KR101438397B1 - High thermal conductive radiation adhesive tape and High thermal conductive radiation adhesive commodities containing the same - Google Patents

Abstract

The present invention relates to a high thermal conductive heat-radiating tape and a high thermal conductive heat-radiating tape article including the same, and is advantageous in that it can be used in electronic products that require thinness by reducing the thickness of the heat-radiating tape while maintaining excellent heat radiation.
In addition, the high thermal conductive heat-radiating tape of the present invention and the high thermal conductive heat-radiating tape article of the present invention as described above have thermal conductivity and dispersion progressing not only horizontally but also vertically so that heat conductivity is excellent and effective heat dissipation can be achieved with a narrow area .

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a high thermal conductive radiation tape and a high thermal conductive radiation tape,

The present invention relates to a high thermal conductive heat-radiating tape and a high thermal conductive heat-radiating tape article comprising the same. More particularly, the present invention relates to a heat-conducting thermally conductive tape having excellent thermal conductivity and thermal conductivity, And more particularly, to a high thermal conductivity heat dissipation tape and a high heat conductivity heat dissipation tape article including the same.

In recent years, components and devices for television, video, computers, medical devices, office machines, communication devices, the latest electric and electronic devices, and automobiles have increased in complexity. As the complexity of electronic parts becomes more complicated, the area is getting smaller due to miniaturization and higher performance, so that the number of electronic parts to be assembled increases, and the shape of the parts itself is also continuously reduced. In particular, as the LED lighting market grows, there is a growing need to effectively remove the heat generated to prevent component life or defects due to increased heat generated by LED lighting.

Since the backlight for a panel for a liquid crystal display, which has a light-emitting diode with excellent color reproduction rate and a high contrast ratio, which has recently been released, has a much higher calorific value than a liquid crystal display panel using a cold cathode fluorescent lamp as a backlight, A thin heat dissipating means for effectively removing generated heat is required. In addition, due to the limitations of heat dissipation products that can be used in LED lighting, there is a need for a product having high adhesion and thermal conductivity irrespective of the metal material.

Accordingly, the conventional heat radiating tape has a problem that the heat radiating effect of the heat radiating tape is deteriorated because the heat conductive tape is made of plastic, paper, nonwoven fabric or the like. In addition, the conventional heat radiation tape has a disadvantage in handling, which is broken or damaged when assembled to form a heat dissipation mechanism, and the heat conduction is made in the horizontal direction due to the principle of heat dissipation. In order to solve this problem, conventionally, the thickness of the heat radiation tape has been increased to increase the thermal conductivity. However, there has been a problem in the development of electronic products which are required to be slim recently.

Further, the heat-radiating adhesive layer used in the conventional heat-radiating tape has a low thermal conductivity, which lowers the heat radiating effect of the heat-radiating tape.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and it is an object of the present invention to effectively remove heat generated from various electronic products and to provide a high thermal conductivity heat dissipation Tape and a highly heat conductive heat-radiating tape article comprising the same.

In order to solve the above-mentioned problems, the present invention provides a tackifier, And a powder coated with ultrafine particle ceramic and containing at least one pore therein.

According to a preferred embodiment of the present invention, the heat-radiating adhesive layer may further include a viscous polymer resin and a thermally conductive filler.

Specifically, the tackifier may include at least one selected from the group consisting of rosin, a rosin derivative, a pine resin, a petroleum resin, an alkylphenol resin, and a phenol resin, preferably a novolac ) Type alkylphenol resin or a resol type alkylphenol resin, and the tackifier may be 2 to 20 parts by weight based on 100 parts by weight of the adhesive polymer resin.

According to a preferred embodiment of the present invention, the powder coated with the ultrafine particle ceramic and including at least one pore therein includes a powder layer having pores therein; And the powder layer may include at least one selected from the group consisting of polyethylene, nylon, polyacetal, vinyl chloride, polystyrene, ABS, and acrylic, The powder layer may have an average thickness of 0.1 to 5 탆. The ceramic of the ultra-fine particle ceramic layer has an average particle size of 10 to 5,000 nm. The ceramic may be selected from the group consisting of Alumina, Silica, Titania, Zirconia, Chromite, Zircon, , Magnesium oxide, and calcium carbonate. Further, the powder coated with the ultrafine particle ceramic and having at least one pore therein may have an average particle size of 1 to 100 μm, and the ultrafine particle ceramic may be coated on 100 parts by weight of the adhesive polymer resin, The powder may be from 1 to 20 parts by weight.

