KR101450066B1 - USB memory device having functions of wireless signal transmission and wireless power driving and USB system using the same - Google Patents

Abstract

The present invention provides a USB memory device having wireless signal transmission and wireless power source driving functions. A USB memory device according to an embodiment of the present invention includes: a substrate including a first side and a second side opposite to each other; One or more memory semiconductor chips mounted on a substrate; A wireless power supply unit mounted on the substrate and receiving power wirelessly to provide power to the control semiconductor chips and the memory semiconductor chips; And a wireless signal unit mounted on the substrate and transmitting and receiving data by using a wireless signal to provide data to the memory semiconductor chips.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a USB memory device having a wireless signal transmission function and a wireless power source driving function, and a USB system using the USB memory device.

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a USB memory device, and more particularly, to a USB memory device having wireless signal transmission and wireless power source driving functions and a USB system using the same.

As the performance of the hardware of the computing device is improved, the data or the program used by the user in the computing device is also rapidly increasing in size. As semiconductor manufacturing technology also develops in this way, it becomes possible to highly integrate semiconductor memory devices, and a USB memory device having a large capacity has become popular. Such a portable storage device is widely used because it is easy to carry and can reliably transmit a large-capacity file to another person. However, since a conventional USB memory device is connected to an external host through a wired terminal, there is a limitation that connection with an external host is limited when there is no USB port or is insufficient.

SUMMARY OF THE INVENTION The present invention provides a USB memory device having wireless signal transmission and wireless power source driving functions.

It is another object of the present invention to provide a USB system using a USB memory device having wireless signal transmission and wireless power source driving functions.

According to an aspect of the present invention, there is provided a USB memory device including: a substrate including a first side and a second side opposite to each other; One or more memory semiconductor chips mounted on the substrate; A wireless power supply unit mounted on the substrate and receiving wireless power to provide power to the memory semiconductor chips; And a wireless signal unit mounted on the substrate and transmitting and receiving data using a wireless signal and providing the data to the memory semiconductor chips.

In some embodiments of the present invention, the memory semiconductor chips are plural, and may also include a chip radio signal transmitter and a chip radio receiver, respectively. The wireless signal unit may include a wireless signal transmitting unit and a wireless signal receiving unit. In addition, the chip radio signal transmitting end may be vertically aligned with the radio signal receiving end. The chip radio signal receiving end may be vertically aligned with the radio signal transmitting end.

In some embodiments of the present invention, the memory semiconductor chips may include a first memory semiconductor chip having a first chip radio signal transmitter and a first chip radio receiver, and a second memory chip coupled to the first chip, And a second memory semiconductor chip having a signal transmitting terminal and a second chip wireless signal receiving terminal. The radio signal unit may include first and second radio signal transmitting units and first and second radio signal receiving units. The first chip radio signal transmitting terminal may be vertically aligned with the first radio signal receiving terminal. The first chip wireless signal receiving end may be vertically aligned with the first wireless signal transmitting end. In addition, the second chip radio signal transmitting end may be vertically aligned with the second radio signal receiving end. In addition, the second chip wireless signal receiving end may be vertically aligned with the second wireless signal transmitting end.

In some embodiments of the present invention, the memory semiconductor chips may be powered wirelessly from the wireless power supply.

In some embodiments of the present invention, the memory semiconductor chips, the wireless power supply, and the wireless signal portion may be located on the first side.

In some embodiments of the present invention, the first side may include one or more first recessed regions. Also, at least one of the radio power unit and the radio signal unit may be located in the first recess region. In addition, the memory semiconductor chips may be overlapped with at least one of the radio power unit and the radio signal unit.

In some embodiments of the present invention, the memory semiconductor chips are located on the first side, the wireless power supply, and the wireless signal portion may be located on the second side.

In some embodiments of the present invention, the second side may include one or more second recessed regions. Also, at least one of the radio power unit and the radio signal unit may be located in the second recess region.

According to an aspect of the present invention, there is provided a USB system comprising: a host; And a USB memory device that is driven by receiving power wirelessly from the host and wirelessly transmits and receives data to and from the host.

Since the USB memory device according to the embodiments of the present invention can receive power and signals wirelessly and can also transmit and receive signals wirelessly, a terminal connected to the outside can be omitted, and an internal circuit can be easily formed And can send and receive data to and from a host that lacks or lacks a USB port. Further, the USB memory device can be made thin by mounting the elements in the recessed region included in the substrate.

1 is a block diagram that schematically illustrates components of a USB memory device and method of operation according to some embodiments of the present invention in connection with a host.
FIG. 2 is a block diagram schematically showing the operation of the radio signal unit of FIG. 1 in relation to a host.
3 is a cross-sectional view illustrating a USB memory device according to some embodiments of the present invention.
4 is a block diagram illustrating a power receiver of the wireless power unit of FIG.
5 is a block diagram showing a power transmission unit of the wireless power supply unit of FIG.
Figs. 6 to 9 are schematic diagrams showing the radio signal unit of Fig. 3. Fig.
10 is a cross-sectional view illustrating a USB memory device according to some embodiments of the present invention.
11-13 are cross-sectional views illustrating USB memory devices in accordance with some embodiments of the present invention.
Figs. 14 and 15 are schematic diagrams showing the positional relationship between the radio signal transmitting / receiving end and the chip radio signal transmitting / receiving unit of Fig.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. The embodiments of the present invention are described in order to more fully explain the present invention to those skilled in the art, and the following embodiments may be modified into various other forms, It is not limited to the embodiment. Rather, these embodiments are provided so that this disclosure will be more faithful and complete, and will fully convey the scope of the invention to those skilled in the art.

In the following description, terms used in this specification are used to describe specific embodiments and are not intended to limit the present invention. As used herein, the singular form of a description may include plural forms unless the context clearly dictates otherwise. Also, the phrases "comprising" and / or "comprising" as used herein do not specify the presence of stated steps, operations, elements, elements, shapes, numbers, and / Elements, shapes, numbers, and / or the presence or addition of one or more of the above-described steps, operations, elements, elements, Also, "and / or" includes any one of the listed items and any combination of one or more of the listed items.

