KR101532716B1 - Optical filter and manufacture method thereof - Google Patents

Abstract

Disclosure of the Invention The present invention provides an electromagnetic wave shielding layer inside a resin layer formed with an engraved pattern to secure a stable electromagnetic wave shielding property, maintain a good contrast property, improve process yield, reduce haze and improve adhesion And a method of manufacturing the same.

An optical filter according to an example of the present invention includes a transparent base substrate, a resin layer disposed on a transparent base substrate and formed with a predetermined engraved pattern, and an electromagnetic wave shielding layer disposed inside the engraved pattern of the resin layer and for shielding electromagnetic waves.

According to another aspect of the present invention, there is provided a method of manufacturing an optical filter, including: laminating a resin layer on a transparent base substrate; patterning the resin layer to form a predetermined engraved pattern; And an electromagnetic wave shielding layer forming step of forming an electromagnetic wave shielding layer inside the engraved pattern.

Electromagnetic wave shielding, engraving pattern, contrast

Description

TECHNICAL FIELD The present invention relates to an optical filter and a manufacturing method thereof,

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to an optical filter included in a display device and a method of manufacturing the same. More particularly, the present invention relates to an optical filter, And a method of manufacturing the same.

2. Description of the Related Art Display devices such as a plasma display panel (PDP) and a liquid crystal display panel (LCD) generate electromagnetic waves by a driving circuit itself or generate electromagnetic waves according to a driving method when a panel is driven .

For example, in a plasma display panel, a screen is displayed by exciting phosphors by ultraviolet rays of approximately 147 nm to emit red, green, and blue light when an inert mixed gas such as He + Xe, Ne + Xe, etc. is discharged. In this way, during the process of driving the panel, electromagnetic waves are generated in a process of generating a high voltage in the driving unit.

Accordingly, such display devices use optical filters having various functions in order to shield such electromagnetic waves.

Such an optical filter blocks electromagnetic waves and near-infrared rays generated by a video display device using a PDP and performs functions such as color correction and reflection prevention.

Such an optical filter is divided into a mesh type filter and a conductive film type filter.

FIGS. 1A and 1B show a conventional mesh type optical filter, wherein FIG. 1A is a copper (Cu) mesh type and FIG. 1B is a silver (Ag) mesh type.

As shown in FIG. 1A, a copper mesh type optical filter is manufactured by laminating a copper foil using an adhesive 21 to a transparent substrate 14 such as PET, PC, PMMA and the like.

In this process, a chemical surface treatment is performed on one side of copper (Cu) in order to improve the adhesion of copper (Cu) and to prevent deterioration of visibility due to glittering of copper (Cu). As a patterning method of copper (Cu) mesh, photolithography is used and a mesh shape is implemented, and then a pressure-sensitive adhesive or the like is laminated on the resin layer 11 of PET or the like.

A functional layer such as a color correction layer 17, an NIR blocking layer 18, and an anti-reflection layer 19 may be added on the optical filter for shielding electromagnetic waves as shown in FIG. 1A.

1B, in the case of the silver (Ag) mesh type, silver (Ag) is transferred to the transparent substrate 14 by the Libya offset method to form a mesh, and then the resin layer 11, such as PET, Such as an adhesive or the like.

Likewise, functional layers such as the color correction layer 17, the NIR blocking layer 17, and the reflection prevention layer 19 can be added to the electromagnetic wave shielding optical filter as shown in Fig. 1B.

1C shows a conventional conductive film type optical filter. The conductive film type is a shielding layer in which a plurality of transparent metal layers are laminated.

As shown in FIG. 1C, a multilayered ITO / Ag conductive film 22 is formed to realize electromagnetic wave shielding characteristics. Likewise, functional layers such as the color correction layer 17, the NIR blocking layer 17, and the anti-reflection film 19 can be added on the electromagnetic wave shielding layer as shown in FIG. 1B.

However, in the case of an optical filter employing a conventional copper (Cu) mesh, copper (Cu) meshes are short-circuited during the photoetching process due to minute bubbles, dents and foreign substances in the adhesive layer generated in the process of laminating the materials, ) Is generated, and haze is increased due to the fine roughness of the copper (Cu) surface or the surface treated surface, and a separate vitrification process must be carried out. In this process, bubbles, .

In the case of the silver (Ag) mesh, the shielding property of the electromagnetic wave is lower than that of the copper (Cu) mesh due to the increase of the material cost and the limitation of the printing due to the use of the expensive silver (Ag) In the case of the conductive film type, on the other hand, there is a disadvantage in that the material cost increases due to the formation of the multilayer vapor deposition film and the electromagnetic wave shielding property is significantly lower than that of the copper (Cu) mesh.

When such an optical filter is used in a plasma display apparatus, a separate contrast enhancement layer is further used to improve bright room contrast. Such a contrast enhancement film is laminated with a transparent base layer of a copper mesh film or a conductive film layer to shield external light, thereby realizing a bright room contrast enhancement function. However, there is a drawback that the manufacturing cost of the optical filter is increased due to the moiré problem caused by the interference with the copper mesh at the time of lapping and the application of the expensive film.

