KR101492466B1 - Temperature control apparatus and method using ball vibration sensor - Google Patents

Abstract

The present invention relates to a temperature control device for an electro-thermal bedding such as an electric bed, an electric mat, and an electric mat. More particularly, the present invention relates to a temperature control device for an electro- And more particularly, to a temperature control apparatus and method using a vibration sensor that adjusts the operation and temperature of a temperature sensor.

Description

Technical Field The present invention relates to a temperature control apparatus and method using a ball vibration sensor,

The present invention relates to a temperature control device for an electro-thermal bedding such as an electric bed, an electric bed, and an electric mat, and more particularly, to a bed temperature control device for detecting vibration due to the use of bedding by a user, And more particularly, to a temperature control apparatus and method using a vibration sensor that adjusts the operation and the temperature of the electro-thermal bedding according to the present invention.

Recently, there has been an increase in the spread of electro-thermal bedding such as electric bills, electric plates, electric mats, etc., which can save heating cost and enable easy heating in leisure activities such as camping.

Generally, the heat transfer bedding such as a yaw, a mat, and the like has a heat transfer part (heater) provided inside and a temperature control device connected to the heat transfer part through a physical connector to control the temperature of the heat transfer bedding do.

Generally, the temperature control device of the electro-thermal bedding includes a heating wire that is wired to the inside of the heating bedding bed and a temperature of the heat generated by the heating wire inside the heating wire bedding, A temperature setting function for performing a temperature control so that the temperature of the electro-thermal bedding can be maintained similar to the set temperature, and a timer for performing a heating operation by supplying current to the heating wire for a predetermined time set by the user And has a timer function.

As described above, since the conventional temperature control device only performs the power on / off control by the timer function and the temperature control according to the set temperature, even if the user leaves the seat in the state of driving the electro-thermal bedding or does not use it, There is a problem that unnecessary power is consumed by performing heating operation and control operation.

Also, since the conventional thermostat performs a continuous heating operation even in the absence of a user, there is a problem that fire due to continuous heating operation may occur. At this time, there is a problem that the user can not cope with a fire quickly because there is no user.

10-0938630

Accordingly, an object of the present invention is to provide a temperature control device and method using a vibration sensor that detects vibration due to the use of a bedding using a rolling property of a ball and controls the operation and temperature of the bedding according to whether vibration is detected .

Another object of the present invention is to provide a ball grid array including a ball, a plurality of contact bars surrounding the ball, the power input line and the ground line being alternately connected and surrounding the ball, The present invention provides a temperature control apparatus and method using a vibration sensor capable of operating an electro-thermal bedding according to the presence of a user by using a ball vibration sensor that outputs a chattering signal whenever a contact bar is connected.

According to another aspect of the present invention, there is provided a temperature control apparatus using a ball vibration sensor, comprising: a heating wire which is wired in a mat across a whole area; A ball vibration sensor disposed inside the mat and outputting a chattering signal corresponding to the vibration of the mat; And a heating operation is performed by supplying a heating current to the heating wire when the vibration of the mat by the input of the chattering signal is detected by the ball vibration sensor. When the vibration is not detected for a predetermined time, And a temperature controller for controlling the heating operation.

Wherein the ball vibration sensor includes: a sensor unit including a ball and outputting a chattering signal due to a vibration of the ball due to vibration of the mat; A power connection member for fixing the sensor unit and electrically connecting the power supply line and the ground line drawn out from the temperature regulation unit to the sensor unit and outputting a chattering signal inputted from the sensor unit to the temperature regulation unit; And a protective member covering and protecting the sensor unit.

The sensor unit includes: the ball; A plurality of contact wires formed so as to form a contact; An upper shielding member for fixing the plurality of contact wires so as to be arranged in a circle so that the balls are surrounded; And a lower shielding member, wherein the plurality of contact wires are fixed in parallel to the contact wires connected to the upper shielding member, wherein contact wires penetrating through the lower shielding member are alternately arranged inside the power connection member, Line.

The sensor unit includes: the ball; A plurality of contact wires formed so as to form a contact; An upper shielding member fixing the plurality of contact wires to be arranged in a circular shape such that the balls are surrounded and forming an upper printed circuit board pattern connecting the odd-numbered contact wires with respect to any contact wires; And a lower shielding member for fixing the contact wires connected to the upper shielding member so that the plurality of contact wires are parallel to each other and forming a lower printed circuit board pattern connecting the contact wires not connected to each other in the upper shielding member, An arbitrary contact wire connected to the printed circuit board pattern and an arbitrary contact wire connected to the lower printed circuit board pattern are connected to the ground line and the power supply line.