Although the terms first, second, etc. are used herein to describe various elements, regions, sections, means and / or functions, these elements, regions, sections, means and / It is obvious that no. These terms are intended to be used to distinguish one element, area, section, means, or function from another element, area, section, means, or function. Thus, a first member, area, section, means or function described below may be referred to as a second member, region, section, means or function without departing from the teachings of the present invention.

Hereinafter, embodiments of the present invention will be described with reference to the drawings schematically showing embodiments of the present invention. Wherein like reference numerals refer to like elements throughout. The elements shown in the drawings are presented for convenience and clarity of description, and variations and modifications may be expected in the art. Accordingly, the embodiments of the present invention should not be construed as being limited to the specific forms disclosed herein.

USB (Universal Serial Bus) is an interface developed to solve the inconvenience caused by the slow speed of existing external expansion ports, which is a kind of serial port, and limited device connection. Generally, a USB system is composed of a USB host and a USB memory device, and all the USB devices are connected to the USB host, and can usually be a personal computer. When a USB memory device is wired or wirelessly connected to a USB interface provided in the host, the host displays a list of files stored in the USB memory device via the user interface, The user can execute the desired file. Such a USB system can connect peripherals such as a keyboard, a monitor, a mouse, a printer, or a modem, which are connected by different connection methods, at the same time and can connect up to 127 peripherals. When a new peripheral is connected, And automatic recognition without performing the reboot process, and it is easy to install because the plug and play (PnP) is fully supported.

1 is a block diagram schematically illustrating components of a USB memory device 1 and a method of operation according to some embodiments of the present invention in relation to a host H. In Fig.

1, a USB memory device 1 includes a control element 2, a wireless power supply element 3, a wireless signal element 4, and a memory element 6. The memory element 6 stores data and may comprise a non-volatile memory, for example a flash memory, in which no data is lost even in the absence of a supply of power. The control element (2) controls access to the data stored in the memory element (6). The control element 2 may be a separate control semiconductor chip, such as an application specific integrated circuit (ASIC), or it may be a control program stored in the system area of the memory element 6. The control element 2 can be designed to be automatically executed by the operating system of the host H when, for example, the USB memory device 1 is connected to the host H. [ In this case, the control element 2 may include a script for automatic execution and an application program that can be executed in the host H. [ The wireless power supply element 3 can receive power from the host H wirelessly and the wireless power supply element 3 can supply power to the control element 2, the wireless signal element 4 and the memory element 6 Can be supplied and operated. The power provided by the wireless power supply element 3 may be, for example, a voltage of 3 V to 5 V and a current of 100 to 500 mA. The radio signal element 4 can also be powered by the wireless power supply element 3 and can transmit and receive wirelessly with the host H. [ The radio signal element (4) can be controlled by the control element (2). The radio signal element 4 can be transmitted with serial data and inverted serial data obtained by inverting the serial data, respectively. As described above, by simultaneously transmitting the serial data and the inverted serial data, it is possible to minimize the noise that may occur when data is transmitted. When the USB memory device 1 is connected to the host H via the wireless signal element 4, an enumeration is performed. The enumeration is a process in which the host H determines the endpoint type, the number, or the product type of the USB memory device 1 and the host H sends the USB memory device 1 an address And acquires a device descriptor and a configuration descriptor from the USB memory device 1 to prepare for data transmission and reception. The USB memory device 1 may be a USB 1.1 standard with a transfer rate of up to 12 Mbps or a USB 2.0 standard with a transfer rate of up to 480 Mbps or a USB 3.0 standard with a transfer rate of up to 4.8 Gbps.

In the present specification, a USB flash drive has been described as an example for explaining the USB memory device 1 according to the embodiments of the present invention. However, the present invention is not limited thereto It is not. For example, the USB memory device 1 may be one of various types of memory cards, such as a PC Card (PCMCIA), CompactFlash (CF), SmartMedia (SM / SMC) A memory card including a Memory Stick Duo (MSD), a Multimedia Card (MMC), a Secure Digital card (SD), a miniSD card, a microSD card, and an xD-Picture Card. The host H disclosed in this specification may include all kinds of devices including an operation unit, a storage unit, a control unit, and an input / output unit, and may be a computer, a personal computer (PC) A personal digital assistant (PDA), a mobile phone, an MP3 player, a navigation, a portable multimedia player (PMP), or a repeater.

Fig. 2 is a block diagram schematically illustrating the operation of the radio signal element 4 of Fig. 1 in relation to the host H. Fig.

2, the wireless signal element 4 of the USB memory device 1 may include a wireless signal transmission / reception element 4a, a wireless signal circuit element 4b and a wireless signal control element 4c. The host H may be an external device capable of exchanging information with the USB memory device 1, and may include, for example, a host transmission / reception terminal H1. The wireless signal element 4 can transmit and receive data wirelessly with the host H and wirelessly transmit and receive the data through the wireless signal transmission and reception element 4a and the host transmission and reception terminal H1 have.

The radio signal transmitting / receiving element 4a may include a separately provided transmitting antenna and a receiving antenna, or may include a transmitting / receiving antenna. In addition, the host transmission / reception terminal H1 may include a separately provided transmission antenna and reception antenna, or may include a transmission / reception antenna. In addition, the host transmission / reception terminal H1 may be a separate device that can be attached to the host H, and may be implemented by separately connecting a device having a wireless transmission / reception function to an existing host that does not have a wireless signal transmission / reception function have. Alternatively, the host transmission / reception terminal H1 may be a device integrally formed with the host H, and the wireless signal transmission / reception function may be embodied in the host H.

