a transformer, a breaker, etc.,

The multi-array infrared sensor 110 may be configured to detect a multi-array of 16 X 4, respectively. Each array can be mapped and set for each power device.

The initial temperature memory 120 may be configured to store an initial temperature of the power device. The initial temperature may be periodically stored at predetermined time intervals.

The initial temperature may be configured such that the temperature sensed by the multi-array infrared sensor 110 is stored for each power device.

The reference temperature memory 130 may be configured to previously store a reference temperature range for determining deterioration for each power device. That is, the temperature for determining deterioration for each power device can be set differently for each power device.

For example, it can be set as shown in Table 1 below.

That is, it can be set differently depending on the electric power equipment such as MOLD (mold) transformer, GLS and cable, and the material thereof.

Power equipment standard Judgment Non-molded transformer surface temperature
80 ℃ ~ 95 ℃ Attention 95 ° C or more and less than 110 ° C More than Mold (MOLD)
Transformers

Iron core portion
100 ° C or more and less than 120 ° C Attention 120 ° C or more and less than 140 ° C More than Epoxy surface (Class B)
70 ° C or more and less than 80 ° C Attention 80 ° C or more and less than 100 ° C More than GLS External surface temperature difference 10 ° C or more and less than 15 ° C Attention
cable

IV cable 60 ° C or more and less than 80 ° C More than EV cable 75 ° C or more and less than 100 ° C More than HIV cable 75 ° C or more and less than 100 ° C More than CV cable 90 ° C or more and less than 110 ° C More than

For example, when the surface temperature of an unformed transformer is 80 degrees or more, it is noticed that there is a carefulness or an abnormality. Referring to Table 1, when the CV cable is a high-voltage cable, .

The deterioration determination module 140 may be configured to calculate the difference between the temperature of the power device sensed by the multi-array infrared sensor 110 and the initial temperature of the corresponding power device stored in the initial temperature memory 120. [

The deterioration determination module 140 determines whether the calculated temperature difference is within the reference temperature range of the corresponding power device stored in the reference temperature memory 130 and determines whether or not each power device is deteriorated based on the determination result .

Specifically, when the surface temperature of the non-molded transformer is less than 95 ° C and less than 95 ° C, the deterioration determining module 140 determines the abnormal state. When the temperature of the iron core of the mold transformer It is judged that the mold is in an abnormal state when the temperature is higher than or equal to 100 ° C and lower than 120 ° C and the abnormal state is determined that the temperature is higher than 120 ° C and lower than 140 ° C. When the epoxy surface of the mold transformer is lower than 70 ° C and lower than 80 ° C, If the temperature difference between the outer surface of the GLS and the IV cable is below 10 ° C and below 15 ° C, it is judged as an abnormal state. If the IV cable is above 60 ° C and below 80 ° C, It is determined that the cable is in an abnormal state when the cable is at least 75 ° C and less than 100 ° C and the abnormal state is determined when the HIV cable is at least 75 ° C and less than 100 ° C and the abnormal state is determined when the CV cable is at 90 ° C or more and less than 110 ° C To be have.

On the other hand, the deterioration determination module 140 may be configured to calculate the temperature difference of each phase transformer with respect to each phase transformer in the case of a three-phase transformer.

The deterioration determination module 140 may be configured to determine whether the temperature difference is within a predetermined temperature range and to determine whether the temperature difference is deteriorated or not.

The predetermined temperature range can be determined as shown in Table 2 below.

The deterioration determination module 140 determines that the temperature of the transformer of one phase of the three-phase transformer is higher than the temperature of the transformers of the remaining two phases. If the temperature difference is more than 0 ° C and less than 5 ° C, It is judged that the temperature difference is less than ~ 10 ° C, and it is judged that it is in the abnormal state when the temperature difference is more than 10 ° C ~ 20 ° C.

The warning module 150 may be configured to output a warning signal according to the determination result of the deterioration determination module 140. [

FIG. 3 shows a connection configuration diagram between the infrared temperature sensor 110 and the microcontroller of the main board, and FIG. 4 shows a circuit diagram of the infrared temperature sensor 110 and the microcontroller.

3, the multi-array infrared sensor 110 may be connected to the microcontroller as shown in FIG. 3, and the input / output pins of the multi-array infrared sensor 110 are shown in Table 3 below.

The multi-array infrared sensor 110 can apply a necessary signal through ten pins or output data of the sensed sensor.

The MCLK frequency read through the information of the multi-array infrared ray sensor 110 may be 1 MHz, and if the data stream fails to receive data normally, the microcontroller may reset the infrared ray temperature sensor 1100 Designed to be able to receive data normally after a while no matter what error occurs.

