KR101416438B1 - Metal mesh, touch screen sensor using the same and manufacturing method of the same - Google Patents
Metal mesh, touch screen sensor using the same and manufacturing method of the same Download PDFInfo
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- KR101416438B1 KR101416438B1 KR1020130157242A KR20130157242A KR101416438B1 KR 101416438 B1 KR101416438 B1 KR 101416438B1 KR 1020130157242 A KR1020130157242 A KR 1020130157242A KR 20130157242 A KR20130157242 A KR 20130157242A KR 101416438 B1 KR101416438 B1 KR 101416438B1
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
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- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
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Abstract
The present invention provides a metal mesh for use in a touch screen sensor, the metal mesh including a transparent substrate, a conductive pattern layer formed on the transparent substrate, and a blackening layer formed on upper and side portions of the metal pattern layer.
Description
The present invention relates to a metal mesh, a touch screen sensor using the metal mesh, and a manufacturing method thereof. More particularly, the present invention relates to a metal mesh having improved characteristics through blackening and a method of manufacturing a touch screen sensor using the metal mesh.
2. Description of the Related Art Recently, electronic devices having small display devices such as navigation and smart phones have been widely used, and display devices having input means such as touch screen panels have been widely used.
BACKGROUND ART A touch screen panel (TSP) is an electronic device equipped with input means capable of controlling a computer using a hand or a touch pen. The touch screen panel includes a resistive film type for sensing a pressure and a capacitive type for detecting movement of a charge. Various techniques for manufacturing structures and manufacturing methods for reducing manufacturing costs and minimizing input errors are being developed.
The touch screen panel generally comprises a window substrate, a black matrix layer, a transparent conductive layer, a metal electrode layer, a primer layer, and the like. First, a black matrix layer, a transparent conductive layer, and a metal electrode layer are sequentially formed on a window substrate, And then the touch screen panel is coupled to the display substrate. Among them, indium tin oxide (ITO) thin film is mainly used as a transparent electrode material.
Such indium tin oxide materials are excellent in transmittance and electrical characteristics, but they have drawbacks in that they can not be used as flexible materials because they are rarely supplied, inexpensive, and flexible because rare-earth metals are used.
Therefore, in order to replace the conventional indium tin oxide, a lot of research has been conducted on transparent electrode materials such as silver nano wire, carbon nanotube, graphene and zinc oxide, and a transparent electrode layer using other methods such as a metal mesh . Metal mesh, which is expected to replace indium tin oxide film in transparent electrode material, has a low resistance value because it uses metal such as silver (Ag) or copper (Cu), but also has a low point of low permeability.
Metal mesh can be substituted for indium tin oxide, which is a transparent electrode material, to manufacture electrode film by finely finishing the metal on a transparent material such as PET film to a thickness of several micrometers can do. Further, it can be applied to a touch screen panel for a flexible display which can not be applied due to the crack characteristic of the existing indium tin oxide.
Up to now, metal mesh technology, which is mainly applied to middle and large sized products, has been developed with the process of miniaturizing the circuit width to 5 μm or less. Therefore, possibility to apply to mobile products has increased, and explosive growth is expected in the touch screen panel market do.
Metal mesh for touch screen panel is generally formed by forming a metal layer such as copper (Cu) or silver (Ag) on PET film by sputtering, transfer or plating method, And a peeling process. Such a method of producing a metal mesh is disclosed in Japanese Patent Application No. 2002-9484 and Japanese Patent Application No. 2009-76654.
Accordingly, a first object of the present invention is to provide a metal mesh for a touch screen sensor which has been subjected to a blackening treatment on upper and side portions of a pattern constituting a metal mesh.
A second object of the present invention is to provide a touch screen sensor to which the metal mesh is applied.
A third object of the present invention is to provide a method of manufacturing the metal mesh for the touch screen sensor.
According to an aspect of the present invention, there is provided a metal mesh for use in a touch screen sensor, the metal mesh including a transparent substrate, a conductive pattern layer formed on the transparent substrate, and a blackening layer formed on upper and side portions of the metal pattern layer. Metal mesh.
According to an embodiment of the present invention, the conductive pattern layer may include a nickel-copper layer, a copper layer, and a nickel copper layer in this order.
According to another embodiment of the present invention, the conductive pattern layer may include a nickel-copper layer, a copper layer, and a nickel layer in this order.
