KR101422408B1 - Equipments and method for fabricating membrane for cmp head using liquid silicone material - Google Patents

Abstract

An apparatus for fabricating a membrane for a CMP head using a liquid silicone material is disclosed. The apparatus for fabricating the membrane for the CMP head comprises: a first storage tank for storing a liquid silicone having the (A) constituent including at least a vinyl siloxane polymer and a hydride crosslinker; a second storage tank for storing a liquid silicone having the (B) constituent including at least a vinyl siloxane polymer and an inhibitor; a third storage tank for storing a liquid silicone having the (C) component including at least a vinyl siloxane polymer and a platinum catalyst; a main supply pipe for supplying the liquid silicone having the (A) component whose supply ratio is adjusted by a first feeding pump and a first supply ratio adjuster, the liquid silicone having the (B) component whose supply ratio is adjusted by a second feeding pump and a second supply ratio adjuster, and the liquid silicone having the (C) component whose supply ratio is adjusted by a third feeding pump and a third supply ratio adjuster; and an injection molder including an injector and a molding device and forming the liquid silicone supplied from a mixer into the membrane for the CMP head with a wafer contact part and a plurality of applied pressure adjusters.

Description

FIELD OF THE INVENTION [0001] The present invention relates to an apparatus and a method for manufacturing a membrane for a CMP head using a liquid silicon material,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a manufacturing technique of a membrane for a CMP head which is joined to a head of a CMP equipment used in CMP (Chemical Mechanical Polishing), that is, a mechanical / chemical planarization process, And more particularly, to an apparatus and a method for manufacturing a membrane for an improved CMP head using a liquid silicon material so that a membrane for a CMP head can be manufactured more reliably and without generating particles.

 CMP (Chemical Mechanical Polishing) is a process of polishing a wafer surface flatly using chemical reaction and mechanical force during semiconductor manufacturing process. The membrane used in the CMP process coupled to the head of the CMP equipment must consider the physical properties and surface treatment methods of the material in order to increase the surface elasticity and adhesion of the surface in contact with the wafer.

Until the wafer size (size) of 200 mm, there was no big problem in the sticking and smoothness control when processing the wafer, because the adhesion to the 200 mm wafer was good even without the surface treatment in a state where the weight of the membrane was large. However, as the size of the wafer has increased to over 300 mm, it has been difficult to improve the adhesion of the surface only by the material of the membrane. For this reason, the membrane material and the surface treatment must be considered more carefully in consideration of the stability, such as prevention of the breakage of the wafer.

In order to solve the problem of material and surface treatment of such a membrane, it is necessary to improve the physical properties of the material for improving the slip property and stickiness of the membrane surface, to improve and improve the moldability of the material, And the research and development of membrane manufacturing technology for CMP head has been carried out. However, there have been problems in use such as control of product use made of raw materials such as EPDM, CR, and silicone and shortening of PM cycle. Therefore, improvement of materials for improvement of physical properties is the first priority. In addition, there is a need to improve the yield of membrane products with constant quality and to improve moldability and workability in the manufacture of membrane products. Filed on June 06, 2008 by the applicant of the present invention, " M & I ", filed on October 26, 2011, and entitled " High tensile silicon membrane for semiconductor CMP process " 1040333 discloses a membrane fabrication technique for a CMP head which greatly alleviates the above-mentioned problems. However, the disclosed technology uses a solid silicon material as a raw material, and maintains physical properties through compounding of materials and pressure press molding to maintain product characteristics. However, in the case of the manufacturing method using the solid phase silicone molding, it is difficult to maintain the product dimensions and the uniformity of the product manufacturing, the operation is very difficult, and it is difficult to increase the product yield. In addition, contamination due to particles occurring in the handling of solid state silicon materials can be problematic.

The present invention discloses a technique for manufacturing a CMP head membrane using a liquid silicon material having reliability characteristics not only for a 200 mm size wafer but also for a CMP process for a wafer having a size of 300 mm or more.

SUMMARY OF THE INVENTION The object of the present invention is to improve the facilities used for manufacturing a CMP head membrane using a solid silicone material to facilities capable of manufacturing a CMP head membrane using a liquid silicone material, The present invention provides an apparatus and a method for manufacturing a membrane for a CMP head, which improves semi-automatization of a moving work, greatly reduces contamination during operation, increases workability, and greatly improves molding reproducibility and work yield of a membrane product.

An apparatus for producing a membrane for CMP head according to an aspect of the present invention comprises a step of storing liquid silicone of component (A) comprising vinyl siloxane polymer, silica filler, Pt catalyst and additives, A first storage tank for storing the first storage tank; A second storage tank for storing liquid silicone of component (B), comprising a vinyl siloxane polymer, a silica filler, a hydride cross linker and an inhibitor; A mixer in which (A) component liquid silicon and (B) component liquid silicon supplied from the first storage tank and the second storage tank are mixed by a first transfer pump and a second transfer pump; And an injection molding machine including an injector and a molding device for molding the liquid silicone supplied from the mixer into a membrane for a CMP head having a wafer contact part and a plurality of pressing force adjusting parts, A first mold block having a central mold set disposed on the inner side of the hollow mold and a second mold block forming a membrane molding cavity when the first mold block is aligned with the first mold block, And a main space in which the wafer contact portion is formed between the first mold block and the second mold block at the time of forming the membrane, wherein at least one of the plurality of peripheral mold pieces includes a movable core mold piece and a plurality of peripheral mold pieces, Between the peripheral mold piece and the central mold piece or between adjacent peripheral mold pieces, And includes a space portion which is added the pressure regulating formed, when separating the membrane from the molding apparatus, the center mold pieces and the plurality of peripheral mold pieces are moved both.