Disclosure of the Invention The present invention provides an electromagnetic wave shielding layer inside a resin layer formed with an engraved pattern to secure a stable electromagnetic wave shielding property, maintain a good contrast property, improve process yield, reduce haze and improve adhesion And a method of manufacturing the same.

It is another object of the present invention to provide an optical filter capable of reducing the moire phenomenon and manufacturing cost by forming an electromagnetic wave shielding layer in an engraved pattern to simultaneously perform contrast and electromagnetic wave shielding, and a manufacturing method thereof.

An optical filter according to an example of the present invention includes a transparent base substrate, a resin layer disposed on a transparent base substrate and formed with a predetermined engraved pattern, and an electromagnetic wave shielding layer disposed inside the engraved pattern of the resin layer and for shielding electromagnetic waves.

Here, the shape of the horizontal section formed by the engraved pattern may include at least one of a triangle and a quadrangle.

In addition, the horizontal cross-sectional shape includes a quadrangle, and the pitch of the engraved pattern may be at least 10um to 300um.

In addition, the rectangle may include a rectangle, and the short side pitch of the engraved pattern may be 20um or more and 50um or less.

Here, the long side pitch of the engraved pattern can be set to be 80um or more and 200um or less.

Here, as the value of the short side pitch of the engraved pattern becomes smaller, the value of the long side pitch can be increased.

In addition, the width of the engraved pattern may be at least 3um and not more than 20um.

Here, the width of the engraved pattern can be made to be at least 3um and not more than 10um.

Here, the shape of the vertical section of the engraved pattern may include at least one of a triangle, a quadrangle, a trapezoid, or an ellipse.

Here, the vertical cross-sectional depth of the engraved pattern can be set to 10um or more and 40um or less.

Here, the vertical cross-sectional depth of the engraved pattern can be set to be 20um or more and 30um or less.

The electromagnetic wave shielding layer may include a metal seed layer formed to a predetermined thickness inside the resin layer and a metal layer formed inside the metal seed layer.

Here, the thickness of the metal seed layer may be at least 0.01 μm or more and 4 μm or less.

Here, the thickness of the metal seed layer may be at least 0.01um or more and 2um or less.

Here, the metal seed layer may be a black-based material.

Here, the metal seed layer may be formed of at least one selected from the group consisting of copper (Cu), nickel (Ni), chromium (Cr), iron (Fe), tungsten (W), phosphorus (P), cobalt Ni-P), nickel-chromium (Ni-Cr), and copper oxide II (CuO).

Here, the metal layer may be at least one selected from the group consisting of Cu, Ag, Al, Ni, Cr, Ni-P, Ni- (CuO).

Here, the transparent base substrate may include any one of a resin film and a transparent glass.

Here, the resin film may include an acrylic pressure sensitive adhesive (PSA).

According to another aspect of the present invention, there is provided a method of manufacturing an optical filter, including: laminating a resin layer on a transparent base substrate; patterning the resin layer to form a predetermined engraved pattern; And an electromagnetic wave shielding layer forming step of forming an electromagnetic wave shielding layer inside the engraved pattern.

Here, the pattern forming step may include an imprinting step of pressing a mold including a relief shape such that a predetermined engraved pattern is formed on an upper portion of the resin layer.

The electromagnetic wave shielding layer includes a black metal seed layer and a metal layer formed inside the metal seed layer. The electromagnetic shield layer forming step includes a surface treatment step for improving adhesion between the metal seed layer and the resin layer; A metal seed layer forming step of forming a metal seed layer in a predetermined thickness inside the engraved pattern of the resin layer; And a metal layer forming step of forming a metal layer inside the metal seed layer.

Here, the surface treatment step may be any one of an etching treatment, a catalytic treatment, a plasma treatment or an ion beam treatment.

Here, the metal seed layer forming step may be performed by any one of electroless plating, chemical vapor deposition (CVD), sputtering, and printing.

Here, in the metal seed layer forming step, the metal seed layer is electroless-coated on the resin layer, and in the metal layer forming step, the metal layer is selectively electroless-plated in the metal seed layer.

Here, the electromagnetic shielding layer forming step may further include removing the metal seed layer on the embossed metal layer to remove the metal seed layer formed on the embossed portion except for the recessed pattern inside the resin layer.

Here, the step of removing the embossed metal seed layer may be performed by a chemical mechanical polishing (CMP) method, a polishing method, or a brushing method.

Further, a display device including the optical filter according to the present invention includes the optical filter as described above.

The optical filter according to the present invention can sufficiently lower the haze by forming the electromagnetic wave shielding layer in the inside of the resin layer formed with the engraved pattern on the surface, and has the effect of securing the optical filter characteristic with much improved adhesion.

