KR101457345B1 - 비정질 탄소 광 흡수층과 호환가능한 레이저 어닐링 시스템용 고온계 - Google Patents

비정질 탄소 광 흡수층과 호환가능한 레이저 어닐링 시스템용 고온계 Download PDF

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KR101457345B1
KR101457345B1 KR1020107001143A KR20107001143A KR101457345B1 KR 101457345 B1 KR101457345 B1 KR 101457345B1 KR 1020107001143 A KR1020107001143 A KR 1020107001143A KR 20107001143 A KR20107001143 A KR 20107001143A KR 101457345 B1 KR101457345 B1 KR 101457345B1
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wavelength
laser
pyrometer
substrate
radiation
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KR20100044786A (ko
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지핑 리
브루스 이. 아담스
티모시 엔. 토마스
아아론 무이르 헌터
아브히라시 제이. 마유르
라제시 에스. 라마누잠
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어플라이드 머티어리얼스, 인코포레이티드
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/034—Observing the temperature of the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0665—Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/18—Working by laser beam, e.g. welding, cutting or boring using absorbing layers on the workpiece, e.g. for marking or protecting purposes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Recrystallisation Techniques (AREA)
  • Laser Beam Processing (AREA)
KR1020107001143A 2007-06-18 2008-05-22 비정질 탄소 광 흡수층과 호환가능한 레이저 어닐링 시스템용 고온계 Active KR101457345B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/764,738 US7804042B2 (en) 2007-06-18 2007-06-18 Pryometer for laser annealing system compatible with amorphous carbon optical absorber layer
US11/764,738 2007-06-18
PCT/US2008/006616 WO2008156543A1 (en) 2007-06-18 2008-05-22 Pyrometer for laser annealing system compatible with amorphous carbon optical absorber layer

Publications (2)

Publication Number Publication Date
KR20100044786A KR20100044786A (ko) 2010-04-30
KR101457345B1 true KR101457345B1 (ko) 2014-11-04

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KR1020107001143A Active KR101457345B1 (ko) 2007-06-18 2008-05-22 비정질 탄소 광 흡수층과 호환가능한 레이저 어닐링 시스템용 고온계

Country Status (6)

Country Link
US (2) US7804042B2 (https=)
EP (2) EP3330036B1 (https=)
JP (1) JP5431313B2 (https=)
KR (1) KR101457345B1 (https=)
CN (1) CN101678507B (https=)
WO (1) WO2008156543A1 (https=)

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US7947584B2 (en) * 2008-05-02 2011-05-24 Applied Materials, Inc. Suitably short wavelength light for laser annealing of silicon in DSA type systems
US10095016B2 (en) 2011-01-04 2018-10-09 Nlight, Inc. High power laser system
US9429742B1 (en) * 2011-01-04 2016-08-30 Nlight, Inc. High power laser imaging systems
US9409255B1 (en) 2011-01-04 2016-08-09 Nlight, Inc. High power laser imaging systems
US9720244B1 (en) 2011-09-30 2017-08-01 Nlight, Inc. Intensity distribution management system and method in pixel imaging
KR102038720B1 (ko) * 2011-12-07 2019-10-30 어플라이드 머티어리얼스, 인코포레이티드 기판 처리를 위한 레이저 반사 측정
CN103862169B (zh) 2012-12-12 2016-08-10 中芯国际集成电路制造(上海)有限公司 激光退火设备和方法
US9310248B2 (en) 2013-03-14 2016-04-12 Nlight, Inc. Active monitoring of multi-laser systems
CN105144355B (zh) 2013-05-01 2018-02-06 应用材料公司 用于在晶片处理系统内进行低温测量的设备与方法
US9709810B2 (en) 2014-02-05 2017-07-18 Nlight, Inc. Single-emitter line beam system
US10247865B2 (en) * 2017-07-24 2019-04-02 Viavi Solutions Inc. Optical filter

Citations (4)