A membrane manufacturing apparatus for a CMP head according to an aspect of the present invention includes a first storage tank for storing liquid silicone of component (A) including at least a vinyl siloxane polymer and a hydride crosslinker, ; A second storage tank for storing liquid silicone of component (B) comprising at least a vinyl siloxane polymer and an inhibitor; A third storage tank for storing liquid silicone of component (C) comprising at least a vinyl siloxane polyemr and a platinum catalyst (Pt catalyst); The liquid silicon of the component (A) supplied with the supply rate controlled by the first feed pump and the first feed rate controller, the liquid silicon of the component (B) supplied with the feed rate controlled by the second feed pump and the second feed rate controller, A main supply line through which the liquid silicon of the component (C) supplied with the supply rate controlled by the third feed pump and the third feed rate controller is supplied together; And an injection molding machine including an injector and a molding device for molding the liquid silicone supplied from the mixer into a membrane for a CMP head having a wafer contact part and a plurality of pressing force adjusting parts, A first mold block having a central mold set disposed on the inner side of the hollow mold and a second mold block forming a membrane molding cavity when the first mold block is aligned with the first mold block, And a main space in which the wafer contact portion is formed between the first mold block and the second mold block at the time of forming the membrane, wherein at least one of the plurality of peripheral mold pieces includes a movable core mold piece and a plurality of peripheral mold pieces, Between the peripheral mold piece and the central mold piece or between adjacent peripheral mold pieces, And includes a space portion which is added the pressure regulating formed, when separating the membrane from the molding apparatus, the center mold pieces and the plurality of peripheral mold pieces are moved both.

According to one embodiment, the apparatus further comprises a main moving means for moving the first mold block between a forming position defining the membrane forming cavity and an opening position opening the membrane forming cavity, The peripheral mold piece, the second peripheral mold piece, and the third mold piece, wherein the first peripheral mold piece, the second peripheral mold piece, and the third peripheral mold piece are moved to different distances by driving the driving mechanism, Second and third rods connected to the first, second, and third moving plates, the first and second rods, the first and second rods, Plate and the third moving plate are spaced apart during the membrane molding and are in contact with each other when the membrane is separated, The central mold piece and the third peripheral mold piece are in a position not to be engaged with each other at the time of forming the membrane, while being moved together with the third peripheral mold piece while being connected to the fourth rod extending from the third movement plate.

According to another embodiment, the central mold piece and the plurality of peripheral mold pieces are assembled to a base plate to constitute the central mold set, and the base plate is detachably attached to a mounting plate at the tip of the drive mechanism, Upon separation, the central mold piece and the plurality of peripheral mold pieces are detached from the mounting plate together with the base plate. At this time, the base plate is attached to the mounting plate by a magnetic force, and by the removal of the magnetic force, the base plate is separated from the mounting plate.

A method of manufacturing a membrane for a CMP head according to an aspect of the present invention includes the steps of forming a liquid silicone of component (A) comprising a vinyl siloxane polymer, a silica filler, a Pt catalyst, Storing in a first storage tank; Storing liquid silicone of component (B) comprising a vinyl siloxane polymer, a silica filler, a hydride crosslinker and an inhibitor in a second storage tank; Supplying liquid silicon containing the component (A) and the component (B) to an injection molding machine including an injector and a molding apparatus; Shaping the liquid silicon into a membrane for a CMP head having a wafer contact portion and a plurality of pressing force adjusting portions in the molding apparatus; A surface of the CMP head membrane molded in the molding apparatus is surface treated, the molding apparatus includes a first mold block having a hollow outer mold cavity and a central mold set disposed inside the outer hollow mold, Wherein the central mold set includes a central mold piece movable with respect to the outer hollow mold and a plurality of peripheral mold pieces, wherein during the forming of the membrane, the first mold block and the second mold block form a membrane molding cavity, Wherein the pressing force adjusting unit is formed between the at least one peripheral mold piece and the central mold piece or between the peripheral mold pieces adjacent to each other, wherein the pressing force adjusting unit is formed between the mold block and the second mold block, Wherein when the membrane is separated from the molding apparatus, the central mold piece A plurality of groups around the mold pieces are moved both.

