KR101484854B1 - Polypropylene resine composition for heat seal and multi-layer film using the same - Google Patents

Polypropylene resine composition for heat seal and multi-layer film using the same Download PDF

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KR101484854B1
KR101484854B1 KR20130102613A KR20130102613A KR101484854B1 KR 101484854 B1 KR101484854 B1 KR 101484854B1 KR 20130102613 A KR20130102613 A KR 20130102613A KR 20130102613 A KR20130102613 A KR 20130102613A KR 101484854 B1 KR101484854 B1 KR 101484854B1
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이우균
김창희
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삼성토탈 주식회사
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/04Homopolymers or copolymers of ethene
    • C08L23/08Copolymers of ethene
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/06Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/32Layered products comprising a layer of synthetic resin comprising polyolefins
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F255/00Macromolecular compounds obtained by polymerising monomers on to polymers of hydrocarbons as defined in group C08F10/00
    • C08F255/02Macromolecular compounds obtained by polymerising monomers on to polymers of hydrocarbons as defined in group C08F10/00 on to polymers of olefins having two or three carbon atoms
    • C08F255/06Macromolecular compounds obtained by polymerising monomers on to polymers of hydrocarbons as defined in group C08F10/00 on to polymers of olefins having two or three carbon atoms on to ethene-propene-diene terpolymers
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18Manufacture of films or sheets
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/0008Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0083Nucleating agents promoting the crystallisation of the polymer matrix
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/04Oxygen-containing compounds
    • C08K5/09Carboxylic acids; Metal salts thereof; Anhydrides thereof
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/16Elastomeric ethene-propene or ethene-propene-diene copolymers, e.g. EPR and EPDM rubbers
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    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/02Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
    • C09J123/10Homopolymers or copolymers of propene
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2500/00Characteristics or properties of obtained polyolefins; Use thereof
    • C08F2500/12Melt flow index or melt flow ratio

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Abstract

The present invention relates to a polypropylene resin composition for heat bonding with excellent heat bonding, transparency and a high crystallization temperature. More specifically, a polypropylene resin composition for heat bonding comprises (A) 100 parts by weight of crystalline ethylene-propylene-1-butene terpolymer whose melting point is between 125 and 135 degree Celsius; (B) 1-10 parts by weight of ethylene alpha-olefins copolymer whose density is 0.85-0.92 g/cm^3 and which is manufactured by a single-site catalyst; (C) and 0.1-0.5 parts by weight of an organic nucleating agent.

Description

열접착용 폴리프로필렌 수지 조성물 및 이를 이용한 다층 필름{Polypropylene resine composition for heat seal and multi-layer film using the same}TECHNICAL FIELD The present invention relates to a polypropylene resin composition for heat bonding and a multilayer film using the same,

본 발명은 열접착용 폴리프로필렌 수지 조성물 및 이를 이용한 폴리프로필렌 다층 필름에 관한 것이다.The present invention relates to a polypropylene resin composition for thermal bonding and a polypropylene multilayer film using the same.

무연신 폴리프로필렌 필름은 가격이 저렴하고 열접착성이 우수하여 식품포장에 널리 사용되고 있다. 포장시 생산속도를 높이면 열접착에 소요되는 시간이 감소하므로 고온에서 접착하거나 열접착층에 사용되는 수지의 열접착온도가 낮아야 한다. 고온에서 접착하면 열에 의해 필름이 손상될 수 있으므로 낮은 열접착온도를 갖는 수지를 사용해야 한다.The unleaded polypropylene film is widely used in food packaging because of its low cost and excellent thermal adhesiveness. Increasing the production speed in packaging reduces the time required for thermal bonding, so the bonding temperature or the thermal bonding temperature of the resin used in the thermal bonding layer should be low. Adhesion at high temperatures can damage the film by heat, so resins with low thermal bond temperatures should be used.

