KR101511023B1 - Manufacturing method for face-down type flexible device and flexible device manufactured by the same - Google Patents

Abstract

The present invention relates to a method for manufacturing a face-down type flexible electronic device and the flexible electronic device manufactured thereby and, more particularly, to a method for manufacturing a face-down type flexible electronic device and the flexible electronic device manufactured thereby, capable of simultaneously transferring and connecting ultra thin film electronic devices without damage by electrically connecting the electronic devices and the electrode pads of the electronic device by transferring the very thin electronic device thereon after a metal or polymer elastic bump is formed with semiconductor exposure patterning, etching, printing, jetting, dotting, and electrohydrodynamic jet printing (E-jet printing) and an adhesive is sprayed on the bump, preventing the short of a wire which connects the electronic devices, forming a fine connection wire through a semiconductor metal wiring process through exposure, a printing process, an ink-jet process, and an E-jet process, and forming the connection wire without damaging the flexible substrate.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a face-down type flexible electronic device manufacturing method and a flexible electronic device manufactured by the method.

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a flexible electronic device of a face-down type and a flexible electronic device manufactured by the method, and more particularly, jet printing is used to form elastic bumps of metal or polymer, an adhesive is applied, and then very thin electronic elements are transferred thereon so that the electronic elements and the electrode pads of the electronic elements are electrically connected , It is possible to perform connection at the same time with transfer without damaging the ultra-thin electronic device, and it is possible to prevent a short circuit of the wiring connecting the electronic devices, and the semiconductor metal wiring process, printing, ink-jet, E-jet process It is possible to form fine connection wirings and face-down wirings capable of forming connection wirings without damaging the flexible substrate Flexible electronic device manufacturing method of expression and to a flexible electronic device produced thereby.

A solid electronic device using a substrate such as silicon has reached its limit in terms of its rigidity due to the rigidity of the substrate and can be applied to a variety of surfaces in a ubiquitous environment, Development of electronic devices is required. Flexible electronic devices are in response to the demands of the times and they are currently used in flexible organic light emitting devices (OLEDs), flexible displays, flexible photovoltaic cells, flexible transistors, sensor) have been actively developed. In addition, because flexible electronic devices can use plastic materials, they are cheaper, lighter, and easier to carry than conventional solid-based electronic devices.

However, in the conventional flexible electronic device, gravure printing type printed electronics technology has mainly been developed and there are many restrictions on the material of the printing device, so that it is difficult to realize a high performance device.

In order to overcome these drawbacks, a company-based flexible electronic device technology is being developed, and a high-performance inorganic device is formed on a silicon wafer using a conventional semiconductor process, and a high-performance flexible electronic device is implemented by transferring the inorganic device to be.

However, in the conventional transfer-based flexible electronic device technology, electronic devices are formed on a silicon substrate, wirings are formed between the electronic devices, and the electronic devices are transferred to the flexible substrate. That is, electronic elements are transferred to the flexible substrate in a state in which wiring connecting the electronic elements to the silicon substrate is formed.

Therefore, there is a problem that the wiring connecting the electronic devices during the transfer to the flexible substrate may be short-circuited, and the electronic devices transferred to the flexible substrate can not be rearranged, making connection between the different electronic devices difficult.

As a conventional technique for manufacturing such a flexible electronic device, a method of manufacturing a flexible sensor device based on carbon nanotubes by a physical transfer method (2012-0136995) has been disclosed in Korean Patent Laid-Open Publication.

GB 2012-0136995E (2012.12.20.)

SUMMARY OF THE INVENTION The present invention has been made in order to solve the above-mentioned problems, and an object of the present invention is to provide a method of manufacturing a flexible printed circuit board by a method such as a semiconductor exposure patterning and etching, printing, jetting, dotting, electro-hydrodynamic jet printing To form an elastic bump of metal or polymer and apply an adhesive. Then, the electronic devices are transferred thereon to electrically connect the electronic devices and the electrode pads of the electronic device, thereby making it possible to transfer the electronic devices without damaging the ultra- The connection can be performed quickly. Further, the connection failure is improved by the elastic bumps, and the post-transfer wiring process is performed on the flexible substrate on which the elastic bumps are formed or the electronic device is transferred to the flexible substrate on which the elastic bumps and the fine wiring are formed in advance It is possible to prevent short-circuiting of the fine wiring during the transferring process and to form fine connection wiring and A method of manufacturing a flexible electronic device of a face-down type in which connection wiring can be formed without damaging the flexible substrate, and a flexible electronic device manufactured by the method.

