KR101451712B1 - Method and apparatus for manufacturing touch screen panel - Google Patents

Abstract

A method and apparatus for manufacturing a touch screen panel are disclosed. A method of manufacturing a touch screen panel according to an embodiment of the present invention includes the steps of forming a decorative layer on a wiring region of a transparent insulating substrate; Forming a transparent electrode layer on the window region and the decorative layer of the insulating substrate; Placing a film-type photosensitizer on the transparent electrode layer, and pressing the film-shaped photosensitizer onto the transparent electrode layer with a pressing member having a plate-type pressing surface capable of elastically deforming; And removing unnecessary portions of the transparent electrode layer by a photolithography process to form a patterned transparent electrode wiring.

Description

TECHNICAL FIELD [0001] The present invention relates to a touch screen panel,

The present invention relates to a method and an apparatus for manufacturing a touch screen panel capable of realizing close adhesion of a film type photosensitive material (DFR: Dry Film Photo Resist) to improve process reliability, enable fine patterning, will be.

The touch screen panel is a device that allows a user to input a command by touching a part of the body (or a touch pen) at a specific position on the screen based on characters or images displayed on the screen.

The touch screen panel can be classified into a resistive type, a capacitive type, an infrared type, and an ultrasonic type according to a command input method. Among them, the electrostatic capacity type is widely used as an input device of various electronic apparatuses because the production cost is low and the light transmittance is good.

The capacitive touch screen panel is manufactured by providing a transparent electrode wiring and a metal wiring on the back side of a transparent insulating substrate such as glass or resin. A transparent electrode wiring functioning as a detection sensor is provided on the back surface of the window region where the image is displayed and a non-transparent metal wiring is provided on the backside of the wiring region on the rim side. Further, a decorative layer for covering metal wiring and the like is provided on the back surface of the wiring region of the insulating substrate from the view of the user. Recently, such a touch screen panel has been developed in the direction of manufacturing a monolithic panel which is thinner and has high light transmittance by directly forming a decorative layer, a transparent electrode wiring and a metal wiring on the back side of an insulating substrate.

When manufacturing an integrated touch screen panel, a decorative layer is formed by printing black ink on the back surface of a wiring region of an insulating substrate, and a transparent electrode layer and a metal layer are formed thereon by a sputtering process or the like. Thereafter, a transparent electrode wiring is formed in the transparent electrode layer by a photolithography process to remove unnecessary portions, and a metal wiring is formed in the metal layer. In the photolithography process, a patterned transparent electrode wiring and a metal wiring are formed through exposure, development, etching, and peeling in a state in which a film type photosensitive agent (DFR: Dry Film Photo Resist) is attached on a transparent electrode layer or a metal layer. A metal wiring may be formed by forming only a transparent electrode wiring in another manner and then printing a metal paste on the wiring area side.

However, since the touch screen panel has a decorative layer that forms a step on the back surface of the insulating substrate, it is difficult to attach the film-type photosensitive agent on the transparent electrode layer or the metal layer. Typically, the film-type photosensitive agent is adhered in such a manner that the upper surface of the film-type photosensitive agent is pressed by means of a cylindrical roller. Such an attachment method is difficult to uniformly press the photosensitive agent at the stepped portion of the decorative layer due to the characteristics of the roller. Therefore, the film type photosensitizer may be lifted at the stepped portion or an air layer may be formed at the adhesion portion. If the adhesion of the photosensitizer is poor, defects such as disconnection may occur in the process of forming the transparent electrode wiring thereafter.

Disclosed is a method and apparatus for manufacturing a touch screen panel capable of realizing close adhesion of a film-type photosensitizer, improving reliability of the process, enabling fine patterning, and reducing the time required for the process.

According to an aspect of the present invention, there is provided a method of manufacturing a semiconductor device, comprising: forming a decorative layer on a wiring region of a transparent insulating substrate; Forming a transparent electrode layer on the window region of the insulating substrate and the decorative layer; Placing a film-type photosensitive agent on the transparent electrode layer, pressing the film-type photosensitive agent with a pressing member having a plate-type pressing surface capable of being elastically deformed, and attaching the film-type photosensitive agent to the transparent electrode layer; And removing the unnecessary portions of the transparent electrode layer by a photolithography process to form a patterned transparent electrode wiring.

