KR101474641B1

KR101474641B1 - Semiconductor module

Info

Publication number: KR101474641B1
Application number: KR1020130056471A
Authority: KR
Inventors: 김종만; 임재현
Original assignee: 삼성전기주식회사
Priority date: 2013-05-20
Filing date: 2013-05-20
Publication date: 2014-12-17
Also published as: KR20140136227A

Abstract

The present invention relates to a semiconductor module. A semiconductor module according to an embodiment of the present invention includes a substrate on which a semiconductor device is mounted, a heat radiation member formed on the other side of the substrate, and a housing formed on one side of the substrate and fastened to the substrate. An elastic member may be formed at the other end of the body, and the elastic member may include a pressing member for pressing one side of the substrate.

Description

[0001] SEMICONDUCTOR MODULE [0002]

The present invention relates to a semiconductor module.

Due to the rapid development of semiconductor technology, semiconductor devices have achieved considerable growth. In addition, semiconductor packages such as SIP (System In Package), CSP (Chip Sized Package), and FCP (Flip Chip Package) in which electronic devices such as semiconductor devices are mounted on a printed circuit board in advance are actively developed ought. Such a semiconductor package is required to have excellent ability to discharge heat generated from semiconductor devices and to insulate the high voltage. In order to solve the heat dissipation problem, various attempts have been made to fabricate various types of package substrates by using a metal material having good heat conduction characteristics. Recently, a package substrate for maximizing heat dissipation of a semiconductor device using anodic oxidation is being studied. A conventional package substrate forms an anodic oxide film on the surface of an aluminum substrate having a through-hole formed therein. At this time, an anodic oxide film is also formed on the inner wall of the through hole (US Patent No. 7947906).

When the package substrate thus formed is engaged with the housing, the substrate may be warped by a force applied to a portion to be coupled with the housing. In addition, warping may occur due to heat generated in the semiconductor device mounted on the package substrate.

According to an aspect of the present invention, there is provided a semiconductor module capable of increasing a contact area between a substrate and a heat radiation member by suppressing warping of the substrate.

According to another aspect of the present invention, there is provided a semiconductor module capable of increasing a contact area between a substrate and a heat dissipating member by applying a predetermined pressure to the substrate to improve heat dissipation performance.

According to an embodiment of the present invention, there is provided a semiconductor device comprising a substrate on which a semiconductor device is mounted, a heat dissipating member formed on the other side of the substrate, and a housing formed on one side of the substrate and fastened to the substrate such that the body extends from the inner wall facing the substrate And an elastic member is formed at the other end of the body, and the elastic member presses the one side of the substrate.

The elastic member may be a spring.

The pressing member may further include a damping member formed between the other end of the body and one end of the elastic member.

The damping member may include a first damping portion connected to the other end of the body, a second damping portion connected to one end of the elastic member, and a bent portion formed between the first damping portion and the second damping portion and formed in a bent shape.

The first damping portion and the second damping portion may be located on the same line.

The first damping portion and the second damping portion may be located on a parallel line.

More than one pressing member may be formed.

The elastic member can be inserted into one side of the substrate.

The pressing member may be formed integrally with the housing.

The heat dissipating member may be a heat sink.

The substrate may be one of a printed circuit board, a ceramic substrate, and a metal substrate.

The semiconductor device may include at least one of a power device and a control device.

The substrate may comprise a circuit pattern.

The substrate may further include a pad to which the pressing member is contacted or inserted.

The features and advantages of the present invention will become more apparent from the following detailed description based on the accompanying drawings.

Prior to that, terms and words used in the present specification and claims should not be construed in a conventional and dictionary sense, and the inventor can properly define the concept of a term in order to describe its invention in the best possible way Should be construed in accordance with the principles and meanings and concepts consistent with the technical idea of the present invention.

The semiconductor module according to the embodiment of the present invention can suppress the warping of the substrate and increase the contact area between the substrate and the heat radiation member.

The semiconductor module according to the embodiment of the present invention can increase the contact area between the substrate and the heat dissipating member by applying a certain pressure to the substrate, thereby improving the heat dissipation performance.