The sensor unit includes: the ball; A plurality of contact wires formed so as to form a contact; The lower shielding member being fixed so that the plurality of contact wires are arranged in a circle so that the balls are surrounded; And an upper printed circuit board pattern is formed on the bottom surface, the plurality of contact wires being fixed so that the contact wires connected to the lower shielding member are parallel to each other and the odd-numbered contact wires are connected with respect to any contact wire, And a lower shielding member formed on the upper surface for connecting the even-numbered contact wires except for the contact wires, wherein the lower shielding member includes an arbitrary contact wire connected to the upper printed circuit board pattern and connected to the lower printed circuit board pattern And an arbitrary contact wire is connected to the ground line and the power supply line.

The sensor unit includes: the ball; And a first terminal for connecting the plurality of contacts formed inside the cylindrical shape in the height direction of the column and the odd-numbered contacts of the contacts, and a second terminal for connecting the odd- And a second terminal and a second terminal for connecting the even-numbered contacts of the contacts, wherein the first terminal and the second terminal are connected to the power line and the ground line.

The sensor unit includes: the ball; A first contact portion which is formed of a conductor and forms a first contact point in which the ball is inserted and moved in a cylindrical manner so as to be inserted therein and which is adjacent to both side openings of the first contact portion, And a cylinder including a second contact part, wherein the first contact part and the second contact part are connected to a power supply line and a ground line.

Wherein the protection member includes: an insertion portion into which the sensor portion is inserted and supports the sensor portion; And a horizontal portion formed to be wider with respect to the insertion portion in the horizontal direction of the mat so that the insertion portion is horizontally held inside the mat.

The temperature controller may control the heating operation in the order of the minimum temperature setting, the heating operation stop, and the source power shutoff in accordance with the time when the vibration is not detected for a predetermined time.

In order to accomplish the above object, the present invention provides a temperature control method using a ball vibration sensor, comprising: detecting vibration from a ball vibration sensor at the time of supplying source power to start monitoring vibration of a heating bed according to input of a chattering signal; process; A heating process of supplying a heating current according to a user's setting to the heating wire after the start of vibration monitoring to perform a heating operation; A micro-vibration time counting step of counting micro-vibration time without vibration if vibration is not detected during the heating operation; And a heating operation control step of controlling the heating operation in accordance with the counted minute vibration time.

Wherein the heating operation control step includes: a first time-over determining step of checking whether the micro-vibration time exceeds a first time; A minimum temperature heating step of setting a preset minimum temperature when the micro-vibration time exceeds a first time and performing a temperature adjustment operation according to the set minimum temperature; Determining whether the micro-vibration time during the minimum temperature heating step exceeds a second time; Stopping the heater operation by interrupting a heating current supplied to the heating wire from the heating unit when the micro-vibration time exceeds the second time; And a power shutdown step of checking whether the micro-vibration time exceeds the third time after the heater operation stop step, and shutting down the source power when the micro-vibration time exceeds the third time.

The method comprising: before the micromotion time exceeds the first time, before the micromotion time exceeds the second time, and before the micromotion time exceeds the third time, the chattering signal And an initialization step of initializing the counted minute vibration time and then performing the heating process.

The present invention uses a ball vibration sensor to operate an electro-thermal bedding according to the presence of a user, thereby preventing unnecessary waste of electric power and preventing fire due to heat in the absence of a user.

In addition, the present invention provides a ball vibration sensor including a plurality of contact points and balls, thereby providing the above-described power dissipation prevention and fire prevention functions and minimizing an increase in the production cost of the heat transfer bedding.