According to another aspect of the present invention, there is provided a method of manufacturing a membrane for a CMP head, comprising: (a) storing liquid silicon of component (A) containing at least a vinyl siloxane polymer and a hydride crosslinker in a first storage tank and; Storing the liquid silicone of component (B) at least comprising a vinyl siloxane polymer and an inhibitor in a second storage tank; Storing liquid silicone of component (C) comprising at least a vinyl siloxane polyemr and a platinum catalyst in a third storage tank; Supplying liquid silicone containing the component (A), the component (B), and the component (C) to an injection molding machine including an injector and a molding apparatus while controlling a supply rate of each component; Shaping the liquid silicon into a membrane for a CMP head having a wafer contact portion and a plurality of pressing force adjusting portions in the molding apparatus; A surface of the CMP head membrane molded in the molding apparatus is surface treated, the molding apparatus includes a first mold block having a hollow outer mold cavity and a central mold set disposed inside the outer hollow mold, Wherein the central mold set includes a central mold piece movable with respect to the outer hollow mold and a plurality of peripheral mold pieces, wherein during the forming of the membrane, the first mold block and the second mold block form a membrane molding cavity, Wherein the pressing force adjusting unit is formed between the at least one peripheral mold piece and the central mold piece or between the peripheral mold pieces adjacent to each other, wherein the pressing force adjusting unit is formed between the mold block and the second mold block, Wherein when the membrane is separated from the molding apparatus, the central mold piece A plurality of groups around the mold pieces are moved both.

According to one embodiment, the surface treatment is performed by spray coating an additional hardened two-component silicone rubber type coating agent on the membrane separated from the molding apparatus.

According to another embodiment, the membrane separated from the molding apparatus is CVD coated.

Also, it is preferable that the temperature in the membrane forming cavity is maintained at 150 to 220 캜.

The present invention provides a technique for manufacturing a membrane for a CMP head having reliable characteristics not only for a 200 mm size wafer using a liquid silicon material but also for a CMP process for a wafer having a size of 300 mm or more. According to the present invention, the facilities used for manufacturing the membrane for the CMP head using the solid-state silicon material are improved to the facilities capable of manufacturing the membrane for the CMP head using the liquid silicon material, and the existing water- It can be improved by automation to greatly reduce contamination during operation, improve workability, and greatly improve molding reproducibility and work yield of membrane products. Specific objects and advantages of the present invention will be fully understood from the following description of the embodiments.

1 is a photograph showing an example of a membrane product for a CMP head.
Figures 2a, 2b, 2c, and 2d are cross-sectional views showing various membranes that may be applied for CMP heads.
FIG. 3A is a configuration diagram illustrating a membrane manufacturing apparatus for a CMP head according to the first embodiment of the present invention.
FIG. 3B is a configuration diagram illustrating a membrane manufacturing apparatus for a CMP head according to a second embodiment of the present invention.
FIGS. 4 to 6 are views for explaining the mold apparatus for manufacturing the CMP membrane shown in FIGS. 3A and 3B. FIG.
Figs. 7 and 8 are views for explaining another embodiment of the molding apparatus,
9 is a flowchart illustrating a method of manufacturing a membrane for a CMP head according to the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. The following embodiments are provided as examples for allowing a person skilled in the art to sufficiently convey the idea of the present invention. Therefore, the present invention is not limited to the embodiments described below, but may be embodied in other forms. In the drawings, the width, length, thickness, and the like of the components may be exaggerated for convenience.

FIG. 1 is a photographic view showing an example of a membrane product for a CMP head, and FIGS. 2A, 2B, 2C and 2D are cross-sectional views showing various membranes applicable for a CMP head.

Referring to FIGS. 1, 2A, 2B, 2C, and 2D, a membrane product for a CMP head is formed in a substantially circular shape and includes a wafer contact portion 5 in the form of a disk that contacts with a wafer during a CMP process, And a plurality of pressing force adjusting portions 6a, 6b, or 6c extending from the back surface of the portion 5. The membrane product for the CMP head shown in FIG. 2A includes only the outer pressure regulating portion 6c and the intermediate pressure regulating portion 6b as the pressure regulating portion, and the membrane product for the CMP head shown in FIGS. A pressing force adjusting portion 6a, an intermediate pressing force adjusting portion 6b, and an outer pressing force adjusting portion 6c. In general, the middle and middle pressing force adjusting portions 6a and 6b are composed of one (straight or curved) vertical extension portion and one (straight or curved) horizontal extension portion, 2a and 2b, it may comprise one vertical extension and two horizontal extensions extending therefrom. The position and shape of the pressing force adjusting portion can be changed by suitably replacing various mold pieces of the molding apparatus, which will be described in detail below. The membrane product for the CMP head shown in FIG. 2d is substantially the same as the structure for the membrane product for the CMP head shown in FIG. 2b, except that the central pressing force adjusting part has a different shape.

The material properties of the membrane product are as follows: the hardness of the material (Shore "A") is 45 to 50 degrees, the tensile strength of the material is 60 to 80 kgf / cm2, the elongation of the material is 400 The hardness of the material (Shore "A") is 48 to 53 degrees, the tensile strength of the material is 75 to 85 Kgf / cm 2, cm 2, elongation (%) of the material is 520 to 640%, and the 100% modulus of the material is preferably 13 to 18 kgf / cm 2. In case of FIG. 2 c, the hardness of the material (Shore "A" It is preferable that the tensile strength of the material is 90 to 100 Kgf / cm 2, the elongation of the material is 400 to 600%, and the 100% modulus of the material is 22 to 27 kgf / cm 2.

