KR101508433B1 - Ic chip reader and operating method of the same - Google Patents

Abstract

The IC chip reader according to an embodiment of the present invention is an IC chip reader comprising: a contact portion for contacting data with the IC chip to read data; a contact portion for contacting the contact portion when the read result of the contact portion is a lead error, And a control unit for controlling operation of the contact unit and the test unit and receiving the test data from the contact unit and determining the cause of the lead error. Therefore, the IC chip reader according to the embodiment of the present invention and its operation method can easily grasp the cause of the error when the IC chip read error occurs.

Description

IC CHIP READER AND OPERATING METHOD OF THE SAME [0002]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC chip reader and an operation method thereof, and more particularly, to an IC chip reader capable of easily grasping the cause of an error when an IC chip reading error occurs and an operation method thereof.

The IC chip includes a CPU and a memory, so it can store vast amounts of information and is capable of high-level cryptographic processing. An IC card called a smart card is a card having such an IC chip, and is capable of storing and processing information in the card, thereby minimizing the risk of forgery and falsification of the magnetic card and widely used as a payment means for providing various services. The IC card has a storage capacity which is higher than that of the conventional magnetic card, and thus it is possible to perform various additional functions requiring additional information storage, thereby improving the security problem. Therefore, the government is promoting the mandatory use of IC cards to replace existing magnetic cards with IC cards.

On the other hand, the IC card is divided into a contact type and a non-contact type according to a usage method. The contact type IC card has a metal pattern on the front face of the card and is the most common type of IC card. The contactless IC card has a built-in module and an antenna capable of wireless communication in the card. Generally, contact IC cards are mainly used for financial transactions through ATMs. When a user who wishes to conduct a financial transaction with a bank inserts an IC card into an ATM, the ATM reads data from the inserted IC card and proceeds with a financial transaction with the user. However, when an IC chip reading error occurs during an attempt to insert an IC card into a financial automation device, there is a problem that the cause of the error can not be easily understood.

An object of the present invention is to provide an IC chip reader capable of easily grasping the cause of an error when an IC chip read error occurs and an operation method thereof.

The technical problems of the present invention are not limited to the above-mentioned technical problems, and other technical problems which are not mentioned can be understood by those skilled in the art from the following description.

The IC chip reader according to an embodiment of the present invention is an IC chip reader comprising: a contact portion for contacting data with the IC chip to read data; a contact portion for contacting the contact portion when the read result of the contact portion is a lead error, And a control unit for controlling operation of the contact unit and the test unit and receiving the test data from the contact unit and determining the cause of the lead error.

In one embodiment, the contact portion may include at least one contact pin in contact with the IC chip.

In one embodiment, the test unit may include a test module for testing whether the contact unit operates normally, a drive unit for moving the test module in contact with the contact unit in response to the control of the control unit, As shown in FIG.

In one embodiment, the test module may include a contact plate in contact with the contact portion, an IC circuit performing a test operation of the test module, and a wiring connecting the contact plate and the IC circuit.

In one embodiment, the IC chip includes a transfer part for transferring the IC chip to the contact point so that the IC chip faces the contact part, and the IC chip can be transferred from the upper surface of the transfer part.

In one embodiment, the test module may be disposed at a lower level than the upper surface of the transfer section.

In one embodiment, the controller may control the test module to move to a level higher than the upper surface or the upper surface of the transfer unit when the lead result of the contact unit is a read error.

In one embodiment, the controller may control the test module to contact the contact portion when the read result of the contact portion is a read error.

In one embodiment, if the test data has a first value, the control unit determines that the cause of the lead error is a defect of the IC chip, and if the test data has a second value, It can be determined that the contact portion is defective.

A method of operating an IC chip reader according to an embodiment of the present invention includes: transferring the IC chip to a contact point with a contact unit; reading data from the IC chip; And a step of contacting the test unit with the contact unit to determine the cause of the lead error if the result of reading the data is a lead error.

In one embodiment, the step of contacting the test unit with the contact unit to determine the cause of the lead error when the read result of the data is a read error includes the steps of emitting the IC chip from the contact point, Generating test data by contact with the contact portion, and determining a cause of the lead error based on the test data.

In one embodiment, the step of determining the cause of the lead error based on the test data may include determining that the cause of the lead error is a failure of the IC chip when the test data has the first value, And if it has the second value, it is determined that the cause of the lead error is a defect of the contact portion.