The process of the USB memory device 1 receiving data from the host H will be described in detail. The process by which the USB memory device 1 receives data from the host H is shown by a solid arrow. The host transmission / reception terminal H1 of the host H transmits data wirelessly to the wireless signal transmission / reception element 4a. The data received at the radio signal transmitting / receiving element 4a is transmitted to the radio signal circuit element 4b by the radio signal controlling element 4c. The wireless signal circuit element 4b can convert the received data into a signal in a form usable in the USB memory device 1. [ In addition, the radio signal circuit element 4b may include a filter (not shown) for filtering radio data of actual usable frequency band among data wirelessly received by the host transmission / reception terminal H1. The wireless signal circuit element 4b may have information on a predefined frequency band and protocol for data to be exchanged between the host H and the USB memory device 1, (4c). Among the data converted in the wireless signal circuit element 4b, data to be stored in the USB memory device 1 can be stored in the memory element 6. [

The process in which the USB memory device 1 transmits data to the host H will be described in detail. The process of transmitting data from the USB memory device 1 to the host H is shown by a dotted arrow. The data to be transmitted among the data stored in the memory element 6 by the radio signal control element 4c can be transmitted to the radio signal circuit element 4b. The radio signal circuit element 4b can, by means of the radio signal control element 4c, convert the data transmitted from the memory element 6 into a signal suitable for radio transmission. The radio signal circuit element 4b may comprise, for example, an impulse generator. Data suitable for radio transmission converted by the radio signal circuit element 4b may be transmitted to the radio signal transmitting / receiving element 4a and transmitted wirelessly. Thereafter, the wirelessly transmitted signal can be received by the host transmission / reception terminal H1 and transmitted to the host H.

The wireless signal transmission between the host H and the USB memory device 1 can be performed by using an infrared data association (IrDA), a radio frequency identification (RFID), a Zigbee, a Bluetooth, a Wi- (UWB, Ultra Wide Band) scheme. Alternatively, the wireless signal transmission between the host H and the USB memory device 1 is performed by combining a method suitable for low capacity data transmission (for example, ZigBee) and a method suitable for high capacity data transmission (for example, UWB) So that the transfer of the drive signal, which is the low-capacity data, and the storage data, which is the high-capacity data, can be separately performed. Or wireless signal transmission between the host H and the USB memory device 1 may be achieved by combining electrostatic induction or magnetic induction methods together with the above methods. In this case, the host H and the USB memory device 1 can implement a proximity wireless scheme capable of transmitting information only within a few centimeters, thereby enhancing security.

3 is a cross-sectional view showing a USB memory device 1 according to some embodiments of the present invention.

3, a USB memory device 1 includes a substrate 10, one or more control semiconductor chips 20, one or more passive components 24, and one or more memory semiconductor chips 60 ). The USB memory device 1 also includes a wireless power supply unit 30 and a wireless signal unit 40. [ The USB memory device 1 also optionally includes control semiconductor chips 20, passive components 24, memory semiconductor chips 60, a wireless power supply 30, and a wireless signal portion 40 And may further include a case 90 that may include an encapsulating material 80 and surround the outside thereof.

The substrate 10 includes a first side 12 and a second side 14 opposite the first side 12. The wireless power supply unit 30 and the wireless signal unit 40 may be located in a part of the first side 12. Also, control semiconductor chips 20, passive elements 24, and memory semiconductor chips 60 may be located in a portion of the first side 12. The control semiconductor chips 20, the passive elements 24, the wireless power supply unit 30, the wireless signal unit 40, and the memory semiconductor chips 60 can be electrically connected by the wiring 16. Therefore, power can be supplied from the wireless power supply unit 30 through the wiring 16. [

The substrate 10 may comprise an epoxy resin, a polyimide resin, a bismaleimide triazine (BT) resin, FR-4 (Flame Retardant 4), FR-5, ceramic, silicone, or glass, And the present invention is not limited thereto. The substrate 10 may be a single layer or may include a multi-layer structure including wiring patterns therein. For example, the substrate 10 may be a rigid flat plate, a plurality of rigid flat plates adhered to each other, or a rigid flat plate adhered to a thin flexible printed circuit board. The plurality of rigid flat plates, or the printed circuit boards, which are adhered to each other, may each include a wiring pattern. In addition, the substrate 10 may be a low temperature co-fired ceramic (LTCC) substrate. The LTCC substrate may include a plurality of ceramic layers stacked, and may include a wiring pattern therein.

The control semiconductor chip 20 can be electrically connected to the wiring 16 through the first connection member 22. [ The control semiconductor chip 20 may correspond to the control element 2 of Fig. The control semiconductor chips 20 can control the communication between the USB memory device 1 and the host H and also control the operation of programming, reading, and erasing data in the memory semiconductor chip 60. [ In addition, the control semiconductor chip 120 may be a semiconductor die or a semiconductor package. The first connecting member 22 may be a bonding wire, and the bonding wire may be gold, silver, copper, aluminum, or an alloy thereof. The bonding wire may be formed in a normal forward folded loop mode or a reverse loop mode. Also, although the first connecting member 22 is shown as a bonding wire, this is merely an example, and the present invention is not limited thereto. For example, the first connection member 122 may be a conductive vias such as solder balls, flip-chip bonding members, bumps, though silicon via, or combinations thereof.

The passive element 24 may be located on a portion of the first side 12 and may be electrically connected to the wiring 16 via solder or solder. The passive element 24 may be a resistance element, an inductor element, a capacitor element, or a switch element, but the present invention is not limited thereto.

