KR101472791B1 - Ultrasonic cleaning device socket - Google Patents

Abstract

The present invention relates to an ultrasonic cleaning module socket. The purpose of the present invention is to easily replace various ultrasonic cleaning modules, thereby changing and applying ultrasonic vibration suitable for each ultrasonic cleaning module.

Description

Ultrasonic cleaning device socket < RTI ID = 0.0 >

The present invention relates to an ultrasonic cleaning module socket.

Generally, the process of fabricating a semiconductor substrate consists of repetitive operations of unit processes such as deposition, lithography, etching, chemical / mechanical polishing, cleaning, drying, and the like. Of these unit processes, the cleaning process is a process for removing foreign substances or unnecessary films adhering to the surface of the semiconductor substrate during each unit process. Cleaning technology is a technique to remove various contaminants generated during the semiconductor manufacturing process by using physical and chemical methods. The chemical method is to remove surface contamination by water washing, etching, redox reaction, etc., using various chemicals or gases. In the chemical method, the attached particles are removed with a pure water or a chemical cleaning solution, and the organic matter is dissolved in a solvent or removed with an oxidizing acid or carbonized in an oxygen plasma. In some cases, a certain amount of surface is etched to expose a new clean surface do. In another physical method, the adherent is peeled off by ultrasonic energy, or the adherent is removed by using a brush or by using high-pressure water. In general, the physical method is combined with a chemical method to achieve efficient cleaning.

Recently, as the pattern formed on the semiconductor substrate becomes finer and the aspect ratio of the pattern becomes larger, the importance of the cleaning process gradually increases. Initially, a method of using only a single chemical method such as immersing and removing a substrate in a cleaning liquid to clean a substrate has been widely used. However, at present, it is much more common to use a physical and chemical method than a chemical method. Further, as the importance of the cleaning process has been increased as described above, much development has been made in the structure of the cleaning apparatus. In the present invention, substrate cleaning is performed by increasing the cleaning efficiency by applying ultrasonic vibration of several hundreds kHz or more to the cleaning liquid while immersing the substrate in the cleaning liquid. Devices are mainly used.

Ultrasonic cleaning using physical methods is mainly performed by particle acceleration and cavitation phenomenon of ultrasonic waves. The cavitation phenomenon is a phenomenon in which micro bubbles are generated and extinguished by the pressure of the ultrasonic wave when the energy of the ultrasonic wave propagates in the solution, and it is accompanied by a very high pressure and a high temperature. This shock wave makes it possible to clean the inside of the object to be cleaned, which is contained in the solution, in an invisible part in a short time. In particular, in addition to the impact energy due to the cavitation, in addition to the impact energy due to the cavitation effect, the stirring effect by the radiation pressure of the ultrasonic wave itself, and the heat effect, synergize with the detergent.

There are two types of equipment for semiconductor cleaning equipment: a batch type for cleaning multiple sheets at a time and a single wafer cleaning type for cleaning sheets one by one.

The batch process is advantageous in that it cleans many wafers at the same time so that the cleaning time is largely saved. However, even if the contaminants separated from any one of the wafers are separated by the cleaning solution, There is a possibility that re-contamination may occur. In the past, the diameter of the wafer was about 4 inches in diameter, but recently it has increased to about 12 inches.

On the other hand, a pattern having a size of several tens of nanometers is being manufactured by a semiconductor process, and in a cleaning process between each unit process, much finer nano particles must be removed without pattern damage. As the particle size becomes smaller, the influence of the van der Waals force between the particles increases, so that the particles can not be removed only by the chemical method. Therefore, by using the chemical method and the ultrasonic vibration described above, It is well known that the same physical method needs to be introduced. However, in the case of the batch type equipment, there is a limitation in implementing such ultrasonic vibration to equally apply to a plurality of wafers. On the other hand, in the single wafer type equipment, only one wafer needs to be cleaned so that the ultrasonic vibration is applied relatively It is much easier.