The step of adhering the film-type photosensitive agent may press the pressing member in a direction perpendicular to the surface of the insulating substrate while keeping the pressing surface of the pressing member parallel to the surface of the insulating substrate.

The step of adhering the film-type photosensitizer may press the entire region of the film-type photosensitizer simultaneously with the pressing surface of the pressing member.

In the step of adhering the film-type photosensitizer, the film-shaped photosensitizer may be pressed while the pressing surface of the pressing member is heated.

The heating temperature of the pressing member can be maintained at 70 to 80 캜.

The pressing member may include an air layer inside.

The decorative layer may be formed by printing colored ink on the back surface of the insulating substrate.

The manufacturing method of the touch screen panel may further include a step of forming a metal wiring on the rear side of the wiring region of the insulating substrate by printing after forming the transparent electrode wiring.

According to another aspect of the present invention, there is provided a method of manufacturing a touch screen panel including a step of attaching a film-type photosensitizer on a transparent electrode layer or a metal layer, the process comprising the steps of: A method of manufacturing a touch screen panel that presses a film-type photosensitizer with a pressing member having a flat pressing surface capable of elastic deformation can be provided.

According to another aspect of the present invention, there is provided a touch sensor comprising a pressing device for pressing a film-type photosensitive material adhered on a transparent electrode layer or a metal layer, wherein the pressing device is made of a material capable of elastic deformation and includes a pressing member having a flat- A manufacturing apparatus for a screen panel can be provided.

The pressing member may be provided by a rubber material capable of being elastically deformed.

The pressing member may include an air layer filled with compressed air therein.

The pressing member may include a heater for heating.

The pressing device may include a supporting panel for pressing the pressing member, and a pressing rod for pressing the supporting panel.

The method of manufacturing a touch screen panel according to an embodiment of the present invention includes pressing a film-type photosensitive agent using a pressing member having a plate-type pressing surface capable of elastic deformation in a process of attaching a film-type photosensitive agent, Type photoresist can be realized.

In addition, the method of manufacturing a touch screen panel according to the present embodiment can closely adhere a film-type photosensitive agent even to a stepped portion, thereby minimizing defects such as disconnection in the process of forming a transparent electrode wiring, , The thickness of the film-type photosensitizer can be made thinner, so that a finer pattern can be realized.

In addition, since the pressing surface of the pressing member presses the entire region of the film-type photosensitive agent at the same time, the method of manufacturing the touch screen panel according to the present embodiment can realize rapid attachment of the film-type photosensitive agent. Therefore, the process time can be shortened accordingly.

1 illustrates a cross-sectional structure of a touch screen panel that can be manufactured by a manufacturing method according to an embodiment of the present invention.
FIG. 2 is a flowchart of a process for schematically illustrating a method of manufacturing a touchscreen panel according to an exemplary embodiment of the present invention.
3 is a cross-sectional view schematically showing a method of manufacturing a touchscreen panel according to an embodiment of the present invention.
4 is a cross-sectional view illustrating a process of attaching a film-type photosensitizer and a pressing device therefor in a method of manufacturing a touchscreen panel according to an embodiment of the present invention.
FIG. 5 is a cross-sectional view illustrating a process of attaching a film-type photosensitizer and a pressing device therefor in a method of manufacturing a touchscreen panel according to an embodiment of the present invention, and shows a modification of the pressing device.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. It is to be understood that the embodiments described below are provided only to illustrate the present invention and are not intended to limit the scope of the present invention. The present invention may be embodied in other embodiments. For the sake of clarity of the present invention, the drawings may omit the parts of the drawings that are not related to the description, and the size of the elements and the like may be somewhat exaggerated to facilitate understanding.

1 illustrates a cross-sectional structure of a touch screen panel that can be manufactured by a manufacturing method according to an embodiment of the present invention. As shown, the touch screen panel 1 may include a transparent insulating substrate 10, a decorative layer 20, a transparent electrode wiring 30, a metal wiring 40, and an insulating layer 50. The touch screen panel 1 may be divided into a window region A where the transparent electrode wiring 30 is located and a wiring region B on the edge side where the metal wiring 40 is located.