1 is a view showing a configuration of a temperature control apparatus using a ball vibration sensor according to the present invention.
FIG. 2 is a view showing the configuration of the electro-thermal bedding to which the temperature control device using the ball vibration sensor according to the present invention is applied.
FIG. 3 is a cross-sectional view of a mat according to an embodiment of the present invention, in which a temperature control device using a ball vibration sensor is applied.
4 is a view for explaining the operation principle of the ball vibration sensor according to the present invention.
5 is a diagram showing a detailed structure of a wire ball vibration sensor of a temperature control apparatus using a ball vibration sensor according to a first embodiment of the present invention.
6 is a view showing a case where the protection member of the wire ball vibration sensor of the temperature control device using the ball vibration sensor according to the second embodiment of the present invention is cylindrical.
7 is a view showing a case where the contacts of the wire ball vibration sensor of the temperature control device using the ball vibration sensor according to the third embodiment of the present invention are connected to a printed circuit board.
8 is a view showing a detailed structure of a PCB type ball vibration sensor of a temperature control apparatus using a ball vibration sensor according to a fourth embodiment of the present invention.
9 is an exploded view of a PCB-type ball vibration sensor of a temperature controller according to a fourth embodiment of the present invention.
10 is a view showing a detailed structure of a cylindrical ball vibration sensor of a temperature control apparatus using a ball vibration sensor according to a fifth embodiment of the present invention.
11 is an exploded perspective view of a cylindrical ball vibration sensor according to a fifth embodiment of the present invention.
12 is a flowchart illustrating a temperature control method using the ball vibration sensor according to the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a configuration and operation of a temperature control apparatus using a ball vibration sensor of the present invention will be described with reference to the accompanying drawings, and a temperature control method in the apparatus will be described.

FIG. 1 is a view showing a configuration of a temperature control device using a ball vibration sensor according to the present invention, FIG. 2 is a view showing the configuration of a heat transfer bedding to which a temperature control device using a ball vibration sensor according to the present invention is applied, 3 is a cross-sectional view of a mat according to an embodiment of the present invention; FIG. 4 is a view for explaining the operation principle of the ball vibration sensor according to the present invention; Hereinafter, a description will be given with reference to Figs. 1 to 4. Fig.

The heat transfer bedding of the present invention includes a mat (10) such as a bed, a bed, a bed, and a temperature control device (100) using a ball vibration sensor.

The temperature control device 100 of the present invention includes a heating coil 131 that receives a heating current and generates heat as the heating current flows and includes a ball vibration sensor 200 for detecting the vibration of the mat 10 .

The ball vibration sensor 200 and the heating wire 131 are formed on the inner surface of the mat 10 as shown in FIGS.

Specifically, the heating wire 131 is wired in a meandering shape inside the mat 10 so as to generate heat uniformly over the entire area of the mat 10. [

The ball vibration sensor 200 is a sensor for detecting the vibration of the mat 10 generated by the user using the mat 10. The user can easily detect whether or not the user utilizes any part of the heat- The mat 10 may be formed on the inner central portion of the mat 10, but a plurality of portions may be formed on the inner side of the mat 10.

4, the ball vibration sensor 200 is connected to two connection contact portions 246-1 and 246-2 of a chattering signal generating portion 240 in which a ball 290 is connected to a power supply line and a ground line, And outputs the connection signal to the temperature regulating unit 30 when connected. The ball 290 intermittently outputs the connection signal when the two contacts connected by the cloud due to vibration are changed or reconnected. The intermittently output connection signal is hereinafter referred to as a chattering signal.

The ball vibration sensor 200 of the present invention includes a sensor module 220 including a power connection member 230 and a sensor unit 250 and a protection member 210 for protecting the sensor unit 250 . The sensor unit 250 includes a ball 290 and a chattering signal generator 240.

The temperature control unit 30 includes a heating wire 131 and a ball vibration sensor 200 which are included in the mat 10 and include a micom 110, a heat transfer unit 130, and a vibration detection unit 120, Lt; / RTI >

The vibration detection unit 120 receives the chattering signal output from the ball vibration sensor 200 and outputs the chattering signal to the microcomputer 110.

The heating unit 130 supplies or cuts the heating current to the heating wire 131 under the control of the microcomputer 110.

The microcomputer 110 controls the overall operation according to the present invention. In particular, if the microcomputer 110 does not detect the vibration of the ball vibration sensor 200 through the vibration detector 120, the microcomputer 110 counts the micro-vibration time, and if the micro- The heating operation of the temperature control device 100 is stopped or the power supplied to the temperature control device 100 is shut off.

Also, the microcomputer 110 may perform the stepwise control according to the counted minute vibration time. For example, the mycam 110 is set to a minimum temperature (e.g., 10 DEG C) when the micro-vibration time exceeds the first time, and the micro-vibration time is set to the second time (first time < , The heating operation is stopped and the power supply can be cut off when the microvibration time exceeds the third time (second time < third time).

FIG. 5 is a view showing a detailed structure of a wire-type ball vibration sensor of a temperature control apparatus using a ball vibration sensor according to a first embodiment of the present invention, and FIG. 6 is a view showing a ball vibration sensor according to a second embodiment of the present invention. Fig. 5 is a view showing a case where the protection member of the wire-shaped ball vibration sensor of the temperature control device used is cylindrical. Will be described with reference to Figs. 5 and 6. Fig.