According to an aspect of the present invention, there is provided a method of manufacturing a flexible electronic device of a face-down type, the method comprising the steps of: A step (SA10) of forming, on the upper surface of the flexible substrate, a connection wiring having connection portions formed at both ends thereof by a method of: A step (SA20) of forming an adhesive layer on the flexible substrate; And transferring the electronic devices from the upper side of the flexible substrate so that the connection unit and the electronic device are connected (SA30); And the connection is performed simultaneously with the transfer without damaging the ultra-thin electronic device.

In step SA10, elastic bumps made of a polymer material are formed on the upper surface of the flexible substrate using any one of semiconductor exposure patterning, etching, printing, jetting, dotting, and electro-hydrodynamic jet printing And the connecting portion of the connection wiring is formed so as to cover the elastic bumps made of the polymer.

Further, in the step SA10, the connection wirings and the elastic bumps including the connection portions are formed at a temperature at which the flexible substrate is not deformed by heat.

In step SA30, electronic devices of the same type or different types are transferred.

The method of manufacturing a flexible electronic device of a face-down type according to the present invention is a method of manufacturing a face-down type flexible electronic device by using any one method selected from semiconductor exposure patterning, etching, printing, jetting, dotting and electrohydrodynamic jet printing, (SB10) forming a connection portion and a wiring connection portion connected to the connection portion; (SB20) forming an adhesive layer on the flexible substrate; (SB30) of transferring the electronic devices from the upper side of the flexible substrate so that the connection unit and the electronic device are connected; (SB40) forming a connection wiring for connecting the wiring connection portions by using any one of a semiconductor exposure patterning and etching, printing, jetting, dotting, and electro-hydrodynamic jet printing; And the connection is performed simultaneously with the transfer without damaging the ultra-thin electronic device.

In step SB10, elastic bumps made of a polymer material are formed on the upper surface of the flexible substrate using any one of semiconductor exposure patterning, etching, printing, jetting, dotting, and electro-hydrodynamic jet printing And the connecting portion is formed so as to cover the elastic bump made of the polymer material.

Further, in the SB10 and SB40 steps, the connecting portion, the wiring connecting portion, the elastic bump, and the connecting wiring are formed at a temperature at which the flexible substrate is not deformed by heat.

In addition, in step SB30, electronic devices of the same kind or different types are transferred.

In addition, in the step SB10, the end of the wiring connection part is formed so as to be exposed to the outside of the electronic device, and in the step SB20, the adhesive layer is formed only in the part where the electronic device is transferred.

The flexible electronic device of the present invention includes: a flexible substrate; A connection wiring formed on an upper surface of the flexible substrate and having a connection portion; An adhesive layer formed on an upper surface of the flexible substrate; And a plurality of electronic elements which are in close contact with the adhesive layer and on which electrode pads are formed, the electrode pads being connected to the connection portions; And a control unit.

In this case, the connection part is closely contacted between the flexible substrate and the electronic device.

Further, the flexible electronic device of the present invention comprises: a flexible substrate; Elastic bumps formed on the upper surface of the flexible substrate; A connection wiring formed on an upper surface of the flexible substrate and having a connection portion formed to cover the elastic bump and connected to the connection portion; An adhesive layer formed on an upper surface of the flexible substrate; And a plurality of electronic elements which are in close contact with the adhesive layer and on which electrode pads are formed, the electrode pads being connected to the connection portions; And a control unit.

In this case, the connection portion and the elastic bump are closely contacted between the flexible substrate and the electronic device.

The method of manufacturing a flexible electronic device of the face-down type according to the present invention and the flexible electronic device manufactured by the method of the present invention can be applied to a flexible substrate by using semiconductor exposure patterning, etching, printing, jetting, dotting, electro-hydrodynamic jet printing The wiring and the elastic bump are formed and the electronic elements are transferred thereon so that the electronic elements and the electrode pads of the electronic element are electrically connected to each other so that the connection can be made simultaneously with the transfer of the electronic elements without breaking the ultra- There is an advantage that a short circuit of the wiring connecting the electronic elements can be prevented.