An operation method of an IC chip reader according to an embodiment of the present invention is an operation method of an IC chip reader having a contact portion for reading data from an IC chip, the method comprising: transferring the IC chip to a contact point with the contact portion , Reading data from the IC chip, reading the magnetic strip if the result of reading the data is a read error, and processing the read data, and after the processing of the read data is completed, And contacting the test unit of the reader with the contact unit to determine the cause of the lead error.

An operation method of an IC chip reader according to an embodiment of the present invention is an operation method of an IC chip reader having a contact portion for reading data from an IC chip, the method comprising: initializing the IC chip reader; The method comprising the steps of: carrying out a test operation for testing the IC chip, after the test operation is completed, transferring the IC chip to a contact point with the contact section; reading the data from the IC chip by the contact section; And determining whether or not a read error has occurred.

In one embodiment, the step of performing a test operation for testing whether or not the contact unit operates normally may be performed again if the read error occurs, and the read data may be processed if the read error does not occur.

The IC chip reader according to an embodiment of the present invention and its operation method can easily grasp the cause of an error when an IC chip read error occurs.

More specifically, the IC chip reader according to one embodiment of the present invention and its operation method can easily determine whether the cause of an error occurs in an IC chip or in a contact portion in contact with the IC chip when a read error occurs in the IC chip .

1 is a block diagram illustrating an IC chip reader according to an embodiment of the present invention.
FIG. 2 is a block diagram illustrating an IC chip reader according to an exemplary embodiment of the present invention. Referring to FIG.
3 is a flowchart illustrating an operation method of the IC chip reader according to the first embodiment of the present invention.
4 to 7 are views for explaining the operation of the IC chip reader according to the embodiment of the present invention.
8 is a flowchart illustrating an operation method of an IC chip reader according to a second embodiment of the present invention.
9 is a flowchart illustrating an operation method of an IC chip reader according to a third embodiment of the present invention.
10 is a flowchart illustrating an operation method of an IC chip reader according to a fourth embodiment of the present invention.

Hereinafter, some embodiments of the present invention will be described in detail with reference to exemplary drawings. It should be noted that, in adding reference numerals to the constituent elements of the drawings, the same constituent elements are denoted by the same reference numerals even though they are shown in different drawings. In the following description of the embodiments of the present invention, a detailed description of known functions and configurations incorporated herein will be omitted when it may make the difference that the embodiments of the present invention are not conclusive.

In describing the components of the embodiment of the present invention, terms such as first, second, A, B, (a), and (b) may be used. These terms are intended to distinguish the constituent elements from other constituent elements, and the terms do not limit the nature, order or order of the constituent elements. When a component is described as being "connected", "coupled", or "connected" to another component, the component may be directly connected or connected to the other component, Quot; may be "connected," "coupled," or "connected. &Quot;

The IC chip reader according to an embodiment of the present invention may be mounted inside a financial instrument such as an ATM (Automated Teller Machine). Such a financial instrument can be obtained from a variety of media such as banknotes, securities, bills, coins, gift certificates, etc. and processing such as deposit processing, paper storage, exchange of vouchers, etc. and processing such as withdrawal processing, And performs financial operations to perform processing. Examples of such financial instruments include an automated teller machine (ATM) such as a cash dispenser (CD), a cash recycling machine, and the like. However, the financial instrument is not limited to the above-described example, and may be a device for automating financial business such as FIS (Financial Information System).

1 is a block diagram illustrating an IC chip reader according to an embodiment of the present invention. FIG. 2 is a block diagram illustrating an IC chip reader according to an exemplary embodiment of the present invention. Referring to FIG.

1 and 2, an IC chip reader according to an embodiment of the present invention includes an IC chip 110, a transfer unit 120, a contact unit 130, a test unit 140, and a control unit 150 .

IC chip 110 may include a microprocessor and memory (e.g., RAM, ROM, flash memory). In addition, the IC chip 110 may include a microprocessor for performing a separate encryption process. A metal pattern may be formed on one surface of the IC chip 110, and the contact portion 130 may contact the metal pattern to read data. Although the IC chip 110 is shown as an independent structure in FIG. 1, the IC chip 110 may be attached to a plastic card such as a credit card, a check card, or the like.

The transfer unit 120 may transfer the IC chip 110 to a contact point with the contact unit 130. The transfer unit 120 may be implemented, for example, in the form of a conveyor. The contact point is defined as a point at which the contact portion 130 can contact the metal pattern of the IC chip 110 by, for example, arranging the IC chip 110 and the contact portion 130 at positions facing each other. . The IC chip 110 may be transported from the upper surface of the transfer part 120 to the contact point, for example.