1 is an exemplary view showing a semiconductor module according to an embodiment of the present invention.
2 is an exemplary view showing a damping member of a pressing member according to an embodiment of the present invention.
3 is an exemplary view showing a damping member of a pressing member according to another embodiment of the present invention.
4 is an exemplary view showing an elastic member of a pressing member according to an embodiment of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS The objectives, specific advantages and novel features of the present invention will become more apparent from the following detailed description taken in conjunction with the accompanying drawings, in which: FIG. It should be noted that, in the present specification, the reference numerals are added to the constituent elements of the drawings, and the same constituent elements are assigned the same number as much as possible even if they are displayed on different drawings. It will be further understood that terms such as " first, "" second," " one side, "" other," and the like are used to distinguish one element from another, no. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS In the following description of the present invention, detailed description of related arts which may unnecessarily obscure the gist of the present invention will be omitted.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is an exemplary view showing a semiconductor module according to an embodiment of the present invention.

Referring to FIG. 1, a semiconductor module 100 includes a substrate 110, a heat radiation member 120, and a housing 130.

The semiconductor element may be mounted on one side of the substrate 110. The substrate 110 may be a printed circuit board, a ceramic substrate, or a metal substrate having an anodized layer, but is not limited thereto.

The substrate 110 may be a printed circuit board having one or more circuits formed on the insulating layer.

As the insulating layer, a resin insulating layer may be used. As the resin insulating layer, a thermosetting resin such as an epoxy resin, a thermoplastic resin such as polyimide, or a resin impregnated with a reinforcing material such as a glass fiber or an inorganic filler, for example, a prepreg can be used, And / or photo-curing resin may be used, but the present invention is not limited thereto. The circuit can be applied without limitations as long as it is used as a conductive metal for a circuit in the circuit board field. Generally, the circuit can be formed of copper.

The ceramic substrate may be made of a metal-based nitride or a ceramic material. For example, the metal-based nitride may comprise aluminum nitride (AlN) or silicon nitride (SiN). Further, the ceramic material may include aluminum oxide (Al ₂ O ₃ ) or beryllium oxide (BeO). The material of the above-mentioned ceramic substrate is, for example, not particularly limited to this.

The metal substrate can be easily obtained at a relatively low cost and can be formed of a metal having excellent heat transfer characteristics. For example, the metal substrate may be aluminum (Al) or an aluminum alloy.

The anodic oxide layer can be produced by, for example, immersing a metal substrate made of aluminum or an aluminum alloy in an electrolyte solution such as boric acid, phosphoric acid, sulfuric acid, chromic acid, etc., applying a positive electrode to a metal substrate, and applying a negative electrode to the electrolytic solution. The anodization layer has an insulating performance, but can have a relatively high heat transfer characteristic of about 10 to 30 W / mk. Thus, the anodic oxidation layer produced using aluminum or an aluminum alloy may be an aluminum anodic oxide film (Al ₂ O ₃ ).

Since the anodic oxidation layer has an insulating property, a circuit layer can be formed. Further, since the anodization layer can be formed to have a thickness smaller than that of a general insulating layer, the heat radiation performance can be improved and the thickness can be reduced.

The semiconductor device may be at least one of a power semiconductor device and a control semiconductor device. For example, the power semiconductor device may be an insulated gate bipolar transistor (IGBT), a diode, or the like. Further, the control semiconductor element may be a control integrated circuit (IC). The type and number of semiconductor devices are not limited to these, and can be easily changed by those skilled in the art.

In addition, the substrate 110 may include a circuit pattern 111. The circuit pattern 111 may be a conventional circuit for electrical signal transmission.

Further, the substrate 110 may include a pad 115 to which the pressing member 140 is contacted or inserted.

The structure of the circuit pattern 111 and the pad 115 formed on the substrate 110 can be easily deleted or added by those skilled in the art.

The first fastening part 112 may be formed on the edge of the substrate 110. The substrate 110 may be fastened to the housing 130 or the heat dissipating member 120 through the first fastening portion 112. For example, the first fastening part 112 may be formed in the form of a through-hole.

The radiation member 120 may be formed on the other side of the substrate 110. The radiation member 120 is a component for emitting heat generated from the substrate 110 or the semiconductor device to the outside. For example, the heat radiation member 120 may be a heat sink. The radiation member 120 may be bonded to the substrate 110 with a contact material. However, the present invention is not limited thereto. The radiation member 120 may be coupled to the substrate 110 with a fastening member such as a screw. Also, the heat radiation member 120 may be coupled to the substrate 110 and the housing 130 at the same time.