In addition, the optical filter according to the present invention can stably maintain the electromagnetic wave shielding property and effectively shield the external light by using the electromagnetic shielding layer as the metal layer and the metal seed layer, and using the black-based material as the metal seed layer There is an effect of improving the contrast ratio.

In addition, the manufacturing method of the optical filter according to the present invention can not only easily adjust the thickness of the electromagnetic wave shielding layer but also simplify the manufacturing process to improve the process yield, improve the uniformity, It has the effect of reducing the unit price.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

In the drawings, the same reference numerals are used to designate the same or similar components throughout the drawings. In the following description of the present invention, a detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear. In addition, the preferred embodiments of the present invention will be described below, but it is needless to say that the technical idea of the present invention is not limited thereto and can be variously modified by those skilled in the art.

2 is a view for explaining an example of an optical filter according to an example of the present invention.

2 (a) and 2 (b), the optical filter includes a transparent base substrate 210, a resin layer 220, an electromagnetic wave shielding layer 220 disposed inside the engraved pattern 221 of the resin layer 220, (230).

The transparent base substrate 210 may include any one of a resin film and a transparent glass.

(PET), polycarbonate (PC), polymethylmethacrylate (PMMA), triacetate cellulose (TAC), polyethersulfone (PES), and the like, when the transparent base substrate 210 is a resinous film. By using the thermoplastic resin as a resin film, the strength can be increased, and the display panel can be prevented from being damaged from an external impact. In this case, the thickness may be, for example, in the range of 25 to 300 μm (micrometer), and the light transmittance may be 80% (percent) or more.

Here, the resin film may include an acrylic pressure sensitive adhesive (PSA). By using the acrylic pressure-sensitive adhesive (PSA), which is a semi-solid material, the resin layer 220 can be firmly bonded to the transparent base substrate 210 with a small pressure.

Next, the resin layer 220 is disposed on the transparent base substrate 210 as shown, and a predetermined engraved pattern 221 is formed. As the resin layer 220, a UV curable resin or a thermosetting resin can be used. 3 (a) and 3 (b) illustrate a case in which the shape of the horizontal cross section formed by the engraved pattern 221 is a quadrangle, but a triangle, a pentagon, or a hexagon . 3, the shape of the vertical cross section of the engraved pattern 221 is triangular (a) or square (b), but it may be trapezoidal. This will be described in more detail in Figs. 5A and 5C.

Next, the electromagnetic wave shielding layer 230 is disposed inside the engraved pattern 221 of the resin layer 220 and functions to shield electromagnetic waves. The electromagnetic wave shielding layer 230 may include a metal seed layer formed to a predetermined thickness inside the resin layer 220 and a metal layer formed inside the metal seed layer. This will be described in more detail in Fig.

3 is a view for explaining various examples of a predetermined engraved pattern formed on a resin layer in an optical filter according to an example of the present invention.

The shape of the horizontal section formed by the engraved pattern 221 may include either a triangle or a quadrangle. That is, as shown in FIG. 3A, the shape of the embossed portion 222 of the horizontal cross section formed by the engraved pattern 221 may include a rectangular shape. In addition, it may be triangular as shown in (b), or may be implemented as (c), (d), and (e).

4A to 4D are views for explaining the horizontal cross section of a resin layer formed with an engraved pattern in an optical filter according to an example of the present invention in more detail.

As shown in FIG. 4A, the horizontal cross-sectional shape of the engraved pattern 221 includes a quadrangle, and the pitch of the engraved pattern 221 may be at least 10um to 300um.

In this way, the pitch of the engraved patterns 221 is at least 10 μm or more, and the electromagnetic wave shielding layer 230 is formed inside the engraved pattern 221, so that electromagnetic waves of 30 M Hz to 1 G Hz generated from the display panel are appropriately There is an effect that it can be shielded.

The pitch of the engraved pattern 221 may be at least 300 μm or less and the electromagnetic wave shielding layer 230 may be formed inside the engraved pattern 221 to shield the electromagnetic wave appropriately. It is possible to secure the light transmittance of the liquid crystal display device 100 properly, thereby improving the luminance.

More preferably, the engraved pattern 221 includes a rectangular cross section and the short side pitch of the engraved pattern 221 is 20um or more and 50um or less, and the long side pitch of the engraved pattern 221 is 80um or more and 200um Or less.

Thus, the short side pitch of the engraved pattern 221 is set to 20um or more and 50um or less, and the long side pitch is set to be 80um or more and 200um or less in order to improve the electromagnetic wave shielding property while maintaining the light transmittance above the proper level.

More specifically, the short side pitch of the engraved pattern 221 is not less than 20um and not more than 50um, and the long side pitch of the engraved pattern 221 is not less than 80um and not more than 200um so that the sheet resistance of the shielding layer is not less than 0.1 ohm / Cm < 2 > to less than 0.1 ohm / cm < 2 >

  For example, if the width of the engraved pattern is 10 μm, and the pitch is 300 μm, it can be maintained at 0.04 ohm / cm ^ 2, which is better than the standard resistance of 0.1 ohm / cm ^ 2, and the light transmittance is about 96% When the long side pitch is set to 100 μm and the short side pitch is set to 50 μm while maintaining the width of the engraved pattern at the same level, the surface resistance is improved to 0.02 ohm / cm 2 or less while maintaining the same light transmittance There is an effect that can be.