According to a preferred embodiment of the present invention, the adhesive polymer resin may be selected from the group consisting of a polyacrylic ester polymer resin, a polyacrylic acid polymer resin, a polymethacrylic polymer polymer resin, a polyacrylic acid soda polymer resin and a polyacrylamide polymer resin And may include any one or more selected. In addition, the thermally conductive filler may include at least one selected from inorganic oxide materials, hydroxide metal compounds, carbonized materials, nitrided materials and boronized materials, and the inorganic oxide materials include alumina, silica ), Titania, Zirconia, Chromite, Zircon, or Magnesium Oxide, and the hydroxide metal compounds are magnesium hydroxide or aluminum hydroxide, and the carbides include silicon carbide Silicon carbide, or titanium carbide, and the nitrides may be silicon nitride or aluminum nitride, and the boronized materials may be boron nitride. Further, the thermally conductive filler may have an average particle size of 1 to 100 μm, and the thermally conductive filler may include 10 to 200 parts by weight based on 100 parts by weight of the adhesive polymer resin.

According to a preferred embodiment of the present invention, the heat radiation tape may further include a mesh base layer, and the mesh base layer may be a polyester base mesh base material. The heat radiation tape may have an average thickness of 50 to 200 占 퐉, a thermal conductivity of 0.5 to 3 W / mK, and an average thickness of 50 to 200 占 퐉. The heat radiation tape may include a heat radiation adhesive layer on one side or both sides of the mesh base layer. Adhesive strength can be from 1,000 to 2,300 gf / 25 mm.

Another aspect of the present invention provides a display device including the heat radiation tape.

The high thermal conductive heat-radiating tape of the present invention can be used in an electronic product which requires thinning of the heat-radiating tape while maintaining excellent heat radiation, thereby making it slim.

Also, it is possible to provide a high thermal conductive heat radiation tape exhibiting an adhesive force superior to that of a conventional heat radiation tape and a high thermal conductive heat radiation tape article containing the same.

1 is a cross-sectional view of a heat-radiating tape according to an embodiment of the present invention.
2A to 2C show a powder coated with ultrafine particle ceramic and containing at least one pore therein, and FIGS. 2B and 2C are sectional views of FIG. 2A.

The pores of the powder having pores therein used in the present invention means that one pore is contained in a spherical powder or two or more bubbles are contained in the powder.

BRIEF DESCRIPTION OF THE DRAWINGS The invention will be described in more detail with reference to the accompanying drawings.

As described above, the conventional heat-radiating tape has a low thermal conductivity, which deteriorates the heat-radiating effect of the heat-radiating tape. The graphite member itself is excellent in thermal conductivity using the graphite member. However, since the graphite member itself is sheet- There was a problem in handling which was broken or damaged at the time, so that there was a difficult problem in the development of an electronic product requiring slimming.

Accordingly, according to one aspect of the present invention, The present invention also provides a heat radiation adhesive tape comprising a thermosetting adhesive layer and a powder coated with ultrafine particle ceramic and containing at least one pore therein. Further, the heat radiation adhesive layer may further comprise a sticky polymer resin and a thermally conductive filler With the heat-radiating tape, the above-mentioned problem was solved.

Further, according to a preferred embodiment of the present invention, the heat radiation tape may further comprise a mesh base layer, and preferably the mesh base layer may be a polyester base mesh base. Further, the heat-conducting conductive heat-radiating tape of the present invention can be made slimmer by reducing the thickness of the heat-radiating tape while maintaining excellent heat radiation through the heat-radiating tape that can include a heat-sensitive adhesive layer on one side or both sides of the mesh base layer.

1 is a cross-sectional view of a heat-radiating tape according to an embodiment of the present invention.

The heat dissipation tape (100) includes a first heat dissipation adhesive layer (120) and a second heat dissipation adhesive layer (130) on both sides or both sides of the mesh substrate (110). And laminating the heat dissipation adhesive layers 120 and 130 on one or both sides so that the release layer 140 directly contacts the end faces or both sides of the heat dissipation adhesive layers 120 and 130. [

First, the mesh substrate 110 will be described.

Examples of the substrate that can be used for the heat radiation tape include plastic, paper, nonwoven fabric, glass fiber, and mesh substrate. A polyester mesh substrate is preferably used.

 Although the thickness of the polyester-based mesh base material is not particularly limited, it may be arbitrarily selected from the range of 1 to 100 mu m, and the thickness of the base material may be varied depending on the use of the heat radiation tape, good. If it is less than 1 mu m, it can not exhibit the reinforcement function properly. If it is more than 100 mu m, the thickness becomes too thick, and the characteristic of the thermal conductivity may be too low. Here, Reinforcement means reinforcement.