열접착온도는 수지의 용융온도와 관계가 있어 용융온도가 낮을수록 열접착온도가 낮아진다. 그러나, 낮은 용융온도를 가지면 저결정성 물질이 많아져 필름의 블로킹을 유발할 수 있고, 생산 공정상 한계가 있어 무한정 낮은 용융온도의 수지를 제조하는 것은 어렵다. 그래서 프로필렌-에틸렌 공중합체보다는 저결정성 물질이 적은 프로필렌-에틸렌-부텐-1 삼원공중합체를 열접착층에 적용하는 것이 유리하고, 일반적으로 125~135℃ 사이의 용융온도를 갖는 폴리프로필렌계 수지로 에틸렌-1-부텐의 삼원공중합체를 사용한다. 이와 관련된 국내특허로 특허출원 제98-08160호가 있다. The heat bonding temperature is related to the melting temperature of the resin, and the lower the melting temperature, the lower the heat bonding temperature. However, if a low melting temperature is used, the number of low crystalline materials may increase, which may cause blocking of the film, and it is difficult to manufacture a resin having an infinitely low melting temperature because of limitations in the production process. Therefore, it is advantageous to apply a propylene-ethylene-butene-1 terpolymer less in the low-crystallization substance than the propylene-ethylene copolymer to the heat-bonding layer, and it is generally preferable to use a polypropylene resin having a melting temperature of 125 to 135 ° C A terpolymer of ethylene-1-butene is used. The related domestic patent is Patent Application No. 98-08160.

그러나, 이 경우에도 필름 가공 기기 및 가공조건에 따라 여러 가지 문제점이 발생한다. 용융온도가 낮을 수록, 저결정성 물질들이 증가하여 표면으로 전이되며 블로킹을 유발하게 되고, 또한 수지의 용융온도가 낮아질수록 결정화온도도 낮아져서, 수지가 다이(Die)에서 토출되어 고화가 덜 된 상태에서 플레이트아웃 롤(Plate-Out Roll)이 닿게 되면 롤자국이 발생하게 된다. 투명한 필름 적용시에는 이러한 자국들이 후가공업체에서 문제가 된다. However, also in this case, various problems arise depending on the film processing equipment and processing conditions. The lower the melting temperature, the lower the amount of the low-crystalline materials increases, the transition to the surface causes blocking, and the lower the melting temperature of the resin, the lower the crystallization temperature, and the resin is discharged from the die, A roll mark is generated when a plate-out roll is brought into contact with the plate-out roll. In the case of transparent film applications, these marks are a problem for post-processing companies.

필름의 내블로킹성을 높이기 위해 일반적으로 수지에 블록킹 방지제를 혼합하는 방법이 있다. 사용되는 블록킹 방지제로는 이산화실리콘이 가장 널리 사용되며 (EP-A-27 586, EP-A-189 242), 경화된 실리콘(EP-A-242 055), 폴리아미드-6, 폴리아미드-6,6, 폴리에틸렌 테레프탈레이트, 폴리에틸렌 벤조에이트 (DE-A-2 244)등이 사용되기도 한다. 그러나 블록킹방지제가 과도하게 사용되면 필름의 투명성이나 광택성이 저하되는 단점이 있다.In order to improve the blocking resistance of the film, there is generally a method of mixing an anti-blocking agent with the resin. Silicon dioxide is the most widely used anti-blocking agent (EP-A-27 586, EP-A-189 242), cured silicone (EP-A-242 055), polyamide- , 6, polyethylene terephthalate, polyethylene benzoate (DE-A-2 244) or the like may be used. However, if the blocking agent is used excessively, the transparency and gloss of the film deteriorate.

열접착성을 높이는 다른 방법으로 유럽특허 No.27586 을 보면 에틸렌 코폴리머에 긴사슬의 알리파틱 아민(Aliphatic Amine)과 폴리다이알킬 실록산(Polydialkyl Siloxane)을 포함하는 열접착용 폴리프로필렌에 관한 내용이 있고, 프로필렌-에틸렌-부텐-1 삼원공중합체에 에틸렌-알파올레핀 공중합체를 혼합한 열접착성 폴리프로필렌 수지 조성물이 공개되어 있으나, 이러한 수지 조성물에 의해 제조된 필름은 표면의 끈적한 물질로 인해 고속도의 포장기계나 가공기계에서는 문제가 발생하게 되거나, 필름의 투명성이 떨어지는 단점이 있다.Another method of increasing the thermal adhesion is disclosed in European Patent No. 27586, which discloses polypropylene for thermal bonding comprising a long chain of aliphatic amines and polydialkyl siloxanes in an ethylene copolymer , And a thermally adhesive polypropylene resin composition in which an ethylene-alpha olefin copolymer is mixed with a propylene-ethylene-butene-1 terpolymer is disclosed. However, the film produced by such a resin composition has a high- There is a disadvantage in that problems arise in the packaging machine or the processing machine of the film, and transparency of the film is deteriorated.