Thus, by making the surface resistance to be a certain level (for example, 0.1 ohm / cm < 2 >) or less, the electromagnetic wave shielding property required in the 42 inch class Full HD PDP class can be satisfied.

4B, as the value of the short side pitch of the engraved pattern 221 becomes smaller, the value of the long side pitch can be increased.

By maintaining the ratio of the area formed by the product of the short side pitch and the long side pitch at a certain level by keeping the value of the long side pitch as the value of the short side pitch of the engraved pattern 221 becomes smaller, .

In addition, the width of the engraved pattern 221 in FIGS. 4C and 4B may be at least 3 μm and not more than 20 μm. In order to make the width of the engraved pattern 221 at least equal to or greater than 3 um and equal to or smaller than 20 um, the width of the electromagnetic wave shielding layer 230 formed inside the engraved pattern 221 is formed to be equal to or greater than a certain level, The electric resistance of the shielding layer 230 is lowered to improve the electromagnetic wave shielding effect and to maintain the appropriate luminance characteristics to be less than 20 μm. By doing so, it is possible to maintain an appropriate contrast characteristic over a certain level as a whole.

More preferably, the width of the engraved pattern 221 may be at least 3 μm or more and 10 μm or less. The width of the engraved pattern 221 should be at least 3um or more and 10um or less to maintain the sheet resistance of the electromagnetic wave shielding layer at or below a proper level to maintain the electromagnetic shielding effect above a certain level, It is for this reason.

For example, when the width of the engraved pattern 221 is 10 mu m, the sheet resistance of the electromagnetic wave shielding layer can be maintained at a level of approximately 0.02 ohm / cm ^ 2 to 0.04 ohm / cm ^ 2.

4C, the engraved pattern 221 may have a short side width and a long side width equal to each other. However, as shown in FIG. 4C (b), the long side width is shorter than the short side width The width of the short side may be wider than the width of the long side, unlike the case of (b). This is to consider the luminance characteristics of the R, G, and B unit cells of the display panel disposed on the back surface of the optical filter. For example, R, G, and B unit cells have different luminance characteristics. An engraved pattern 221 formed at a portion adjacent to a unit cell having a relatively strong luminance characteristic is formed by relatively thickening the long side width, Characteristics. The width of the engraved pattern 221 may be varied depending on the horizontal cross-sectional position of the optical filter in consideration of the luminance characteristic, the contrast ratio characteristic, and the electromagnetic wave shielding characteristic according to the horizontal cross-sectional position of the optical filter You can.

5A to 5B are views for explaining a vertical section of a resin layer formed with an engraved pattern in an optical filter according to an example of the present invention in more detail.

5A, the shape of the vertical cross section of the engraved pattern 221 may be a triangle (b), a rectangle (a), or a trapezoid (c) as shown in FIG. 5A, And a vertical cross section of the engraved pattern 221 may be formed so as to include all the shapes of a triangle, a quadrangle, and a trapezoid as shown in (e) of FIG. 5A. 5A, since the luminance characteristic, the contrast ratio characteristic, and the electromagnetic wave shielding characteristic may vary depending on the position of the horizontal cross section of the optical filter, the vertical cross section of the engraved pattern 221 varies depending on the position of the optical filter, It is possible to change the shape of the surface.

Here, the depth of the engraved pattern 221 may be 10um or more and 40um or less. The thickness of the electromagnetic wave shielding layer 230 formed inside the engraved pattern 221 of the resin layer 220 is formed at an appropriate level so that the depth of the electromagnetic wave shielding layer 230 formed at the appropriate level The electric resistance of the electromagnetic wave shielding layer is lowered to maintain the electromagnetic wave shielding efficiency at an appropriate level and to improve the contrast property to a certain level or more. As described above, the depth of the engraved pattern 221 can be formed differently according to the horizontal cross-sectional position of the optical filter in consideration of the luminance characteristic, the contrast ratio characteristic, and the electromagnetic wave shielding characteristic according to the horizontal cross-sectional position of the optical filter.

Further, more preferably, the depth of the engraved pattern 221 can be set to be not less than 20um and not more than 30um. The reason why the depth of the engraved pattern 221 is 20um or more and 30um or less is to keep the sheet resistance of the electromagnetic wave shielding layer at a predetermined level or less and maintain the electromagnetic wave shielding property at a certain level, .

For example, when the vertical cross-sectional shape of the engraved pattern 221 is triangular and the depth is 25 um, the sheet resistance of the electromagnetic wave shielding layer is maintained at about 0.02 ohm / cm ^ 2 to 0.04 ohm / cm ^ 2, The total reflection ratio can be relatively lowered to reduce the reflection light, thereby improving the contrast ratio.