FIG. 3A is a configuration diagram illustrating a membrane manufacturing apparatus for a CMP head according to the first embodiment of the present invention.

3A, the apparatus for manufacturing a membrane for CMP head according to the first embodiment of the present invention is an injection molding apparatus comprising a first storage tank 100, a second storage tank 110, a mixer 120, , And an injection molding machine (1).

The first storage tank 100 is connected to the mixer 120 through a first feed pump 105 and a first feed pipe 106. The first storage tank 100 stores a silicon liquid mixture of components (A) comprising a vinyl siloxane polymer, a silica filler, a Pt catalyst, and an additive. (A) component mixture is supplied to the mixer 120 by the first transfer pump 105.

The second storage tank 110 is connected to the mixer 120 through a second feed pump 115 and a second feed pipe 116. The second storage tank 110 may comprise a silicon liquid mixture of components (B) comprising a vinyl siloxane polymer, a silica filler, a hydride crosslinker and an inhibitor, . (B) component mixture is supplied to the mixer 120 by the second feed pump 115. [

The mixer 120 mixes the components (A) and (B) component mixture from the first and second storage tanks 100 and 110 and mixes the components (A) and (B) Quot; silicone rubber ") is sent to the injection molding machine 1. The injection molding machine basically includes an injector I and a mold apparatus M. The injector I further conveys the liquid silicone rubber and transfers the liquid silicone rubber into the membrane forming cavity defined in the mold apparatus M. [ The membrane forming cavity is maintained in the temperature range of 150 to 220 캜 depending on its size, and the liquid silicone rubber is crosslinked and cured within this temperature range.

FIG. 3B is a view illustrating a manufacturing apparatus for a membrane for a CMP head according to a second embodiment of the present invention. 3B, the apparatus for producing a membrane for a CMP head includes a main supply line 207 connected to an injection molding machine 1 and supplies liquid silicone rubber to the injection molding machine M through a main supply line 207 . A first storage tank 200 is installed in the uppermost stream of the main supply pipe 207 and a first feed pump 205 and a first feed rate controller 206 are installed downstream of the first storage tank 200. The feed rate of component (A) stored in the first storage tank 200 may be controlled through the first feed pump 205, the first feed rate adjuster 206, or a combination thereof. The component (A) of the liquid silicone rubber base stored in the first storage tank 200 comprises at least one vinyl siloxane polymer and at least one hydride cross linker, At least one silica filler, at least one pre-structuring compound, at least one release agent, and the like.

The second storage tank 210 is connected to the main supply line 207 through a conduit provided with a second feed pump 215 and a second feed rate controller 216. The feed rate of the component (B) stored in the second storage tank 210 may be controlled through the second feed pump 215, the second feed rate controller 216, or a combination thereof. The component (B) may include at least a vinyl siloxane polymer and an inhibitor.

The third storage tank 220 is connected to the main supply line 207 through a pipe provided with a third feed pump 225 and a third feed rate controller 226. The feed rate of component (C) stored in the third storage tank 220 may be controlled through the third feed pump 225, the third feed rate controller 226, or a combination thereof. The component (C) may comprise at least one vinyl siloxane polymer and a platinum catalyst mixed therewith. (A), the component (B) and the component (C) are supplied to the injection molding machine 1 through the main supply duct 206.

At least one of the component (A), the component (B) and the component (C) may include a silica filler, although the component (A) is described above as including a silica filler.

FIGS. 4 to 6 are views for explaining the mold apparatus for manufacturing the CMP membrane shown in FIGS. 3A and 3B. FIG.

4 to 6, a mold apparatus M for manufacturing a CMP head membrane includes a wafer contact portion 5 (see Figs. 2A, 2B, and 2C) and a plurality of pressing force adjusting portions 6a The first mold block 7 and the second mold block 8 have a structure suitable for semi-automatic injection molding of a membrane for a CMP head having the first mold block 6, the second mold block 6b and the second mold block 6c (see FIGS. 2A, 2B and 2C) .

When the first mold block 7 and the second mold block 8 coincide with each other and are in a molding position as shown in FIG. 4, the above-described membrane forming cavity can be formed, The membrane for CMP head made of silicone rubber can be formed to have the wafer contact portion and the pressing force adjusting portions. After forming the membrane for the CMP head, the membrane forming cavity is opened as shown in Fig. 5, and through the deformation of the first mold block 7 as shown in Fig. 6, It can be easily separated from the apparatus 1.

The first mold block 7 includes a movable center mold set 72 for molding the CMP head membrane together with the outer hollow mold 71 and the outer hollow mold 71 and the second mold block 8, . The first mold block 7 and the second mold block 8 are arranged so as to be close to each other as shown in Fig. 4 for product molding or to be apart from each other as shown in Fig. 5 for product separation, At least one of the first mold block 7 and the second mold block 8 is configured to be movable back and forth (or up and down).