The thickness of the polyester-based mesh base material can be appropriately selected depending on the product in which the heat-radiating tape is used. Since the polyester-based mesh base material has a mesh structure, heat is transmitted by the principle of heat conduction, and heat dissipation is facilitated through the void portion of the mesh, so that heat can be transmitted by the principle of the thermal flow and the heat radiation. In the case of using a base material having a low thermal conductivity, the temperature of the heat-generating region is lowered by the principle that the heat transmitted from the heat source is diverged horizontally to spread the heat to the periphery of the heat source. The heat transferred from the heat source is transferred vertically to the air, thereby lowering the temperature of the heat generating part. Such a vertical heat transfer principle may have a better heat radiation effect than horizontal heat transfer. Since the heat generated in the heating element is transmitted through the polyester-based mesh base material by the heat conduction, the thermal expansion, and the heat radiation, the heat transfer efficiency is much higher than that of the conventional plastic, paper and nonwoven fabric. The effect can also be excellent.

Next, the heat-dissipating adhesive layers 120 and 130 will be described.

The conventional pressure-sensitive adhesive layer has a low thermal conductivity, which lowers the heat radiation effect of the heat-radiating tape.

Accordingly, in one embodiment of the present invention, the heat radiation tape is a tackifier; And a thermally conductive adhesive layer coated on the surface of the thermally conductive adhesive layer and containing a powder containing at least one pore therein, the thermally conductive adhesive layer further comprising a viscous polymer resin and a thermally conductive filler, Provides thermal conductivity and excellent heat dissipation effect.

First, the adhesive property of the heat- The polymer resin will be described.

According to a preferred embodiment of the present invention, the viscous polymer resin may include at least one selected from the group consisting of acrylic, polyacrylic ester, polyacrylic acid and polymethacrylic acid, polyacrylic acid soda and polyacrylamide , And the type of the adhesive polymer resin that can be used is not particularly limited. The type of the acrylic polymer resin is not particularly limited, and any acrylic resin may be used as long as it can be used as a pressure-sensitive adhesive in the art. Preferably, a polyacrylate-based adhesive polymer resin is used, and more preferably an acrylic pressure-sensitive adhesive resin having a Tg value of -30 to 40 ° C can be used.

Next, the tackifier constituting the heat-sensitive adhesive layer will be described.

The tackifier provides a role for improving the adhesion of the heat-radiating tape.

According to a preferred embodiment of the present invention, the tackifier may include any one or more selected from the group consisting of rosin, rosin derivatives, pine resin, petroleum resin, alkylphenol resin and phenol resin The tackifier may be a novolac type alkylphenol resin or a resol type alkylphenol resin from the viewpoint of excellent dispersibility and a polyacrylic acid ester type adhesive polymer resin.

First, rosin and rosin derivatives which can be used in the tackifier are described.

Rosin-based tackifiers such as rosin and rosin derivatives include unmodified rosins (rosin) such as rosin, wood rosin and tall oil rosin; Modified rosin (hydrogenated rosin, disproportionated rosin, polymerized rosin, other chemically modified rosin, etc.) obtained by modifying these unmodified rosin by hydrogenation, disproportionation, polymerization or the like; Various other rosin derivatives; And the like. Examples of the rosin derivatives include esters obtained by esterification of unmodified rosin with alcohols (that is, esters of rosin), modified rosins (hydrogenated rosin, disproportionated rosin, polymerized rosin, etc.) Rosin esters (e.g., esters of modified rosins); Unsaturated fatty acid-modified rosins obtained by modifying unmodified rosin or modified rosin (hydrogenated rosin, disproportionated rosin, polymerized rosin, etc.) with unsaturated fatty acids; Unsaturated fatty acid-modified rosin esters obtained by modifying rosin esters with unsaturated fatty acids; Rosin alcohols obtained by reducing a carboxyl group in unmodified rosin, modified rosin (hydrogenated rosin, disproportionated rosin, polymerized rosin, etc.), unsaturated fatty acid modified rosin or unsaturated fatty acid modified rosin ester; Metal salts of rosins (especially rosin esters) such as unmodified rosin, modified rosin, and various rosin derivatives; A rosin (unmodified rosin, modified rosin, various rosin derivatives, etc.) obtained by adding phenol to an acid catalyst and thermally polymerizing the resulting mixture

Phenolic resin; And the like.

Next, the above-mentioned fineness coefficient will be described.

The fineness roller is included in the terpene resin, and the terpene resin is a terpene resin such as an? -Pinene polymer, a? -Pinene polymer and a dipentene polymer; Modified terpene resins obtained by modifying these terpene resins (phenol modification, aromatic modification, hydrogenation modification, hydrocarbon modification, etc.); And the like. Examples of the modified terpene resin include a terpene-phenol resin, a styrene-modified terpene resin, an aromatic modified terpene resin, and a hydrogenated terpene resin.

The following petroleum resin system will be described.