According to another embodiment of the present invention, the conductive pattern layer may be a nickel-copper layer and a copper layer.
According to another embodiment of the present invention, the conductive pattern layer may include a black nickel layer, a copper layer, and a black nickel layer in this order.
According to another embodiment of the present invention, the blackening layer may be made of black nickel or black chrome.
According to another embodiment of the present invention, the black nickel may be formed by electrolytic plating or electroless plating.
In order to achieve the second object, the present invention provides a touch screen sensor including the metal mesh.
According to another aspect of the present invention, there is provided a method of forming a patterned conductive layer, comprising the steps of: providing a transparent substrate; forming a conductive layer on the transparent substrate; patterning the conductive layer in a mesh pattern; And forming a blackening layer on the upper and side portions of the metal mesh.
According to an embodiment of the present invention, the conductive layer is formed of a nickel-copper layer / copper layer, a nickel-copper layer / a copper layer / a nickel-copper layer or a black nickel layer / a copper layer / a black nickel layer, The step of forming the layer may comprise a degreasing step, a catalytic treatment step, a pickling step and an electroless black nickel plating step.
According to another embodiment of the present invention, the conductive layer comprises a nickel-copper layer / nickel layer, and the step of forming the blackening layer includes a degreasing step, a pickling step, a first electroless nickel plating step, and a second electroless plating step Nickel plating step.
Since the metal mesh for a touch screen of the present invention is formed with a blackening layer, the reflectivity of the display screen can be reduced, and the bright-room contrast ratio can be increased, which is advantageous for ensuring visibility. In addition, since the blackening layer is formed not only at the upper portion of the metal mesh but also at the side portion or the lower portion of the mesh pattern, the reflectivity with respect to the incident light from the side is also reduced, thereby further enhancing the quality of the display device.
The manufacturing method of the metal mesh for a touch screen according to the present invention can reduce the manufacturing cost of the metal mesh by using the plating method and can apply different blackening layer forming processes depending on the structure of the mesh pattern layer to form a high quality blackening layer can do.
1 is a cross-sectional view for explaining a method of manufacturing a metal mesh to which a mesh pattern composed of a nickel-copper layer / a copper layer / a nickel-copper layer is applied.
FIG. 2 is a cross-sectional view illustrating a method of manufacturing a metal mesh to which a mesh pattern composed of a nickel-copper layer / a copper layer / a nickel layer is applied.
3 is a cross-sectional view illustrating a method of manufacturing a metal mesh to which a mesh pattern composed of a nickel-copper layer / copper layer is applied.
4 is a cross-sectional view for explaining a method of manufacturing a metal mesh to which a mesh pattern composed of a black nickel layer / a copper layer / a black nickel layer is applied.
5 is a flow chart for explaining a blackening process of a metal mesh composed of a nickel-copper layer / a copper layer / a nickel-copper layer or a nickel-copper layer / a copper layer.
6 is a flow chart for explaining a blackening process of a metal mesh composed of a nickel-copper layer / a copper layer / a nickel layer.
The present invention provides a metal mesh for use in a touch screen sensor, the metal mesh including a transparent substrate, a conductive pattern layer formed on the transparent substrate, and a blackening layer formed on upper and side portions of the metal pattern layer.
The metal mesh of the present invention is used in a touch screen sensor and can replace a conventional transparent electrode using an indium tin oxide thin film and has low electrical resistance and high visibility. In addition, since it is manufactured by the plating method, the manufacturing cost can be reduced, and in particular, it can be advantageously applied to a flexible substrate such as a polymer substrate.
In the metal mesh for a touch screen of the present invention, the conductive layer forming the mesh pattern may be formed in various structures, and different blackening layer forming processes may be applied depending on the configuration of the conductive layer.
The mesh pattern layer applied to the metal mesh for a touch screen of the present invention includes a triple layer of nickel-copper layer / copper layer / nickel copper layer, a triple layer of nickel-copper layer / copper layer / nickel layer, a nickel- Layer or a triple layer of a black nickel layer / a copper layer / a black nickel layer. After the formation of the multilayer, the patterning process may be performed through processes such as application of a patterned protective film and etching. Concretely, a type mainly composed of hydrochloric acid as the etching solution and a type mainly containing nitric acid, sulfuric acid and hydrogen peroxide can be applied.