The contact unit 130 can contact the IC chip 110 and read data from the IC chip 110. [ The contact portion 130 may include at least one contact pin 131 for contacting the IC chip 110. The contact pins 131 may be arranged in various forms corresponding to the metal pattern of the IC chip 110, and are not limited to those shown in Fig. The contact pin 131 may contact the at least one contact on the metal pattern of the IC chip 110 to read data. For example, the data may include bank account numbers, transaction passwords, and other customer information. The data read from the contact unit 130 may be transmitted to the controller 150.

The test unit 140 may test whether the contact unit 130 is operating normally if the IC chip data read result of the contact unit 130 is a read failure. The test unit 140 may include a test module 141, a driver 142, and a connection unit 143.

The test module 141 may contact the contact portion 130 to test whether the contact portion 130 is operating normally. The test module 141 includes a contact plate 141a for contacting the contact pins 131 of the contact portion 130, an IC circuit 141b and a wiring 141c for connecting the contact plate 141a and the IC circuit 141b ). The contact plate 141a may be disposed on the upper surface of the test module 141 and may be made of a metal material. The contact plate 141a may be disposed at a lower level than the upper surface of the transfer unit 120. [ The IC circuit 141b can be designed such that, for example, the test module 141 has the same function as the IC chip 110 (see Fig. 1). The wiring 141c may be made of a material capable of preventing deformation or breakage due to impact due to contact between the contact pin 131 and the contact plate 141a.

The test module 141 has such a structure as described above to protect the IC circuit 141b from impact due to repetitive contact of the contact pin 131 and the contact plate 141a. That is, by minimizing the error probability of the test module 141 itself, it is possible to improve the accuracy of the lead error cause analysis.

The driving unit 142 may move the test module 141 in contact with the contact unit 130 in response to the control of the controller 150. [ For example, when a read error occurs, the driving unit 142 generates a rising force for moving the contact plate 141a to a level equal to or higher than the upper surface of the transfer unit 120 in response to the control of the controller 150 . The driving unit 142 may be implemented, for example, as a solenoid.

The connection unit 143 may connect the test module 141 and the driving unit 142. The connection unit 143 can transmit the amplification force from the driving unit 142 (that is, the force for moving the test module 141 in the direction of the contact unit 130) to the test module 141.

The control unit 150 may control the operation of the contact unit 130 and the test unit 140. The control unit 150 can determine the cause of the lead error based on the test data transmitted from the contact unit 130. [ The test data may refer to data that the contact unit 130 reads from the test module 141 and may include a simple recognition signal indicating whether the contact unit 130 and the test module 141 have made a normal contact It should be understood as a wide range of data.

For example, when the test data has the first value, the controller 150 may determine that the IC chip 110 is defective in the cause of the lead error. That is, when the test data has the first value, it may mean that the contact unit 130 reads data from the test module 140 normally. Failure of the IC chip 110 may mean, for example, physical damage to the metal pattern, circuit damage inside the chip, and / or damage to the program inside the chip.

If the test data has a second value different from the first value, the control unit 150 may determine that the cause of the lead error is a defect of the contact unit 130. That is, when the test data has the second value, it may mean that the contact unit 130 fails to read data from the test module 140 normally. Failure of the contact portion 130 may mean, for example, damage to the contact pin 131 and / or circuit damage within the contact portion 130.

As described above, the IC chip reader according to the embodiment of the present invention can determine the cause of the lead error when a read error occurs in the IC chip 110. That is, the IC chip reader can determine whether the cause of the lead error is in the IC chip 110 or in the contact unit 130. In particular, when the IC chip reader is used in a banking automation equipment (ATM) or the like, the determination of the cause of the lead error can improve the management efficiency of the ATM. For example, if it is determined that the contact unit 130 is defective as a result of the determination of the cause of the lead error, the user can be informed by using another automated teller machine to reduce the inconvenience of the user, You can solve it immediately.

3 is a flowchart illustrating an operation method of the IC chip reader according to the first embodiment of the present invention. 4 to 7 are views for explaining the operation of the IC chip reader according to the embodiment of the present invention. 4 and 5 below, it is assumed that the IC chip 110 is attached to the card, but the present invention is not limited thereto. In order to facilitate understanding, FIGS. 4 to 7 will be described on the assumption that a read error occurs.