The petroleum resin-based tackifier may be a polymer polymerized from a vinyl monomer containing an acryloyl group or a methacryloyl group in order to ensure compatibility with the acrylic pressure-sensitive adhesive resin. The acryloyl group or methacryloyl group-containing vinyl monomer is preferably a vinyl monomer having 3 to 12 carbon atoms, more preferably a vinyl monomer having 5 to 9 carbon atoms. If the number of carbon atoms is less than 3, miscibility with the acrylic pressure sensitive adhesive resin may be deteriorated. If the number of carbon atoms exceeds 12, viscosity control may not be easy. In the present invention, the viscosity of the polymer used as the tackifier may preferably be 2,000 to 18,000 cps and have a weight average molecular weight of 500 to 50,000. If the viscosity is less than 2,000 cps, the adhesive property may be weakened. If the viscosity exceeds 18,000 cps, there may be a problem that the workability is poor. If the weight-average molecular weight is less than 500, the adhesive strength may be weakened. If the weight-average molecular weight is more than 50,000, the adhesion-imparting function may be weakened.

Next, the alkylphenol resin and phenol resin will be described.

The alkylphenol resin and the phenol resin can be broadly divided into a novolak type and a resole type, preferably a novolak type phenol resin, more preferably a solid novolak type phenolic resin having a molecular weight of 1,000 to 4,000 Mw have. The phenolic resin may be in a form of thermosetting using a hexamine curing agent.

The present invention can improve the wettability or softness of a pressure-sensitive adhesive by including a tackifier in the pressure-sensitive adhesive polymer, so that the adhesive force of the pressure-sensitive adhesive can be improved and the adhesion to various surfaces can be improved , It is possible to improve the adhesion between electronic component elements having a rough surface, preferably a rough surface. Therefore, even when the adhesive area of the adhesive is wide, the portion not in contact with the adhesive between the heat sink and the heat sink can be reduced, thereby preventing local hot spots.

Further, the tackifier may be 2 to 20 parts by weight based on 100 parts by weight of the adhesive polymer resin. When the content of the tackifier is less than 2 parts by weight, a structure capable of exhibiting desired wettability or the like is formed When the content of the adhesive polymer is more than 20 parts by weight, the content of the adhesive polymeric resin becomes greater than that of the adhesive polymeric resin, so that the adhesive tape may be aged more rapidly and the wettability may be significantly lowered. (See Tables 1 and 2)

Here, the wettability according to the present invention means the degree of spreading, sticking or adhesion of the adhesive on the solid surface. In other words, in the present invention, wettability refers to a property that a liquid or a solid spreads on a solid surface, and is a measure indicating the degree of adhesion.

On the other hand, it is more preferably a novolak type phenolic resin, more preferably a solid novolak type phenolic resin having a molecular weight of 1,000 to 4,000 Mw.

FIGS. 2A to 2C are views showing a powder coated with ultra-fine particle ceramic of the present invention and containing at least one pore therein.

Specifically, the powder 150 coated with the ultra fine particle ceramic constituting the heat radiation pressure sensitive adhesive layer and including at least one pore therein will be described. FIG. 2A is a powder 150 coated with ultrafine particle ceramic used for a heat radiation tape according to an embodiment of the present invention and having at least one pore therein, and includes a powder layer 160 having pores therein; And a super fine grain ceramic layer 170 formed on the powder layer.

FIG. 2B is a cross-sectional view of FIG. 2A showing one pore inside the powder according to another preferred embodiment of the present invention. FIG. 2C is a cross-sectional view of the powder according to another preferred embodiment of the present invention, 2a of Fig. 2a. Fig.

First, the powder layer 160 having pores therein may include at least one pore therein, and the powder layer having pores therein may be a thermoplastic resin, and preferably polyethylene, nylon, polyacetal , Vinyl chloride, polystyrene, ABS, and acrylic. The average thickness of the powder layer having pores therein may be 0.1 to 5 탆. If the average thickness of the powder layer is less than 0.1 mu m, the characteristics of the powder layer itself may be lost and a hollow spherical body may not be formed. If the average thickness exceeds 5 mu m, the powder layer may become too thick and the effect of the pore layer may be lost.

The ceramic of the ultrafine particle ceramic layer 170 may have an average particle size of 10 to 5,000 nm, preferably an average particle size of 10 to 1,000 nm. If it is less than 10 nm, the ceramic layer may be difficult to form, It may be difficult to adsorb it on the powder layer. And the ceramic of the ceramic layer is selected from the group consisting of Alumina, Silica, Titania, Zirconia, Chromite, Zircon, Magnesium Oxide and Calcium Carbonate. And may include any one or more of them.

The powder 150 coated with the ultra fine particle ceramic and having at least one pore therein may have an average particle size of 1 to 100 μm. If the average particle size of the powder containing one or more pores in the interior of the ultra-fine particle ceramic is 1 If it is less than 탆, it can be a powder that can not have pores. If it is more than 100 탆, the thickness of the powder layer may become thick. Also, the powder coated with the ultra fine particle ceramic and containing at least one pore therein may be 1 to 20 parts by weight based on 100 parts by weight of the adhesive polymer resin. If the amount of the powder is less than 1 part by weight, the effect of adhesion may be insufficient. If the amount of the additive is more than 20 parts by weight, the viscosity of the adhesive polymer may increase and the adhesive polymer may be difficult to produce.