The insulating substrate 10 may be a transparent glass substrate or a plastic substrate forming the outer surface of the display device. The glass substrate may include soda lime glass, tempered glass, and the like. The plastic substrate is made of silicon, PET (Polyethylene Terephthalate), PEN (Polyethylene Naphthalate), PES (Polyether Sulfone), Polyimide, PAR (Polyarylate), PC (Polycarbonate), Polymethyl Methacrylate (PMMA), Cycloolefin Copolymer And the like.

The decorative layer 20 is provided on the back surface of the wiring region B of the insulating substrate 10 so as to cover the metal wiring 40 or the like located in the wiring region B. The decorative layer 20 may be formed in such a manner that black paste, black ink, or the like is coated on the back surface of the wiring region (B) of the insulating substrate 10 by a screen printing method.

The transparent electrode wiring 30 functions to detect whether or not the surface of the insulating substrate 10 is in contact with the surface of the insulating substrate 10 by a capacitive method. The transparent electrode wiring 30 may be provided on the rear surface of the window region A of the insulating substrate 10 and on the rear surface of the decorative layer 20. The transparent electrode wiring 30 may be provided in such a manner that unnecessary portions are removed by photolithography in a state in which a transparent electrode layer is formed of a metal oxide or an organic material.

The metal oxide constituting the transparent electrode wiring 30 may be one selected from the group consisting of ITO (indium tin oxide), ATO (antimony tin oxide), zinc oxide (ZnO), tin oxide (SnO2), IZO (Indium Zinc Oxide), GZO Zinc Oxide), Aluminum-doped Zinc Oxide (AZO), and Codium Tin Oxide (CTO). The organic material may include at least one of polyaniline, polyacetylene, poly (3,4-ethylenedioxythiophene), polypyrrole, and carbon nanotube (CNT).

The metal wiring 40 may be formed on the rear surface of the decorative layer 20 and may be formed of a conductive material electrically connected to the transparent electrode wiring 30. The metal wiring 40 is formed of a metal such as Au, Ag, Cu, Al, Ni, W, Ti, Pt, (Sn), Pb, Zn, In, Cd, Cr, Mo, Fe, Co, Mg, , Tantalum (Ta), manganese (Mn), or the like.

The metal wiring 40 may be formed by printing a metal (Ag, Al, or the like) paste on the back side of the decorative layer 20 after the transparent electrode wiring 30 is provided. Of course, the metal interconnection 40 may be formed by a method of patterning by a photolithography process in the state where a metal layer is formed by vacuum deposition, sputtering or the like, like the transparent electrode interconnection 30.

The insulating layer 50 may be provided to cover the backside of the metal wiring 40 in a state where a flexible printed circuit board (FPCB) 60 is connected to the metal wiring 40. The insulating layer 50 may be provided to form an insulating film by printing an insulating material. As the insulating material, one or more of organic compounds such as urethane, polyester, and acrylic or inorganic compounds such as alumina (Al2O3), silica (SiO2), and magnesia (MgO) . ≪ / RTI >

Next, a method of manufacturing such a touch screen panel 1 will be described with reference to FIGS. 2 and 3. FIG.

2, the method for manufacturing the touch screen panel 1 includes an insulating substrate preparing step 71, a decorative layer forming step 72, a transparent electrode layer forming step 73, a film type photosensitive agent attaching step 74, A transparent electrode wiring forming step 75, a metal wiring forming step 76, a flexible circuit board bonding step 77, and an insulating layer forming step 78.

3 (b), the decorative layer forming step 71 forms a decorative layer 20 by applying black paste or black ink on the back surface of the wiring region B of the insulating substrate 10 by a screen printing method do. The present embodiment exemplifies the case where the decorative layer 20 is provided by a screen printing method, but the manner of forming the decorative layer 20 is not limited thereto. The decorative layer 20 is formed by coating a photosensitive resin composition containing a black pigment on the entire rear surface of an insulating substrate or by forming a thin film of chromium or the like by sputtering or chemical vapor deposition or the like on a window region by a photolithography process It may be provided in a manner that removes it.

The transparent electrode layer forming step 73 is performed so that the decorative layer 20 provided on the insulating substrate 10 and the back surface of the window region A are formed on the back surface of the window region A, And a film is formed of a metal oxide or an organic material. That is, the transparent electrode layer 31 is formed of a transparent conductive material such as indium tin oxide (ITO), indium zinc oxide (IZO), or zinc oxide (ZnO). The transparent electrode layer 31 may be formed by vacuum evaporation, ion plating, sputtering, chemical vapor deposition, or the like. Or a method of attaching a transparent electrode film made in the form of a thin film to the insulating substrate 10.