상기 문제점을 해결하기 위한 본 발명의 목적은, 열접착성이 우수하여 낮은 열접착 온도에서 필름 포장을 할 수 있고, 투명성을 유지하면서도, 높은 결정화온도를 가지는 폴리프로필렌 수지 조성물을 제공하는 것이다.An object of the present invention to solve the above problems is to provide a polypropylene resin composition which is excellent in thermal adhesiveness and can be packaged in a film at a low heat bonding temperature and has a high crystallization temperature while maintaining transparency.

상기 목적을 달성하기 위한 본 발명의 양상은,According to an aspect of the present invention,

(A)용융온도가 125~135℃인 결정성 에틸렌-프로필렌-1-부텐 삼원공중합체 100중량부; (B)밀도가 0.85~0.92g/㎤이고 단일 활성점 촉매로 제조된 에틸렌-알파올레핀 공중합체 1∼10 중량부; 및 (C)유기 핵제 0.1~0.5중량부를 포함하는 열접착용 폴리프로필렌 수지 조성물을 제공한다. (A) 100 parts by weight of a crystalline ethylene-propylene-1-butene terpolymer having a melting temperature of 125 to 135 ° C; (B) 1 to 10 parts by weight of an ethylene-alpha olefin copolymer made from a single-site catalyst having a density of 0.85 to 0.92 g / cm 3; And (C) 0.1 to 0.5 parts by weight of an organic nucleating agent.

본 발명은 또한 상기 폴리프로필렌 수지 조성물을 이용하여 제조된 다층 필름을 제공한다.The present invention also provides a multilayer film produced using the polypropylene resin composition.

본 발명에 의한 폴리프로필렌 수지 조성물은 낮은 열접착온도를 가지므로, 필름 포장 가공시 열에너지 소비량을 감소시켜 원가 절감이 가능하고, 투명성을 유지하면서 높은 결정화도를 가져, 필름 가공시 롤자국이 발생하지 않는 폴리프로필렌 다층 필름을 제공할 수 있다.Since the polypropylene resin composition according to the present invention has a low heat bonding temperature, it is possible to reduce the consumption of heat energy by reducing the amount of heat energy consumed during film packaging processing, to have a high degree of crystallization while maintaining transparency, It is possible to provide a polypropylene multilayer film.

이하, 본 발명에 관하여 보다 상세하게 설명한다. Hereinafter, the present invention will be described in more detail.

본 발명의 폴리프로필렌 수지 조성물은 하기의 (A) 성분 100중량부, (B) 성분 1~10중량부, (C) 성분 0.1~0.5중량부로 구성되는 것을 특징으로 한다.The polypropylene resin composition of the present invention is characterized by comprising 100 parts by weight of the following component (A), 1 to 10 parts by weight of the component (B), and 0.1 to 0.5 parts by weight of the component (C).

(A) 용융온도가 125~135℃인 결정성 에틸렌-프로필렌-1-부텐 삼원공중합체,(A) a crystalline ethylene-propylene-1-butene terpolymer having a melting temperature of 125 to 135 DEG C,

(B) 밀도가 0.85~0.92g/㎤이고 단일 활성점 촉매로 제조된 에틸렌-알파올레핀 공중합체,(B) an ethylene-alpha olefin copolymer prepared with a single-site catalyst having a density of 0.85 to 0.92 g / cm 3,

(C) 유기 핵제. (C) Organic nucleating agent.

본 발명에 이용되는 폴리프로필렌계 수지는, 프로필렌을 주성분으로 하는 결정성 에틸렌-프로필렌-1-부텐 삼원 공중합체로 되어 있어 용융온도가 125~135℃로 열접착성이 우수하다. 용융온도가 125℃ 미만의 폴리프로필렌 수지는 생산공정상의 어려움이 있으며, 135℃ 초과의 용융온도를 갖는 수지는 열접착성이 열세하다. 수지의 MI(230℃)은 6~8g/10min으로 일반적인 무연신 폴리프로필렌 필름용의 흐름성을 갖는다. The polypropylene-based resin used in the present invention is a crystalline ethylene-propylene-1-butene terpolymer having propylene as a main component and has a melting temperature of 125 to 135 캜 and excellent thermal adhesiveness. A polypropylene resin having a melting temperature of less than 125 占 폚 has a difficulty in the production process, and a resin having a melting temperature of more than 135 占 폚 is poor in heat adhesion. The MI (230 ° C) of the resin is 6 to 8 g / 10 min and has flowability for a general unoriented polypropylene film.