3, an operation method of an IC chip reader according to an exemplary embodiment of the present invention includes a step of transferring an IC chip 110 (see FIG. 1) to a contact point with a contact unit 130 (see FIG. 2) A test module 141 (see FIG. 2) is connected to the contact unit 130, and the IC chip 110 is connected to the IC chip 110, (S140) of judging the cause of the read error by contacting the IC chip (S140), and processing the data read from the IC chip when the read error does not occur (S150).

(S140) of determining the cause of the lead error by contacting the test module 140 (see FIG. 2) with the contact portion 130 when a read error occurs, a step S141 of emitting the IC chip from the contact point, The step of contacting the test module with the contact portion to generate test data (S142), and analyzing the cause of the lead error from the test data (S143).

Meanwhile, the operation method of the IC chip reader according to the embodiment of the present invention is not limited to the order of each step described above, but can be implemented in various ways. For example, steps S142 and S143 may be performed to determine the normal operation of the contact unit 130 when a read error does not occur (for example, when the IC chip reader is initialized). This makes it easy to maintain / repair the IC chip reader.

If it is determined in step S140 that the read error does not occur immediately after repeating the steps S110 to S130 N times (N? 2, N is a natural number) .

Hereinafter, steps S110 to S150 will be described with reference to Figs.

Referring to FIG. 4, in step S110, the transfer unit 110 may transfer a card having the IC chip 110 attached thereto so that the IC chip 110 is transferred to the contact point. The transferred IC chip 110 may be disposed, for example, between the contact portion 130 and the test module 141.

In step S120, the contact unit 130 may be lowered to contact the IC chip 110. [ The contact portion 130 can be lowered to a level suitable for contacting the contact pin 131 with the metal pattern of the IC chip 110, for example. The contact unit 130 may transmit the data read from the IC chip 110 to the controller 150 (see FIG. 1).

Referring to FIG. 5, if a read error occurs, the transfer unit 120 may discharge the card with the IC chip 110 in the first direction (a) in step S141. This is to contact the test module 141 with the contact portion 130 to determine the cause of the lead error. For example, the first direction (a) may be the same direction as the direction in which the IC chip 110 is conveyed, but is not limited thereto, and may include a direction opposite to the direction in which the IC chip 110 is conveyed, can do.

Referring to FIG. 6, in response to the control of the controller 150 (see FIG. 1), the driver 142 may generate a force for moving the test module 141 toward the contact unit 130. For example, the driving unit 142 may induce the test module 141 to operate in the second direction (b) by pulling the connecting portion 143 in the third direction (c). However, the operation of the driving unit 142 for moving the test module 141 is not limited to this, and the test module 141 can be moved using various types, power sources, and the like. The driving unit 142 can move the contact plate 141a of the test module 141 to a level equal to or higher than the upper surface of the transfer unit 120. [

Referring to FIG. 7, in step S142, the test module 141 may contact the contact portion 130. FIG. The contact unit 130 may transmit the test data generated by reading the test module 141 to the control unit 150 (see FIG. 1).

In step S143, the control unit 150 can analyze the cause of the lead error based on the test data. For example, when the test data has the first value, the controller 150 may determine that the IC chip 110 is defective in the cause of the lead error. Failure of the IC chip 110 may mean, for example, physical damage to the metal pattern, circuit damage inside the chip, and / or damage to the program inside the chip. If the test data has a second value different from the first value, the control unit 150 may determine that the cause of the lead error is a defect of the contact unit 130. Failure of the contact portion 130 may mean, for example, damage to the contact pin 131 and / or circuit damage within the contact portion 130.

As described above, the operation method of the IC chip reader according to the embodiment of the present invention can determine the cause of the lead error when the IC chip 110 generates the read error. That is, the IC chip reader can determine whether the cause of the lead error is in the IC chip 110 or in the contact unit 130, thereby improving the management efficiency of the IC chip reader.

8 is a flowchart illustrating an operation method of an IC chip reader according to a second embodiment of the present invention. As described with reference to FIG. 4, the IC chip may be mounted on the card. In the second embodiment, it is assumed that the IC card having the IC chip includes a general magnetic strip . The technique of reading data from the magnetic strip is already well known, so a detailed description will be omitted.

8, an operation method of the IC chip reader according to the second embodiment of the present invention includes a step S210 (see FIG. 1) of transferring the IC chip 110 (see FIG. 1) to a contact point with the contact unit 130 A step S230 of reading the IC chip 110 (S220), a step S230 of determining whether a read error has occurred (S230), a step S240 of reading the magnetic strip when a read error occurs, (S250) of judging whether or not to terminate the process of the read data, and performing a test operation (S260) for testing the contact portion of the IC chip reader.