The center mold set 72 is provided with a plurality of mold pieces 71 arranged to be movable backward at different distances with respect to each other by one mold moving section from a molding position aligned in a line in the hollow of the outer hollow mold 71 721, 722, 723, 724). The plurality of mold pieces 721, 722, 723 and 724 includes a central mold piece 721 positioned at the center of the mold, and first, second and third peripheral mold pieces 721, (722, 723, 724).

The first mold block 7 may be moved by any of the main moving means (not shown) in a state where the outer hollow metal mold 71 and the plurality of mold pieces 721, 722, It can move with the block 8 to the forming position of FIG. 4 to define the membrane forming cavity. 5, the first mold block 7 is retracted by the main moving means to open the membrane forming cavity as shown in Fig.

The first, second and third peripheral metal mold pieces 722, 723 and 724 can be separated and moved to different distances as shown in FIG. 6 while the outer hollow mold 71 is fixed , Thereby facilitating the separation of the molded membrane product. The first, second and third peripheral mold pieces 722, 723 and 724 are connected to the first, second and third moving plates 73a and 73b which move at different distances by the forward driving of the driving mechanism 75 73b and 73c, respectively, and connected to first, second and third rods 74a, 74b and 74c extending at different distances. At this time, the center mold piece 721 can move forward with the third peripheral mold piece 724 while being connected to the fourth rod 74d extending from the third movement plate 73c, which is one of the movement plates . At this time, the central mold piece 721 and the third peripheral mold piece 724, which share the third moving plate 73c, are positioned at positions that are not involved with each other at the time of forming the membrane, that is, It is preferable to be in a position that can not be achieved.

 Alternatively, a separate moving plate connected to the fourth rod 74d connected to the central mold piece 721 may be additionally provided. However, the central mold piece 721 and one of the peripheral mold pieces (the third peripheral mold piece in this embodiment) are integrated with the third moving plate 73c integrally to move together, thereby further simplifying the device . It is also conceivable to fix one of the above-mentioned mold pieces to, for example, the outer hollow mold 71, but this is preferable in that the replacement of the central mold set eliminates the merit of manufacturing membranes of various sizes Can not do it.

4, the mold pieces 721 722, 723 and 724 of the first mold block 7 are aligned so as to be coplanar as a whole on the front surface, and correspond to the flat surface of the membrane for the CMP head . The movable plates 73a, 73b and 73c are all spaced apart from each other and the mold pieces 721, 722, 723 and 724 of the central mold set 72 and the outer hollow mold 71 are mutually interfered And remain fixed relative to each other.

After the membrane forming for the CMP head is completed as shown in Fig. 4 and then the membrane forming cavity is opened as shown in Fig. 5, the mold pieces 721, 722, 723, 724 of the mold set 72 Can be advanced with respect to the outer hollow metal mold 71 as shown in FIG. 6, so that the interference between the metal mold pieces 721, 722, 723 and 724 can be released. At this time, advancement of the mold pieces 721, 722, 723, and 723 causes the driving mechanism 75 to push the first moving plate 73a to advance, and the advancing first moving plate 73a is moved to the second moving plate 73a. The second moving plate 73b is advanced by pushing the third moving plate 73b, and the advanced second moving plate 73b pushing the third moving plate 73c forward. As a result, the first, second and third moving plates 73a, 73b and 73c which are spaced from each other are brought into contact with each other in turn.

The drive mechanism 75 is preferably operated by a gear mechanism rather than an oil pressure or pneumatic mechanism. That is, the drive mechanism 75 employs a gear mechanism that converts the rotational motion of the motor into a linear motion, thereby eliminating the inaccuracy of the central mold set control due to the lack of pressure, have.

Referring again to FIG. 4, the main space a in which the wafer contact portion of the membrane for the CMP head is formed is limited between the first mold block 7 and the second mold block 8, and the second peripheral mold piece A first subspace b defined by a vertical portion of the outer pressing force adjusting portion is defined between the outer surface of the third peripheral mold piece 723 and the third peripheral mold piece 724 and the inner surface of the second mold block 8, A second subspace c defining a first horizontal extension of the outer press force regulator is defined between the rear surface of the third peripheral mold piece 724 and the front surface of the outer hollow mold 71, A third subspace d is defined between the rear surface of the second peripheral mold piece 723 and a second horizontal extension of the outer press force regulating portion and the first peripheral mold piece 722 and the second peripheral mold piece 723 , A fourth sub-space (e) in which the intermediate pressing force adjusting portion is formed in a substantially "a" shape is formed, Between the piece 721 and the second peripheral metal piece 723, the fifth sub-space f in which the central pressing force adjusting portions are formed in the substantially "a" The spaces a, b, c, d, e, and f are connected as a whole, and the spaces are combined into a single membrane forming cavity. The membrane forming cavity is formed by an injection port formed in the second mold block 8 It is connected. The injector I as described above injects the liquid silicone rubber through the injection port into the membrane molding cavity. The liquid silicone rubber is cured in the membrane forming cavity and molded into a membrane for the CMP head.