The powder 150 coated with the ultrafine particle ceramic and including at least one pore therein is shown in FIGS. 2A to 2C.

Next, the thermally conductive filler constituting the heat-sensitive adhesive layer will be described.

The thermally conductive filler serves to enhance the thermal conductivity of the heat-radiating tape.

According to a preferred embodiment of the present invention, the thermally conductive filler may include at least one selected from the group consisting of inorganic oxide materials, hydroxide metal compounds, carbonized materials, nitrile materials and boronated materials, The inorganic oxide materials include Alumina, Silica, Titania, Zirconia, Chromite, Zircon, or Magnesium Oxide. The hydroxide metal compounds include magnesium hydroxide Or aluminum hydroxide and the carbonized materials are silicon carbide or titanium carbide and the nitrile materials are silicon nitride or aluminum nitride and the boronized materials are boron Nitrides, and further mixed with stoichiometric and non-stoichiometric combinations of Al ₂ O ₃ , AlN, may include Al (OH) _3, MgO, ZnO, BeO, BN, Si ₃ N _4, SiC and one or more of oxides, nitrides and carbides including SiO _2. On the other hand, the thermally conductive filler may more preferably be Al ₂ O ₃ .

According to a preferred embodiment of the present invention, the thermally conductive filler may have an average particle diameter of 1 to 100 μm, and may include 10 to 200 parts by weight based on 100 parts by weight of the adhesive polymer resin.

If the average particle diameter of the thermally conductive filler is less than 1 탆, the viscosity of the slurry increases when mixed with the adhesive polymer resin during the production of the pressure-sensitive adhesive, resulting in deterioration of processability. The coating property of the pressure-sensitive adhesive to the substrate may be deteriorated. When the average particle diameter of the thermally conductive filler is more than 100 탆, the thermally conductive filler may be precipitated in the step of mixing with the adhesive polymer resin or curing the coating.

When the content of the thermally conductive filler is less than 10 parts by weight, the heat transfer rate may be decreased. When the content of the thermally conductive filler is more than 200 parts by weight, the hardness of the adhesive may excessively increase, The softness of the pressure-sensitive adhesive may be reduced, and the adhesion of the pressure-sensitive adhesive may be deteriorated. Here, the softness can replace the flexible degree of the pressure-sensitive adhesive.

On the other hand, the heat radiation adhesive agent for forming the heat radiation adhesive layer can increase the dispersing effect of the heat radiation adhesive liquid by using a dispersant, and may further include an optional crosslinker to control the adhesive property. That is, the heat-sensitive adhesive of the heat-radiating adhesive layer of the present invention may contain a photo-initiator, a pigment, an antioxidant, a brightener, a UV stabilizer, a defoamer, a thickener, a plasticizer, a flame retardant, Additives. The additive is not limited as long as it is commonly used in the art. Here, the solvent may be any organic solvent used in the art, and toluene or ethyl acetate may be preferably used.

 Specifically, the heat dissipation adhesive may be prepared by subjecting a polymer to the subject of a viscous polymer resin, a thermally conductive filler, and a tackifier, and if necessary, adding the crosslinking agent or the like. The polymer may be subjected to solution polymerization, bulk polymerization, Can be appropriately selected. The resulting polymer may be a random copolymer, a block copolymer or a graft copolymer. In the solution polymerization, as the polymerization solvent, for example, methyl ethyl ketone, acetone, ethyl acetate, tetrahydrofuran, dioxane, cyclohexanone, n-hexane, toluene, xylene, mesitylene, methanol, Propanol, isopropanol, water and various aqueous solutions are used. The reaction is usually carried out at about 60 to 80 DEG C for about 4 to 10 hours under an inert gas stream such as nitrogen. On the other hand, the polymerization initiator and the chain transfer agent used in the radical polymerization are not particularly limited and can be appropriately selected and used. Such a solvent may include 10 to 80 parts by weight based on 100 parts by weight of the adhesive polymer resin. If the amount of the solvent is less than 10 parts by weight, the viscosity of the dispersion is too high to prepare the liquid. If the amount of the solvent exceeds 80 parts by weight, the total solid content of the dispersion may be low and the production of the sheet may become difficult.

