KR101552901B1 - Semiconducter Substrate Protect Film Auto Peeler - Google Patents

Semiconducter Substrate Protect Film Auto Peeler Download PDF

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Publication number
KR101552901B1
KR101552901B1 KR1020140076680A KR20140076680A KR101552901B1 KR 101552901 B1 KR101552901 B1 KR 101552901B1 KR 1020140076680 A KR1020140076680 A KR 1020140076680A KR 20140076680 A KR20140076680 A KR 20140076680A KR 101552901 B1 KR101552901 B1 KR 101552901B1
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KR
South Korea
Prior art keywords
substrate
film
taping
pair
scratch
Prior art date
Application number
KR1020140076680A
Other languages
Korean (ko)
Inventor
황선오
Original Assignee
주식회사 코엠에스
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Publication date
Application filed by 주식회사 코엠에스 filed Critical 주식회사 코엠에스
Priority to KR1020140076680A priority Critical patent/KR101552901B1/en
Application granted granted Critical
Publication of KR101552901B1 publication Critical patent/KR101552901B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof

Abstract

The upright loading apparatus 10 comprises an upright positioning step S10 for erecting the substrate upright such that one of the line segments connecting the substrate to the substrate vertex is parallel to the gravity direction; The taping unit transfer means 20 is configured so that two taping units T1 and T2 on which adhesive tapes are mounted face each other on both sides of the substrate so as to face each other at a square corner portion of the films F attached to both sides of the substrate Attaching a taping unit (S20); A preliminary peeling step (S30) by a taping unit in which the taping unit transfer means (20) moves the taping units (T1, T2) at the same time in the opposite direction and the film is peeled from the upper square hole of the substrate; A present peeling step (S40) in which the clamper elevating means (40) peels the film off the substrate by raising the clamper (41) clamping the upper rectangular corner portion of the substrate; And a pair of the taping units.

Description

Technical Field [0001] The present invention relates to a semiconductor film peeling method and a peeling apparatus using a pair of taping units,

The present invention provides a film peeling apparatus and a peeling method for a semiconductor using a pair of taping units.

The printed circuit board (PCB) or the substrate for semiconductor manufacturing is protected by the protective film on the upper and lower surfaces of the substrate, . Therefore, in order to mount various components such as semiconductor, capacitor, and resistance on such a substrate, the protective film attached to the substrate surface must be removed.

As a conventional technique, there is a patent application No. 10-1119571 (patentee: COM, applicant), and in the prior art, film peeling progresses in a horizontal lying state as a substrate to enlarge the structure of the apparatus, There are many problems.

The present invention provides a film peeling apparatus and a peeling method for a semiconductor using a pair of taping units which can be miniaturized and compacted by reducing the feeding amount of the substrate and the feeding amount of the peeling apparatus, .

The present invention relates to a semiconductor film peeling apparatus and a peeling method using a pair of taping units which can accurately and completely peel a protective film of a substrate and can increase a working efficiency per hour while handling a substrate of 30 to 80 cm in size, .

The upright loading apparatus 10 comprises an upright positioning step S10 for erecting the substrate upright such that one of the line segments connecting the substrate to the substrate vertex is parallel to the gravity direction;

The taping unit transfer means 20 is configured so that two taping units T1 and T2 on which adhesive tapes are mounted face each other on both sides of the substrate so as to face each other at a square corner portion of the films F attached to both sides of the substrate Attaching a taping unit (S20);

A preliminary peeling step (S30) by a taping unit in which the taping unit transfer means (20) moves the taping units (T1, T2) at the same time in the opposite direction and the film is peeled from the upper square hole of the substrate;

A present peeling step (S40) in which the clamper elevating means (40) peels the film off the substrate by raising the clamper (41) clamping the upper rectangular corner portion of the substrate;

And a pair of the taping units.