In consideration of such various aspects, a single-wafer process in which a more precise and effective cleaning can be performed without a large increase in cost tends to be more preferable.

In order to increase the cleaning efficiency, when the ultrasonic vibration is applied at a certain position in the process of applying the ultrasonic vibration, there is a problem that the pattern of the fine line width at the peak position is damaged due to miniaturization of the pattern line width. In order to solve such a problem, it has been necessary to uniformly apply ultrasonic vibration without peaks across the entire surface of the wafer to prevent pattern damage. For this purpose, various shapes and structures of the vibrators have been studied. Korean Patent Registration No. 0852396 ("Ultrasonic Cleaning Device", 2008.08.08), Korean Patent Registration No. 1002706 ("Ultrasonic Cleaning Device", Dec. 14, 2010) filed and registered by the present applicant, 0979568 ("Ultrasonic Precision Cleaning Apparatus ", Aug. 26, 2010) disclose various examples of the shape and structure of an ultrasonic cleaning apparatus that operates as such a vibrator. Fig. 1 is an illustration of various ultrasonic cleaning devices. Figs. 1 (A), (B), and (C) sequentially illustrate representative prior art patents.

These various ultrasonic cleaning apparatuses can carry out an optimized cleaning process for certain specific conditions. However, in any one type of ultrasonic cleaning apparatus, it is only possible to perform cleaning of an object that meets the conditions of the cleaning apparatus. Therefore, it is necessary to provide a variety of cleaning apparatuses in an industrial environment that is becoming diversified and changing rapidly, , A complicated process occurring in the process of selecting a cleaning device satisfying the condition among the various cleaning devices to clean a desired object, and a problem of an increase in the process time.

1. Korea Patent No. 0852396 ("Ultrasonic Cleaning Device", Aug. 08, 2008) 2. Korean Patent No. 1002706 ("Ultrasonic Cleaning Device", Dec. 14, 2010) 3. Korea Patent No. 0979568 ("Ultrasonic Precision Cleaning Device", Aug. 26, 2010)

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide an ultrasonic cleaning apparatus and a ultrasonic cleaning apparatus which can easily change a variety of ultrasonic cleaning modules, And an ultrasonic cleaning module socket.

According to an aspect of the present invention, there is provided an ultrasonic cleaning module socket including a piezoelectric element for generating an ultrasonic wave, a piezoelectric element coupled to one side of the piezoelectric element and opposed to the object to be cleaned, An ultrasonic transducer 112 for transmitting ultrasonic waves generated from the piezoelectric element 111 to the object 500 to be cleaned, a power line 113 for applying power to the piezoelectric element 111, A socket connection part 114 for receiving the power through the at least one power connection part 114a and transmitting the power to the power line 113; A plurality of ultrasonic cleaning modules 110 including a housing 115 for applying ultrasonic vibration to the cleaning liquid applied to the object 500 to be cleaned; An ultrasonic vibration oscillator 130 for generating and transmitting an ultrasonic vibration signal to the outside; And an ultrasonic cleaning module socket 120 provided in the ultrasonic cleaning device platform 100. The ultrasonic cleaning module socket 120 is detachably coupled to the socket connection part 114 of the ultrasonic cleaning module 110, And transmits the ultrasonic vibration signal to the ultrasonic cleaning module 110 coupled to the ultrasonic cleaning module socket 120 by being connected to the ultrasonic cleaning module 130.

More specifically, the ultrasonic cleaning module socket 120 includes a socket receiving portion 121 formed to allow the socket connecting portion 114 to be inserted therein; At least one electrode part 122 made of an electrically conductive material and provided at a position corresponding to the power connection part 114a; An elastic part 123 provided at one side of the electrode part 122 to apply a restoring force in a direction in which the electrode part 122 protrudes from the socket receiving part 121; An engaging part 124 formed at one side of the socket receiving part 121 and configured to engage and disengage the socket connecting part 114; And a control unit.