본 발명에 사용된 에틸렌-알파올레핀 공중합체는 밀도가 0.85∼0.92g/㎤이다. 밀도가 0.85g/㎤ 미만이면 저결정성 물질이 필름 표면으로 전이되어 필름의 블라킹성을 저해하게 되며, 0.92g/㎤ 초과하면 필름의 투명성이 열세해진다. 에틸렌-알파올레핀 공중합체의 MI(190℃)는 1∼10인 것이 바람직한데, MI가 1미만이거나 10을 초과하면 상기의 폴리프로필렌계 수지와의 분산성이 저하되어 열접착성과 투명성이 떨어진다. 또한 에틸렌-알파올레핀 공중합체는 단일 활성점 촉매(SSC)로 제조된 것이어야 하는데, 지글러-나타 촉매로 제조된 에틸렌-알파올레핀 공중합체는 저결정성 물질이 증가하여 필름의 블로킹이 열세해진다. The ethylene-alpha olefin copolymer used in the present invention has a density of 0.85 to 0.92 g / cm3. If the density is less than 0.85 g / cm 3, the low crystalline material is transferred to the film surface to deteriorate the film's blinking property. If the density is more than 0.92 g / cm 3, transparency of the film is reduced. The MI (190 DEG C) of the ethylene-alpha olefin copolymer is preferably 1 to 10. When the MI is less than 1 or exceeds 10, the dispersibility with the polypropylene-based resin decreases, resulting in poor thermal adhesion and transparency. In addition, the ethylene-alpha olefin copolymer should be made from a single-site-point catalyst (SSC). However, the ethylene-alpha olefin copolymer prepared with the Ziegler-Natta catalyst increases the amount of low-crystalline materials,

본 발명에서는 폴리프로필렌계 수지 100중량부에 에틸렌-알파올레핀 공중합체 1~10 중량부가 적당하며, 우수한 물성을 나타내기 위해서는 3∼7중량부가 바람직하다. 에틸렌-알파올레핀 공중합체의 첨가량이 1 중량부 미만이면 열접착성의 증가가 없으며, 10 중량부 초과하면 폴리프로필렌계 수지와 에틸렌-알파올레핀 공중합체의 상분리가 일어나서 가공시 불균일현상이 일어나 필름의 두께편차가 발생한다. In the present invention, 1 to 10 parts by weight of the ethylene-alpha olefin copolymer is suitably added to 100 parts by weight of the polypropylene resin, and 3 to 7 parts by weight is preferable in order to exhibit excellent physical properties. When the amount of the ethylene-alpha olefin copolymer is less than 1 part by weight, there is no increase in thermal adhesiveness. When the amount is more than 10 parts by weight, phase separation occurs between the polypropylene resin and the ethylene- alpha olefin copolymer, Deviation occurs.

본 발명에서는 투명성 향상을 위해 유기 핵제를 사용한다. 상기 유기 핵제로는 예컨대 비스벤질리덴솔비톨, 비스메틸벤질리덴솔비톨, 비스에틸벤질리덴솔비톨, 1,2-클로로-2,4-메틸 벤질리덴솔비톨, 1,3,2,4-비스,3,4-디메틸벤질리덴 솔비톨 등을 사용할 수 있으며, 비스 4-프로필벤질리덴프로필솔비톨 핵제 또는 바이사이클로 헵탄 디카르복실릭산 핵제를 사용하는 것이 바람직하다. 상기 유기 핵제의 함량이 0.1중량부 미만인 경우에는 투명성이 발현되지 않으며, 0.5중량부를 초과하는 경우에는 초과된 양에 비하여 투명성 향상 효과가 거의 없다. 본 발명의 수지 조성물에는 비스 4-프로필벤질리덴프로필솔비톨을 0.1~0.5 중량부 첨가하는 것이 특히 바람직하다. In the present invention, an organic nucleating agent is used for improving transparency. Examples of the organic nucleus agent include bisbenzylidene sorbitol, bismethylbenzylidene sorbitol, bisethylbenzylidene sorbitol, 1,2-chloro-2,4-methylbenzylidene sorbitol, 1,3,2,4- 4-dimethylbenzylidene sorbitol and the like, and it is preferable to use bis 4-propylbenzylidene propyl sorbitol nucleus agent or bicycloheptane dicarboxylic acid nucleating agent. When the content of the organic nucleating agent is less than 0.1 parts by weight, transparency is not exhibited. When the amount is more than 0.5 parts by weight, there is little improvement in transparency as compared with an excess amount. It is particularly preferable to add 0.1 to 0.5 parts by weight of bis-4-propylbenzylidene propyl sorbitol to the resin composition of the present invention.