According to the present invention, there is provided a semiconductor film peeling apparatus and a peeling apparatus using a pair of taping units which are capable of miniaturizing and compacting the apparatus by reducing the feeding amount of the substrate and the feeding amount of the peeling apparatus, Method is provided.

In addition, according to the present invention, it is possible to accurately and completely peel the protective film of the substrate, while increasing the working efficiency per hour while handling a substrate of 30 to 80 cm in size, and using a pair of taping units having excellent durability, And a peeling apparatus are provided.

BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a flow chart of a film stripping method for a semiconductor using a pair of taping units of the present invention.
2 is a conceptual explanatory view of a film peeling method for a semiconductor using a pair of taping units according to the present invention.
3 is a conceptual diagram of a film peeling apparatus for a semiconductor using a pair of taping units according to the present invention.
4 is a conceptual diagram of an upright loading device of the present invention.
5 is a conceptual view of a scratch-forming unit of the present invention.
6 is a conceptual view of the adhesive unit and the adhesive unit transfer means of the present invention.

Hereinafter, a film peeling method and a peeling apparatus for a semiconductor using a pair of taping units according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings. 2 is a conceptual diagram for explaining a film peeling method for a semiconductor using a pair of taping units according to the present invention. Fig. 3 is a cross-sectional view showing a pair of taping units according to the present invention. Fig. 4 is a conceptual view of the upright loading device of the present invention, Fig. 5 is a conceptual view of the scratch forming unit of the present invention, and Fig. 6 is a conceptual view of the adhesive unit and the adhesive unit transfer means of the present invention.

1 to 6, in the upright positioning step S10, the upright loading apparatus 10 is configured such that one of the diagonals connecting the substrate, which is horizontal with the ground, to the vertex of the substrate is parallel to the gravity direction The substrate is erected upright. In the taping unit attaching step S20, the taping unit conveying means 20 moves the two taping units T1 and T2, on which the adhesive tape is mounted, to both sides of the substrate so as to face each other at the same time, And adhere to the square corners of the films (F).

In the preliminary peeling step S30 by the taping unit, the taping unit transfer means 20 simultaneously moves the taping units T1 and T2 in the opposite direction so that the film reaches the opposite square corner of the vertex closest to the surface of the substrate . At this time, the same two degree of freedom movement mechanism as that of the embodiment of FIG. 6 can be used for retreating (lowering) and lowering of the taping units T1 and T2, but a cam mechanism for moving along a specific curve can be used. Description of known technologies relating to a two-degree-of-freedom linear motion mechanism or a curved cam mechanism is omitted.

In this peeling step (S40), the film is peeled from the substrate by lifting the clamper (41) clamping the opposite square corner portions of the vertex closest to the paper surface of the substrate. 1 or 2, it is preferable that the clamping operation of the clamper 41 is performed after the preliminary peeling step S30. However, in the case where there is a blank region in which the film existing on the edge of the substrate is not adhered, It is also possible to clamp before the peeling step. However, it is preferable that the rising of the clamper 41 proceeds after the preliminary peeling step S30.

As shown in FIGS. 1 to 6, in the simultaneous peeling method for a vertical double-sided roll type semiconductor film according to one embodiment of the present invention, before the upright positioning step (S10), or before the upright positioning step (S10) A scratch forming step (S50) in which a scratch forming unit (50) forms scratches for assisting in film peeling at the square corners of the film adhered to both sides of the substrate (S) during a taping unit attaching step (S20) As shown in FIG.

5, the scratch-forming unit 50 includes a straight motion type scratch 51 having a sharp front end that makes linear motion and scratches the film, and a linear motion type scratch 51 having irregularities formed on the outer circumferential surface, And a non-contact type laser 55 that forms a scratch by irradiating a laser on a scratch-forming area.