The number of the ultrasonic cleaning modules 110 may correspond to the number of the piezoelectric elements 111, the position of the piezoelectric element 111 in the housing 115, the shape of the ultrasonic transducer 112, 112 may be formed differently from each other.

The object 500 to be cleaned is preferably a wafer.

The ultrasonic cleaning device platform 100 may further include a cleaning target support 140 on which the object to be cleaned 500 is placed; A cleaning liquid supply unit 150 for applying a cleaning liquid to the surface of the object 500 to be cleaned; A system case 160 housed in the ultrasonic cleaning module 110, the ultrasonic cleaning module socket 120, the support part 140 to be cleaned, and the cleaning liquid supply part 150 so as to be hermetically sealed from the outside; As shown in FIG. In this case, the ultrasonic cleaning apparatus platform 100 may be configured such that the object 500 to be cleaned is a wafer, and a single object 500 to be cleaned is placed on the object 140 to be cleaned in a single cleaning process, (single wafer cleaning type).

According to the present invention, various ultrasonic cleaning modules optimized for specific conditions can be easily replaced, and the ultrasonic vibration suitable for each ultrasonic cleaning module can be changed and applied, so that it can be applied to various objects to be cleaned with a single equipment There is a big effect to make. More fundamentally, according to the present invention, not only a chemical method using a cleaning liquid but also a physical method using ultrasonic vibration can clean the wafer, so that nanoparticles can be cleanly removed, thereby improving the cleaning efficiency. At this time, as described above, the ultrasonic vibration can be applied uniformly over the entire surface of the wafer under optimum conditions by using the optimal cleaning module for various conditions. Therefore, when applying ultrasonic vibration, There is a great effect that it is possible to fundamentally prevent the problem that the pattern of the fine line width at the position is damaged. Of course, since the pattern damage factor generated during the cleaning process is eliminated, the defective rate in the semiconductor production process can be ultimately reduced.

Also, according to the present invention, it is not necessary to provide a variety of cleaning devices even in an environment where various processes or processes need to be frequently changed, so that only the cleaning module is appropriately replaced and the ultrasonic vibration of the condition suitable for the cleaning module is easily changed There is a great economical effect that the cost of installing or replacing the equipment is much reduced compared with the conventional one.

In addition, in order to clean a desired object to be cleaned in the related art, it is necessary not only to provide a plurality of kinds of cleaning devices but also to select a suitable cleaning device and move the object to be cleaned to the selected cleaning device. And an increase in the process time. However, according to the present invention, these problems are solved at the origin.

Figure 1 shows examples of various ultrasonic cleaning devices.
2 is an embodiment of an ultrasonic cleaning device platform having the ultrasonic cleaning module socket of the present invention.
3 is a simplified cross-sectional view of the ultrasonic cleaning module of the present invention.
4 is a simplified cross-sectional view of an ultrasonic cleaning module socket of the present invention.

Hereinafter, an ultrasonic cleaning module socket according to the present invention having the above-described structure will be described in detail with reference to the accompanying drawings.

FIG. 2 illustrates an embodiment of an ultrasonic cleaning device platform having an ultrasonic cleaning module socket according to the present invention. 2, the ultrasonic cleaning apparatus platform 100 having the ultrasonic cleaning module socket of the present invention includes a plurality of ultrasonic cleaning modules 110, an ultrasonic cleaning module socket 120, an ultrasonic vibration oscillator 130, . A cleaning liquid supply unit 150 for applying a cleaning liquid to the surface of the object to be cleaned 500, a cleaning liquid supply unit 150 for applying the cleaning liquid to the surface of the object 500 to be cleaned, the ultrasonic cleaning module 110, The system case 160 may include a cleaning liquid supply unit 150, a cleaning liquid supply unit 150, and a system case 160. The system case 160 may be configured to be hermetically sealed from the outside. Here, the object to be cleaned 500 is based on a wafer, but it goes without saying that the apparatus of the present invention can be used for cleaning other objects of a similar type.