In addition, it is possible to form fine connection wirings using semiconductor exposure patterning, etching, printing, jetting, dotting, and E-jet printing (electro-hydrodynamic jet printing), and it is possible to form wirings without damaging the flexible substrate have.

In addition, it is easy to manufacture a flexible electronic device formed of heterogeneous electronic devices, and it is possible to form various designs of flexible electronic devices.

FIGS. 1 to 4 are schematic cross-sectional views illustrating a method of manufacturing a flexible electronic device of a face-down type according to the present invention and a flexible electronic device manufactured thereby.
5 is a top plan view of the flexible electronic device of the present invention.
6 is a block diagram illustrating an E-jet printing apparatus and method according to the present invention.
7 is a schematic diagram showing an embodiment of a connection according to the invention;

Hereinafter, the method of manufacturing a flexible electronic device of the face-down type according to the present invention and the flexible electronic device manufactured by the method of the present invention will be described in detail with reference to the accompanying drawings.

1 to 4 are schematic cross-sectional views illustrating a method of manufacturing a flexible electronic device of the face-down type of the present invention and a flexible electronic device manufactured thereby.

First, a method of manufacturing a flexible electronic device of a face-down type according to the present invention is a method of manufacturing a face-down type flexible electronic device using a method selected from semiconductor exposure patterning and etching, printing, jetting, dotting and electrohydrodynamic jet printing, (SA10) on the upper surface of the flexible substrate (100); (SA20) of forming an adhesive layer (200) on the flexible substrate (100); (SA30) transferring the electronic devices 300 from the upper side of the flexible substrate 100 so that the connection unit 410 and the electronic device 300 are connected to each other; .

Step SA10 connects the connection part 410 and the connection part 410 to the upper surface of the flexible substrate 100 so that the connection between the electronic devices 300 and the electrode pads 310 of the electronic device 300 can be electrically connected. The connection wiring 400 is formed.

1, the connection wiring 400 is formed in a form designed in advance so as to fit the position where the electronic elements 300 are to be transferred, and the connection part 410 is also connected to the electrode pad 310 of the electronic elements 300 to be transferred As shown in FIG. The connection part 410 is connected to the connection wiring 400 and is formed to protrude upward.

At this time, the connection wiring 400 and the connection part 410 are formed using semiconductor exposure patterning and etching, printing, jetting, dotting, and electro-hydrodynamic jet printing. The connection wirings 400 are connected to the electrode pads 310 of the electronic devices 300 and the connection portions 410 are formed at the connection portions. The connection wiring 400 is formed to connect the electronic elements 300 and is configured to connect the electrode pads 310 in one electronic element 300 and the electrode pads 310 of the electronic element 300 And the other side is extended to the outside of the electronic device 300. In this case,

In particular, E-jet printing includes a transfer stage 510 capable of transferring a flexible substrate 100 as shown in FIG. 6; An ink chamber 520 containing a printable conductive fluid; A nozzle 530 formed in the ink chamber 520 to eject the conductive fluid; A pressure regulator 550 for supplying a constant pressure to the ink chamber 520; And a power supply 540 connected to the flexible substrate 100 and the nozzle 530. The E-jet printing apparatus 500 includes a flexible substrate 100 and a nozzle 530. The E-jet printing apparatus 500 includes a flexible substrate 100, And a connecting portion.

As described above, the connection wiring 400 and the connection portion 410 can be formed from the conductive fluid injected by the electrostatic force in the nozzle 530 disposed on the upper portion of the flexible substrate 100, . Further, by using the E-jet printing, it is possible to form the connection wiring and the connection portion with a very precise and fine width (1 탆 to 2 탆), and to keep the temperature for forming the connection wiring and the connection portion relatively low So that the connection wirings and connection portions can be formed without damaging the flexible substrate.

Step SA20 is a step of forming an adhesive layer 200 on the upper surface of the flexible substrate 100. The adhesive layer 200 may be formed by applying or spraying an adhesive on the upper surface of the flexible substrate 100. [ 2, the adhesive layer 200 may be formed on the upper surface of the flexible substrate 100, and the adhesive layer 200 may be formed to cover the connection wiring 400. Referring to FIG.