The wireless power supply unit 30 may include a power receiving unit 32, a power transmitting unit 34, or both. The wireless power supply 30 may correspond to the wireless power supply 3 of FIG. The power receiving unit 32 can receive power from the outside, for example, from the host H wirelessly, and the power transmitting unit 34 can transmit power wirelessly. For example, the power received through the power receiving section 32 is supplied to the control semiconductor chips 20, the passive elements 24, the wireless signal section 40, and the memory semiconductor chips 60 via the wiring 16 Can be supplied. In addition, the power receiving unit 32 or the power transmitting unit 34 may be omitted as an optional component. For example, in place of the power receiving section 32 that receives power wirelessly, power can be supplied from an external power source (not shown) such as a battery or a power supply through a wired line (not shown) such as a terminal . In addition, power can be supplied through the wiring 16, for example, instead of the power transmission unit 34 that transmits power wirelessly. The power receiving unit 32 and the power transmitting unit 34 will be described in detail below with reference to FIG. 4 and FIG.

The wireless signal unit 40 may include a wireless signal transmission / reception terminal 42, a wireless signal circuit unit 44, and a wireless signal control unit 46. The radio signal section 40 may correspond to the radio signal element 4 of FIG. The radio signal transmitting / receiving unit 42, the radio signal circuit unit 44 and the radio signal controlling unit 46 are connected to the radio signal transmitting / receiving element 4a, the radio signal circuit element 4b and the radio signal controlling element 4c ). ≪ / RTI > The radio signal unit 40 can perform both transmission and reception of radio signals or only transmission or reception of radio signals. The radio signal transmitting / receiving end 42 can transmit or receive radio signals from the host H (see FIG. 2). In addition, the radio signal transmitting / receiving end 42 may transmit or receive a radio signal from the memory semiconductor chips 60. Therefore, the radio signal transmitting / receiving end 42 is located in correspondence with the host transmitting / receiving end H1 of the host H so as to transmit and receive the radio signal, or in correspondence with the chip signal transmitting / receiving end included in the memory semiconductor chips 60 Can be located. The radio signal circuitry 44 may generate or convert the signals transmitted or received at the radio signal transmitting and receiving end 42. The radio signal control unit 46 can control the radio signal transmission / reception end 42 and the radio signal circuit unit 44 to transmit or receive signals. The wireless signal unit 40 will be described in detail below with reference to FIGS. 6 to 9. FIG.

The memory semiconductor chip 60 may be electrically connected to the wiring pattern 16 through the second connection member 62. [ The memory semiconductor chip 60 may correspond to the memory element 6 of Fig. The memory semiconductor chip 60 is a storage device capable of storing data and is a storage device such as a NAND flash memory, a PRAM (Phase-change random access memory), an RRAM (Resistive RAM), a FeRAM (Ferroelectric RAM) Volatile memory. In addition, the memory semiconductor chips 60 may have the same or different sizes. In addition, the memory semiconductor chip 60 may be a semiconductor die or a semiconductor package. The types, the number, the size, the stacking method, the stacking manner, and the like of the memory semiconductor chip 60 shown in the figure are illustrative and the present invention is not limited thereto. The second connecting member 62 may be a bonding wire, and the bonding wire may be gold, silver, copper, aluminum, or an alloy thereof. In the drawing, the second connecting member 62 is shown as a bonding wire, but this is merely an example, and the present invention is not limited thereto. For example, the second connection member 142 may be a conductive vias such as solder balls, flip chip bonding members, bumps, though silicon via (TSV), or a combination thereof.

The encapsulant 80 can be an encapsulant material, for example, an epoxy resin or a silicone resin, which is exemplary and the present invention is not limited thereto. The encapsulant 80 protects the substrate 10, the control semiconductor chips 20, the passive elements 24, the wireless power supply 30, the wireless signal portion 40, and the memory semiconductor chips 60 from the outside . In addition, the case 90 may include a metal or a polymer, and may protect the USB memory device 1 from the outside, and in some cases, at least a part of the case 90 may be omitted. Further, the sealing material 80 can replace the function of the case 90. [

Hereinafter, the wireless power supply unit 30 will be described in detail with reference to FIGS. 4 and 5. FIG. 4 is a block diagram showing a power receiving unit 32 of the wireless power supply unit 30 of FIG. 5 is a block diagram showing the power transmission unit 34 of the wireless power supply unit 30 of FIG.

The wireless power supply unit 30 may be a radio frequency (RF) wave or a radiative system using ultrasound waves, an inductive coupling system using magnetic induction, or a non-radiative type using magnetic resonance non-radiative manner. < / RTI > The radial system can receive and transmit power energy wirelessly using a monopole or PIFA (Planar Inverted-F antenna) antenna. In the radial system, radiation is generated while an electric field or a magnetic field varying with time interacts with each other. When there is an antenna of the same frequency, power can be received and transmitted according to the polarization characteristic of the incident wave. The inductive coupling system can receive and transmit power energy wirelessly by generating a strong magnetic field in one direction by winding the coil a plurality of times and generating a coupling by bringing a resonant coil in close range within a similar range of frequencies . The non-radiative scheme can receive and transmit power energy wirelessly by using evanescent wave coupling that moves electromagnetic waves between two media that resonate at the same frequency through a near field.

4, the power receiving unit 32 may include a power receiving unit 32a, a power converting unit 32b, a power storing / supplying unit 32c, a power detecting unit 32d, and a power controlling unit 32e. have.

The power receiving terminal 32a wirelessly receives an external power signal transmitted from the outside, for example, from the host H, and transmits it to the power converting unit 32b. The power receiving end 32a may include an antenna, a coil, or a resonator, and the external power signal may be an AC signal. In this case, the external power signal may be received by the radial system, inductive coupling system, or non-radiative system described above. If necessary, the power receiving end 32a may be configured to convert the external power signal into a high frequency alternating current.

The power conversion section 32b can convert the power signal received from the power receiving terminal 32a, for example, an AC signal into a DC signal. Specifically, the power converting section 32b may include a voltage limiting circuit (not shown) and a rectifying circuit (not shown). The voltage limiting circuit may function to prevent the AC signal from being excessively supplied. The rectifying circuit may rectify the AC signal to a DC current. When a DC signal is transmitted from the power receiving terminal 32a, the power converting section 32b may be omitted or may function to convert the DC signal to a predetermined voltage. Then, the DC signal converted by the power conversion unit 32b may be transmitted to the power storage / provision unit 32c.