본 발명의 수지조성물에는 산화방지제, 중화제, 안티블로킹제 등과 같은 각종 첨가제가 본 발명의 특징에 어긋나지 않는 범위 내에서 첨가될 수 있다. Various additives such as an antioxidant, a neutralizing agent, an anti-blocking agent and the like may be added to the resin composition of the present invention within a range that does not deviate from the characteristics of the present invention.

이하, 본 발명을 실시예, 비교예로써 더욱 구체적으로 설명하는 바, 본 발명은 이것에 의해서 한정되는 것은 아니다. 또 실시예, 비교예에 있어서의 특성의 측정은 하기의 방법 및 기준으로 행하였다.  Hereinafter, the present invention will be described more specifically with reference to examples and comparative examples, but the present invention is not limited thereto. The properties of the examples and comparative examples were measured by the following methods and standards.

열접착Thermal bonding 온도 ( Temperature ( HeatHeat sealingsealing temperature온도 ))

필름을 온도 23±1℃, 습도 50±5%의 항온 항습실에 24시간 방치한 후, 두 장의 시편을 압력 2kg/㎠, 시간 1초에서 온도별로 두 장의 시편을 접착시킨 뒤, 인장 시험기로 떼어낼 때, 두 시편간의 열접착부가 박리가 되지 않기 시작할 때의 온도를 측정한다. The film was allowed to stand for 24 hours in a temperature and humidity chamber at a temperature of 23 ± 1 ° C and a humidity of 50 ± 5%. The two specimens were bonded to each other at a pressure of 2 kg / Measure the temperature at which the heat bonding between the two specimens begins to peel off.

결정화온도Crystallization temperature ( ( CrystallizationCrystallization temperature온도 ))

디퍼런셜 스캐닝 칼로리미터(Differential Scanning Calorimetry)를 이용하여 시료를 200℃에서 7분간 유지한 후, 10℃/min의 속도로 40℃까지 냉각하면서 결정화온도를 측정하였다. The sample was maintained at 200 DEG C for 7 minutes using differential scanning calorimetry and then the crystallization temperature was measured while cooling to 40 DEG C at a rate of 10 DEG C / min.

흐림도 (Cloudiness ( HazeHaze ))

ASTM D 1003 조건에 따라 측정하였다. ASTM D 1003 conditions.

플레이트아웃Plate out 롤( role( PlatePlate -- OutOut RollRoll ) 자국 관찰) Local observation

무연신 폴리프로필렌(CPP) 필름 압출기를 통해서 수지1만 가공시 롤자국이 발생하게 하는 조건을 고정시킨 후, 실시예/비교예 실험시 롤자국 발생여부를 관찰하였다.After the condition that a roll mark is generated in the processing of the resin 1 through the unleaded polypropylene (CPP) film extruder was fixed, it was observed whether or not a roll mark occurred in the experiment of the Example / Comparative Example.

 

실시예1Example 1

성분(a) 100중량부에 첨가제로 산화방지제, 중화제와 안티블로킹제를 적당량 배합하고 성분(c) 4중량부와 성분(g) 0.2중량부를 첨가하여 믹서로 혼합한 후, 압출기를 이용 210℃에서 펠렛상 조성물을 얻었다. 이 조성물을 구경 45mm의 압출기 및 T-die를 이용하여 용융온도 230℃에서 압출하여, 표면온도 40℃의 냉각롤로 급냉하여 필름을 성형하여 권취 두께 30μm, 폭 40cm의 롤상 필름을 얻었다. An antioxidant, an antifoaming agent and an antioxidant are added to 100 parts by weight of the component (a) as an additive. 4 parts by weight of the component (c) and 0.2 parts by weight of the component (g) are added thereto and mixed by a mixer. To obtain a pellet-like composition. This composition was extruded at a melting temperature of 230 占 폚 using an extruder having a diameter of 45 mm and a T-die and rapidly cooled by a cooling roll with a surface temperature of 40 占 폚 to form a film to obtain a rolled film having a winding thickness of 30 占 퐉 and a width of 40 cm.