After the transparent electrode layer 31 is formed, a step 74 of attaching a film-type photosensor (DFR: Dry Film Photo Resist) 35 on the transparent electrode layer 31 is performed as shown in FIG. 3 (d) . Then, as shown in FIGS. 3 (d) to 3 (f), a transparent (transparent) electrode wiring pattern 30 is formed by patterning in such a manner as to remove unnecessary portions from the transparent electrode layer 31 by a photolithography process An electrode wiring forming step (75) is performed. That is, a transparent electrode wiring 30 as shown in FIG. 3F is formed through a photolithography process through exposure, development, etching, and stripping. 3 (d), reference numeral 36 denotes a mask for the exposure process.

The metal wiring forming step 76 is a step of forming the metal wiring 40 connected to the transparent electrode wiring 30 on the back side of the decorative layer 20 as shown in Fig. The metal wiring 40 can be formed by printing a metal (Ag, Al, etc.) paste.

After the metal wiring 40 is formed, a step 78 of connecting the flexible circuit board 60 and forming the insulating layer 50 is performed as shown in FIG. 3 (h). The insulating layer 50 may also be provided in a manner that an insulating material is applied to the back surface of the metal wiring 40 by printing.

The present embodiment shows a case where the metal wiring 40 is formed by a printing method, but the formation method of the metal wiring 40 is not limited thereto. The metal wiring 40 may be formed by a method of patterning by a photolithography process in the state where a metal layer (not shown) is formed by a method such as vacuum evaporation or sputtering in the same manner as the transparent electrode wiring 30. In this case, a metal layer may be formed on the transparent electrode layer 31, and a film-type photosensitizer 35 for the photolithography process may be deposited on the metal layer.

4, the step of attaching the film-type photosensitizer 35 on the transparent electrode layer 31 is performed by a pressing device (not shown) for pressing the film-shaped photosensitizer 31, (80) can be used. The pressing device 80 includes a pressing member 81 made of a material such as rubber or silicon capable of being elastically deformed, a holding panel 82 for pressing the pressing member 81, (83).

The pressing member 81 has a pressing surface 81a of a flat plate shape corresponding to or larger than the area of the film-like photosensitive member 35 to which the pressing member 81 is attached. The pressing member 81 is provided with a heater 84 for heating the pressing member 81. The heater 84 can be realized by a method in which an electric heater is embedded in the pressing member 81 or a method in which the heating fluid heated inside the pressing member 81 is circulated.

4A, the pressing surface 81a of the pressing member 81 is spaced apart from the insulating substrate 10 when the film type photosensitive agent 35 is attached using the pressing device 80 The film-type photosensitizer 35 is placed on the transparent electrode layer 31 in the state of FIG. At this time, the pressing surface 81a of the pressing member 81 maintains a state parallel to the surface of the insulating substrate 10.

4 (b), the pressing member 81 is moved in a direction perpendicular to the surface of the insulating substrate 10 to press the film-shaped photosensitive agent 35, do. At this time, since the pressing surface 81a of the pressing member 81 simultaneously presses the entire surface of the film-type photosensitizer 35 at an equal pressure, the film-type photosensitizer 35 can be uniformly attached to the transparent electrode layer 31. Particularly, since the pressing surface 81a of the pressing member is elastically deformed in the pressing process, even though there is a step on the upper surface of the transparent electrode layer 31 due to the formation of the decorative layer 20, the uniform attachment of the film- Can be implemented.

When the film-shaped photosensitive agent 35 is pressed by using the pressing member 81 which is elastically deformed, the stepped portion C can also be pressed with a high pressure. That is, since the pressing surface 81a of the pressing member 81 is deformed to correspond to the shape of the stepped portion C, the film-shaped photosensitive agent 35 is pressed against the stepped portion C, Can be attached. Further, since the pressing member 81 is heated by the heater 84, the pressing member 81 can be smoothly deformed in the pressing process, and the pressing force can be applied to almost the same level at the corners of the stepped portion C. At this time, the heating temperature of the pressing member 81 may be 70 to 80 캜.