FIGS. 7 and 8 are views for explaining another embodiment of the molding apparatus, wherein FIG. 8 shows a state in which a membrane forming cavity is opened immediately after forming a membrane for a CMP head, and FIG. The center mold set 72 is detached from the drive mechanism 75 and the separately prepared spare center mold set 72 'is replaced. The center mold piece 721 and the first to third peripheral mold pieces 722, 723 and 724 are provided on the base member 721 in place of the moving plates and the moving rods provided in the molding apparatus of the previous embodiment, Is assembled to the plate (B). The base plate B is detachably attached to the mounting plate 75a at the front end of the driving mechanism 75. [ The base plate 75a attached to the mounting plate 75a and the central mold set 72 assembled thereon are moved to the position where the central mold set 72 can be easily separated by advancing the drive mechanism 75 Move forward. The adhesion force between the next base plate 75a and the base plate B is removed so that the base plate 75a and the central mold set 72 on the base plate 75a are separated. At this time, it is preferable that the adhesive force is a magnetic force, and the central base plate 75a and the central mold set 72 are separated from the mounting plate 75a by an electric signal for eliminating the magnetic force. The mold pieces 721, 722, 723 and 724 of the separated central mold set 72 are separated to separate the membrane for the CMP head. On the mounting plate 75a on which the central mold set 72 is detached, the other base plate B on which the other central mold set 72 to be replaced is assembled is attached by magnetic force. A robot arm R may be used to attach, separate and / or move the central mold set 72 or 72 '.

The surface of the membrane for the CMP head formed as described above is surface-treated to complete the manufacture of the CMP membrane product. As the surface treatment, wet coating with a silicone rubber type coating on the surface of the CMP membrane and CVD coating method can be used. The wet coating method is preferably sprayed to a thickness of 10 μm or less by using a DSE80042 SERIESES addition-curing two-component silicone rubber type coating agent. For CVD (Chemical Vapor Deposition) coating method, PARYLENE C-TYPE is preferred, and the coating thickness is 0.4 to 0.8 μm.

A method of manufacturing a membrane for a CMP head according to the present invention will now be described with reference to FIG.

First, a first step (S1) in which two or more liquid silicon components are separately stored in two or more tanks is performed, and then a second step (S2) is performed in which liquid silicon components are mixed and supplied to the injection molding machine. The first step (S1) and the second step may be performed according to the foregoing description with reference to FIGS. 3A and 3B.

Next, a third step (S3) of molding a membrane for a CMP head in a molding apparatus of an injection molding machine is performed. The forming and post-forming separation of the membrane for the CMP head can be followed by the foregoing description with reference to Figs. 3 to 5 or Figs. 6 and 7.

Next, a fourth step (S4) of surface-treating the CMP head membrane separated from the molding apparatus of the injection molding machine is performed. The fourth step S4 may be performed by spray coating or CVD coating the addition-curing two-component silicone rubber type coating agent.

After the fourth step (S4), that is, after forming and separating the membrane for the CMP head, POST-CURING of the membrane is carried out, and the after- Within 30 minutes to 240 minutes.

Claims (12)

