KR101461723B1 - Ash and zinc-gas removing apparatus in snout - Google Patents

Abstract

The apparatus for removing contaminants of Snooth according to an embodiment of the present invention is connected to the Snooth so as to collect Snooth which is installed between the heating furnace and the plating bath filled with the plating solution and the contaminants in the Snooth, And removing means provided to remove the contamination source through adhesion.
Further, the removing means of the Snart's contaminant removing device according to an embodiment of the present invention may be provided between the Snart and the plating bath to induce the fluid collected in the Snart to the plating bath to generate bubbles. As shown in Fig.

Description

[0002] Ash and zinc-gas removing apparatus in snout [0003]

More particularly, the present invention relates to an apparatus for improving the quality of a plate to be penetrated through a snout by allowing a contaminant source to adhere to the inside of the cell and be discharged to the outside.

Generally, a coated steel sheet for plating a specific molten metal, for example, molten zinc or the like, on the surface of a steel sheet, in particular, a cold-rolled steel sheet is excellent in corrosion resistance and the like of a steel sheet and has an excellent appearance.

Especially, in recent years, such coated steel sheets have been used as electronic products and automobile steel sheets, and the development of technology for manufacturing high quality steel sheets has been concentrated.

A typical plating process of a plated steel plate such as a plated steel plate is a continuous galvanizing process. For example, as shown in Fig. 1, a plated plate 5 'unwound from a payoff reel After the heat treatment in the heating furnace 2 'through the welder and the inlet looper, the plating is performed while passing through the plating bath 3' filled with the plating solution 4 'such as molten zinc.

Generally, since the plate 5 'subjected to heat treatment in the heating furnace 2' is in a high temperature state of about 400 ° C or more, it can be easily oxidized in the atmosphere, and therefore, in order to prevent oxidation of the plate 5 ' And is supplied to the plating bath 3 'through the snout 10' so as not to come into contact with the plating bath 3 '.

On the other hand, the copper plate 5 'supplied to the plating bath 3' through the Snart 10 'is plated with molten zinc (Zn), where the melting point of zinc is about 419 ° C.

A high pressure air or nitrogen gas is injected onto the surface of the copper plate 5 'while the copper plate 5' passes through a gas wiping device or an air knife provided on the upper surface of the plating vessel 3 ' (Hereinafter referred to as' gas') such that the molten amount of the surface of the plated plate 5 'is properly polished.

It is also possible to determine whether the plating amount of the plated metal plate 5 'is appropriate in the plating adhesion amount measurement gauge, feed back the measured value, and adjust the gas discharge pressure of the gas wiping device, The plating deposition amount of the plated plate 5 'is continuously controlled.

At this time, a sink roll and a stabilizing roll for guiding the plated plate 5 'into the plating vessel 3' and suppressing the vibration of the plated plate 5 'are provided .

On the other hand, the plated plate 5 'supplied to the plating vessel 3' is plated with the molten amount in the plating vessel 3 ', for example, molten zinc.

At this time, the molten zinc of the plating bath 3 'is maintained at 420 ° C or higher, whereby the molten zinc evaporates on the molten zinc bath surface of the plating bath 3'. Evaporation of such molten zinc also occurs on the bath surface inside the snout 10 '.

On the other hand, the zinc vapor evaporated from the molten zinc is contacted with the ambient atmosphere at room temperature, and the temperature is lowered while meeting with the relatively low temperature Snout 10 ', thereby condensing or solidifying on the inner wall surface of the Snout 10'.

The zinc vapor condensed or solidified on the wall surface of the Snatch 10 'is referred to as ash (b). The generated soot flows downward into the plating bath 3 'due to its own weight or vibration of the Snart 10'.

As a result, the zinc particles (b) floating on the plating bath 3 'are buried when the plating solution 4' flows into the plating unit 5 ', and the surface of the plating unit 5' There is a problem that defects such as streaks are generated.

Therefore, it is necessary to study the invention for improving the quality of the copper plate 5 'by removing contaminants such as zinc vapor in the Snath 10'.

An object of the present invention is to provide a device for removing a contamination source of Snooth, which improves the quality of a plated plate passing through the inside of the snout by adhering a contamination source such as zinc vapor in Snout to the inside of the cell.