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US6183130B1 (en) 1998-02-20 2001-02-06 Applied Materials, Inc. Apparatus for substrate temperature measurement using a reflecting cavity and detector
WO2006055130A2 (en) * 2004-11-12 2006-05-26 Applied Materials, Inc. Multiple band pass filtering for pyrometry in laser based annealing systems
US7109435B2 (en) 2001-12-07 2006-09-19 Sony Corporation Beam irradiator and laser anneal device
WO2006124966A2 (en) * 2005-05-17 2006-11-23 Applied Materials, Inc. Low temperature absorption layer deposition and high speed optical annealing system

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US6535535B1 (en) * 1999-02-12 2003-03-18 Semiconductor Energy Laboratory Co., Ltd. Laser irradiation method, laser irradiation apparatus, and semiconductor device
US6822787B1 (en) 1999-04-26 2004-11-23 Finisar Corporation Lasing semiconductor optical amplifier with optical signal power monitor
US6531681B1 (en) * 2000-03-27 2003-03-11 Ultratech Stepper, Inc. Apparatus having line source of radiant energy for exposing a substrate
JP3903761B2 (ja) * 2001-10-10 2007-04-11 株式会社日立製作所 レ−ザアニ−ル方法およびレ−ザアニ−ル装置
KR100436218B1 (ko) * 2001-12-24 2004-06-16 한국원자력연구소 ＬｉＦ에 Ｍｇ,Ｃｕ,Ｎａ, 및 Ｓｉ를 첨가한 방사선계측용 열발광소자 및 그의 제조방법
US6987240B2 (en) * 2002-04-18 2006-01-17 Applied Materials, Inc. Thermal flux processing by scanning
US8288239B2 (en) * 2002-09-30 2012-10-16 Applied Materials, Inc. Thermal flux annealing influence of buried species
JP3939205B2 (ja) * 2002-06-18 2007-07-04 浜松ホトニクス株式会社 レーザ加工装置、レーザ加工温度測定装置、レーザ加工方法及びレーザ加工温度測定方法
US6747245B2 (en) * 2002-11-06 2004-06-08 Ultratech Stepper, Inc. Laser scanning apparatus and methods for thermal processing
US7109087B2 (en) * 2003-10-03 2006-09-19 Applied Materials, Inc. Absorber layer for DSA processing
US7304310B1 (en) * 2003-11-21 2007-12-04 Kla-Tencor Technologies Corp. Methods and systems for inspecting a specimen using light scattered in different wavelength ranges
US7078302B2 (en) * 2004-02-23 2006-07-18 Applied Materials, Inc. Gate electrode dopant activation method for semiconductor manufacturing including a laser anneal
US7642205B2 (en) * 2005-04-08 2010-01-05 Mattson Technology, Inc. Rapid thermal processing using energy transfer layers
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US6183130B1 (en) 1998-02-20 2001-02-06 Applied Materials, Inc. Apparatus for substrate temperature measurement using a reflecting cavity and detector
US7109435B2 (en) 2001-12-07 2006-09-19 Sony Corporation Beam irradiator and laser anneal device
WO2006055130A2 (en) * 2004-11-12 2006-05-26 Applied Materials, Inc. Multiple band pass filtering for pyrometry in laser based annealing systems
WO2006124966A2 (en) * 2005-05-17 2006-11-23 Applied Materials, Inc. Low temperature absorption layer deposition and high speed optical annealing system

Also Published As

Publication number Publication date
US8232503B2 (en) 2012-07-31
EP2167272A1 (en) 2010-03-31
CN101678507B (zh) 2012-11-28
US20080308534A1 (en) 2008-12-18
KR20100044786A (ko) 2010-04-30
EP3330036B1 (en) 2019-11-06
CN101678507A (zh) 2010-03-24
EP2167272B1 (en) 2018-01-24
EP2167272A4 (en) 2016-11-23
EP3330036A1 (en) 2018-06-06
JP2010530639A (ja) 2010-09-09
US20110006044A1 (en) 2011-01-13
WO2008156543A1 (en) 2008-12-24
US7804042B2 (en) 2010-09-28
JP5431313B2 (ja) 2014-03-05

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