A first storage tank for storing liquid silicone of component (A), comprising a vinyl siloxane polymer, a silica filler, a Pt catalyst and an additive;
A second storage tank for storing liquid silicone of component (B), comprising a vinyl siloxane polymer, a silica filler, a hydride crosslinker and an inhibitor;
A mixer in which (A) component liquid silicon and (B) component liquid silicon supplied from the first storage tank and the second storage tank are mixed by a first transfer pump and a second transfer pump; And
And an injection molding machine including an injector and a molding device for molding the liquid silicone supplied from the mixer into a membrane for a CMP head having a wafer contact part and a plurality of pressing force adjusting parts,
The molding apparatus includes a first mold block having a hollow outer mold cavity and a central mold set disposed on the inner side of the outer hollow mold and a second mold block forming a membrane molding cavity when the first mold block coincides with the first mold block, The central mold set includes a central mold piece movable with respect to the outer hollow metal mold and a plurality of peripheral mold pieces, and during the membrane molding, the wafer contact portion is formed between the first mold block and the second mold block And a subspace in which the pressing force adjusting unit is formed is provided between at least one peripheral mold piece and the central mold piece or between neighboring peripheral mold pieces. When the membrane is separated from the molding apparatus, The central mold piece and the plurality of peripheral mold pieces are all moved, Further comprising a main moving means for moving the first mold block between a forming position for defining the mold cavity and an opening position for opening the membrane forming cavity, wherein the peripheral mold pieces include a first peripheral mold piece, Wherein the first peripheral mold piece, the second peripheral mold piece, and the third peripheral mold piece include a first moving plate that moves at different distances by driving of a driving mechanism, The first moving plate, the second moving plate, and the third moving plate are connected to the moving plate and the third moving plate, respectively, and connected to the first rod, the second rod and the third rod extending at different distances from each other, Wherein the central mold piece is spaced apart from the third moving plate and is in contact with the membrane during the membrane separation, Wherein the central mold piece and the third peripheral mold piece are in a position where they are not engaged with each other at the time of forming the membrane, characterized in that the central mold piece and the third peripheral mold piece are moved together with the third peripheral mold piece, Apparatus for manufacturing membrane for CMP head. A first storage tank for storing liquid silicone of component (A) comprising at least a vinyl siloxane polymer and a hydride crosslinker;
A second storage tank for storing liquid silicone of component (B) comprising at least a vinyl siloxane polymer and an inhibitor;
A third storage tank for storing liquid silicone of component (C) comprising at least a vinyl siloxane polymer and a platinum catalyst (Pt catalyst);
The liquid silicon of the component (A) supplied with the supply rate controlled by the first feed pump and the first feed rate controller, the liquid silicon of the component (B) supplied with the feed rate controlled by the second feed pump and the second feed rate controller, A main supply line through which the liquid silicon of the component (C) supplied with the supply rate controlled by the third feed pump and the third feed rate controller is supplied together;
And an injection molding machine including an injector and a molding device for molding the liquid silicone supplied from the main supply line into a membrane for a CMP head having a wafer contact part and a plurality of pressing force adjusting parts,
The molding apparatus includes a first mold block having a hollow outer mold cavity and a central mold set disposed on the inner side of the outer hollow mold and a second mold block forming a membrane molding cavity when the first mold block coincides with the first mold block, The central mold set includes a central mold piece movable with respect to the outer hollow metal mold and a plurality of peripheral mold pieces, and during the membrane molding, the wafer contact portion is formed between the first mold block and the second mold block And a subspace in which the pressing force adjusting unit is formed is provided between at least one peripheral mold piece and the central mold piece or between neighboring peripheral mold pieces. When the membrane is separated from the molding apparatus, The central mold piece and the plurality of peripheral mold pieces are all moved, Further comprising a main moving means for moving the first mold block between a forming position for defining the mold cavity and an opening position for opening the membrane forming cavity, wherein the peripheral mold pieces include a first peripheral mold piece, Wherein the first peripheral mold piece, the second peripheral mold piece, and the third peripheral mold piece include a first moving plate that moves at different distances by driving of a driving mechanism, The first moving plate, the second moving plate, and the third moving plate are connected to the moving plate and the third moving plate, respectively, and connected to the first rod, the second rod and the third rod extending at different distances from each other, Wherein the central mold piece is spaced apart from the third moving plate and is in contact with the membrane during the membrane separation, Wherein the central mold piece and the third peripheral mold piece are in a position where they are not engaged with each other at the time of forming the membrane, characterized in that the central mold piece and the third peripheral mold piece are moved together with the third peripheral mold piece, Apparatus for manufacturing membrane for CMP head. A first storage tank for storing liquid silicone of component (A), comprising a vinyl siloxane polymer, a silica filler, a Pt catalyst and an additive;
A second storage tank for storing liquid silicone of component (B), comprising a vinyl siloxane polymer, a silica filler, a hydride crosslinker and an inhibitor;
A mixer in which (A) component liquid silicon and (B) component liquid silicon supplied from the first storage tank and the second storage tank are mixed by a first transfer pump and a second transfer pump; And
And an injection molding machine including an injector and a molding device for molding the liquid silicone supplied from the mixer into a membrane for a CMP head having a wafer contact part and a plurality of pressing force adjusting parts,
The molding apparatus includes a first mold block having a hollow outer mold cavity and a central mold set disposed on the inner side of the outer hollow mold and a second mold block forming a membrane molding cavity when the first mold block coincides with the first mold block, The central mold set includes a central mold piece movable with respect to the outer hollow metal mold and a plurality of peripheral mold pieces, and during the membrane molding, the wafer contact portion is formed between the first mold block and the second mold block And a subspace in which the pressing force adjusting unit is formed is provided between at least one peripheral mold piece and the central mold piece or between neighboring peripheral mold pieces. When the membrane is separated from the molding apparatus, The central mold piece and the plurality of peripheral mold pieces are all moved, And the plurality of peripheral mold pieces are assembled to a base plate to constitute the central mold set, and the base plate is detachably attached to a mounting plate at a front end of a driving mechanism, and when the membrane is separated, Is separated from said mounting plate with said base plate. ≪ RTI ID = 0.0 > 11. < / RTI > A first storage tank for storing liquid silicone of component (A) comprising at least a vinyl siloxane polymer and a hydride crosslinker;