As described above, since the film-shaped photosensitive material 35 can be closely attached even to the stepped portion C, defects such as disconnection can be prevented in the process of forming the transparent electrode wiring 30 thereafter. In addition, since the thickness of the film-type photosensitizer 35 can be made thinner and the adhesion can be tightened, a finer pattern can be realized. In addition, since the pressing surface 81a of the pressing member 81 presses the entire area of the film-type photosensitive member 35 at the same time, it is possible to realize rapid adhesion. Therefore, the process time can be shortened accordingly.

5 shows a modification of the pressurizing device. 5, the pressing member 181 is provided in the form of a tube made of rubber, silicone, or the like capable of being elastically deformed, and has an air layer 181b filled with compressed air therein. 5 (a), the pressure of the air layer 181b is maintained at a pressure such that the pressing surface 181a of the pressing member 181 can maintain a flat state in a state where the pressing member 181 is spaced apart maintain.

5 (b), the pressing device 180 deforms the pressing member 181 when the pressing member 181 presses the film-shaped photosensitive member 35, Even the stepped portion formed by the layer 20 can be pressed with a substantially uniform pressure. Further, the air layer 181b inside the pressing member 181 allows the pressing force to be uniformly dispersed throughout the pressing surface 181a, thereby realizing a more uniform attachment.

1: touch screen panel, 10: insulating substrate,
20: decorative layer, 30: transparent electrode wiring,
31: transparent electrode layer, 35: film-type photosensitizer,
36: mask, 40: metal wiring,
50: insulating layer, 60: flexible circuit board,
80: pressing device, 81: pressing member,
81a: pressing face, 82: supporting member,
84: Heater.

Claims (14)

A step of forming a decorative layer in a wiring region of a transparent insulating substrate;
Forming a transparent electrode layer on the window region of the insulating substrate and the decorative layer;
Placing a film-type photosensitive agent on the transparent electrode layer, pressing the film-type photosensitive agent with a pressing member having a plate-type pressing surface capable of being elastically deformed, and attaching the film-type photosensitive agent to the transparent electrode layer;
And removing the unnecessary portions of the transparent electrode layer by a photolithography process to form a patterned transparent electrode wiring. The method according to claim 1,
Wherein the step of adhering the film-type photosensitive agent presses the pressing member in a direction perpendicular to the surface of the insulating substrate while keeping the pressing surface of the pressing member parallel to the surface of the insulating substrate. The method according to claim 1,
Wherein the step of adhering the film-type photosensitizer simultaneously presses the entire region of the film-type photosensitizer with the pressing surface of the pressing member. 4. The method according to any one of claims 1 to 3,
Wherein the step of adhering the film-type photosensitizer presses the film-type photosensitizer while heating the pressing surface of the pressing member. 5. The method of claim 4,
Wherein the heating temperature of the pressing member is maintained at 70 to 80 占 폚. The method according to claim 1,
Wherein the pressing member includes an air layer inside. The method according to claim 1,
Wherein the decorative layer is formed by printing colored ink on the back surface of the insulating substrate. The method according to claim 1,
Further comprising the step of forming a metal wiring on the back side of the wiring region of the insulating substrate by a printing method after forming the transparent electrode wiring. A method of manufacturing a touch screen panel including a step of attaching a film-type photosensitizer on a transparent electrode layer or a metal layer,
Wherein the step of attaching the film type photosensitizer comprises pressing a film type photosensitizer with a pressing member having a plate type pressing face capable of elastically deforming the film type photosensitizer at the attachment position. An apparatus for manufacturing a touch screen panel having a transparent electrode layer or a pressing device for pressing a film-type photosensitive agent adhering on a metal layer,
Wherein the pressing device includes a pressing member having a flat pressing surface, the pressing device being made of a material capable of being elastically deformed. 11. The method of claim 10,
Wherein the pressing member is provided by a rubber material capable of being elastically deformed. 12. The method of claim 11,
Wherein the pressing member includes an air layer filled with compressed air therein. 13. The method according to any one of claims 10 to 12,
Wherein the pressing member includes a heater for heating. 11. The method of claim 10,
Wherein the pressing device includes a supporting panel for pressing the pressing member and a pressing rod for pressing the supporting panel.

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