Step SA30 is a step of transferring the electronic devices 300 to the upper surface of the adhesive layer 200 so that the electronic devices 300 are closely attached to the flexible substrate 100. At this time, the electronic element 300 is closely contacted with the connection portion 410. Here, the electronic devices 300 may be transferred to a flexible substrate 100 after being transferred to a PDMS (Polydimethylsiloxane) mold or a stamp, etc., in the state of being formed on a rigid substrate such as a silicon substrate. Also, the electronic device 300 is formed with the electrode pad 310, and the electrode pad 310 is transferred to be positioned on the lower side. Here, the method of transferring the electrode pad 310 of the electronic device 300 to the flexible substrate 100 so that the electrode pad 310 is disposed on the lower side is a face-down method. Further, the electronic devices are transferred to the flexible substrate with a certain distance from each other.

Thus, the method of manufacturing a flexible electronic device of the face-down type according to the present invention comprises forming a connection wiring and a connection portion on a flexible substrate by using semiconductor exposure patterning and etching, printing, jetting, dotting, and electrohydrodynamic jet printing, And the electrode pads of the electronic device are electrically connected to each other to allow connection at the same time as the transfer of the electronic devices and advantageously the short circuit of the wiring connecting the electronic devices can be prevented .

In addition, it is possible to form fine connection wirings by using E-jet printing, and it is possible to form wirings without damaging the flexible substrate.

In step SA10, an elastic bump made of a polymer material is formed on the upper surface of the flexible substrate 100 by using any one method selected from semiconductor exposure patterning, etching, printing, jetting, dotting, and electro-hydrodynamic jet printing The connection portion 410 of the connection wiring 400 may be formed to cover the elastic bump 430 made of the polymer.

That is, after the elastic bumps 430 made of a polymer material are formed in a convex shape on the flexible substrate 100 as shown in FIG. 2, the connection portions 410 are formed so as to cover the elastic bumps 430, The connecting portion 410 can be easily attached to the electrode pad 310 of the electronic device 300 by the elastic bump 430 made of a polymer material.

The elastic bumps 430 made of a polymer material are formed using semiconductor exposure patterning, etching, printing, jetting, dotting, and electro-hydrodynamic jet printing. The elastic bumps 430 are formed on the outer surface of the elastic bump 430, A connection part 410 made of a metal or polymer material of an electrically conductive material may be formed on the connection part 400. The connection part 410 may be integrally formed with the connection wiring 400. [

In step SA10, the connection wirings 400 including the connection part 410 and the elastic bumps 430 can be formed at a temperature at which the flexible substrate 100 is not deformed by heat.

That is, when the connection part 410, the connection wiring 400 and the elastic bump 430 are formed at a high temperature, the flexible substrate 100 formed of a plastic resin or the like may be deformed or damaged, The connection portion 410, the connection wiring 400 and the elastic bump 430 are formed by the above-described method, the flexible substrate 100 can be formed at a temperature at which the flexible substrate 100 is not deformed by heat.

In step SA30, the same or different electronic devices 300 may be transferred.

That is, one kind of the same electronic elements 300 may be transferred or different kinds of different electronic elements 300 may be transferred. For example, when two kinds of electronic elements 300 are transferred, (300) may be transferred first, and then the remaining two kinds of electronic devices (300) may be transferred. The electronic devices 300 are transferred after the connection wirings 400 including the connection portions 410 and the elastic bumps 430 are formed on the flexible substrate 100 so that the dissimilar electronic devices 300 can be freely arranged and transferred The connection portion 410, the connection wiring 400 and the elastic bump 430 of the electronic devices 300 can be easily formed.

In addition, it is easy to manufacture a flexible electronic device formed of heterogeneous electronic devices, and it is possible to form various designs of flexible electronic devices.

The method of manufacturing a flexible electronic device of the face-down type according to the present invention is a method of manufacturing a flexible substrate 100 (100) using any one method selected from semiconductor exposure patterning and etching, printing, jetting, dotting and electrohydrodynamic jet printing. A step SB10 of forming a connection part 410 and a wiring connection part 420 connected to the connection part 410 on the upper surface of the connection part 410; A step SB20 of forming an adhesive layer 200 on the flexible substrate 100; (SB30) of transferring the electronic devices 300 from the upper side of the flexible substrate 100 so that the connection unit 410 and the electronic device 300 are connected to each other; And forming a connection wiring 400 connecting the wiring connection parts 420 using any one of semiconductor exposure patterning and etching, printing, jetting, dotting, and electro-hydrodynamic jet printing SB40); The connection can be made simultaneously with the transfer without damaging the ultra-thin electronic device.