A method of forming a triple layer of a nickel-copper layer / a copper layer / a nickel copper layer with a mesh pattern layer is to form an underlying plating layer of nickel-copper or the like on a material such as a PET film by a sputtering method Followed by sputtering to form a copper layer and again to form a nickel-copper layer over the copper layer to prevent oxidation and protect the copper layer.
A method for forming a triple layer of nickel-copper layer / copper layer / nickel layer with a mesh pattern layer is as follows. First, a base plating layer of nickel-copper or the like is formed on a material such as a PET film by a sputtering method Forming a copper layer by post-sputtering, and forming a nickel layer again on the copper layer to prevent oxidation and protect the copper layer.
The method of forming the nickel-copper layer / copper layer as the mesh pattern layer is as follows. First, a base plating layer such as nickel-copper is formed on a material such as a PET film by a sputtering method and a copper layer is formed thereon by sputtering will be.
A method of forming a triple layer of a black nickel layer / a copper layer / a black nickel layer with a mesh pattern layer is a method in which black nickel is plated on a material such as a PET film by electroless plating and then is subjected to sputtering, electroless plating, A copper metal layer is formed, and electroless black nickel plating is formed thereon.
The method of forming the blackening layer on the various mesh pattern layers is different depending on the configuration of the pattern layer. The electroless nickel plating method can be applied, and the blackening layer is formed on the upper and side portions of the pattern layer. In the case where the mesh pattern layer is formed of a triple layer of a black nickel layer / a copper layer / a black nickel layer, it is possible to obtain a pattern in which all four sides are blackened by forming a blackening layer on the top and side portions. But also the light reflected from the inside can be absorbed in the pattern layer, so that better optical characteristics can be realized.
As a method for forming the blackening layer, black nickel plating, black oxide plating, black chromium plating by electroplating, and black nickel plating by electroless chemical reaction can be applied. The black nickel treatment by electrolytic plating is performed for about 3 minutes at a current density of about 0.5 ASD at room temperature and at a working condition of about pH 6 using a solution of metal nickel salt, sodium sulfur compound, inorganic acid, . In addition, the oxide treatment by electroless plating can be performed for about 30 seconds to about 2 minutes depending on the color required at room temperature by using sulfur compounds such as sodium and potassium and chlorides.
A method of forming a metal mesh according to the present invention will be described below with reference to the drawings.
1 is a cross-sectional view for explaining a method of manufacturing a metal mesh to which a mesh pattern composed of a nickel-copper layer / a copper layer / a nickel-copper layer is applied. Referring to FIG. 1, a nickel-
FIG. 2 is a cross-sectional view illustrating a method of manufacturing a metal mesh to which a mesh pattern composed of a nickel-copper layer / a copper layer / a nickel layer is applied. Referring to FIG. 2, a nickel-
3 is a cross-sectional view illustrating a method of manufacturing a metal mesh to which a mesh pattern composed of a nickel-copper layer / copper layer is applied. Referring to FIG. 3, first, a nickel-
4 is a cross-sectional view for explaining a method of manufacturing a metal mesh to which a mesh pattern composed of a black nickel layer / a copper layer / a black nickel layer is applied.
Referring to FIG. 4, first, a
The black nickel treatment by electroless plating differs depending on whether the material for the metal mesh is composed of a double layer, a triple layer, and whether the upper layer is a nickel-copper alloy layer or a pure nickel layer in a triple layer. When the upper layer is made of copper or when it is made of nickel-copper alloy, it may be composed of degreasing, catalyst, electroless nickel plating and optional post-treatment. When the upper layer of the metal mesh material is made of pure nickel, the black nickel treatment may be a step of performing electroless nickel plating without a catalytic process after degreasing and pickling.
5 is a flow chart for explaining a blackening process of a metal mesh composed of a nickel-copper layer / a copper layer / a nickel-copper layer or a nickel-copper layer / a copper layer. Referring to FIG. 5, a degreasing process is performed first (S1). The degreasing process is a process for removing oxide film and contamination on the surface of a metal mesh circuit for blackening. Then, a catalyst treatment process is performed (S2). The catalytic treatment process is a catalytic treatment process for performing electroless nickel plating after degreasing. Then, a pickling process is performed (S3). The pickling process is intended to prevent smear plating after the catalytic treatment. Then, an electroless nickel plating process is performed (S4). A blackening layer is formed on the upper and side portions of the metal mesh by an electroless nickel plating process. As an optional process, a post-treatment process may optionally be performed to enhance the environmental resistance (S5).