The sensor unit 250 according to the first embodiment of the present invention includes a ball 290 and a chattering signal generating unit 240.

5, the chattering signal generator 240 according to the first embodiment is formed in a thin cylindrical shape or a rectangular shape to form a connection contact portion 246 and is circularly arranged to surround the ball 290 The odd numbered wires 243 of the wires 243 are bundled to form the first connection contact portion 246-1 and the even numbered wires 243 are bundled to form the second connection contact portion 246-2 A lower shielding member 241 for blocking the balls 290 located inside the circle formed by the wires 243 from being detached from the lower end of the wire 243, And an upper blocking member 242 for fixing the other end portions of the wire 243 to form a circular shape in parallel with the lower blocking member 241.

The protective member 210 includes an insertion portion 211 to which the sensor unit 250 of the sensor module 220 is inserted and which is coupled to the power connection member 230 through a screw connection or a screw connection, And a horizontal portion 1222 for inserting the insertion portion 211 inserted into the mat 10 so as to be horizontal with respect to the horizontal surface of the mat 10 inside the mat 10. [

The outer shape of the insertion portion 211 may be formed in a circular shape as shown in FIG. 6, or may be formed in various other shapes. The shape of the opening and the inner groove of the insertion portion 211 into which the sensor unit 250 is inserted may be circular or rectangular.

7 is a view showing a case where the contacts of the wire ball vibration sensor of the temperature control device using the ball vibration sensor according to the third embodiment of the present invention are connected to a printed circuit board.

A printed circuit board (PCB) is formed on the lower blocking member 241 and the lower blocking member 242 of the sensor unit 250 in the wire ball vibration sensor 200 according to the third embodiment. A PCB pattern 244 for connecting the odd-numbered wires 243 from any wire 243 is formed in the lower shielding member 241 and the PCB pattern 244 is formed in the upper shielding member 242 to connect the odd- The upper PCB pattern 245 connecting the even-numbered wires 243 is formed.

The lower PCB pattern 244 may be formed on the bottom surface of the upper blocking member 242 and the upper PCB pattern 245 may be formed on the upper surface of the upper blocking member 242 as shown in FIG.

The upper PCB pattern 245 and the lower PCB pattern 244 for connecting the odd-numbered wires 243 to at least one of the upper shielding member 242 and the lower shielding member 241, Any one of the wires 243 and any one of the even-numbered wires 243 may be elongated to form the connection contact portions 246-1 and 246-2.

FIG. 8 is a view showing a detailed structure of a PCB-type ball vibration sensor of a temperature control apparatus using a ball vibration sensor according to a fourth embodiment of the present invention, and FIG. Fig. 2 is an exploded view of a PCB-type ball vibration sensor. Fig.

8 and 9, the sensor unit 250 according to the fourth embodiment includes a ball 290 and a chattering signal generator 240 in the form of a flexible PCB 260.

The chattering signal generating unit 240 includes a flexible substrate 261 that is cylindrically and roundly rolled so that the ball 290 is inserted therein and is movable in the height direction of the column of the flexible substrate 261, The first terminal 264 connecting the odd numbered contacts 262 of the contacts and the second terminal 264 connecting the even numbered contacts 263 of the contacts, And a flexible printed circuit board 260 including terminals 265. The first terminal 264 may be a first connection contact 246-1 and the second terminal 265 may form a second connection contact 246-2.

The first terminal 264 and the second terminal 265 are connected to the power supply line and the ground line inside the power supply connection member 230.

FIG. 10 is a view showing a detailed structure of a cylindrical ball vibration sensor of a temperature control apparatus using a ball vibration sensor according to a fifth embodiment of the present invention, and FIG. 11 is a schematic view of a cylindrical ball vibration sensor according to a fifth embodiment of the present invention. Fig. 7 is an exploded perspective view of the sensor. Fig.

10 and 11, the sensor unit 250 according to the fifth embodiment includes a chattering signal generator 240 in the form of a ball 290 and a cylinder 270.

The chattering signal generating unit 240 includes a first contact unit 271 formed of a conductor and having a ball penetrating inside to allow the ball to move inward to form a first connection contact 246-1, And a cylinder 270 including a second contact portion 272 configured to be adjacent to both openings of the first contact portion 271 and forming a second connection contact 246-2.

12 is a flowchart illustrating a temperature control method using the ball vibration sensor according to the present invention.