The power storage / provision unit 32c may include a power storage element such as a capacitor, and may store the direct current signal transmitted to the power conversion unit 32b. In addition, the DC signal, i.e., power, can be transmitted to the power transmitter 34 through wiring or the like, and other components such as control semiconductor chips 20, wireless signal portion 40, and / (60). ≪ / RTI > The power storage / provision unit 32c may be omitted as an optional component, and in this case, power can be supplied directly to other elements from the power conversion unit 32b.

The power detection unit 32d continuously measures a power value, for example, a voltage value and a current value, supplied from the power conversion unit 32d to the power storage / provision unit 32c, Information to the power control section 32e. For example, the power detection section 32d may be a circuit including a resistance element capable of directly measuring the voltage value and the current value.

The power control unit 32e can control the overall operation of the power receiving unit 32. [ The power control section 32e can be operated by the DC current delivered by the power conversion section 32b. The power control unit 32e receives the voltage value and the current value transmitted from the power detection unit 32d and can control the driving of the power conversion unit 32b accordingly. For example, the power control section 32e compares the voltage value and the current value measured and transmitted by the power detection section 32d with a predetermined reference voltage value and a reference current value, thereby controlling the power conversion section 32b and the power The driving of the power conversion section can be controlled so that the overvoltage or the overcurrent of the storage / provision section 32c does not occur. Further, the function of the power control section 32e can be performed by the control semiconductor chips 20. [

5, the power transmitting unit 34 may include a power converting unit 34a, a high frequency power driving unit 34b, a power transmitting unit 34c, a power detecting unit 34d, and a power controlling unit 34e.

The power conversion unit 34a may receive a power signal transmitted from the outside, for example, an AC signal or a DC signal, or may receive the DC power transmitted from the power receiving unit 32. [ Accordingly, the power conversion section 34a can convert the received AC power into a DC current or convert the received DC power into a desired DC voltage or current. Then, the power conversion unit 34a can supply the operating power to the high-frequency power driving unit 34b and the power control unit 34e. Similar to the power conversion section 32b described above, the power conversion section 34a may include a voltage limiting circuit (not shown) and a rectifying circuit (not shown). In addition, the power conversion section 34a is optional and may be omitted in some cases.

The high-frequency power driver 34b is driven in accordance with the received operating power so as to generate alternating-current power, for example, high-frequency power. For example, the high-frequency power driver 34b may include a switching mode power supply (SMPS) that generates the high-frequency alternating current through a high-speed switching operation. Then, the high-frequency power generated by the high-frequency power driver 34b may be provided to other elements, for example, memory semiconductor chips 60, and the heat driver 70, wirelessly through the power transmitter 34c.

The power detector 32d continuously measures a power value, for example, a voltage value and a current value, supplied from the high-frequency power driver 34b to the power transmitter 34c, and outputs information about the voltage value and the current value to the power To the control unit 34e. For example, the power detection section 34d may be a circuit including a resistance element capable of directly measuring the voltage value and the current value.

The power control section 34e can control the overall operation of the power transmission section 32. [ The power control section 34e can be operated by the DC current delivered by the power conversion section 34a. Similar to the power control unit 32e, the power control unit 34e receives the voltage value and the current value transmitted from the power detection unit 34d and can control the driving of the power conversion unit 34a accordingly. The power control unit 34e controls the high frequency power driving unit 34b to modulate the width, amplitude, frequency, and number of pulses of the generated high frequency power pulse, can do. By using the pulse width modulation (PWM), pulse amplitude modulation (PAM), pulse frequency modulation (PFM), pulse number modulation (PNM) 1 power control unit can adjust the power of the high frequency alternating current. In addition, the function of the power control section 34e can be performed by the control semiconductor chips 20. [

The power transmitting terminal 34c receives a high frequency alternating current from the high frequency power driving section 34b and supplies power to the control semiconductor chips 20, the passive elements 24, the wireless signal section 40, and the memory semiconductor chips 60 As shown in FIG.

The power transmitting unit 34c of the wireless power supply unit 30 may be a monopole or a PIFA type power supply unit when the wireless power supply unit 30 uses a radio frequency wave or an ultrasonic wave, and a planar inverted-F antenna. The antenna generates an electromagnetic wave in accordance with a high frequency current, and a receiving antenna included in the elements, for example, the memory semiconductor chips 60 receiving the generated power, receives the electromagnetic wave to generate high frequency power from the electromagnetic wave .

In the case of the inductive coupling method described above, that is, when the wireless power supply unit 30 uses magnetic induction, the power transmitting terminal 34c of the wireless power supply unit 30 may include a coil. According to the electromagnetic induction principle, when a high frequency current is applied to the power transmitting terminal 34c, the coil generates a magnetic field, and the receiving coil included in the devices, for example, the memory semiconductor chips 60, And generates a high-frequency current from the magnetic field.

In the case of the above-described non-radiation type wireless power transmission system, that is, when the wireless power supply unit 30 uses magnetic field resonance, the power transmission terminal 34c includes a resonator for generating an evanescent wave . The attenuation wave produces a steel sheet field in a short distance and the intensity decreases exponentially as the distance increases. The resonator of the power transmitting terminal 34c may resonate at the same frequency as the receiving resonator of the devices receiving the generated power, for example, the memory semiconductor chips 60. In this case, a kind of energy tunnel A near field electromagnetic field can be formed. When a high frequency current is applied to the power transmitting terminal 34c, the resonator generates a damping wave, and the damping wave can wirelessly transmit the power through the near field.

Hereinafter, the radio signal unit 40 will be described in detail with reference to FIGS. 6 to 9. FIG. 6 to 9 are schematic diagrams showing the radio signal section 40 of Fig.