The width and depth of the engraved pattern 221 can be formed differently depending on the position of the horizontal section of the optical filter as shown in FIGS. 5A, 5B, and 5C. For example, the width of the engraved pattern 221 may be relatively narrow and the depth may be relatively deeper in order to maintain the contrast ratio and luminance characteristics of the central portion relatively higher than the outer portion of the optical filter. In this manner, the volume formed by the width and the depth of the engraved pattern can be adequately ensured, thereby obtaining uniform electromagnetic wave shielding efficiency throughout the optical filter, and correcting different luminance characteristics at the center and outer portions of the display panel You can.

FIG. 6 is a view for explaining the electromagnetic wave shielding layer formed inside the relief pattern in the optical filter according to an example of the present invention in more detail.

The electromagnetic wave shielding layer 230 includes a metal seed layer 231 and a metal layer 232 formed inside the resin seed layer 231 and the metal seed layer 231, can do.

Here, the thickness of the metal seed layer 231 may be at least 0.01 μm or more and 4 μm or less. The thickness of the metal seed layer 231 is set to be at least 0.01um or more by appropriately ensuring the thickness of the metal seed layer 231 so that the resistance value of the metal seed layer 231 becomes a certain level or less, This is to ensure shielding efficiency. In addition, the thickness of the metal seed layer 231 is set to be at least 4 탆, which makes it possible to appropriately secure the thickness of the metal layer 232 by making the thickness of the metal seed layer 231 equal to or less than a proper level, So that the current formed inside the metal layer 232 by the electromagnetic wave through the metal layer 232 having a low value can be more easily discharged to the outside of the optical filter.

More preferably, the thickness of the metal seed layer 231 can be at least 0.01um or more and 2um or less. The thickness of the metal seed layer 231 is set to be at least 0.01um or more and 2um or less in order to stably maintain the surface resistance and appropriately perform the plating of the metal layer in order to appropriately maintain the electromagnetic wave shielding property. For example, when the metal layer 232 is plated with copper, Ni-P or Ni-Cr may be used. At this time, when the metal seed layer 231 is formed to about 0.05 um, the surface resistance of the metal seed layer 3 to 5 While maintaining the home level, stable copper plating becomes possible.

Here, the metal seed layer 231 may include a black-based material. By forming the metal seed layer 231 to be black-colored, external light absorbed into the display panel through the optical filter can be effectively absorbed, and external light can be prevented from being reflected into the display panel. Accordingly, it is possible to reduce the reflectance of the external light incident into the display panel, thereby improving the contrast characteristic.

In addition, it is possible to prevent a moire phenomenon which is an interference fringe caused by overlapping two or more periodic wave patterns.

More specifically, the contrast ratio can be defined as (white light luminance + reflected light luminance) / (black light luminance + reflected light luminance) where the metal seed layer 231 absorbs reflection by external light, There is an effect that the contrast ratio is improved. This has an effect of improving the contrast ratio by about twice as much as that when the black seed metal layer 231 is not used (ex: 120: 1 before use and 250: 1 after use)

Here, the metal seed layer 231 may be formed of copper (Cu), nickel (Ni), chromium (Cr), iron (Fe), tungsten (W), phosphorus (P), cobalt (Co) , Nickel-phosphorus (Ni-P), nickel-chromium (Ni-Cr), and copper oxide II (CuO). As described above, when the metal seed layer 231 includes the above-described material, the color of the metal seed layer 231 can be made to be a black-based material, and the electrical conductivity can be increased to further enhance the effect of electromagnetic wave shielding There is an effect that can be made.

The metal layer 232 may be formed of at least one selected from the group consisting of copper (Cu), silver (Ag), aluminum (Al), nickel (Ni), chromium (Cr), nickel- And copper oxide II (CuO). By making the metal layer 232 include the above-described material, the electrical conductivity of the metal layer 232 can be made relatively equal to or higher than that of the material of the metal seed layer 231. Accordingly, the electromagnetic wave absorbed in the metal seed layer 231 is more easily discharged to the outside of the optical filter, thereby further enhancing the effect of electromagnetic wave shielding.

7 is a view for explaining an example in which another functional filter layer other than the electromagnetic wave shielding layer 230 is formed in the optical filter according to the example of the present invention.

7A, a resin layer 220 formed with an engraved pattern 221 is disposed on a transparent base substrate 210, and a metal layer 220 is formed in the engraved pattern 221 of the resin layer 220, An electromagnetic wave shielding layer 230 including a metal seed layer 232 and a metal seed layer 231 is formed and a color correction layer 710 and a near infrared ray shielding layer 720 are formed on the resin layer 220, An anti-reflection (AR) layer 730, and an anti-glare layer (AG) layer 740 may be further formed.

As described above, the metal seed layer 231 absorbs light from the outside and minimizes reflection, thereby further improving the contrast and allowing the user to appreciate a clearer image quality.