The heat-sensitive adhesive layer may preferably have a thickness in the range of 5 to 300 mu m, and more preferably 10 to 40 mu m. When the thickness is less than 5 탆, the amount of the adhesive is insufficient and the adhesive strength is lowered. When the thickness exceeds 300 탆, the heat-insulating adhesive has a lower thermal conductivity than the mesh substrate. In the manufacturing method of the heat-radiating tape, the heat-sensitive adhesive layer may be formed by gravure coating, micro gravure coating, Ki gravure coating, Comma Knife coating, roll coating, A spray coating, a Meyer Bar coating, a slot die coating and a reverser coating, (M) and offset (f) And preferably a gravure coating method can be used.

Next, the release layer 140 formed on one side or both sides so as to directly contact the above-mentioned heat-sensitive adhesive layer will be described.

The release layer can be formed into a heat-radiating tape by a method of lamination. The lamination method is not limited. For example, a wet lamination method or a non-solvent dry lamination method is used. .

After completing the series of processes, the heat-radiating tape of the present invention can be cut to a suitable size or wound and rolled using a roll winder. This can be done in a conventional manner.

According to another preferred embodiment of the present invention, the heat radiation tape has a thickness of 50 to 200 탆, a thermal conductivity of 0.5 to 3 W / mK, an adhesive strength of 1,000 to 2,300 gf / 25 mm, When the adhesive sheet is attached to an adherend having a large area, there are many portions where the adhesive is not properly adhered and the heat transfer contact area is small, so that sufficient heat transfer of the heat generating element is difficult to achieve. If it is thick, the heat transfer rate is slow, and it may take a long time to achieve heat dissipation.

According to another aspect of the present invention, there is provided a display device including the heat radiation tape of the present invention.

The present invention can provide a heat radiation tape article including the heat radiation tape, but may be, but not limited to, a transfer tape, a pressure-sensitive adhesive tape including a double-sided tape, a pressure-sensitive adhesive film, or a hot melt.

According to another preferred embodiment of the present invention, the heat-radiating tape may be a heat-generating part of a CPU or the like of a slim notebook computer or a PC, a heat generating part of a plasma display panel (PDP), a liquid crystal display (LCD), a light emitting diode A backlight unit including a heat dissipation tape and a light source, which can be used in a backlight unit including a light source, The unit can be used in a display device (LCD) including a liquid crystal panel for displaying images using light. The backlight unit (BLU) is disposed below a liquid crystal display panel (LCD panel) and provides light to the LCD panel, for example, white light. The BLU of the present invention may include both a direct method in which a light source is positioned below a liquid crystal panel and an edge-light method in which a light source is located on a side.

The heat radiation tape of the present invention can be cut and used in an appropriate size in both the direct-down type and the edge light type. In the BLU, a plurality of cold cathode fluorescent lamps (CCFLs), light emitting diodes (LEDs), or external electrode fluorescent lamps (EEFLs) may be used as the light source, Can be used.

The LED may be composed of red, green, and blue or a single color of white light. In the case of a BLU using the LED as a light source, the BLU can be miniaturized and light efficiency can be improved, and uniformity of light can be maintained . However, in the case of an LED, since a large amount of heat is generated and the need for heat radiation is greater, the use of the heat radiation tape of the present invention can be more effective.

The high thermal conductive heat-radiating tape of the present invention can provide a high thermal conductive heat-radiating tape capable of thermal conduction and heat dispersion progressing not only horizontally but also vertically so as to have an excellent thermal conductivity and effective heat dissipation in a narrow area, and a high thermal conductive heat- have.

Hereinafter, the present invention will be described in more detail with reference to the following examples. However, the following examples should not be construed as limiting the scope of the present invention, and should be construed to facilitate understanding of the present invention.

[ Example ]

Example  One

(1) Adhesive production

50 parts by weight of aluminum hydroxide (Al (OH) ₃ ) having an average particle diameter of 10 탆 as a thermally conductive filler and 100 parts by weight of an acrylic pressure-sensitive adhesive resin (POA-5660, viscosity 800 cps, 40% , And 70 parts by weight of alumina (Al ₂ O ₃ ), which is phosphoric acid, were mixed and stirred until sufficiently homogeneous to prepare a mixture of a viscous polymer resin and a thermally conductive filler.

Next, a modified acrylic resin (DS-7505-H, Urethane modified alkyd resin, solid content 60%) was injected into the gas phase from a vessel in a vacuum environment to prepare a powder containing pores (average particle diameter: Average thickness 500 nm). Next, calcium carbonate having an average particle diameter of 0.5 탆 was adsorbed onto the powder layer by a wet method to prepare a powder (average diameter 5 탆, MFL-1) coated with ultrafine particle ceramic and containing at least one pore therein.

Next, 1 part by weight of MFL-1 was added to 100 parts by weight of the acrylic pressure-sensitive adhesive resin, and the mixture was stirred and mixed to prepare a mixture of MFL-1.