This is similar to the above-described method of manufacturing a flexible electronic device of the face-down type of the above-described electronic device. However, as shown in FIG. 3, the connection part 410, which is a part connected to the electrode pad 310 of the electronic device 300, 420 are formed on the adhesive layer 200, the adhesive layer 200 is applied, the electronic device 300 is transferred, and finally, the connection wiring 400 connecting the wiring connection portions 420 is formed.

Thus, the connection can be made at the same time as the transfer of the electronic elements, and the connection wiring can be formed after the transfer of the electronic elements, so that the connection of the electronic elements can be diversified, have.

4, at step SB10, the flexible substrate 100 is patterned by any one method selected from semiconductor exposure patterning, etching, printing, jetting, dotting, and electro-hydrodynamic jet printing, The elastic bump 430 may be formed on the upper surface of the elastic bump 430, and the connection part 410 may be formed to cover the elastic bump 430 made of the polymer. The connecting portion 410, the wiring connecting portion 420, the elastic bump 430 and the connecting wiring 400 can be formed at a temperature at which the flexible substrate 100 is not deformed by heat at steps SB10 and SB40 . In addition, in step SB30, the same or different types of electronic devices may be transferred.

In step SB10, the end of the wiring connection part 420 is exposed to the outside of the electronic device 300. In step SB20, the adhesive layer 200 may be formed only at a portion where the electronic device 300 is transferred have.

That is, the wiring connection part 420 is extended from the connection part 410 so as to be exposed outside the side surface of the electronic device 300 when the electronic device 300 is transferred to the flexible substrate 100, The adhesive layer 200 may be formed only on a portion corresponding to the width of the electronic device 300 which is a portion to which the electronic device 300 is transferred and fixed to the flexible substrate 100. [ At this time, it is preferable that the adhesive layer 200 is not formed at the end of the wiring connection part 420 to which the connection wiring 400 is connected.

The flexible electronic device 1000 of the present invention includes a flexible substrate 100; A connection wiring 400 formed on the upper surface of the flexible substrate 100 and having a connection part 410; An adhesive layer 200 formed on the upper surface of the flexible substrate 100; And a plurality of electronic devices 300 which are in close contact with the adhesive layer 200 and in which the electrode pads 310 are formed on the lower side and the electrode pads 310 are connected to the connection parts 410; .

1 to 5, the connection portion 410 and the connection wiring 400 are formed on the upper surface of the flexible substrate 100 by semiconductor exposure patterning and etching, printing, jetting, dotting, electro-hydrodynamic jet printing, The adhesive layer 200 is formed on the upper surface of the flexible substrate 100 and the electronic device 300 is transferred to the adhesive layer 200 in a face-down manner to be closely contacted with the adhesive layer 200, have. In addition, a wiring connection part 420 connected to the connection part 410 is formed, and the connection wiring 400 is formed after the electronic device 300 is transferred, so that a flexible electronic device can be formed.

At this time, the connection part 410 may be closely contacted between the flexible substrate 100 and the electronic device 300. That is, the connection part 410 is transferred from the upper side of the flexible substrate 100 to the adhesive layer 200 so that the electrode pad 310 of the electronic component 300 and the connection part 410 are in close contact with each other So that electrical shorting of the flexible electronic device can be prevented.

In addition, the flexible electronic device 1000 of the present invention includes a flexible substrate 100; Elastic bumps (430) formed on the upper surface of the flexible substrate (100); A connection wiring 400 formed on an upper surface of the flexible substrate 100 and having a connection part 410 formed to cover the elastic bump 430 and connected to the connection part 410; An adhesive layer 200 formed on the upper surface of the flexible substrate 100; And a plurality of electronic devices 300 which are in close contact with the adhesive layer 200 and in which the electrode pads 310 are formed on the lower side and the electrode pads 310 are connected to the connection parts 410; . ≪ / RTI >

This is because the flexible bump 430 is formed before forming the connection part 410 in the flexible electronic device of the embodiment and the connection part 410 is formed on the elastic bump 430 so that when the electronic device 300 is transferred, So that the electrical connection of the connection part 410 can be ensured. At this time, the connection part 410 and the elastic bump 430 are closely contacted between the flexible substrate 100 and the electronic device 300, thereby preventing electrical shorting of the flexible electronic device.