The ultrasonic cleaning module 110 is similar to the cleaning devices shown in the examples shown in FIG. 1, and performs ultrasonic vibration to the cleaning liquid applied to the cleaning object 500 to perform physical cleaning It plays a role. 1, a plurality of ultrasonic cleaning modules 110 have different configuration conditions. However, the ultrasonic cleaning module 110 basically includes a vibrator to generate vibration, and the cleaning liquid applied to the object 500 to be cleaned And the vibration generated by a part of the contact is transmitted to the cleaning liquid. FIG. 3 is a simplified cross-sectional view of such an ultrasonic cleaning module of the present invention. The basic structure of the ultrasonic cleaning module 110 includes a piezoelectric element 111 for generating ultrasonic waves, a piezoelectric element 111 coupled to one side of the piezoelectric element 111 and opposed to the object to be cleaned 500, An ultrasonic transducer 112 for transmitting the generated ultrasonic waves to the object 500 to be cleaned, a power supply line 113 for applying power to the piezoelectric transducer 111, an ultrasonic vibration signal applied from the outside, A socket connection part 114 for receiving the power supply line 114a and transmitting the power supply line 113 to the power supply line 113 and the housing connection part 114 for housing the piezoelectric element 111 and the power supply line 113 115).

That is, when a power source as a vibration signal is applied from the outside to the piezoelectric element 111 through the power line 113, the piezoelectric element 111 is stretched and contracted to generate vibration. As described above, the ultrasonic transducer 112 has one end connected to the piezoelectric element 111 and the other end opposed to the object 500 to be cleaned. The other end of the ultrasonic transducer 112 is directly connected to the object to be cleaned 500) is contacted with the cleaning liquid applied to the surface. The tensile and contractive motion of the piezoelectric element 111 is transmitted to the ultrasonic transducer 112 as it is and the ultrasonic transducer 112 in contact with the ultrasonic transducer 112 vibrates in the ultrasonic transducer 112. As a result, will be. The ultrasonic cleaning module 110 for transmitting the ultrasonic vibrations to the cleaning liquid in this way is shown in FIG. 1 as an arrow direction (indicated by the arrow in FIG. 1) in the radial direction, A cleaning operation is performed while moving along the entire surface of the object 500 to be cleaned.

1, for example, the number of the piezoelectric elements 111, the position of the piezoelectric element 111 in the housing 115, the position of the ultrasonic transducer 112, The structure of the ultrasonic transducer 112, and the like, and the characteristics of the vibration generated thereby vary. As described above, in the physical cleaning using the ultrasonic vibration, when a peak occurs at a certain position in the process of applying vibration to the cleaning liquid, the surface of the object to be cleaned 500 at the corresponding position may be damaged. Particularly, in the case where the object to be cleaned 500 is a wafer on which a fine line width pattern is formed, the possibility of surface damage causes pattern damage, which is a direct cause of increasing the defect rate of semiconductor quality. On the other hand, when ultrasonic vibration of a sufficient size is not transmitted through the ultrasonic transducer 112, a cleaning effect is not generated. Therefore, the ultrasonic vibration must be suitably strong for a sufficient cleaning effect, Should be avoided. For this purpose, the configuration conditions (the number of piezoelectric elements, the position, the shape of the ultrasonic transducer, the structure, etc.) of the ultrasonic cleaning module 110 can be adjusted so that the sound pressure distribution generated at the end of the ultrasonic transducer 112 can be controlled.

Considering all these points, the degree of contamination of the object to be cleaned 500, the kind of the contaminant, the degree of chemical reaction between the cleaning liquid and the contaminant, the degree of chemical reaction of the microstructure formed on the object 500 to be cleaned (E.g., a pattern line width or a pattern material in the case of a wafer on which the pattern 500 is formed), the optimum ultrasonic vibration characteristics may vary. For this reason, the ultrasonic cleaning module 110 is not made of only one kind, but various kinds of ultrasonic cleaning modules 110 are formed as shown in FIG.