The wireless signal unit 40 may transmit and receive a wireless signal by a proximity wireless scheme. Accordingly, the wireless signal unit 40 can transmit or receive a wireless signal by magnetic induction or electrostatic induction. The wireless signal unit 40 may transmit or receive a wireless signal through an RF (Radio Frequency). The radio signal transmitting / receiving end 42 may include a coil or an antenna.

6, the radio signal unit 40 includes a radio signal transmitting / receiving end 42, a radio signal circuit unit 44, and a radio signal control unit 46. The radio signal transmitting / receiving end 42 may be composed of, for example, a transmitting antenna and a receiving antenna, respectively. In the case where the radio signal transmitting / receiving end 42 is formed of an antenna, the transmitting antenna and the receiving antenna can be designed in consideration of the wavelength of RF used for signal transmission. Alternatively, the radio signal transmitting / receiving end 42 may be a coil for transmitting and receiving signals. In the case where the radio signal transmitting / receiving end 42 is made up of a coil, the transmitting and receiving may be carried out in the same coil or may be performed by transmitting and receiving, respectively, by providing separate coils for transmitting and receiving, respectively. Hereinafter, for convenience of explanation, only one case where the transmitting coil and the receiving coil are separately provided will be described.

The radio signal unit 40 may include a radio signal transmitting / receiving end 42 composed of one coil. The coils included in the radio signal transmitting / receiving end 42 may be disposed so that the coils of the chip radio signal transmitting and receiving unit 66 (see FIG. 10) included in the memory semiconductor chips 60 are coaxial with the coils. Alternatively, the coils included in the radio signal transmitting / receiving end 42 may be arranged so that the coils of the host transmitting / receiving element Ha of the host H coincide with the central axis. However, the sizes of these coils do not have to be the same, and the size of the coils may be changed to obtain the desired reception sensitivity. The positional relationship between the radio signal transmitting / receiving end 42, the radio signal circuit portion 44 and the radio signal controlling portion 46 is not limited to the form shown in FIG. Also, as described later, the number of coils constituting the radio signal transmitting / receiving end 42 may vary.

Referring to FIG. 7, the radio signal transmitting / receiving end 42 is composed of two coils 42a and 42b. The first coil 42a and the second coil 42b constituting the radio signal transmitting / receiving end 42 may be arranged to generate magnetic field signals whose phases are inverted by 180 degrees from each other. In this case, two coils of the same configuration can be used for the chip radio signal transmitting and receiving unit 66 (see Fig. 10). If two coils are used in this way, differential transmission is possible and noise can be removed. Accordingly, the wireless signal circuitry 44 may include a differential circuit.

Referring to FIG. 8, the radio signal transmitting / receiving end 42 is composed of two coils 42a and 42b. At this time, the first coil 42a and the second coil 42b constituting the radio signal transmitting / receiving end 42 are connected in parallel and arranged so as to generate a magnetic field signal whose phase is inverted by 180 degrees. In this case, two coils of the same configuration can be used for the chip radio signal transmitting and receiving unit 66 (see Fig. 10). If two coils are used in this way, differential transmission is possible and noise can be removed. Accordingly, the wireless signal circuitry 44 may include a differential circuit.

Referring to FIG. 9, the radio signal transmitting / receiving end 42 is composed of two coils 42a and 42b. At this time, the first coil 42a and the second coil 42b constituting the radio signal transmitting / receiving end 42 are connected in series and can be arranged to generate a magnetic field signal whose phase is inverted by 180 degrees. In this case, two coils having the same configuration can be used for the chip radio signal transmitting and receiving unit 66 (see Fig. 10). If two coils are used in this way, differential transmission is possible and noise can be removed. Accordingly, the wireless signal circuitry 44 may include a differential circuit.

10 is a cross-sectional view showing a USB memory device 1a according to some embodiments of the present invention. For the sake of brevity and clarity of the present embodiment, the description of the parts overlapping with the above-described embodiment will be omitted.

10, a USB memory device 1a includes a substrate 10 and includes one or more control semiconductor chips 20 located on a first side 12 of the substrate 10, The passive components 24, the wireless power supply 30 wireless signal portion 40, and one or more memory semiconductor chips 60a. In addition, the USB memory device 1 may further include a case 90 optionally. The memory semiconductor chips 60a may include a chip power receiving unit 64 and a chip radio signal transmitting and receiving unit 66 in place of the second connecting member 62 in Fig. The chip power receiving unit 64 may receive the power transmitted from the power transmitting unit 34 and provide power to the memory semiconductor chips 60. [ The chip radio signal transmitting and receiving unit 66 can transmit and receive radio signals to and from the radio signal transmitting and receiving end 42. The illustrated number and position of the chip power receiving unit 64 and the chip radio signal transmitting and receiving unit 66 are illustrative, and the present invention is not limited thereto. Although not shown, the control semiconductor chips 20 may also include components that perform similar functions as the chip power receiver 64 and the chip radio signal transceiver 66, Receive the transmitted power, or transmit / receive a radio signal to / from the radio signal transmitting / receiving end 42. In this case, the first connecting member 22 may be omitted.

It will be appreciated that the technical features described above with reference to Figures 3 and 10 can be applied in combination with one another. That is, the USB memory device 1a according to the present invention includes the memory semiconductor chips 60a of FIG. 10 and the control semiconductor chips 20 of FIG. 3, or the memory semiconductor chips 60 of FIG. Control semiconductor chips 20a. Alternatively, the memory semiconductor chips 60 of FIG. 3 and the memory semiconductor chips 60a of FIG. 10 may be mixed. These modifications are equally applicable to the following embodiments.

11-13 are cross-sectional views showing USB memory devices 1b, 1c, 1d according to some embodiments of the present invention. For the sake of brevity and clarity of the present embodiment, the description of the parts overlapping with the above-described embodiment will be omitted.