실시예Example 2 및 3 2 and 3

표 1에 보는 바와 같이, 성분(c)와 성분(g)의 첨가량을 바꾸는 이외에 실시예 1에 준하여 폴리프로필렌 필름을 얻었다. 그것들의 특성을 표 2에 나타냈다. As shown in Table 1, a polypropylene film was obtained in the same manner as in Example 1, except that the addition amounts of the component (c) and the component (g) were changed. Their properties are shown in Table 2.

비교예Comparative Example 1 내지 7 1 to 7

표 1에 보는 바와 같이, 첨가되는 수지의 함량 및 성분을 변경하여 실시예 1에 준한 실험을 통하여 필름을 얻었다. 그것의 필름 특성을 표 2에 나타냈다.As shown in Table 1, the film was obtained through the experiment according to Example 1 by changing the content and the components of the resin to be added. The film properties thereof are shown in Table 2.

구 분division 성분 (a)Component (a) 성분 (b)Component (b) 성분 (c)Component (c) 성분 (d)Component (d) 성분 (e)Component (e) 성분 (f)Component (f) 성분 (g)Component (g) 실시예1Example 1 100100 -- 44 -- -- -- 0.20.2 실시예2Example 2 100100 -- 88 -- -- -- 0.20.2 실시예3Example 3 100100 -- 44 -- -- -- 0.40.4 비교예1Comparative Example 1 100100 -- -- -- -- -- -- 비교예2Comparative Example 2 -- 100100 44 -- -- -- 0.20.2 비교예3Comparative Example 3 100100 -- 44 -- -- -- -- 비교예4Comparative Example 4 100100 -- 1515 -- -- -- 0.40.4 비교예5Comparative Example 5 100100 -- -- 44 -- -- 0.20.2 비교예6Comparative Example 6 100100 -- -- -- 44 -- 0.20.2 비교예7Comparative Example 7 100100 -- -- -- -- 44 0.20.2

주) week)

1) 성분 (a) : 프로필렌-에틸렌-부텐-1 삼원공중합체, 용융온도 130℃, MI(230℃)=7.0g/10min1) Component (a): Propylene-ethylene-butene-1 terpolymer, melting temperature 130 DEG C, MI (230 DEG C) = 7.0 g / 10 min

2) 성분 (b):  프로필렌-에틸렌-부텐-1 삼원공중합체, 용융온도 120℃, MI(230℃)=7.0g/10min2) Component (b): Propylene-ethylene-butene-1 terpolymer, melting temperature 120 DEG C, MI (230 DEG C) = 7.0 g / 10 min

3) 성분 (c) : 단일 활성점 촉매로 제조된 에틸렌-알파올레핀 공중합체, 3) Component (c): an ethylene-alpha olefin copolymer prepared with a single active site catalyst,

               Density 0.91g/㎤ MI(190℃)=5.0g/10minDensity 0.91 g / cm < 3 > MI (190 DEG C) = 5.0 g / 10 min

4) 성분 (d) : 지글러-나타 촉매로 제조된 에틸렌-알파올레핀 공중합체,4) Component (d): an ethylene-alpha olefin copolymer prepared with a Ziegler-Natta catalyst,

               Density 0.91g/㎤, MI(190℃)=5.0g/10minDensity 0.91 g / cm 3, MI (190 ° C) = 5.0 g / 10 min

5) 성분 (e) : 단일 활성점 촉매로 제조된 에틸렌-알파올레핀 공중합체,5) Component (e): an ethylene-alpha olefin copolymer prepared with a single active site catalyst,

               Density 0.93g/㎤, MI(190℃)=5.0g/10minDensity 0.93 g / cm 3, MI (190 ° C) = 5.0 g / 10 min