1 to 6, a film peeling method for a semiconductor using a pair of taping units according to the present invention is characterized in that a film F on which the taping units T 1 and T 2 are peeled off is attached to the film collection roller 60 And a step S70 of rolling the separated film F by rotating the film collection roller 60 by rotating the film collection roller rotating means 70. In this case,

As shown in FIGS. 1 to 6, in the film peeling apparatus for a semiconductor using a pair of taping units according to the present invention, one of the diagonal lines connecting the vertex of the substrate , which is in a horizontal state with the ground , and an upright loading device 10 is built a substrate in an upright positioned, the upright loading device 10, a pair of taping units (T1, T2) interposed between the parallel spaced apart from each other in location to, and a taping unit (T1, T22) Are adhered to the square corners of the films (F) adhered to both sides of the substrate facing each other on both sides of the substrate at the same time, and the taping units (T1, T22) are transported away from the substrate at the time of preliminary peeling, And a taping-unit transferring means (20) for peeling off the upper-side quadrant of the substrate. A clamper 41 located on top of the upright loading device 10 and clamping the top square corner portion of the substrate; and a clamper 41 coupled to the clamper 41 and lifting the clamper 41 to cause the film to peel off the substrate And clamper elevating means (40).

As shown in FIGS. 1 to 6, the film peeling apparatus for a semiconductor using a pair of taping units according to the present invention is characterized in that the taping units (T1, T2) are attached to both sides of the substrate It is preferable to further comprise a scratch forming unit 50 for forming scratches for assisting film separation at the square corners of the film adhered to both sides of the substrate before being adhered to the square corners of the films F Do.

5 and 6B, the scratch forming unit 50 includes a straight motion type scratch 51 having a sharp front end that scatters the film in a linear motion, and a plurality of protrusions formed on the outer circumferential surface of the scratch forming unit 50, And a non-contact type laser 55 which forms a scratch by irradiating a laser on a scratch forming area.

4, the simultaneous peeling apparatus for a vertical double-sided roll type semiconductor film according to the present invention is characterized in that the upright loading apparatus 10 includes a supporting roller (r) A support roller frame 11 arranged in parallel with the support roller r and arranged in parallel to the support roller frame 11 so as to be spaced apart from the support roller frame 11; And a frame rotating means 15 for rotating the other supporting roller frame 12 integrally.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, ≪ RTI ID = 0.0 > and / or < / RTI >

It is to be understood that the appended claims are intended to supplement the understanding of the invention and should not be construed as narrowly interpreted to imply that the scope of the claims does not affect the interpretation of the scope of the claims

10: upright loading device
20: Taping unit feeding means
40: clamper elevating means
41: clamper
50: Scratch-forming unit
51: Straight motion type scratch
53: Turning ring ring
55: Contactless laser
60: Film collection roller
T1, T2: Taping unit
F: Film

Claims (8)

The upright loading apparatus 10 erecting the substrate upright such that one of the diagonal lines connecting the substrate to the substrate's vertex is parallel to the gravity direction ;

The taping unit transfer means 20 is configured so that two taping units T1 and T2 on which adhesive tapes are mounted face each other on both sides of the substrate so as to face each other at a square corner portion of the films F attached to both sides of the substrate Attaching a taping unit (S20);

The pre-peeling step S30 (FIG. 3) by the taping unit in which the taping unit transfer means 20 moves the taping units T1 and T2 simultaneously in opposite directions and the film is peeled from the opposed square edges of the vertex closest to the surface of the substrate )Wow;

A present peeling step (S40) in which the clamper elevating means (40) raises the clamper (41) clamping the opposite square corner portions of the vertexes closest to the ground surface of the substrate so that the film is peeled off the substrate;