The housing 130 may be formed on one side of the substrate 110. The housing 130 is a component formed to protect components located inside the housing 130, such as the substrate 110 and semiconductor devices. Thus, the housing 130 may be formed to surround the substrate 110. [ The second fastening part 132 may be formed at the edge of the housing 130. Here, the rim of the housing 130 may be a portion joining with one side of the substrate 110. The second fastening part 132 may be formed to be in line with the first fastening part 112 of the substrate 110. A fastening member may be simultaneously inserted into the first fastening portion 112 of the substrate 110 and the second fastening portion 132 of the housing 130 so that the substrate 110 and the housing 130 may be coupled to each other. Here, the fastening member can be a screw. However, the type of the fastening member is not limited thereto. The shapes of the first fastening portions 112 of the substrate 110 and the second fastening portions 132 of the housing 130 are not limited thereto. That is, the fastening portion and the fastening member may be formed in any form as long as the fastening portion and the fastening member can couple the substrate 110 and the housing 130 together.

The housing 130 includes a pressing member 140. One or more pressing members 140 may be formed. The pressing member 140 can minimize the occurrence of warping of the substrate 110 by pressing the substrate 110 when the housing 130 is coupled to the substrate 110. [ The pressing member 140 can press the substrate 110 toward the radiation member 120 to prevent lifting of the substrate 110 and increase the contact area between the substrate 110 and the radiation member 120. [ Further, the contact area between the substrate 110 and the heat radiation member 120 can be increased by the pressing member 140, and the heat radiation performance can be improved. The pressing member 140 may include a body 141 and an elastic member 146.

The body 141 may be formed to extend from the inner wall of the housing 130 facing the substrate 110. The elastic member 146 may be formed at the other end of the body 141.

One side of the elastic member 146 is connected to the other end of the body 141, and the other side is formed to press one side of the substrate 110. The elastic member 146 may press the substrate 110 on one side of the substrate 110. Or the elastic member 146 may be inserted into one side of the substrate 110 to press the substrate 110. The elastic member 146 can press the substrate 110 with an appropriate force regardless of the degree of bending of the substrate 110 by the elastic force. For example, the elastic member 146 may be a spring. The elastic member 146 may be any one that is compressed in accordance with the degree of bending of the substrate 110 as well as the spring.

In addition, the pressing member 140 may further include a damping member 145. The damping member 145 may be formed between the body 141 and the elastic member 146. The damping member 145 may be formed in a partially bent shape. The bent portion of the damping member 145 can serve to absorb an external shock or vibration.

The pressing member 140 according to the embodiment of the present invention may be formed integrally with the housing 130. [ That is, the housing 130 including the pressing member 140 may be formed by an insert injection molding method. Accordingly, the pressing member 140 is formed at the same time as the housing 130, thereby improving the coupling strength between the housing 130 and the pressing member 140, thereby improving the reliability of the semiconductor module 100.

In the semiconductor module 100 according to the embodiment of the present invention, the housing 130 may be formed on the substrate 110 on which the heat radiation member 120 is formed. When the substrate 110 and the housing 130 are coupled to each other, the substrate 110 may be warped by the force to be fastened and the substrate 110 may be lifted from the heat radiation member 120. Or the substrate 110 may be warped due to heat generated in the semiconductor device mounted on the substrate 110. [ At this time, the pressing member 140 formed inside the housing 130 presses the substrate 110 toward the heat radiation member 120, thereby preventing the substrate 110 from falling off the heat radiation member 120. That is, the contact area between the substrate 110 and the heat radiation member 120 can be increased in the pressing member 140 inside the housing 130. Therefore, the contact area between the substrate 110 and the heat radiation member 120 increases, and the heat radiation efficiency can also be increased. Also, the pressing member 140 may form a bent portion to absorb external shock or vibration, thereby improving the reliability of the semiconductor module 100. [

2 is an exemplary view showing a damping member of a pressing member according to an embodiment of the present invention.

Referring to FIG. 2, the pressing member 140 may include a damping member 145 at the other end of the body 141. The damping member 145 may include a first damping portion 142, a second damping portion 144, and a bending portion 143. The first damping portion 142 may be connected to the other end of the body 141.

The second damping portion 144 may be connected to one side of the elastic member 146 (not shown in FIG. 2).

The bending portion 143 may be formed between the first damping portion 142 and the second damping portion 144. According to the embodiment of the present invention, the bending portion 143 may have a structure bent four times. 2, the first damping portion 142 and the second damping portion 144 may be located on the same line.