The apparatus for removing contaminants of Snooth according to an embodiment of the present invention is connected to the Snooth so as to collect Snooth which is installed between the heating furnace and the plating bath filled with the plating solution and the contaminants in the Snooth, And removing means provided to remove the contamination source through adhesion.

Further, the removing means of the Snart's contaminant removing device according to an embodiment of the present invention may be provided between the Snart and the plating bath to induce the fluid collected in the Snart to the plating bath to generate bubbles. As shown in Fig.

Further, the removing means of the apparatus for removing contaminants of Snooth according to an embodiment of the present invention may further include an extension pipe extended from the suction unit, so as to be provided at the lower end of the plating bath.

In addition, an outlet for discharging the collected fluid to the fine bubbles may be formed in the extended pipe of the apparatus for removing contaminants of Snooth according to an embodiment of the present invention.

In addition, the removing means of the apparatus for removing pollution sources according to an embodiment of the present invention may further include a moisture supply unit for supplying water to increase the adhesive force in the bubbles.

The apparatus for removing contaminants of Snooth according to an embodiment of the present invention may be formed on the surface of the plating solution so as to prevent dispersion of contaminants floating on the surface of the plating solution, And a processing means for providing a dispersion preventing wall having an entrance and exit hole formed therein.

In addition, a processing means connected to the removing means of the Snart's contaminant removal apparatus according to an embodiment of the present invention, provided with a contamination source in the inside of the Snart, is provided, and a container containing the application solution in which the bubbles float .

In addition, the processing means of the Snart's contaminant removal apparatus according to an embodiment of the present invention may be configured such that the application solution which is a plating solution is closely adhered to the upper side of the vessel and a circulation portion provided for circulation with the plating solution of the plating tank, It is further possible to provide a container cap that prevents contamination and the escape of air bubbles.

Further, the removing means of the apparatus for removing contamination of Snooth according to an embodiment of the present invention may include a bubble generating unit provided in the plating bath to generate bubbles.

The apparatus for removing contaminants of Snooth according to the present invention has an advantage that a contaminant source such as zinc vapor in Snooth can be easily adhered to the inside of bubbles and can be easily removed from the Snooth.

Accordingly, the contamination source existing on the inner wall surface of the Snart due to the condensation of the contamination source is dropped into the plating bath, and thus the substrate can be prevented from being contaminated when the plating vessel enters the plating bath.

Therefore, the apparatus for removing pollutants of Snooth according to the present invention can produce an effect of producing a product with high quality.

Fig. 1 is a view showing a device configuration including a Snart in a general plating steel sheet process.
Fig. 2 is a configuration diagram showing a first embodiment of the apparatus for removing pollution sources of the present invention. Fig.
3 is a block diagram illustrating the operation principle of the apparatus for removing pollutants in Snatus according to the present invention.
Fig. 4 is a configuration diagram showing a second embodiment of the pollutant removal apparatus of the present invention. Fig.
5 is a configuration diagram showing a third embodiment of the apparatus for removing contamination of the present invention.
6 is a configuration diagram showing a fourth embodiment of the apparatus for removing contamination of the present invention.

Hereinafter, specific embodiments of the present invention will be described in detail with reference to the drawings. It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the inventive concept. Other embodiments falling within the scope of the inventive concept may readily be suggested, but are also considered to be within the scope of the present invention.

The same reference numerals are used to designate the same components in the same reference numerals in the drawings of the embodiments.

The contaminated source (a) of the present invention can be adhered to the inside of the bubble (c) and discharged to the outside, so that the quality of the plated sheet (5) passing through the slats (10) To the present invention.

That is, the contaminant source (a) such as zinc vapor in the snout 10 is adhered in the bubble c to remove the contaminant source (a) in the snout 10, The contaminant source a existing on the wall surface of the snout 10 falls down to the plating vessel 3 so that when the plating vessel 5 is introduced into the plating vessel 3, 5) can be prevented from being contaminated, and a product with excellent quality can be produced.

In addition, the apparatus for removing pollution sources 1 according to the present invention can reduce the initial cost of implementing the apparatus and lower the maintenance cost, as compared with the case where the contamination source (a) is removed by using a filter, have.