6, the microcomputer 110 starts monitoring the ball vibration sensor 121 when power is supplied (S111), and controls the heating unit 130 in the heating mode according to whether the user is set or not And supplies a heating current to the heating wire 131 (S112).

When the heating mode operation is started, the microcomputer 110 checks whether the chattering signal is inputted from the ball vibration sensor 121 through the vibration detecting unit 120 (S113).

If the chattering signal is inputted, the microcomputer 110 continues to operate in the heating mode, and if the chattering signal is not inputted, the microcomputer 110 starts counting the minute vibration time (S115).

After the start of the counting of the micro-vibration time, the microcomputer 110 checks whether the micro-vibration time counted exceeds the first time (S117).

If the micro-vibration time does not exceed the first time, the microcomputer 110 checks whether the chattering signal is input during the micro-vibration time count (S119).

If the microvibration time exceeds the first time and the chattering signal is not input in the meantime, the microcomputer 110 sets the current set temperature to a preset minimum temperature (S121). On the other hand, if the chattering signal is input before the first time-out, the microcomputer 110 initializes the micro-vibration time during counting (S120) and continues the heating mode.

After setting the minimum temperature, the microcomputer 110 checks whether the micro-vibration time exceeds a second time (S123).

If the micro-vibration time exceeds the second time, the microcomputer 110 controls the heat transfer unit 130 to set the heater operation interrupt mode (S125). The heater operation interruption mode is a mode in which heater operation is literally stopped.

However, if the micro-vibration time does not exceed the second time, the microcomputer 110 again checks whether the chattering signal is input to the vibration detection unit 120 (S124).

If the chattering signal is input again before the micro-oscillation time exceeds the second time, the microcomputer 110 initializes the micro-oscillation time, sets the user-set temperature set by the user (S125) The heating (heating) operation is continued.

If the chattering signal is not inputted while the micro-vibration time exceeds the second time, the microcomputer 110 sets the heater operation interruption mode and stops driving the heat storage unit 130 (S126). That is, the microcomputer 110 cuts off the power supplied to the heat transfer unit 130.

Under the heater operation interruption mode, the microcomputer 110 checks whether the micro-vibration time exceeds the third time (S127).

If the micro-vibration time does not exceed the third time, it is checked whether the chattering signal is input again (S128).

If the chattering signal is input again before the microwave oscillation time exceeds the third time, the microcomputer 110 releases the heater operation interruption mode, initializes the microwave oscillation time, switches to the heating mode, and performs the heating operation . At this time, it is also preferable that the microcomputer 110 sets a user set temperature and performs control to maintain the user set temperature.

However, if the chattering signal is not inputted until the micro-oscillation time exceeds the third time and exceeds the time, the microcomputer 110 cuts off the source power (S129).

In the above description, the case where power is sequentially turned off when vibration is not detected has been described. However, if the vibration is not detected for a predetermined time, the microcomputer 110 may be configured to immediately shut off the source power.

 While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims. It will be easily understood. It is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, it is intended to cover various modifications within the scope of the appended claims.

10: Mat 20: Connector
30: Temperature controller (main body of temperature controller) 100: Temperature controller
110: Microcomputer 120: Vibration detector
130: Heat transfer unit 200: Ball vibration sensor
210: protective member 211:
212: horizontal part 220: sensor module
230: power supply connecting member 240: chattering signal generating unit
241: lower block member 242: upper block member
243: contact wire 244: upper printed circuit board (PCB)
245: lower printed circuit board 246: connection contact part
250: Sensor part 260: Flexible printed circuit board
261: flexible substrate 262: first contact
263: second contact point 264: first terminal
265: second terminal 270: cylinder
271: first contact portion 272: second contact portion
290: Ball

Claims (12)