The step S260 may be the same as the step S140 described with reference to FIG. That is, step S260 may include emitting the IC chip from the contact point, contacting the test module with the contact section to generate test data, and analyzing the cause of the lead error from the test data.

In addition, the method of operating the IC chip reader according to the second embodiment of the present invention may further include a step S270 of processing the read data if no read error occurs in step S230. Steps S250 and S260 may be performed after step S270. However, step S260 may be omitted according to the embodiment.

That is, unlike the first embodiment, the operation method of the IC chip reader according to the second embodiment of the present invention does not perform the contact portion test operation immediately when a read error of the IC chip occurs, (For example, transaction processing using the read data when the IC chip reader is implemented in a financial automation device), and testing the contact part when data processing is completed, thereby minimizing the inconvenience of the user.

9 is a flowchart illustrating an operation method of an IC chip reader according to a third embodiment of the present invention.

Referring to FIG. 9, an operation method of an IC chip reader according to a third embodiment of the present invention includes initializing an IC chip reader (S310), contacting a test module with a contact portion to test a contact portion of the IC chip reader A step S340 of generating test data, a step S330 of determining whether a read error has occurred, a step S340 of terminating the operation of the IC chip reader when a read error occurs, (Operation S350).

Steps S310 to S350 may be performed under the control of the control unit 150 (see FIG. 1).

The initialization in step S310 may mean that the IC reader is powered on and the operation is started or the IC reader is reset, for example.

As described above with reference to FIG. 3, in step S330, the controller 150 can determine that the lead error does not occur when the test data has the first value, and when the test data has the second value It can be determined that a read error has occurred.

That is, the operation method of the IC chip reader according to the third embodiment of the present invention can check the operation error of the IC chip reader beforehand by testing the contact unit before the IC chip reader starts to operate.

10 is a flowchart illustrating an operation method of an IC chip reader according to a fourth embodiment of the present invention.

Referring to FIG. 10, an operation method of an IC chip reader according to a fourth embodiment of the present invention includes a step of initializing an IC chip reader (S410), a step of performing a test operation for testing a contact portion of the IC chip reader (S440), a step of performing an IC chip read operation (S450), a step of determining whether a read error has occurred or not (S460), and if the read error does not occur, processing the read data (S470). On the other hand, if it is determined in step S460 that a read error has occurred, step S420 may be performed again.

Step S420 may be the same as step S140 described with reference to FIG. That is, step S420 may include emitting the IC chip from the contact point, contacting the test module with the contact part to generate test data, and analyzing the cause of the lead error from the test data.

The operation of the IC chip reader according to the fourth embodiment of the present invention is performed in steps S440 and S450 regardless of the test result of step S420 (i.e., even when it is determined that the contact portion of the IC chip reader is defective) . Therefore, if there is no read error as a result of performing the operations of steps S440 and S450, the operation of the IC chip reader is normal, but the possibility of the error of the test operation itself can not be excluded, so that the check of the IC chip reader can be induced.

In addition, the method of operating the IC chip reader according to the fourth embodiment of the present invention is not limited to the above-described embodiment, and if the read error occurs as a result of step S460, Is a natural number). As a result of repeating N times, if the lead error still occurs, it can be judged that the contact portion of the IC chip reader is defective. On the other hand, when data is normally read out from the IC chip as a result of repeatedly performing N times, it can be determined that the test module of the IC chip reader is defective. Therefore, the manager of the IC chip reader can check whether the contact portion or the test module is defective and can take appropriate measures, so that the maintenance / management of the IC chip reader can be facilitated.

This embodiment may be more meaningful when the contact portion is determined to be defective as a result of performing Step S420. For example, in step S420, the test module may be determined to be defective according to the test result despite the cause of the defect. This is because it is assumed that there is no failure of the test module itself in the first to third embodiments. Therefore, if a read error occurs as a result of step S460, the process of repeating step S450 N times (where N? 2, N is a natural number) repeatedly determines whether the test module is defective or the contact part is defective .

While the present invention has been described in connection with what is presently considered to be the most practical and preferred embodiment, it is to be understood that the invention is not limited to the disclosed embodiments. That is, within the scope of the present invention, all of the components may be selectively coupled to one or more of them. In addition, although all of the components may be implemented as one independent hardware, some or all of the components may be selectively combined to perform a part or all of the functions in one or a plurality of hardware. As shown in FIG. The codes and code segments constituting the computer program may be easily deduced by those skilled in the art. Such a computer program can be stored in a computer-readable storage medium, readable and executed by a computer, thereby realizing an embodiment of the present invention. As the storage medium of the computer program, a magnetic recording medium, an optical recording medium, a carrier wave medium, or the like may be included.