In order to operate the infrared temperature sensor 110 and receive data, an appropriate clock must be applied to the MCLK. The clock frequency of the MCLK reads data from the address of Ox59 and Ox5A from the EEPROM, .

The calculation formula is as shown in the following equation (1).

4 is a difference chart showing a signal for reading data of the infrared ray temperature sensor 110 according to an embodiment of the present invention.

In FIG. 4, the time of t (Pix) can be calculated by using the value of MCLK according to the following equation (2). Here, in order to obtain the secure data, the frequency of the SCK satisfying the formula of 32 X t (SCK) < t (Pix) should be used and the calculation of t (Pix)

In FIG. 4, the data size of the stream has a total size of 1056 words, and a synchronization word is included in the frame to detect a communication error.

The synchronization word in the frame is transmitted to the microcontroller by including 0x789A in the 1024th data and 0xBCDE in the 1025th data in the size of 2 words. These two words can be used to find frame errors and the beginning of a frame. Therefore, the value of the 1024th data of the data is compared with the value of the 1025th data to check whether the frame is erroneous. If an error occurs, the start position of the frame can be found through two sync words.

In order to measure the temperature by the deterioration occurring in the water immersion chamber, a signal of the 16 * 4 multi-array multi-array infrared sensor 110 is stored in the main board through I2C communication, the stored data is transmitted to the PC for data analysis, It can also be databaseized in numbers.

As shown in the main board circuit of the microcontroller combined with the multi-array infrared sensor 110, the power supply and the RS232 communication line are internally connected to the outside. When the RS232 port is connected to the PC after the power is applied, the 2D infrared image can be configured to be viewed on the PC

5 is a flow chart for determining whether or not the complex electrical equipment is abnormal according to an embodiment of the present invention.

5, when a transformer of one phase is heated in a place where three transformers are installed, the maximum temperature monitoring method that determines that a problem occurs when a temperature difference of more than a certain level is generated as compared with a transformer of the remaining phase, A three-phase comparison monitoring method, a maximum temperature monitoring method, and a three-phase comparison monitoring method, which determine that a problem occurs when a predetermined temperature is exceeded, may be used.

It is difficult to judge whether there is an abnormality by comparing the temperature for each electric power facility or setting the highest temperature. Therefore, it is also problematic to compare the temperature of each facility with the maximum permissible temperature for each facility. Therefore, a method for monitoring various facilities at the same time is needed.

As shown in FIG. 5, a multi-array infrared ray sensor 110 is installed and an area for each facility to be monitored is set in advance while observing the image. The maximum allowable temperature of the facility for the set area is set, It can be configured to determine that a problem has occurred.

In addition, when the temperature of each facility changes suddenly with time, the function of informing the alarm message may be mixed, so that the abnormality of the facility can be captured in advance

FIG. 6 is a conceptual view of temperature sensing of a device-dependent deterioration detection system of a high-voltage switchboard, a low-voltage switchboard, a distribution board, and a motor control panel using a multi-array infrared sensor according to an embodiment of the present invention. This is a temperature sensing interface screen for the device-specific deterioration detection system of the high-voltage switchboard, the low-voltage switchboard, the distribution board, and the motor control panel using the multi-array infrared sensor.

Referring to FIGS. 6 and 7, a power device is mapped to each array, so that a temperature change of a specific array can be detected as a temperature change of a specific power device. And can be configured to easily recognize the temperature of a specific array by color mapping by array to easily recognize each color by color.

FIG. 8 is an alarm screen of a high-voltage switchboard, a low-voltage switchboard, a distribution board, and a motor control panel using a multi-array infrared sensor according to an embodiment of the present invention. A power distribution board, a low voltage distribution board, a distribution board, and a motor control board.

Referring to FIGS. 8 and 9, the alarm screen is divided into attention, inspection, and urgency, and the communication status screen displays the communication status in real time for each of the multi-array infrared sensors 110.

10 is a timing chart showing a transmission / reception sequence of a multi-array infrared sensor according to an embodiment of the present invention.

Referring to FIG. 10, a transmission / reception sequence of the multi-array infrared sensor 110 is shown. T1 is the delay time between characters, T2 is the delay time between the request telegram and the response telegram, T3 is the total response time of the response frame, T4 is the delay between the start of the next frame after completion of the frame transmitted and received, It represents time. The following Table 4 shows more specifically T1 to T4.

Where T3 represents the response frame time of the 16 * 4 array function 0x03.

For example, T4 may be 250 ms- (10 ms + T2 + T3), and if T4 is 92 ms, communication of 150 ms period (4 Hz) is performed . If you want to update later, you can increase T4.