A second storage tank for storing liquid silicone of component (B) comprising at least a vinyl siloxane polymer and an inhibitor;
A third storage tank for storing liquid silicone of component (C) comprising at least a vinyl siloxane polymer and a platinum catalyst (Pt catalyst);
The liquid silicon of the component (A) supplied with the supply rate controlled by the first feed pump and the first feed rate controller, the liquid silicon of the component (B) supplied with the feed rate controlled by the second feed pump and the second feed rate controller, A main supply line through which the liquid silicon of the component (C) supplied with the supply rate controlled by the third feed pump and the third feed rate controller is supplied together;
And an injection molding machine including an injector and a molding device for molding the liquid silicone supplied from the main supply line into a membrane for a CMP head having a wafer contact part and a plurality of pressing force adjusting parts,
The molding apparatus includes a first mold block having a hollow outer mold cavity and a central mold set disposed on the inner side of the outer hollow mold and a second mold block forming a membrane molding cavity when the first mold block coincides with the first mold block, The central mold set includes a central mold piece movable with respect to the outer hollow metal mold and a plurality of peripheral mold pieces, and during the membrane molding, the wafer contact portion is formed between the first mold block and the second mold block And a subspace in which the pressing force adjusting unit is formed is provided between at least one peripheral mold piece and the central mold piece or between neighboring peripheral mold pieces. When the membrane is separated from the molding apparatus, The central mold piece and the plurality of peripheral mold pieces are all moved, And the plurality of peripheral mold pieces are assembled to a base plate to constitute the central mold set, and the base plate is detachably attached to a mounting plate at a front end of a driving mechanism, and when the membrane is separated, Is separated from said mounting plate with said base plate. ≪ RTI ID = 0.0 > 11. < / RTI > 5. The apparatus according to claim 4, wherein the base plate is attached to the mounting plate by a magnetic force, and is separated from the mounting plate by removal of the magnetic force. Storing liquid silicone of component (A), comprising vinyl siloxane polymer, silica filler, Pt catalyst and additives, in a first storage tank;
Storing liquid silicone of component (B) comprising a vinyl siloxane polymer, a silica filler, a hydride crosslinker and an inhibitor in a second storage tank;
Supplying liquid silicon containing the component (A) and the component (B) to an injection molding machine including an injector and a molding apparatus;
Shaping the liquid silicon into a membrane for a CMP head having a wafer contact portion and a plurality of pressing force adjusting portions in the molding apparatus;
Treating the formed membrane for the CMP head in the molding apparatus,
The molding apparatus includes a first mold block having a hollow outer mold cavity and a central mold set disposed on the inner side of the outer hollow mold and a second mold block forming a membrane molding cavity when the first mold block coincides with the first mold block, The central mold set includes a central mold piece movable with respect to the outer hollow metal mold and a plurality of peripheral mold pieces, and during the membrane molding, the wafer contact portion is formed between the first mold block and the second mold block And a subspace in which the pressing force adjusting unit is formed is provided between at least one peripheral mold piece and the central mold piece or between neighboring peripheral mold pieces. When the membrane is separated from the molding apparatus, The central mold piece and the plurality of peripheral mold pieces are all moved, Characterized in that the membrane separated from the molding apparatus is spray-coated with an addition-curing two-part silicone rubber type coating agent. Storing liquid silicon of component (A) at least in a first storage tank comprising at least a vinyl siloxane polymer and a hydride cross linker;
Storing the liquid silicone of component (B) at least comprising a vinyl siloxane polymer and an inhibitor in a second storage tank;
Storing the liquid silicone of component (C) comprising at least a vinyl siloxane polymer and a platinum catalyst in a third storage tank;
Supplying liquid silicone containing the component (A), the component (B), and the component (C) to an injection molding machine including an injector and a molding apparatus while controlling a supply rate of each component;
Shaping the liquid silicon into a membrane for a CMP head having a wafer contact portion and a plurality of pressing force adjusting portions in the molding apparatus;
Treating the formed membrane for the CMP head in the molding apparatus,
The molding apparatus includes a first mold block having a hollow outer mold cavity and a central mold set disposed on the inner side of the outer hollow mold and a second mold block forming a membrane molding cavity when the first mold block coincides with the first mold block, The central mold set includes a central mold piece movable with respect to the outer hollow metal mold and a plurality of peripheral mold pieces, and during the membrane molding, the wafer contact portion is formed between the first mold block and the second mold block And a subspace in which the pressing force adjusting unit is formed is provided between at least one peripheral mold piece and the central mold piece or between neighboring peripheral mold pieces. When the membrane is separated from the molding apparatus, The central mold piece and the plurality of peripheral mold pieces are all moved, Characterized in that the membrane separated from the molding apparatus is spray-coated with an addition-curing two-part silicone rubber type coating agent. delete delete delete The method of claim 6 or 7, wherein the membrane is subjected to a backwash flow to the membrane prior to surface treatment in a baking chamber, wherein the backwash is maintained at a temperature of 150-220 < 0 > C for 30 minutes to 240 minutes Wherein the liquid silicone is used. [12] The membrane according to claim 11, wherein the membrane subjected to the surface treatment has one of X, Y and Z properties, wherein the X property is a hardness (Shore "A") of 45 to 50 degrees and a tensile strength of 60 to 80 Kgf cm 2, the elongation percentage (%) is 400 to 520%, the 100% modulus is 16 to 22 kgf / cm 2, the Y property has a hardness (Shore "A") of 48 to 53 degrees and a tensile strength of 75 to 85 Kgf / cm 2 , Elongation (%) of 520 to 640%, and 100% modulus of 13 to 18 kgf / cm2. The Z physical properties are hardness (Shore "A") of 63 to 70 degrees, tensile strength of 90 to 100 Kgf / (%) Is 400 to 600%, and the 100% modulus is 22 to 27 kgf / cm < 2 >.

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