The ultrasonic vibration oscillator 130 generates an ultrasonic vibration signal and transmits it to the outside. In the present invention, the ultrasonic vibration oscillator 130 is connected to the ultrasonic cleaning module socket 120, which will be described in more detail below, to transmit ultrasonic vibration signals to the ultrasonic cleaning module 110 coupled to the ultrasonic cleaning module socket 120 .

In the present invention, the ultrasonic cleaning module 110, which meets specific conditions, is inserted into the ultrasonic cleaning module socket 120 to perform a cleaning process. In this case, not only the ultrasonic cleaning module socket 120 but also the ultrasonic cleaning modules 110 can be shared by the support part 140, the cleaning liquid supply part 150, the system case 160, and the like . Also, the ultrasonic vibration oscillator 130, which is connected to the ultrasonic cleaning module socket 120 and applies an ultrasonic vibration signal to the ultrasonic cleaning module 110, can also share all the ultrasonic cleaning modules 110. However, since the ultrasonic vibration modules 110 have different ultrasonic vibration characteristics, the ultrasonic vibration module 130 applies all the ultrasonic vibrations to the various ultrasonic cleaning modules 110 , It should be of a form capable of generating various ultrasonic vibration signals.

More specifically, the ultrasonic vibration oscillator 130 can change the frequency band of the ultrasonic vibration signal and the power magnitude of the ultrasonic vibration signal. Of course, other parameters related to the vibration characteristics may be changed, but the desired vibration characteristics can be easily adjusted by adjusting the frequency band and the power magnitude variable. More specifically, the ultrasonic vibration oscillator 130 is preferably configured to generate ultrasonic vibration signals having frequency bands in the range of several hundreds to several thousand kHz. In addition, the ultrasonic vibration oscillator 130 is preferably configured to generate an ultrasonic vibration signal having a power level within a range of several to several thousand W.

The ultrasonic cleaning module socket 120 of the present invention will now be described in more detail.

As described above, in order to perform the cleaning process under any specific condition, an ultrasonic cleaning apparatus suited to the conditions is required. In order to actually operate the ultrasonic cleaning apparatus (in the form shown in Fig. 1) at this time, a generator for oscillating the ultrasonic vibration, a stage for supporting the object to be cleaned, a nozzle for applying the cleaning liquid, The ultrasonic cleaning apparatuses are provided in the respective ultrasonic cleaning apparatuses.

Considering that the cleaning process is performed between each unit factory in the semiconductor manufacturing process and the technology development and change of the semiconductor technology itself is very fast, It is difficult to perform all the desired cleaning processes with only one ultrasonic cleaning apparatus. Therefore, if necessary, a plurality of ultrasonic cleaning devices each having a generator, a stage, a nozzle, and the like must be installed as described above, so that the installation cost of the equipment is greatly increased, and the space utilization in the field is greatly reduced. In addition, when cleaning an object to be cleaned, it is necessary to determine which ultrasonic cleaning apparatus is suitable to select the ultrasonic cleaning apparatus, and in the process of moving the object to be cleaned by the ultrasonic cleaning apparatus, the plurality of ultrasonic cleaning apparatuses There arises problems such as inconveniences that the copper wires become complicated and an increase in the time taken for selection and movement at the installed site.

In order to solve such a problem, in the present invention, only the portion of the ultrasonic cleaning module 110, which is a device for directly transmitting the ultrasonic vibration to the cleaning liquid, is constructed by replacing the generator, the stage, the nozzle, Issues such as bars are resolved at the source. That is, in the present invention, a plurality of the ultrasonic cleaning modules 110 meeting various specific conditions are provided, and the ultrasonic cleaning module 110 can be used in accordance with a required cleaning process.