Thereafter, 5 parts by weight of a novolac phenol resin (weight average molecular weight: 2,500 MW, Kangnam Chemical Co., Ltd., KC-7505, tackifier) having a softening point of 140 ° C was added to the mixture of MFL- Based on 100 parts by weight of the acrylic pressure-sensitive adhesive resin) was added and stirred to prepare a heat-dissipating adhesive (first heat-insulating adhesive).

(2) Manufacture of heat-radiating tape

A comma coating facility was used to form a first heat-dissipating pressure-sensitive adhesive layer having a thickness of 150 占 퐉 on the silicone-coated release film using the first heat-dissipating adhesive, and then adhered to one side of a 15 占 퐉 polyester mesh.

Thereafter, a second heat-radiating adhesive layer is formed by the same method as that of the first heat-insulating adhesive, and a second heat-radiating adhesive layer is formed on the opposite side of the first heat- (See FIG. 1).

Example  2

Except that 15 parts by weight of a novolac phenol resin (weight average molecular weight: 2,500 MW, Kangnam Chemical Co., Ltd., KC-7505, tackifier) having a softening point of 140 ° C was used as a tackifier The heat-radiating tape was produced in the same manner as in Example 1.

Example  3

A heat-radiating tape was produced in the same manner as in Example 1, except that MFL-1 was used in an amount of 10 parts by weight.

Example  4

Except that an epoxy resin (National Chemical Co., Ltd. YD-017, Bisphenol-A type, epoxy equivalent 1,750 to 2,100 g / eq.) Was used in place of the acrylic pressure-sensitive adhesive resin, .

Example  5

Except that 5 parts by weight of aluminum hydroxide (Al (OH) ₃ ) was used in place of the aluminum hydroxide (Al (OH) ₃ ).

Comparative Example  One

A heat radiation tape was produced in the same manner as in Example 1 except that a tackifier was not used.

Comparative Example  2

Except that 0.5 part by weight of a novolak type phenol resin (KAN-HWASUNG KAN-KIT-7505) having a solidifying agent having a tackifier of 2,500 MW and a softening point of 140 DEG C was used. A heat radiation tape was produced.

Comparative Example  3

The heat-radiating tape was produced in the same manner as in Example 1, except that a super-fine-particle ceramic was coated and a powder containing at least one pore therein was not used.

Comparative Example  4

A heat radiation tape was produced in the same manner as in Example 1, except that 0.1 part by weight of MFL-1, which is a powder containing ultrafine particle ceramic and at least one pore therein, was used.

Comparative Example  5

A heat-radiating tape was produced in the same manner as in Example 1, except that 30 parts by weight of the powder MFL-1 containing at least one pore therein was coated with ultrafine ceramic.

Comparative Example  6

Except that aluminum hydroxide (Al (OH) ₃ ) was not used, a heat radiation tape was produced in the same manner as in Example 1.

Experimental Example  1: Property test

The thermal conductivity, adhesion and heat resistance of the heat-dissipating tapes prepared in Examples 1 to 5 and Comparative Examples 1 to 6 were measured.

(1) Thermal conductivity

Thermal conductivity was measured by ASTM E 1461 Laser Flash method, and the unit was W / mK.

(2) Adhesion

Adhesion was evaluated by 180º peel test, KST 1025, and SUS plate. The unit of adhesive force is gf / 25 mm.

(3) Heat resistance

The heat-resistant holding force is applied to the SUS plate by attaching a heat-radiating tape (25 mm x 25 mm, length x length) and then reciprocating once at a speed of 300 mm / min using an automatic pressing machine. Apply a load of 500 g on this heat-resistant tape, raise the temperature from 60 ° C to 200 ° C, and observe the distance the heat-radiating tape has been pushed from the SUS plate at intervals of 10 minutes for 60 minutes. The unit of heat retaining force is the pushing distance ㎜.

Thermal conductivity (W / mK) Adhesion (gf / 25mm) Heat Retention (mm) Example 1 1.03 1750 0 Example 2 0.95 1900 0 Example 3 1.09 1920 0 Example 4 1.1 150 0 Example 5 0.25 1800 0 Comparative Example 1 1.1 730 10 Comparative Example 2 1.1 900 5 Comparative Example 3 1.08 400 25.4 Comparative Example 4 1.05 450 25.4 Comparative Example 5 0.3 1950 25.4 Comparative Example 6 0.4 1900 0

As a result of measurement, the adhesive tape prepared in Example 1 showed a slightly lower thermal conductivity than the adhesive tape prepared in Comparative Example 1, which did not contain a tackifier, but exhibited an excellent wetting property with an adhesive strength of 54% . The results of Comparative Examples 1 to 4 significantly deteriorate the adhesive force, and the thermal conductivity of Comparative Examples 5 and 6 is remarkably low.

It can be confirmed that the adhesive tape according to the present invention has excellent wettability, that is, adhesive force, while maintaining excellent thermal conductivity.