More specifically, FIG. 2 is a structural view showing a first embodiment of the pollutant removing apparatus 1 of the present invention, and FIG. 3 is a view showing the operation principle of the pollutant removing apparatus 1 of the present invention Fig.

Referring to FIGS. 2 and 3, the apparatus for removing pollutants in Snatus according to an embodiment of the present invention includes a furnace 3 installed between a heating furnace 2 and a plating solution 4, (A) through adhesion in the bubble (c) of the contamination source (a) in association with the snout (10) so as to collect the contamination source (a) The processing means 20 may be provided with the processing means 20 provided for processing.

In addition, the removing means 20 of the apparatus for removing contaminants S of the Snart according to an embodiment of the present invention induces the fluid collected in the Snart 10 to the plating tank 3 to generate bubbles And a suction unit 31 provided between the Snath 10 and the plating tank 3 so as to allow the plating liquid to be supplied to the plating tank 3.

The removal means 20 of the apparatus for removing contaminants S of the Snart according to an embodiment of the present invention may further include an extension pipe extending from the suction unit 31 to be provided at the lower end of the plating tank 3 32).

In addition, an outlet 32a for discharging the collected fluid to fine bubbles may be formed in the extension pipe 32 of the apparatus for removing pollution sources 1 according to an embodiment of the present invention.

The Snath 10 is installed between the heating furnace 2 of the plating process and the plating bath 3 filled with the plating solution 4 so that the plated plate 5 is transferred from the heating furnace 2 to the plating bath 3 3).

To this end, the snout 10 may be provided with a gas injection part for injecting an atmospheric gas for preventing the surface thereof from being oxidized as the plated plate 5 is exposed to the atmosphere.

The gas injection unit may be provided at one end of the snout 10 connected to the heating furnace 2, and the atmospheric gas may be an inert gas, a nitrogen gas, or the like. The atmospheric gas may be injected in the form of a curtain to block oxygen in the atmosphere.

The removing means 30 sucks the sucking gas containing the contaminant source a from the snout 10 and provides the sucking gas to the plating tank 3 or the container 23.

To this end, the removal means 30 may provide a suction portion 31. That is, the suction unit 31 can be provided as a power source for sucking the suction gas from the snout 10.

The removing means 30 may be provided with an extension pipe 32 extending from the suction unit 31 and being connected to the lower end of the plating vessel 3 or the vessel 23 Can be provided.

As a result, a fluid, which is a suction gas sucked and provided by the suction unit 31, is generated from the lower end of the plating vessel 3 or the vessel 23 as bubbles c, So that it can be separated and removed.

That is, it is possible to increase the probability of contact between the generated bubble (c) and the contaminant (a), thereby increasing the removal efficiency of the contaminant (a).

As described above, the pollutant removing device 1 of the present invention can be configured to remove the pollutant source (a) by utilizing the existing plating tank 3. That is, when the contaminant source (a) floats on the surface of the plating solution (4) of the plating tank (3) by the removing means (20), the operator can remove the contaminant source

Meanwhile, the extension pipe 32 may be provided with a discharge port 32a for discharging the suction gas to the minute bubble c. The discharge port 32a may be formed by arranging a plurality of bubbles c You can adjust the size.

At this time, the smaller the bubble (c), the larger the area in which the contamination source (a) in the bubble (c) can adhere, so that it is advantageous to reduce the size of the discharge port (32a).

3, the removal means 20 removes the suction gas from the plating vessel 3 or the vessel 23 to remove the gas from the vessel 3. [ The discharged bubbles c float on the upper liquid surface of the plating vessel 3 or the vessel 23.

At this time, the bubble (c) floats to adhere the contaminant source (a) in the bubble (c), and the contaminant source (a) floats upward like the bubble (c).

This is because the adhesion of the contamination source (a) such as zinc vapor is the largest at the liquid surface of the liquid. Since the boundary surface of the bubble c serves as a liquid surface, the contaminant source (a) . These effects can be easily seen from Table 1.