And a pair of the taping units. The method according to claim 1,
Prior to the upright positioning step S10,
Alternatively, between the standing position step S10 and the taping unit attaching step S20,
A scratch forming step (S50) in which the scratch-forming unit (50) forms scratches for assisting film separation at the square corners of the film attached to both sides of the substrate (S);
And a pair of the taping units. 3. The method of claim 2,
The scratch-forming unit (50)
A linear motion type scratch 51 having a sharp front end that linearly moves and scratches the film,
A rotatable knurling hole 53 formed on the outer circumferential surface to form irregularities to form a scratch on the film by contact rotation,
And a non-contact type laser (55) for forming a scratch by irradiating a laser on a flaw forming region. The film peeling method for a semiconductor using a pair of taping units according to claim 1, The method according to claim 1,
(S60) of attaching the peeled film (F) to the film collection roller (60) by the taping units (T1, T2);

Further comprising a step (S70) of rotating the film collection roller (60) by the film collection roller rotating means (70) to roll the separated film (F) and collecting the same A method for peeling a film for semiconductor use. An upright loading device 10 for erecting the substrate upright such that one of the diagonals connecting the substrate to the substrate vertex is parallel to the gravity direction ;

A pair of taping units (T1, T2) spaced apart from each other with the upright loading device (10) interposed therebetween;

The taping units T1 and T2 are disposed on both sides of the substrate so as to face each other at the same time so as to be attached to the square corners of the films F attached to both sides of the substrate, A taping unit transfer means (20) for transferring the film away from the substrate to peel the film from the opposite square corner of the vertex closest to the surface of the substrate ;

A clamper (41) located on top of said upright loading device (10) and clamping opposite square corner portions of vertices closest to the ground of the substrate ;

Clamper lifting means (40) coupled to the clamper (41) and lifting the clamper (41) to cause the film to peel off the substrate;

And a pair of taping units each having a pair of taping units. 6. The method of claim 5,
Before the taping units T1 and T2 are attached to the square corner portions of the films F attached to both sides of the substrate by the tapping unit transfer means 20,

A scratch forming unit (50) for forming scratches on the square corners of the film adhered to both sides of the substrate to assist film separation;
And a pair of taping units each including a pair of taping units. The method according to claim 6,
The scratch-forming unit (50)
A linear motion type scratch 51 having a sharp front end that linearly moves and scratches the film,
A rotatable knurling hole 53 formed on the outer circumferential surface to form irregularities to form a scratch on the film by contact rotation,
And a non-contact type laser (55) for forming a scratch by irradiating a laser on a flaw forming area. The film peeling apparatus for a semiconductor using a pair of taping units. 6. The method of claim 5,
The upright loading device (10)
One side support roller frame 11 in which the support rollers r are arranged in parallel in one plane,
The other supporting roller frame 12 is disposed in parallel to the one supporting roller frame 11 in parallel and spaced apart from the one supporting roller frame 11,
A frame rotating means 15 for integrally rotating the one supporting roller frame 11 and the other supporting roller frame 12,
And a pair of taping units each having a pair of taping units.
KR1020140076680A 2014-06-23 2014-06-23 Semiconducter Substrate Protect Film Auto Peeler KR101552901B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020140076680A KR101552901B1 (en) 2014-06-23 2014-06-23 Semiconducter Substrate Protect Film Auto Peeler

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Application Number Priority Date Filing Date Title
KR1020140076680A KR101552901B1 (en) 2014-06-23 2014-06-23 Semiconducter Substrate Protect Film Auto Peeler

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006008276A (en) 2004-06-23 2006-01-12 Tdk Corp Peeling device and peeling method
WO2006003816A1 (en) 2004-07-02 2006-01-12 Sharp Kabushiki Kaisha Method and device for peeling off film
KR101119571B1 (en) 2011-09-19 2012-03-06 주식회사 코엠에스 Semiconducter substrate protect film auto peeler

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006008276A (en) 2004-06-23 2006-01-12 Tdk Corp Peeling device and peeling method
WO2006003816A1 (en) 2004-07-02 2006-01-12 Sharp Kabushiki Kaisha Method and device for peeling off film
KR101119571B1 (en) 2011-09-19 2012-03-06 주식회사 코엠에스 Semiconducter substrate protect film auto peeler

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