Experimental Example  2 : Heat dissipation  Measure

The 7.5W LED light was applied to the electric stand, and the heat dissipation tape was attached to the LED stand. After driving for 2 hours, the degree of heat radiation was tested.

division LED lighting temperature (℃) Before heat-insulating tape 72 Example 1 67.5 Example 2 67.8 Example 3 67.3 Example 4 66.0 Example 5 70.8 Comparative Example 1 69.5 Comparative Example 2 69.2 Comparative Example 3 69.5 Comparative Example 4 69.8 Comparative Example 5 71.4 Comparative Example 6 71.6

As a result of the measurement, the heat-radiating tape showed a heat-radiating effect of lowering the temperature of the display panel to 4 ° C or higher, preferably 5 ° C or higher. However, in Comparative Example 1, the temperature of the display panel was lowered by 2.5 占 폚, 2.8 占 폚 in Comparative Example 2, 2.5 占 폚 in Comparative Example 3, 2.2 占 폚 in Comparative Example 4, 1.8 占 폚 in Comparative Example 5 and 0.4 占 폚 in Comparative Example 6 went. In this case, the coating was easily peeled off or the adhesion was not good, so the heat dissipation effect was not continuous.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the same is by way of illustration and example only and is not to be construed as limiting the scope of the present invention.

It is therefore intended that the scope of the invention be defined by the claims appended hereto and their equivalents.

100: Heat-radiating tape 110: Mesh base
120: first heat-dissipating pressure-sensitive adhesive layer 130: second heat-
140:
150: a powder coated with ultrafine ceramic and containing at least one pore therein
160: Powder layer having pores therein 170: Ceramic layer

Claims (14)

Tackifiers;
A powder coated with ultrafine ceramic and comprising at least one pore therein;
Sticky polymer resin; And
A thermally conductive filler,
And 2 to 20 parts by weight of a tackifier for 100 parts by weight of the adhesive polymer resin,
Wherein the ceramic of the ultra fine particle ceramic layer has an average particle diameter of 10 to 5,000 nm. delete The method according to claim 1,
Wherein the tackifier comprises at least one selected from the group consisting of rosin, a rosin derivative, a pine resin, a petroleum resin, an alkylphenol resin and a phenol resin.
The method according to claim 1,
Wherein the tackifier is a novolac type alkylphenol resin or a resol type alkylphenol resin.
The method of claim 1, wherein the powder coated with the ultra fine particle ceramic and including at least one pore therein
A powder layer having pores therein; And a super-fine grain ceramic layer formed on the powder layer.
6. The method of claim 5,
Wherein the powder layer comprises at least one selected from the group consisting of polyethylene, nylon, polyacetal, vinyl chloride, polystyrene, ABS, and acryl, and the powder layer has an average thickness of 0.1 to 5 탆. .
6. The method of claim 5,
The powder coated with the ultra fine particle ceramic and having at least one pore therein has an average particle size of 1 to 100 탆. The powder is coated with ultrafine particle ceramic on 100 parts by weight of the adhesive polymer resin, And 20 parts by weight of a thermosetting resin. The method according to claim 1,
The ceramic includes at least one member selected from the group consisting of Alumina, Silica, Titania, Zirconia, Chromite, Zircon, Magnesium Oxide and Calcium Carbonate Wherein the heat-radiating tape is a heat-radiating tape. The method according to claim 1,
The adhesive polymer resin may include at least one selected from a polyacrylate ester polymer resin, a polyacrylic acid polymer resin, a polymethacrylic acid polymer resin, a polyacrylic acid soda polymer resin, and a polyacrylamide polymer resin Heat-resistant tape. The method according to claim 1,
The thermally conductive filler may be selected from the group consisting of Alumina, Silica, Titania, Zirconia, Chromite, Zircon, Magnesium Oxide, Magnesium Hydroxide, Aluminum Hydroxide, Silicon Carbide wherein the heat radiation tape comprises at least one member selected from the group consisting of titanium carbide, titanium carbide, silicon nitride, aluminum nitride and boron nitride. The method according to claim 1,
Wherein the thermally conductive filler has an average particle diameter of 1 to 100 μm and the thermally conductive filler is contained in an amount of 10 to 200 parts by weight based on 100 parts by weight of the adhesive polymer resin. The method according to claim 1,
The heat radiation tape according to claim 1, further comprising a mesh base layer, wherein a heat radiation adhesive layer is formed on one side or both sides of the mesh base layer.
The method according to claim 1,
Wherein the heat radiation tape has an average thickness of 50 to 200 占 퐉, a thermal conductivity of 0.5 to 3 W / mK and an average adhesive strength of 1,000 to 2,300 gf / 25 mm. A display device comprising the heat radiation tape according to any one of claims 1 and 3 to 13.

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