The bent portion 143 having such a bent structure can absorb an external impact or vibration. The external impact or vibration is absorbed by the bent portions 143 in the direction different from the first damping portion 142 and the second damping portion 144 so that the impact received by the semiconductor module 100 can be reduced have.

The damping member 145 having such a bent structure can prevent defects such as breakage of the housing 130 or the substrate 110 due to external impact or vibration of the semiconductor module 100.

3 is an exemplary view showing a damping member of a pressing member according to another embodiment of the present invention.

Referring to FIG. 3, the pressing member 140 may include a damping member 145 at the other end of the body 141. The damping member 145 may include a first damping portion 142, a second damping portion 144, and a bending portion 143. The first damping portion 142 may be connected to the other end of the body 141.

The second damping portion 144 may be connected to one side of the elastic member 146 not shown in FIG.

The bending portion 143 may be formed between the first damping portion 142 and the second damping portion 144. According to the embodiment of the present invention, the bending portion 143 may have a double folded structure. 3, the first damping portion 142 and the second damping portion 144 may be positioned in parallel with each other.

2 and 3, the structure of the bent portion 143 of the pressing member 140 has been described. However, the structure of the bending portion 143 is not limited to the structure shown in Figs. The structure of the bent portion 143 can be easily changed by a person skilled in the art if the structure is capable of absorbing external impact or vibration by the bent portion.

4 is an exemplary view showing an elastic member of a pressing member according to an embodiment of the present invention.

Referring to FIG. 4, the pressing member 140 may include an elastic member 146 formed at the other end of the damping member 145. The elastic member 146 may be formed of a material or structure having an elastic force. The elastic member 146 may press the substrate 110 by directly contacting the upper surface of one side of the substrate 110. Or the elastic member 146 may be inserted into one side of the substrate 110 to press the substrate 110. The elastic member 146 has an elastic force and can press the substrate 110 constantly regardless of the degree of bending of the substrate 110.

According to an embodiment of the present invention, the elastic member 146 may be a spring. 4, a part of the damping member 145 may be inserted into the elastic member 146. [ At this time, the damping member 145 can be inserted only to the middle of the elastic member 146. This is to prevent the damping member 145 from directly pressing the substrate 110 and damaging the substrate 110 when the substrate 110 has a large warpage.

In the embodiment of the present invention, although the elastic member 146 has been described as being springable, the structure of the elastic member 146 is not limited thereto. That is, if the elastic member 146 has an elastic force capable of constantly pressing the substrate 110 as well as the spring, the material and structure of the elastic member 146 can be easily changed by those skilled in the art.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the same is by way of illustration and example only and is not to be construed as limiting the present invention. It is obvious that the modification or improvement is possible.

It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

100: semiconductor module
110: substrate
111: Circuit pattern
112: first fastening portion
115: Pad
120:
130: housing
132: second fastening portion
140:
141: Body
142: first damping portion
143:
144: second damping portion
145: damping member
146: Elastic member

Claims

A substrate on which a semiconductor element is mounted;
A heat dissipating member formed on the other side of the substrate; And
And a housing formed on one side of the substrate and fastened to the substrate,
The housing includes:
A body formed to extend from an inner wall facing the substrate;
An elastic member disposed on one side of the substrate so as to press the substrate; And
And a damping member formed between the other end of the body and one end of the elastic member.

The method according to claim 1,
The elastic member is a spring,

delete

The method according to claim 1,
Wherein the damping member comprises:
A first damping portion connected to the other end of the body;
A second damping portion connected to one end of the elastic member; And
A bent portion formed between the first damping portion and the second damping portion and formed in a bent shape;
&Lt; / RTI >

The method of claim 4,
Wherein the first damping portion and the second damping portion are located on the same line.

The method of claim 4,
Wherein the first damping portion and the second damping portion are located on a parallel line.

The method according to claim 1,
Wherein at least one of the pressing members is formed.

The method according to claim 1,
Wherein the elastic member is inserted into one side of the substrate.

The method according to claim 1,
Wherein the pressing member is formed integrally with the housing.

The method according to claim 1,
Wherein the heat dissipating member is a heat sink.

The method according to claim 1,
Wherein the substrate is one of a printed circuit board, a ceramic substrate, and a metal substrate.

The method according to claim 1,
Wherein the semiconductor device comprises at least one of a power device and a control device.

The method according to claim 1,
Wherein the substrate further comprises a circuit pattern.

The method according to claim 1,
Wherein the substrate further comprises a pad to which the pressing member is contacted or inserted.