7, the connecting portion 410 may be formed in various shapes such as a spring shape, a curved convex-concave shape, a shape where one side is coupled to the flexible substrate and the other side is floating, The elastic bumps 430 are preferably formed in a convex hemispherical shape. The connection part 410 is formed in a curved shape so as to cover the upper surface of the elastic bump 430 and a pattern corresponding to the electrode pad 310 is formed on the upper surface of the connection part 410, 310).

The elastic bumps 430 may be formed in an elastic shape so that the elastic bumps 430 can be pressed between the electronic device 300 and the flexible substrate 100. The elastic bumps 430 may be held between the flexible substrate 100 and the electrode pads 310 of the electronic device 300 after the transfer of the electronic device 300 and kept in a flat state.

It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. It goes without saying that various modifications can be made.

1000: Flexible electronic device
100: flexible substrate
200: adhesive layer
300: Electronic element 310: Electrode pad
400: connection wiring 410: connection
420: wiring connection part 430: elastic bump
500: E-jet printing device
510: transfer stage 520: ink chamber
530: Nozzle 540: Power source
550: Pressure regulator

Claims (13)

(SA10) of forming a connection wiring on the upper surface of the flexible substrate, the connection wiring having connection portions formed at both ends by using any one of semiconductor exposure patterning and etching, printing, jetting, dotting and electro-hydrodynamic jet printing, ;
A step (SA20) of forming an adhesive layer on the flexible substrate; And
(SA30) of transferring electronic elements from the upper side of the flexible substrate so that the connection unit and the electronic device are connected to each other; The connection is made simultaneously with the transfer without damaging the ultra-thin electronic device,
In step SA10, elastic bumps made of a polymer material are formed on the upper surface of the flexible substrate using any one of semiconductor exposure patterning, etching, printing, jetting, dotting, and electrohydrodynamic jet printing, Is formed so as to cover the elastic bumps of the polymer material.
delete The method according to claim 1,
Wherein the connection wiring and the elastic bump including the connection portion are formed at a temperature at which the flexible substrate is not deformed by heat in the step SA10.
The method according to claim 1,
Wherein the same or different types of electronic devices are transferred in step SA30.
Forming a connection portion on the upper surface of the flexible substrate and a wiring connection portion connected to the connection portion by using any one of semiconductor exposure patterning, etching, printing, jetting, dotting, and electrohydrodynamic jet printing (SB10 );
(SB20) forming an adhesive layer on the flexible substrate;
(SB30) of transferring the electronic devices from the upper side of the flexible substrate so that the connection unit and the electronic device are connected; And
(SB40) of forming connection wirings connecting the wiring connection portions by using any one of semiconductor exposure patterning, etching, printing, jetting, dotting, and electro-hydrodynamic jet printing; The connection is made simultaneously with the transfer without damaging the ultra-thin electronic device,
In step SB10, elastic bumps made of a polymer material are formed on the upper surface of the flexible substrate using any one of semiconductor exposure patterning, etching, printing, jetting, dotting, and electro-hydrodynamic jet printing, Wherein the first electrode and the second electrode are formed to cover the elastic bumps of the polymer material.
delete 6. The method of claim 5,
Wherein the connecting portion, the wiring connecting portion, the elastic bump, and the connecting wiring are formed at a temperature at which the flexible substrate is not deformed by heat at the steps SB10 and SB40.
6. The method of claim 5,
Wherein the same or different types of electronic devices are transferred in step SB30.
6. The method of claim 5,
Wherein the wiring connection part is formed such that an end of the wiring connection part is exposed to the outside of the electronic device in step SB10, and the adhesive layer is formed only in a part of the electronic device to which the electronic device is transferred in step SB20.
delete delete A method for manufacturing a flexible electronic device using a face-down type flexible electronic device according to any one of claims 1, 3, 4, 5, 7, 8, and 9,
Flexible substrate;
Elastic bumps formed on the upper surface of the flexible substrate;
A connection wiring formed on an upper surface of the flexible substrate and having a connection portion formed to cover the elastic bump and connected to the connection portion;
An adhesive layer formed on an upper surface of the flexible substrate; And
A plurality of electronic elements which are in close contact with the adhesive layer and on which electrode pads are formed on the lower side and the electrode pads are connected to the connection portions; Wherein the flexible electronic device comprises:
13. The method of claim 12,
Wherein the connecting portion and the elastic bump are in close contact with each other between the flexible substrate and the electronic device.

Images