Suction gas
Flow rate (l / min) Moisture gas
Flow rate (l / min) Total flow
(l / min) Dew point of water (℃) Contamination source content before discharge (mg / Nm ³ ) Contaminant content after discharge (mg / Nm ³ ) Source
Removal efficiency 45 5 50 -10 90 12 13 45 5 50 0 90 8 9 40 10 50 -20 80 8 10 40 10 50 -10 80 6 8 20 30 50 -20 40 3 8

The results of the experiment shown in Table 1 are as follows. Two crucibles having a depth of 25 cm are prepared. One crucible (hereinafter referred to as 'crucible 1') is prepared with a molten zinc molten metal at 450 ° C. and the other crucible A sucking gas containing a contaminant source (a) such as zinc vapor, a zinc source and the like, and a water gas to be supplied additionally were injected, and a bubble (c) of 5 mm was generated at a depth of 200 mm.

As shown in Table 1, by introducing a suction gas sucked from the snout 10 into the crucible 2 to generate bubbles c, the source a is adhered to the bubbles c and removed Able to know.

That is, the removal efficiency of the contaminant source (a) is a ratio (i / j) of the content (i) of the contaminant source (a) before discharge to the content (j) .

On the other hand, if moisture gas is supplied to the bubble (c), the efficiency of removal of the contamination source (a) can be increased.

That is, the removing unit 30 may further provide a water supply unit 33 capable of supplying water to the plating tank 3 or the container 23, and may be connected to the extension pipe 32, So as to supply moisture.

Thereby, the moisture can be supplied into the bubble c. At this time, if the moisture is supplied to the interface of the bubble (c), the adhesion force at the interface of the bubble (c) can be further increased.

That is, since the viscosity of water is substantially higher than that of the other plating solution 4 to the other application solution 23a, the efficiency of adhesion of the contaminant a to the inner boundary surface of the bubble c can be increased.

Fig. 4 is a configuration diagram showing a second embodiment of the pollution source removal apparatus 1 of the present invention. Fig.

Referring to FIG. 4, the apparatus for removing pollution sources 1 according to an embodiment of the present invention includes a plating solution removing unit 4 for removing contaminants (a) floating on the surface of the plating solution 4, (20) which extends on the surface of the solution (4) and provides a dispersion preventing wall (22) in which an inlet and a hole through which the plating solution (4) enters and exits is formed.

That is, in order to prevent the contamination source (a) from being dispersed, the dispersion preventing wall 22 is formed in such a manner that the portion of the plating bath 3 provided with the bubble generating portion 34 is divided into a portion of the other plating bath 3 So that they can be separated.

The dispersion preventing wall 22 is formed to extend to the liquid level of the plating solution 4 to prevent the contamination source a floating on the liquid level from being dispersed to other parts of the plating vessel 3, The treatment of the pollutant source (a) can be facilitated.

For this, the dispersion preventing wall 22 is formed to extend on the liquid surface of the plating solution 4, and an entrance hole through which the plating solution 4 enters and exits may be formed on the lower side. As a result, the plating solution 4 can be freely moved in and out, but can be separated only on the surface of the plating solution 4.

Fig. 5 is a configuration diagram showing a third embodiment of the pollutant removing apparatus 1 of the present invention. Fig.

Referring to FIG. 5, a contamination source (a) in the snout 10 is connected to the removal means 30 of the Snatus pollution source removal apparatus 1 according to an embodiment of the present invention, , And processing means (20) for providing a container (23) containing an application solution (23a) on which the bubble (c) floats.

The treatment means 20 of the Snart's contaminant removal apparatus 1 according to an embodiment of the present invention may be configured such that the application solution 23a as the plating solution 4 is supplied to the plating solution 3 And a container cap 21 which is in close contact with the upper side of the container 23 and prevents the contaminant source a and the air bubble c from escaping outward can be further provided have.

That is, the removing means 30 may be provided in the plating vessel 3, but may be provided in a separate vessel 23 to remove the contamination source a. The application solution 23a may be contained in the container 23 so that the air bubble c may float.

This makes it possible to easily remove the contaminant source (a) that has floated on the liquid surface of the container (23). That is, the portion of the contaminant source (a) floating is the portion on the liquid surface of the container 23, and the contaminant source (a) is removed only at this portion, so that the plating container 3 can be prevented from being contaminated .

Here, the application solution 23a may be any solution having a large adhesive force on the surface of the liquid, but may be provided as the plating solution 4 of the plating bath 3. In this case, the circulation unit 24 may be provided to circulate the plating solution 3 and the plating solution 4 in the vessel 23. Thereby, there is an advantage that the contamination source (a) can be removed by using the plating solution (4) without a separate application solution (23a).