Furthermore, the terms "comprises", "comprising", or "having" described above mean that a component can be implanted unless otherwise specifically stated, But should be construed as including other elements. All terms, including technical and scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs, unless otherwise defined. Commonly used terms, such as predefined terms, should be interpreted to be consistent with the contextual meanings of the related art, and are not to be construed as ideal or overly formal, unless expressly defined to the contrary.

The foregoing description is merely illustrative of the technical idea of the present invention, and various changes and modifications may be made by those skilled in the art without departing from the essential characteristics of the present invention. Therefore, the embodiments disclosed in the present invention are intended to illustrate rather than limit the scope of the present invention, and the scope of the technical idea of the present invention is not limited by these embodiments. The scope of protection of the present invention should be construed according to the following claims, and all technical ideas within the scope of equivalents should be construed as falling within the scope of the present invention.

110: IC chip
120:
130:
140:
150:
131: contact pin
141: Test module
142:
143: Connection
141a: contact plate
141b: IC circuit
141c: wiring

Claims (15)

A contact portion for contacting the IC chip to read data;
A test unit for testing whether the contact unit is in normal contact with the contact unit when the result of the IC chip lead of the contact unit is a read error; And
And a controller for determining that the IC chip is defective when the contact portion has the first value and the defective contact portion if the test data has the second value, IC chip reader. The method according to claim 1,
Wherein the contact portion includes at least one contact pin that contacts the IC chip. The method according to claim 1,
The test unit may include: a test module that tests whether the contact unit operates normally;
A driving unit for moving the test module in contact with the contact unit in response to the control of the control unit; And
And a connection unit connected between the test module and the driving unit. The method of claim 3,
The test module comprising: a contact plate contacting the contact portion;
An IC circuit for performing a test operation of the test module; And
And a wiring connecting the contact plate and the IC circuit. The method of claim 3,
And a transfer unit for transferring the IC chip to a contact point such that the IC chip faces the contact unit, wherein the IC chip is transferred from the upper surface of the transfer unit. 6. The method of claim 5,
Wherein the test module is disposed at a level lower than an upper surface of the transfer unit. 6. The method of claim 5,
Wherein the control unit controls the test module to move to the same level as the upper surface of the transfer unit or to move to a higher level than the upper surface when the read result of the contact unit is a read error. The method according to claim 1,
Wherein the control unit controls the test module to contact the contact unit when the read result of the contact unit is a read error. delete Transferring the IC chip to a contact point with the contact portion;
Reading data from the IC chip; And
Wherein when the read data is a read error, the test unit contacts the contact unit to test whether the contact unit operates normally, and when the contact unit has contacted the test unit and the test data read has a first value, Judging that the IC chip is defective and judging that the contact portion is defective when the test data has the second value. 11. The method of claim 10,
Wherein when the read data is a read error, the test unit contacts the contact unit to test whether the contact unit operates normally, and when the contact unit has contacted the test unit and the test data read has a first value, Determining that the IC chip is defective and determining that the contact portion is defective when the test data has the second value, releasing the IC chip from the contact point;
Contacting the test unit with the contact unit to generate the test data; And
And determining a cause of the read error based on the test data. delete An operation method of an IC chip reader having a contact portion for reading data from an IC chip,
Transferring the IC chip to a contact point with the contact portion;
Reading data from the IC chip;
Reading the magnetic strip if the result of reading the data is a read error, and processing the read data; And
The test portion of the IC chip reader is contacted with the contact portion to test whether or not the contact portion operates normally after the processing of the read data is completed, And determining that the contact portion is defective when the test data has the second value. An operation method of an IC chip reader having a contact portion for reading data from an IC chip,
Initializing the IC chip reader;
Generating test data by performing a test operation for testing whether the contact unit operates normally;
Transferring the IC chip to a contact point with the contact portion after the test operation is terminated;
The contact portion reading data from the IC chip; And
Determining whether a read error has occurred in the data; And
Determining that the IC chip is defective if the test data has a first value when the read error occurs and determining that the contact unit is defective if the test data has a second value; . 15. The method of claim 14,
Performing a test operation for testing whether the contact unit is normally operated when the read error occurs,
And if the read error does not occur, processes the read data.

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