The following Table 5 shows the protocol format of the request telegram and the response telegram.

The data in Table 5 can be configured to read the readings from the Read Holding Registers (0x03).

The following Table 6 can be configured as a fixed value as a starting address.

Table 7 shows data values.

In Table 7, it can be seen that a total of 65 registers are required, one register for the ambient temperature and 64 registers for the target temperature. When two bytes (bytes) are allocated per register, the total number becomes 130 bytes.

Table 8 shows the Hexa value and Decimal value of the request / response telegram of the register. At the time of shipment, it is fixed to ID 1 and can be shipped.

Tables 9 and 10 show values for temperature.

Table 9 shows the data for the image temperature, and Table 10 shows the data for the sub-zero temperature.

For example, at the image temperature, 0x016D is 365, which is 36.5 degrees. At zero temperature, 0xFF9 is -100 degrees, which is 100 as 0x0064 when 2's complement operation is performed.

At the time of shipment, to obtain 65 register values from address 500 (0x01F4) of ID 1, it is as follows.

0x01, 0x03, 0x82, Ambient Temperature Hi, Ambient Temperature Lo, Pixel (0, 0, 0), 0x04, 0x04, 0), Hi, ..., CRC.

The number of registers is fixed at 65 (0x41).

The ID write is performed in the case of ID 1 with 0xFF, 0x06, 0x03, 0xE8, 0x00, 0x01, (0xDD), (0xA4) for ID 1, 0xFF, 0x06, 0x03, 0xE8, 0x00, 0x05, 0x06, 0x03, 0xE8, 0x00, 0x04, (0x1D), (0x5) for ID 4 and 0xFF, 0xA7).

11 is a pixel table according to an embodiment of the present invention.

Referring to FIG. 11, coordinate values and temperature values of each pixel of the multi-array infrared sensor 110 are illustrated.

It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined in the following claims There will be.

110: Multi-array infrared sensor
120: initial temperature memory
130: Reference temperature memory
140: deterioration judgment module
150: Warning module

Claims (5)

A multi-array infrared sensor for sensing a temperature of at least one of power devices of at least one of a high-voltage switchboard, a low-voltage switchboard, a distribution board, and a motor control board;
An initial temperature memory for storing an initial temperature for each part and material of the power device, the initial temperature being periodically stored at a predetermined time;
A reference temperature memory for storing a reference temperature range for determining deterioration for each power device in advance for each part and material of the power device and different temperatures for determining deterioration for each power device;
It is determined whether or not the difference between the temperature of the power device detected by the multi-array infrared sensor and the initial temperature of the corresponding power device stored in the initial temperature memory is within the reference temperature range of the corresponding power device stored in the reference temperature memory A degradation determination module
And a warning module for outputting a warning signal according to the determination result of the deterioration determination module,
The degradation determination module includes:
If the surface temperature of the non-molded transformer is in the precautionary state, if it is less than 95 ° C and less than 95 ° C, it is determined that it is in the abnormal state if it is in the range of 95 ° C or more and less than 110 ° C. It is judged to be in an abnormal state when the temperature is higher than 120 ° C. and lower than 140 ° C. and it is judged that the epoxy surface of the mold transformer is in an abnormal state if it is lower than 70 ° C. and lower than 80 ° C., It is judged that the temperature difference between the outer surface temperature is higher than or equal to 10 ° C and less than 15 ° C and it is determined that the IV cable is in an abnormal state when it is lower than 60 ° C and lower than 80 ° C. And determines that the HIV cable is in an abnormal state when the HIV cable is less than 75 ° C and less than 100 ° C and determines that the CV cable is in an abnormal state when the CV cable is less than 90 ° C and less than 110 ° C, And the temperature of the transformer of the other two phases are compared with each other, it is judged as a steady state when a temperature difference of 0 ° C or more and less than 5 ° C is generated. When a temperature difference of 5 ° C or more and less than 10 ° C occurs, Lt; 0 &gt; C to less than 20 &lt; 0 &gt; C,
The multi-array infrared sensor includes:
16x4 array, and each array is mapped to each power device and is set. When the microcontroller is connected to the microcontroller, the microcontroller resets the infrared temperature sensor to generate an error Wherein the data reception is normally performed even after a predetermined time elapses, even when the temperature of the high-voltage switchboard, the low-voltage switchboard, the distribution panel, and the motor control panel is lowered.
The method according to claim 1,
The device-specific deterioration detection system includes:
Mapping the power devices for each array to detect temperature variations of a particular array as temperature variations of the particular power devices,
Wherein the temperature of the specific array is visually recognized by color by color mapping of each array to enable recognition of the temperature of the specific array by color mapping. . delete delete delete

Images