On the other hand, on the upper side of the vessel 23, a gas-type contaminant source (a) discharged from the liquid surface of the application solution 23a, A cap 21 may be provided.

The container cap 21 may be provided so as to cover the entire upper surface of the container 23 and may provide an outlet 25a for treating the gas collected above the container 23. The discharge port 25a may be connected to an external gas processing device and configured to process the gas.

FIG. 6 is a block diagram showing a fourth embodiment of a pollution source removal apparatus 1 according to the present invention. Referring to FIG. 6, the apparatus for removing pollution sources 1 of Snatus according to an embodiment of the present invention, The removing means 30 may include a bubble generating portion 34 provided in the plating bath 3 to generate bubbles c.

The bubble generating unit 34 may be provided in the plating tank 3 and may further supply gas generated by the sucking gas sucked in the sucking unit 10 to generate more bubbles c, Thereby further enhancing the removal efficiency of the pollutant source (a).

The bubble generator 34 may be provided in the plating vessel 3 or may be provided in a separate vessel 23 to remove the contamination source a. For this, the bubble generating unit 34 is provided in a separate container 23, and the application solution 23a may be contained in the container 23 so that the bubble c may float. A detailed description thereof has been given above.

1: Snout's contaminant removal device 2: heating furnace
3: plating bath 4: plating solution
5: Gold Plate 10: Snout
20: processing means 21: container cap
22: dispersion preventing wall 23: container
24: circulation part 30: removal means
31: suction unit 32: extension pipe
33: water supply unit 34: bubble generator

Claims (9)

delete delete A Snath disposed between the heating furnace and the plating bath filled with the plating solution; And
Removing means provided in association with the snout so as to collect the contaminants in the snout, the contaminants being removed through adhesion of the contaminants in the bubbles;
/ RTI >
Wherein the removing means comprises:
A suction unit provided between the Snath and the plating bath to collect the suction gas containing the contaminant in the Snooth and to induce bubbles in the plating bath; And
An extension pipe extending from the suction unit to be provided at a lower end of the plating bath;
Further comprising: means for detecting the presence of the contamination source. The method of claim 3,
And an outlet for discharging the collected fluid to the minute bubble is formed in the extension pipe. A Snath disposed between the heating furnace and the plating bath filled with the plating solution; And
Removing means provided in association with the snout so as to collect the contaminants in the snout, the contaminants being removed through adhesion of the contaminants in the bubbles;
/ RTI >
Wherein the removing means comprises:
A suction unit provided between the Snath and the plating bath to collect the suction gas containing the contaminant in the Snooth and to induce bubbles in the plating bath; And
A water supply unit for supplying water to increase the adhesion of the bubbles;
Wherein the contamination eliminating device comprises: 6. The method according to any one of claims 3 to 5,
Processing means for providing a dispersion preventing wall formed on the liquid surface of the plating solution so as to prevent dispersion of floating contaminants separated on the surface of the plating solution and having an entrance hole through which the plating solution enters and exits;
Further comprising: means for detecting the presence of the contamination source. A Snath disposed between the heating furnace and the plating bath filled with the plating solution;
Removing means provided in association with the snout so as to collect the contaminants in the snout, the contaminants being removed through adhesion of the contaminants in the bubbles; And
Processing means connected to the removing means to provide a container containing the application solution in which the contamination of the inside of the snout is introduced, and in which the bubbles float;
Further comprising:
Wherein the removing means comprises:
A suction unit provided between the Snath and the plating bath to collect the suction gas containing the contaminant in the Snooth and to induce bubbles in the plating bath;
Wherein the contamination eliminating device comprises: 8. The method of claim 7,
The processing means,
A circulation unit for circulating the application solution, which is a plating solution, with the plating solution in the plating tank; And
A container cap which is brought into close contact with the upper side of the container to prevent the contaminants and the air bubbles from falling out;
To provide more of the Snooth 's contaminant removal device. 9. The method according to any one of claims 3 to 5, 7, and 8,
Wherein the removing means comprises: a bubble generator provided in the plating vessel to generate bubbles;
Wherein the contamination eliminating device comprises:

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