A heating wire which is wired from the inside of the mat to the entire area of the mat;
A ball vibration sensor disposed inside the mat and outputting a chattering signal corresponding to the vibration of the mat; And
A heating operation is performed by supplying a heating current to the heating wire when the vibration of the mat by the input of the chattering signal is detected from the ball vibration sensor, and when the vibration is not detected for a predetermined time, And a temperature controller for controlling the operation of the temperature sensor.
The method according to claim 1,
The ball vibration sensor includes:
A sensor unit including a ball and outputting a chattering signal due to the rolling of the ball due to vibration of the mat;
A power connection member for fixing the sensor unit and electrically connecting the power supply line and the ground line drawn out from the temperature regulation unit to the sensor unit and outputting a chattering signal inputted from the sensor unit to the temperature regulation unit; And
And a protective member covering and protecting the sensor unit.
3. The method of claim 2,
The sensor unit includes:
The ball;
A plurality of contact wires formed so as to form a contact;
An upper shielding member for fixing the plurality of contact wires so as to be arranged in a circle so that the balls are surrounded; And
Wherein the plurality of contact wires include a lower blocking member to which the contact wires connected to the upper blocking member are fixed in parallel,
And the contact wires connected to the lower shielding member are alternately connected to the power supply line and the ground line inside the power connection member.
3. The method of claim 2,
The sensor unit includes:
The ball;
A plurality of contact wires formed so as to form a contact;
An upper shielding member fixing the plurality of contact wires to be arranged in a circular shape such that the balls are surrounded and forming an upper printed circuit board pattern connecting the odd-numbered contact wires with respect to any contact wires; And
And a lower shield member having the plurality of contact wires fixed to the upper shielding member so that the contact wires are parallel to each other and the lower printed circuit board pattern connecting the contact wires not connected to the upper shielding member,
Wherein an arbitrary contact wire connected to the upper printed circuit board pattern and an arbitrary contact wire connected to the lower printed circuit board pattern are connected to the ground line and the power supply line.
3. The method of claim 2,
The sensor unit includes:
The ball;
A plurality of contact wires formed so as to form a contact;
The lower shielding member being fixed so that the plurality of contact wires are arranged in a circle so that the balls are surrounded; And
An upper printed circuit board pattern is formed on the bottom surface, the plurality of contact wires are fixed so that the contact wires connected to the lower shielding member are parallel to each other and the odd-numbered contact wires are connected with respect to any contact wire, And a lower shielding member formed on the upper surface of the lower printed circuit board pattern connecting the even-numbered contact wires except the wires,
Wherein an arbitrary contact wire connected to the upper printed circuit board pattern and an arbitrary contact wire connected to the lower printed circuit board pattern are connected to the ground line and the power supply line.
3. The method of claim 2,
The sensor unit includes:
The ball; And
A first terminal for connecting the odd-numbered contacts of the contacts, and a second terminal for connecting the odd-numbered contacts of the contacts, And a second terminal and a second terminal for connecting the even-numbered contacts of the flexible printed circuit board,
Wherein the first terminal and the second terminal are connected to a power line and a ground line.
3. The method of claim 2,
The sensor unit includes:
The ball;
A first contact part formed of a conductor and forming a first contact point through which the ball is inserted and moved inside in a cylindrical shape,
And a cylinder including a second contact portion configured to be adjacent to both openings of the first contact portion and having a second contact,
Wherein the first contact part and the second contact part are connected to a power line and a ground line.
3. The method of claim 2,
Wherein,
An inserting portion into which the sensor portion is inserted and which supports the sensor portion; And
And a horizontal portion that is formed to be wider with respect to the insertion portion in a horizontal direction of the mat so that the insertion portion is horizontally held inside the mat.
The method according to claim 1,
Wherein the temperature controller controls the heating operation in the order of the minimum temperature setting, the heating operation stop, and the source power shutoff when the vibration is not detected for a predetermined time.
A vibration monitoring initiation process for starting to monitor the vibration of the electro-thermal bedding according to the input of the chattering signal from the ball vibration sensor when the source power is supplied;
A heating process of supplying a heating current according to a user's setting to the heating wire after the start of vibration monitoring to perform a heating operation;
A micro-vibration time counting step of counting micro-vibration time without vibration if vibration is not detected during the heating operation; And
And a heating operation control step of controlling the heating operation according to the counted minute vibration time.
11. The method of claim 10,
The heating operation control process includes:
Determining whether the micro-vibration time exceeds a first time;
A minimum temperature heating step of setting a preset minimum temperature when the micro-vibration time exceeds a first time and performing a temperature adjustment operation according to the set minimum temperature;
Determining whether the micro-vibration time during the minimum temperature heating step exceeds a second time;
Stopping the heater operation by interrupting a heating current supplied to the heating wire from the heating unit when the micro-vibration time exceeds the second time; And
And a power cut-off step of checking whether the micro-vibration time exceeds the third time after the heater operation stopping step, and shutting down the source power when the micro-vibration time exceeds the third time Temperature control method using sensor.
12. The method of claim 11,
When the chattering signal is input before the micro-oscillation time exceeds the first time, before the micro-oscillation time exceeds the second time, and before the micro-oscillation time exceeds the third time, And initializing the microvibration time to be less than the microvibration time, and then performing the heating process.

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