11, the USB memory device 1b is different from the USB memory device 1a of FIG. 10 in that the first side 12 of the substrate 10 is provided with the first recessed area R1 and the second And a recessed region R2. The wireless power supply unit 30 and / or the wireless signal unit 40 may be mounted in the first recess region R1 and optionally sealed by the encapsulant 82. The wireless power supply unit 30 and the wireless signal unit 40 may be mounted so as not to protrude from the first recess region R1. Although not shown, the first recess region R1 may be a plurality and the wireless power supply unit 30 and the wireless signal unit 40 may be separately mounted in the first recess region R1. In addition, the control semiconductor chips 20 and / or passive elements 24 may be mounted in the second recess region R2 and optionally sealed by the encapsulant 84. [ The control semiconductor chips 20 and the passive elements 24 may be mounted so as not to protrude from the second recess region R2. Also, although not shown, the second recess region R2 may be plural, and the control semiconductor chips 20 and the passive elements 24 may be separately mounted on the second recess region R2.

In this embodiment, the memory semiconductor chips 60a may be positioned on the control semiconductor chips 20, the passive elements 24, the wireless power supply 30, and the wireless signal portion 40, And thus can be mounted on a wider area of the first side 12. Therefore, compared to the embodiment of FIG. 3 or 10, the memory semiconductor chips 60a of this embodiment can have a larger size. The chip power receiving section 64 included in the memory semiconductor chips 60a of the present embodiment can be positioned to smoothly receive power from the power transmitting section 34 and can be located in the upper right room of the power transmitting section 34, . The chip radio signal transmitting and receiving section 66 included in the memory semiconductor chips 60a can be positioned to smoothly transmit and receive a radio signal from the radio signal transmitting and receiving end 42, Can be placed in a room. The positional relationship between the wireless signal transmitting / receiving end 42 and the chip wireless signal transmitting / receiving unit 66 will be described in detail with reference to FIG. 14 and FIG.

Although not shown, the case of applying the memory semiconductor chips 60 having the second connection member 62 of FIG. 3 instead of the memory semiconductor chips 60a in this embodiment is also applied to the technical idea of the present invention . Similarly, the control semiconductor chips 20 having the second connection member 22 of FIG. 3 can be applied instead of the control semiconductor chips 20a. (Not shown) electrically connected to the control semiconductor chips 20 on the substrate 10, if necessary.

12, the USB memory device 1c of this embodiment is different from the USB memory device 1a of FIG. 10 in that the memory semiconductor chips 60a are located on the first side 12 of the substrate 10 The control semiconductor chips 20, the passive elements 24, the wireless power supply 30 and the wireless signal portion 40 are provided on the second side of the substrate 10, other than the memory semiconductor chips 60a, (14). Therefore, compared to the embodiment of FIG. 3 or 10, the memory semiconductor chips 60a of this embodiment can have a larger size. The control semiconductor chips 20, the passive elements 24, the wireless power supply unit 30, and the wireless signal unit 40 can be sealed by the sealing material 88. [ As described above, in place of the control semiconductor chips 20a and the memory semiconductor chips 60a, the control semiconductor chips 20 (1) and 20 (2) having the first and second connection members 22 and 62, respectively, And memory semiconductor chips 60 can be applied.

13, the USB memory device 1c of this embodiment is different from the USB memory device 1a of FIG. 10 in that the memory semiconductor chips 60a are located on the first side 12 of the substrate 10 The control semiconductor chips 20, the passive elements 24, the wireless power supply 30 and the wireless signal portion 40 are provided on the second side of the substrate 10, other than the memory semiconductor chips 60a, (14). In addition, similar to the embodiment described with reference to Fig. 11, the second side 14 of the substrate 10 further includes a third recess region R3 and a fourth recess region R4. The wireless power supply unit 30 and / or the wireless signal unit 40 may be mounted in the third recess region R3 and optionally sealed by the encapsulant 82. The wireless power supply unit 30 and the wireless signal unit 40 may be mounted so as not to protrude from the third recess region R3. Although not shown, the third recess region R3 may be a plurality and the wireless power supply section 30 and the wireless signal section 40 may be separately mounted in the third recess region R3. In addition, the control semiconductor chips 20 and the passive elements 24 may be mounted in the fourth recess region R4 and optionally sealed by the encapsulant 84. The control semiconductor chips 20 and the passive elements 24 can be mounted so as not to protrude from the fourth recess region R4. Although not shown, the fourth recess region R4 may be plural, and the control semiconductor chips 20 and the passive elements 24 may be separately mounted on the fourth recess region R4. Therefore, compared to the embodiment of FIG. 3 or 10, the memory semiconductor chips 60a of this embodiment can have a larger size. In addition, as described above, instead of the control semiconductor chips 20a and the memory semiconductor chips 60a, the control semiconductor chips each having the first and second connection members 22 and 62 as shown in Fig. 3 (20) and memory semiconductor chips (60).

Figs. 14 and 15 are schematic diagrams showing the positional relationship between the radio signal transmitting / receiving end 42 and the chip radio signal transmitting / receiving unit 66 of Fig.

Referring to FIG. 14, the radio signal transmitting / receiving end 42 may include a radio signal transmitting terminal 42S and a radio signal receiving terminal 42R. The memory semiconductor chips 60a may include a stacked first memory semiconductor chip 60a1 and a second memory semiconductor chip 60a2. The first chip radio signal transceiver 661 included in the first memory semiconductor chip 60a1 may include a first chip radio signal transmitter 661S and a first chip radio receiver 661R. The second chip radio signal transceiver 662 included in the second memory semiconductor chip 60a2 may include a second chip radio signal transmitter 662S and a second chip radio receiver 662R. The wireless signal transmitting terminal 42S may be positioned to correspond to both the first and second chip wireless signal receiving terminals 661R and 662R, and may be positioned to correspond to each other vertically, for example. In addition, the radio signal receiving terminal 42R may be positioned to correspond to both the first and second chip radio signal transmitting terminals 661S and 662S, and may be positioned to correspond to each other vertically, for example. Accordingly, the first and second memory semiconductor chips 60a1 and 60a2 share the same radio signal transmitting terminal 42S and the radio signal receiving terminal 42R, and can transmit and receive signals wirelessly. In this case, a signal transmitted or received at the radio signal transmitting terminal 42S and the radio signal receiving terminal 42R can control access to either the first memory semiconductor chip 60a1 or the second memory semiconductor chip 60a2 The access signal may include an access signal.