Hereinafter, each functional layer will be described in more detail.

When a small protrusion is formed on the surface of the Anti-Glared (AG) layer 740, the light coming from the outside is scattered in various directions by small protrusions and diffused.

In this case, when the user observes the image displayed by the display device, the light incident on the display screen from the outside is scattered or diffused due to the small projection, and the light spreads in various directions.

Therefore, the small projections on the filter surface can reduce the direct reflected light to the incidence of the external light, and can suppress the external light incident on the user's eye as much as possible.

Therefore, the user can perceive only the external light reflected by the amount of light, which is much smaller than the amount of light reflected by the external light in one direction. Thus, the user can observe the image displayed by the plasma display device, which is originally intended to be observed, more clearly and easily, and appreciate the clearer image.

The anti-reflection (AR) layer 730 has a function of improving the contrast by reducing ultraviolet rays and external reflected light when viewing a screen of a display panel, a computer, or a monitor.

In general, the actual transmittance is also less than 92% for glasses which are considered completely transparent. The rest is loss caused by reflection. In order to reduce the loss caused by reflection, it is possible to appreciate a clearer image by reducing the reflection by using the antireflection (AR) layer 730 adjacent to almost 100% of the light transmittance.

The near infrared ray shielding layer 720 has a function of shielding near infrared rays. For example, the plasma display device emits a near infrared ray having a wavelength of 0.75 mu m to 3 mu m derived from an inert gas such as Ne, Xe because it implements an image by applying high voltage and high frequency for plasma discharge The near-infrared ray shielding layer 720 shields near-infrared rays that cause such a problem. The near-infrared ray shielding layer 720 shields near-infrared rays.

The color correction layer 710 includes a color control dye and serves to enhance the color purity by adjusting the color tone. Such a color compensation layer has the effect of lowering the luminance of a specific color among the visible light incident from a display device such as a PDP panel and increasing the luminance of a specific color. For example, the luminance of red and green may be lowered and the luminance of blue may be relatively increased to improve the optical characteristics.

Each of these functional layers may be adhered to an adhesive film forming an adhesive layer. Such adhesive layers may be silicon-based or acrylic-based adhesive layers, and additives such as ultraviolet screening agents, coloring dyes, and deterioration inhibitors may suitably be used as such pressure-sensitive adhesives.

7A, if the vertical cross-sectional shape of the engraved pattern 221 is triangular, the light entering from the outside is absorbed by the metal seed layer 231, Even when light coming from the outside is reflected by the engraved pattern 221 of the display panel 220, it is not directly reflected to the user, thereby further improving the contrast characteristic.

8 is a view for explaining an example of a manufacturing method of an optical filter according to an example of the present invention.

As shown in the figure, a method of manufacturing an optical filter according to an exemplary embodiment of the present invention includes a lamination step S10, a pattern formation step S20, and an electromagnetic wave shielding layer formation step S30.

In the laminating step (S10), the resin layer 220 is laminated on the transparent base substrate 210. In the pattern forming step S20, a predetermined engraved pattern 221 is formed on the resin layer 220. [ Here, the pattern forming step for forming the engraved pattern 221 includes imprinting for pressing a mold including a relief shape to form a predetermined engraved pattern 221 on the upper portion of the resin layer 220 Imprinting) step.

The method of forming the engraved pattern 221 on the resin layer 220 using the mold has the effect of simplifying the manufacturing process, shortening the manufacturing time, and improving the production yield. For example, the imprinting step using the mold does not require complicated and expensive processes such as exposure and development processes required in the conventional method, and does not require a separate equipment such as an offset process. Therefore, the manufacturing process of the optical filter can be relatively simplified, and the manufacturing cost can be relatively reduced.

Here, the shape of the horizontal cross section of the engraved pattern 221 may include at least one of a triangle, a rectangle, a pentagon, and a hexagon. At this time, when the formation of the horizontal cross section is a quadrangle, the pitch of the engraved pattern 221 may be at least 10um to 300um. More preferably, if the horizontal cross-sectional shape of the engraved pattern 221 includes a rectangle, the short side pitch of the engraved pattern 221 may be 20um or more and 50um or less, and the long side pitch of the engraved pattern 221 may be 80um or more It can be made to be 200um or less.

At this time, the engraved pattern 221 can be formed so that the value of the long side pitch increases as the short side pitch of the engraved pattern 221 becomes smaller.

In addition, the maximum width of the engraved pattern 221 can be set to be at least 3um and not more than 20um. More preferably, the maximum width of the engraved pattern 221 can be made to be at least 3um and not more than 10um.

The shape of the vertical section of the engraved pattern 221 may be formed to include at least one of a triangle, a square, and a trapezoid. Here, the depth of the engraved pattern 221 can be made to be 10um or more and 40um or less. More preferably, the depth of the engraved pattern 221 can be made to be 20um or more and 30um or less.