The ultrasonic cleaning module socket 120 can directly implement this operation. The ultrasonic cleaning module socket 120 is detachably coupled to the socket connection part 114 of the ultrasonic cleaning module 110 and is connected to the ultrasonic vibration module 100 to be connected to the ultrasonic cleaning module socket 120 The ultrasonic cleaning module 110 is connected to the ultrasonic cleaning module 110. The ultrasonic cleaning module 110 according to a certain specific condition is inserted into the ultrasonic cleaning module socket 120 by using an ultrasonic vibration signal transmitted to the ultrasonic cleaning module 110 coupled to the ultrasonic cleaning module 110, The operation of separating the ultrasonic cleaning module 100 from the ultrasonic cleaning module socket 120 and using the ultrasonic cleaning module 110 newly fitted to the ultrasonic cleaning module socket 120 according to the changed specific conditions .

Fig. 4 shows a more specific example of the ultrasonic cleaning module socket. The ultrasonic cleaning module socket 120 includes a socket receiving portion 121, an electrode portion 122, an elastic portion 123, and a latching portion 124. Referring to FIG. 4, each part will be described in more detail as follows.

The socket receiving portion 121 is formed to be recessed from the socket body so that the socket connecting portion 114 can be inserted therein. The inside shape of the socket receiving portion 121 is preferably the same as the outside shape of the socket connecting portion 114.

The electrode part 122 is made of an electrically conductive material and is provided at a position corresponding to the power connection part 114a. 4, one end of the electrode unit 122 is connected to the ultrasonic vibration oscillator 130 (shown in FIG. 2), and the other end of the electrode unit 122 is connected to the socket connection unit 141 Is inserted into the power connection part 114a. The electrode unit 122 transmits the ultrasonic vibration signal transmitted from the ultrasonic vibration oscillator 130 to the ultrasonic cleaning module 110. The electrode unit 122 may be formed as a single unit It is more preferable that the electrode unit 122 is formed as a plurality of electrodes as shown in FIG.

The elastic part 123 is formed at one side of the electrode part 122 so as to apply a restoring force in a direction in which the electrode part 122 protrudes from the socket receiving part 121. The elastic part 123 receives a force to further protrude the electrode part 122 due to the urging force of the elastic part 123. In other words, the elastic part 123 contacts the electrode part 122 and the power connection part 114a As well as to strengthen the role of.

The latching part 124 is formed at one side of the socket receiving part 121 so that the socket connecting part 114 can be engaged and detached. In FIG. 4, the shape of the latching part 124 is greatly simplified, but the present invention is not limited at all. For example, a protrusion may be formed in the socket connection part 114, and a groove may be formed in the socket receiving part 121 to engage the protrusion with the groove. In this case, the socket receiving part 121 May be the engaging portion 124. [0053] As shown in FIG. In another example, a groove may be formed in the socket connecting part 114 and a cam having a proper shape may be provided on a side of the socket receiving part 121 so that the socket connecting part 114 can be inserted into the socket receiving part The cam formed in the socket receiving portion 121 may be engaged with the engaging portion 124 by being engaged with the groove on the socket connecting portion 114. [ . As a matter of course, the shape and structure of the latching part 124 are not limited, and if the socket connecting part 114 is formed at one side of the socket receiving part 121 so that the socket connecting part 114 can be hooked and detached, The shape and the structure of the light guide plate 124 can be variously modified.

The ultrasonic cleaning device platform 100 can be used by replacing the ultrasonic cleaning module 110 with the ultrasonic cleaning module socket 120 in accordance with the degree of contamination and contaminants of the object 500 to be cleaned, In the ultrasonic vibration oscillator 130, an ultrasonic vibration signal corresponding to the ultrasonic cleaning module 110 can be appropriately changed and applied, so that an optimal cleaning process can be performed according to the object to be cleaned.