6) 성분 (f) : 저밀도 폴리에틸렌, Density 0.92g/㎤, MI(190℃)=7.0g/10min6) Component (f): low density polyethylene, Density 0.92 g / cm 3, MI (190 ° C) = 7.0 g / 10 min

7) 성분 (g) : 비스 4-프로필벤질리덴프로필솔비톨 핵제7) Component (g): Bis 4-propylbenzylidene propyl sorbitol nucleus

구 분division 열접착온도(℃)Heat bonding temperature (캜) 결정화온도(℃)Crystallization temperature (캜) Haze (%)Haze (%) 플레이트아웃 롤자국Plate-out roll marks 실시예1Example 1 125125 109109 1One 미발생Not occurring 실시예2Example 2 125125 109109 1One 미발생Not occurring 실시예3Example 3 125125 112112 22 미발생Not occurring 비교예1Comparative Example 1 130130 9090 55 발생Occur 비교예2Comparative Example 2 120120 9595 1One 미발생Not occurring 비교예3Comparative Example 3 125125 110110 1010 발생Occur 비교예4Comparative Example 4 123123 105105 55 미발생Not occurring 비교예5Comparative Example 5 128128 108108 1One 미발생Not occurring 비교예6Comparative Example 6 130130 113113 33 미발생Not occurring 비교예7Comparative Example 7 128128 108108 22 미발생Not occurring

주) 열접착온도는 열접착강도값이 0.6kg가 되는 온도로 낮을수록 열접착성이 우수함.Note) As the heat bonding temperature is lowered to a temperature at which the heat bonding strength value is 0.6 kg, the heat bonding property is excellent.

표 2에서 보는 바와 같이, 성분(a)를 베이스수지로 하여 1~10중량부의 성분(c)와 0.1~0.5중량부의 성분(g)가 첨가된 조성물을 사용하여 제조된 필름은 결정화 온도, 헤이즈 등의 물성이 비교예에 비하여 우수하였다.As shown in Table 2, a film prepared from a composition prepared by adding 1 to 10 parts by weight of the component (c) and 0.1 to 0.5 parts by weight of the component (g) using the component (a) Were superior to the comparative examples.

Claims (4)

(A)용융온도가 125~135℃인 결정성 에틸렌-프로필렌-1-부텐 삼원공중합체 100중량부;
(B)밀도가 0.85~0.92g/㎤이고 단일 활성점 촉매로 제조된 에틸렌-알파올레핀 공중합체 1∼10 중량부; 및
(C)유기 핵제 0.1~0.5중량부를 포함하는 열접착용 폴리프로필렌 수지 조성물이고,
상기 유기 핵제는 비스 4-프로필벤질리덴프로필솔비톨 핵제 또는 바이사이클로 헵탄 디카르복실릭산 핵제인 것을 특징으로 하는 폴리프로필렌 수지 조성물. 
(A) 100 parts by weight of a crystalline ethylene-propylene-1-butene terpolymer having a melting temperature of 125 to 135 ° C;
(B) 1 to 10 parts by weight of an ethylene-alpha olefin copolymer made from a single-site catalyst having a density of 0.85 to 0.92 g / cm 3; And
(C) 0.1 to 0.5 parts by weight of an organic nucleating agent,
Wherein the organic nucleating agent is bis 4-propylbenzylidene propyl sorbitol nucleating agent or bicycloheptane dicarboxylic acid nucleating agent.
제1항에 있어서,
상기 에틸렌-알파올레핀 공중합체의 용융지수는 1~10g/10min(190℃)인 것을 특징으로 하는 폴리프로필렌 수지 조성물. 
The method according to claim 1,
Wherein the ethylene-alpha olefin copolymer has a melt index of 1 to 10 g / 10 min (190 DEG C).
삭제delete 제1항 내지 제2항 중 어느 한 항의 폴리프로필렌 수지 조성물로 제조된 다층 필름. A multilayer film made from the polypropylene resin composition of any one of claims 1 to 2.
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KR20190123159A (en) * 2018-04-23 2019-10-31 효성화학 주식회사 Polypropylene resin composition for thermal adhesion film and polypropylene thermal adhesion film
KR102104866B1 (en) 2018-04-23 2020-04-28 효성화학 주식회사 Polypropylene resin composition for thermal adhesion film and polypropylene thermal adhesion film

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