In the step of forming the electromagnetic wave shielding layer 230 (S30), the electromagnetic wave shielding layer 230 is formed in the recessed pattern 221. The step S30 of forming the electromagnetic wave shielding layer 230 will be described in more detail with reference to FIG.

9 is a view for explaining an example for manufacturing the electromagnetic wave shielding layer 230 in the method of manufacturing an optical filter according to an example of the present invention.

The forming step S30 of the electromagnetic wave shielding layer 230 may include a surface treatment step S31, a metal seed layer forming step S32, a burying part 222 removing the metal seed layer 231 S33), and a metal layer 232 forming step (S34).

In the surface treatment step S31, in order to improve the adhesion between the metal seed layer 231 and the resin layer 220, the upper part of the resin layer 220 patterned with the engraved pattern 221 is subjected to chemical surface treatment An amine-based reactor is provided to perform surface treatment so as to improve the reactivity with the catalyst (cadmium chloride). For such surface treatment step S31, any one of an etching treatment, a catalyst treatment, a plasma treatment or an ion beam treatment may be used.

In the metal seed layer 231 forming step S32, the metal seed layer 231 is formed to a predetermined thickness inside the engraved pattern 221 of the resin layer 220. The metal seed layer 231 may be formed by any one of electroless plating, chemical vapor deposition (CVD), sputtering, and printing.

By forming the metal seed layer 231 using any one of electroless plating, chemical vapor deposition (CVD), sputtering, and printing, it is possible to form the metal seed layer 231, It is possible to dramatically increase the uniformity of the image filter without causing it to occur.

In addition, by improving the uniformity of the image filter naturally during the process, it is possible to relatively reduce the defect rate and improve the process yield relatively.

According to such a method, the thickness of the metal seed layer 231 requiring a fine thickness can be more easily formed, and the defect rate at the time of fabrication can be greatly reduced.

At this time, the thickness of the metal seed layer 231 may be at least 0.01 um or more and 4 um or less. More preferably, the thickness of the metal seed layer 231 may be at least 0.01 μm or more and 2 μm or less. At this time, the metal seed layer 231 can be made of a black-based material and can be formed of copper (Cu), nickel (Ni), chromium (Cr), iron (Fe), tungsten Co, silver (Ag), nickel-phosphorus (Ni-P), nickel-chromium (Ni-Cr) and copper oxide II (CuO).

In the step of removing the metal seed layer 231, the metal seed layer 231 formed on the embossed portion 222 is removed from the resin layer 220 except for the inside of the engraved pattern 221. For this, in the step of removing the metal seed layer 222, the metal seed layer 231 formed in the embossing portion 222 is formed by using any one of a chemical mechanical polishing (CMP) method, a polishing method and a brushing method. Can be removed.

In the metal layer formation step, the metal layer 232 is formed in the metal seed layer 231. The material of the metal layer 232 may be selected from the group consisting of Cu, Ag, Al, Ni, Cr, Ni-P, Ni-Cr, ) And CuO to selectively form a metal layer 232 in the metal seed layer 231 formed in the engraved pattern 221. The metal seed layer 231 is formed on the metal seed layer 231,

The metal seed layer 231 is formed in the depressed pattern 221 of the resin layer 220 having the depressed pattern 220 and the embossed portion 222 of the depressed pattern 221 except for the depressed pattern 221 in the step of forming the metal seed layer 231 And then the metal seed layer 231 formed on the embossed portion 222 is removed by any one of CMP (Chemical Mechanical Polishing) method, polishing method and Brushing method, The metal layer 232 can be selectively formed by selectively electrolytically plating the metal layer 232 in the layer 231.

It will be apparent to those skilled in the art that various modifications, substitutions and substitutions are possible, without departing from the scope and spirit of the invention as disclosed in the accompanying claims. will be. Therefore, the embodiments disclosed in the present invention and the accompanying drawings are intended to illustrate and not to limit the technical spirit of the present invention, and the scope of the technical idea of the present invention is not limited by these embodiments and the accompanying drawings . The scope of protection of the present invention should be construed according to the following claims, and all technical ideas within the scope of equivalents should be construed as falling within the scope of the present invention.

FIGS. 1A to 1C are diagrams for explaining the structure of an optical filter according to the related art; FIG.

2 is a view for explaining an example of an optical filter according to an example of the present invention;

3 is a view for explaining various examples of a predetermined engraved pattern formed on a resin layer in an optical filter according to an example of the present invention;

4A to 4C are views for explaining in detail a horizontal section of a resin layer formed with an engraved pattern in an optical filter according to an example of the present invention.

FIGS. 5A and 5B are views for explaining a vertical section of a resin layer formed with an engraved pattern in an optical filter according to an example of the present invention;

6 is a view for explaining the electromagnetic wave shielding layer formed inside the relief pattern in the optical filter according to an example of the present invention in more detail;

7 is a view for explaining an example in which a functional filter layer other than the electromagnetic wave shielding layer is formed in the optical filter according to the example of the present invention.