15, a plurality of radio signal transmitting / receiving ends 42 may be provided, and may be plural corresponding to the number of memory semiconductor chips 60a, for example. For example, the radio signal transmitting / receiving end 42 may include third and fourth radio signal transmitting ends 423S and 424S and third and fourth radio signal receiving ends 423R and 424R. The memory semiconductor chips 60a may include a stacked third memory semiconductor chip 60a3 and a fourth memory semiconductor chip 60a4. The third chip radio signal transceiver 663 included in the third memory semiconductor chip 60a3 may include a third chip radio signal transmitter 663S and a third chip radio receiver 663R. The fourth chip radio signal transceiver 664 included in the fourth memory semiconductor chip 60a4 may include a fourth chip radio signal transmitter 664S and a fourth chip radio receiver 664R. The third and fourth wireless signal transmitting terminals 423S and 424S may be positioned to correspond to the third and fourth chip wireless signal receiving terminals 663R and 664R respectively and may be positioned to correspond to each other vertically . The third and fourth wireless signal receiving terminals 423R and 424R may be positioned so as to correspond to the third and fourth chip wireless signal transmitting terminals 663S and 664S, . Therefore, the third memory semiconductor chip 60a3 can wirelessly transmit and receive signals to and from the third wireless signal transmitting terminal 423S and the third wireless signal receiving terminal 423R, respectively, and the fourth memory semiconductor chip 60a4 can individually transmit And can wirelessly transmit and receive signals to and from the fourth wireless signal transmitting terminal 424S and the fourth wireless signal receiving terminal 424R.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention. Will be clear to those who have knowledge of.

1, 1a, 1b, 1c, 1d: USB memory device, 10: substrate,
20: control semiconductor chip, 24: passive element,
30: wireless power unit, 40: wireless signal unit,
60: memory semiconductor chip, 80: sealing material, 90 case

Claims (11)

A substrate including a first side and a second side opposite to each other;
One or more memory semiconductor chips mounted on the substrate;
A wireless power supply unit mounted on the substrate and receiving wireless power to provide power to the memory semiconductor chips; And
And a wireless signal unit mounted on the substrate and having a wireless signal transmitting terminal and a wireless signal receiving terminal for transmitting and receiving data using a wireless signal and providing the data to the memory semiconductor chips,
Wherein each of the memory semiconductor chips includes a chip radio signal transmitter and a chip radio receiver,
Wherein the chip radio signal transmitting end is positioned to correspond to the radio signal receiving end vertically,
Wherein the chip radio signal receiving end is vertically positioned to correspond to the radio signal transmitting end.
delete delete A substrate including a first side and a second side opposite to each other;
One or more memory semiconductor chips mounted on the substrate;
A wireless power supply unit mounted on the substrate and receiving wireless power to provide power to the memory semiconductor chips; And
And a wireless signal unit mounted on the substrate and transmitting and receiving data by using a wireless signal and providing the data to the memory semiconductor chips,
The memory semiconductor chips may include a first memory semiconductor chip having a first chip radio signal transmitter and a first chip radio signal receiver, and a second memory chip coupled to the second memory chip, The first memory chip includes a second memory semiconductor chip,
Wherein the radio signal unit includes first and second radio signal transmitting units and first and second radio signal receiving units,
Wherein the first chip radio signal transmitting end is positioned to correspond to the first radio signal receiving end vertically,
Wherein the first chip radio signal receiving end is positioned to correspond to the first radio signal transmitting end vertically,
Wherein the second chip radio signal transmitting end is positioned to correspond to the second radio signal receiving end vertically,
And the second chip wireless signal receiving end is vertically positioned to correspond to the second wireless signal transmitting end.
delete delete A substrate including a first side and a second side opposite to each other;
One or more memory semiconductor chips mounted on the substrate;
A wireless power supply unit mounted on the substrate and receiving wireless power to provide power to the memory semiconductor chips; And
And a wireless signal unit mounted on the substrate and transmitting and receiving data by using a wireless signal and providing the data to the memory semiconductor chips,
The first side comprising one or more first recessed regions,
Wherein at least one of the radio power unit and the radio signal unit is located in the first recess region. 8. The USB memory device as claimed in claim 7, wherein the memory semiconductor chips are overlapped with at least one of the wireless power supply unit and the wireless signal unit. A substrate including a first side and a second side opposite to each other;
One or more memory semiconductor chips mounted on the substrate;
A wireless power supply unit mounted on the substrate and receiving wireless power to provide power to the memory semiconductor chips; And
And a wireless signal unit mounted on the substrate and transmitting and receiving data by using a wireless signal and providing the data to the memory semiconductor chips,
Wherein the memory semiconductor chips are located on the first side, and the wireless power unit and the wireless signal unit are located on the second side. A substrate including a first side and a second side opposite to each other;
One or more memory semiconductor chips mounted on the substrate;
A wireless power supply unit mounted on the substrate and receiving wireless power to provide power to the memory semiconductor chips; And
And a wireless signal unit mounted on the substrate and transmitting and receiving data by using a wireless signal and providing the data to the memory semiconductor chips,
The second side comprising one or more second recessed regions,
Wherein at least one of the wireless power unit and the wireless signal unit is located in the second recess region. Host; And
10. The USB memory device according to any one of claims 1 to 7, wherein the USB memory device is driven by receiving power from the host wirelessly and transmits and receives data wirelessly with the host.
And a USB system.

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