At this time, the object to be cleaned 500 may be a wafer. In this case, in the ultrasonic cleaning device platform 100, a single object 500 to be cleaned is placed on the object 140 to be cleaned in one cleaning process, (Single wafer cleaning type) cleaning device. As described above, in the conventional batch type cleaning apparatus (a method of cleaning a plurality of wafers at once), there is a problem of re-contamination, and it has been difficult to effectively apply such ultrasonic vibration to various objects to be cleaned. However, since the ultrasonic cleaning apparatus platform 100 of the present invention places the wafers on the support part 140 to be cleaned one by one and carries out the cleaning process, the problem of re-contamination and the problem of effective vibration transmission are essentially eliminated.

It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. It goes without saying that various modifications can be made.

100: Ultrasonic cleaning device platform
110: Ultrasonic cleaning device 111: Piezoelectric element
112: Ultrasonic transducer 113: Power line
114: socket connection 115: housing
120: Ultrasonic Cleaning Module Socket
121: socket receiving portion 122: electrode portion
123: elastic portion 124:
130: ultrasonic vibration oscillator 140: object to be cleaned
150: cleaning liquid supply unit 160: system case
500: subject to be cleaned

Claims (5)

A piezoelectric element 111 for generating ultrasonic waves and a piezoelectric element 111 coupled to one side of the piezoelectric element 111 and opposed to the object to be cleaned 500 to transmit ultrasound generated in the piezoelectric element 111 to the object to be cleaned 500 A power supply line 113 for applying power to the piezoelectric element 111 and an ultrasonic vibration signal applied from the outside are received through at least one power connection 114a to be connected to the power line 113, And a housing 115 housing the piezoelectric element 111 and the power line 113. The cleaning object 500 may include a plurality of piezoelectric elements 111, A plurality of ultrasonic cleaning modules 110 for applying ultrasonic vibrations to the cleaning liquid applied to the plurality of ultrasonic cleaning modules 110; An ultrasonic vibration oscillator 130 for generating and transmitting an ultrasonic vibration signal to the outside; An ultrasonic cleaning module socket (120) provided in an ultrasonic cleaning device platform (100)
The ultrasonic cleaning module 110 is coupled to the ultrasonic cleaning module socket 120 and is connected to the ultrasonic vibration module 100. The ultrasonic cleaning module 110 is connected to the ultrasonic cleaning module 110, To transmit the ultrasonic vibration signal,
The ultrasonic cleaning module socket (120)
A socket receiving portion 121 formed to allow insertion of the socket connecting portion 114;
At least one electrode part 122 made of an electrically conductive material and provided at a position corresponding to the power connection part 114a;
An elastic part 123 provided at one side of the electrode part 122 to apply a restoring force in a direction in which the electrode part 122 protrudes from the socket receiving part 121;
An engaging part 124 formed at one side of the socket receiving part 121 and configured to engage and disengage the socket connecting part 114;
Wherein the ultrasonic cleaning module comprises:
delete The ultrasonic cleaning module according to claim 1, wherein the plurality of ultrasonic cleaning modules (110)
At least one of constituent conditions including the number of the piezoelectric elements 111, the position of the piezoelectric element 111 in the housing 115, the shape of the ultrasonic transducer 112, and the structure of the ultrasonic transducer 112 Wherein the plurality of ultrasonic cleaning module sockets are different from each other.
The cleaning apparatus according to claim 1, wherein the object to be cleaned (500)
Wherein the ultrasonic cleaning module is a wafer.
The apparatus of claim 1, wherein the ultrasonic cleaner platform (100)
A cleaning target support portion 140 on which the object to be cleaned 500 is placed;
A cleaning liquid supply unit 150 for applying a cleaning liquid to the surface of the object 500 to be cleaned;
A system case 160 housed in the ultrasonic cleaning module 110, the ultrasonic cleaning module socket 120, the support part 140 to be cleaned, and the cleaning liquid supply part 150 so as to be hermetically sealed from the outside;
Further comprising: an ultrasonic cleaning module socket mounted on the ultrasonic cleaning module.

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