8 is a view for explaining an example of a manufacturing method of an optical filter according to an example of the present invention.

9 is a view for explaining an example for manufacturing an electromagnetic wave shielding layer in the method of manufacturing an optical filter according to an example of the present invention.

DESCRIPTION OF THE RELATED ART [0002]

210: transparent base substrate 220: resin layer

221: engraved pattern 230: electromagnetic wave shielding layer

231: metal seed layer 232: metal layer

Claims (28)

A transparent base substrate; A resin layer disposed on the transparent base substrate and formed with a predetermined engraved pattern; And An electromagnetic wave shielding layer disposed inside the engraved pattern of the resin layer and shielding electromagnetic waves; Wherein the electromagnetic wave shielding layer comprises a metal seed layer formed to a predetermined thickness inside the resin layer and a metal layer formed inside the metal seed layer. The method according to claim 1, Wherein the shape of the horizontal cross section formed by the engraved pattern includes either a triangle or a quadrangle. 3. The method of claim 2, Wherein the horizontal cross-sectional shape comprises a rectangle, Wherein the pitch of the engraved pattern is at least 10um and not more than 300um. The method of claim 3, Wherein the rectangle comprises a rectangle, And the short side pitch of the engraved pattern is 20um or more and 50um or less. 5. The method of claim 4, Wherein the long side pitch of the engraved pattern is 80um or more and 200um or less. 6. The method of claim 5, And the value of the long side pitch increases as the value of the short side pitch of the engraved pattern decreases. 5. The method of claim 4, Wherein the width of the engraved pattern is at least 3um and not more than 20um. 5. The method of claim 4, Wherein the width of the engraved pattern is at least 3 um and less than 10 um. 3. The method of claim 2, Wherein the shape of the vertical section of the engraved pattern includes at least one of a triangle, a quadrangle, and a trapezoid. 10. The method of claim 9, Wherein the vertical section depth of the engraved pattern is 10um or more and 40um or less. 10. The method of claim 9, Wherein the vertical cross-sectional depth of the engraved pattern is 20um or more and 30um or less. delete The method according to claim 1, Wherein the thickness of the metal seed layer is at least 0.01 탆 and not more than 4 탆. The method according to claim 1, Wherein the thickness of the metal seed layer is at least 0.01um and not more than 2um. The method according to claim 1, Wherein the metal seed layer is a black-based material. The method according to claim 1, The metal seed layer may include at least one of copper (Cu), nickel (Ni), chromium (Cr), iron (Fe), tungsten (W), phosphorus (P), cobalt (Co), silver (Ag) -P), nickel-chromium (Ni-Cr), and copper oxide II (CuO). The method according to claim 1, The metal layer may be at least one selected from the group consisting of Cu, Ag, Al, Ni, Cr, Ni-P, Ni-Cr, CuO). ≪ / RTI > The method according to claim 1, The transparent base substrate Wherein the optical filter comprises one of a resin film (Film) and a transparent glass (Glass). 19. The method of claim 18, Wherein the resin film comprises an acrylic pressure sensitive adhesive (PSA). A lamination step of laminating a resin layer on a transparent base substrate; A pattern forming step of forming a predetermined engraved pattern on the resin layer; And An electromagnetic wave shielding layer forming step of forming an electromagnetic wave shielding layer inside the engraved pattern; Wherein the step of forming the electromagnetic wave shielding layer comprises: forming a metal seed layer having a predetermined thickness in the depressed pattern of the resin layer; And a metal layer forming step of forming a metal layer in the metal seed layer. 21. The method of claim 20, The pattern forming step And imprinting the mold with a mold having a relief shape to form the predetermined engraved pattern on the resin layer. 21. The method of claim 20, The electromagnetic wave shielding layer forming step A surface treatment step for improving adhesion between the metal seed layer and the resin layer; A metal seed layer forming step of forming the metal seed layer to a predetermined thickness inside the engraved pattern of the resin layer; And A metal layer forming step of forming the metal layer in the metal seed layer; Wherein the optical filter comprises a plurality of optical fibers. 23. The method of claim 22, The surface treatment step Wherein the etching treatment is performed by any one of an etching treatment, a catalytic treatment, a plasma treatment, and an ion beam treatment. 23. The method of claim 22, The metal seed layer forming step Wherein the film is formed by any one of electroless plating, chemical vapor deposition (CVD), sputtering, and printing. 23. The method of claim 22, The metal seed layer forming step may include a step of electroless-plating the metal seed layer on the resin layer, Wherein the forming of the metal layer comprises selectively plating the metal layer in the metal seed layer. 23. The method of claim 22, The electromagnetic wave shielding layer forming step And removing the metal seed layer on the embossed portion of the resin layer except the inside of the engraved pattern. 27. The method of claim 26, The step of removing the embossed metal seed layer (CMP) method, a polishing method, and a brushing method. In a display device including an optical filter, A display device comprising the optical filter according to any one of claims 1 to 11 and 13 to 19.

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