6 is a flow chart for explaining a blackening process of a metal mesh composed of a nickel-copper layer / a copper layer / a nickel layer. Referring to FIG. 6, the degreasing process is performed first (S1). The degreasing process is a process for removing oxide film and contamination on the surface of a metal mesh circuit for blackening. Then, a pickling process is performed (S2). Then, a first electroless nickel plating process is performed (S3). In the first electroless nickel plating, it is preferable to use a plating solution having an excellent activity for plating electroless nickel directly on the pure nickel layer without a catalyst process, and it can be proceeded by plating with a thin strike concept. Then, a second electroless nickel plating process is performed. The second electroless nickel plating is intended to realize blackening, and is performed in an electroless nickel plating solution with an additive capable of blackening. As an optional process, a post-treatment process may optionally be performed to enhance the environmental resistance (S5).
Hereinafter, the method used for forming the blackening layer of the present invention will be described in more detail with reference to Examples.
Example 1 (Blackening process of metal mesh made of nickel-copper layer / copper layer / nickel-copper layer or nickel-copper layer / copper layer)
The first process, degreasing, is a metal mesh circuit for blackening. To remove the oxide film or contamination on the surface, the acid solution (SAC-502, manufactured by Wiemote Co., Ltd.) consisting of a weak acid such as organic acid and a surfactant And treated at 40 DEG C for about 1 minute.
After degreasing, a catalyst (Cata 584, manufactured by Wiemote Co., Ltd.) is subjected to electroless nickel plating. Other catalysts such as palladium sulfate such as palladium chloride may be used as the main component of the catalyst. In this case, the metal palladium concentration is about 25 ppm at room temperature for about 30 seconds.
After the catalyst treatment, a pickling process was carried out in a 5% sulfuric acid solution at room temperature for about 30 seconds in order to prevent smear plating.
The electroless nickel plating (CF-100) for blackening after the pickling uses a nickel sulfate salt as a metal salt and the composition composed of a functional additive such as a reducing agent, a stabilizer, a complexing agent and a wetting agent is blackened Treated with an electroless nickel plating solution using zinc oxide, titanium oxide (purified gold product) and TYZOR 131 (manufactured by DuPont) as additive for about 5 minutes at about 80 to 85 ° C, Nickel plated layer was obtained.
In order to enhance the environmental resistance, after treatment (HCR-100, a product of WYMITE Co., Ltd.) was carried out. This post treatment was a solution containing a trivalent chromium salt as a main component and a wettable additive, After the completion of the reaction, treatment was carried out at room temperature for about 1 minute to secure characteristics. The medicines mentioned above refer to representative products, and various products exhibiting the same functions can be applied.
Example 2 (Blackening step of metal mesh consisting of nickel-copper layer / copper layer / nickel layer)
When the triple layer of the metal mesh material is composed of nickel-copper layer / copper layer / nickel layer, the black nickel treatment comprises a step of performing electroless nickel plating without a catalytic process after degreasing and pickling.
The first process, degreasing, is a metal mesh circuit for blackening. To remove the oxide film or contamination on the surface, the acid solution (SAC-502, manufactured by Wiemote Co., Ltd.) consisting of a weak acid such as organic acid and a surfactant And treated at 40 DEG C for about 1 minute.
After degreasing, pickling treatment was carried out at about 30 ° C for about 1 minute in about 10% hydrochloric acid solution.
The pickled material is blackened through a black nickel plating process consisting of a first electroless nickel plating and a second electroless nickel plating.
In the first electroless nickel plating, it is preferable to use a plating solution which is excellent in activity to directly coat electroless nickel with a triple layer of pure nickel without a catalyst process, and it proceeds with plating with a thin strike concept. TF-23, a product of WYMITE Co., Ltd., is an electroless nickel plating solution suitable for this purpose. It uses nickel sulfate as a metal salt and contains electroless nickel plating composed of a functional additive such as a reducing agent, a stabilizer, a complexing agent, The solution was treated at about 80 to 85 캜 for about 5 minutes to form a primary nickel layer.
After the first electroless nickel plating, a second electroless nickel plating was performed to realize the blackening. As the second electroless nickel plating agent, TF-24 (product of WYMITE Co., Ltd.) was used. As in the case of the electroless nickel plating solution, the nickel sulfate was used as the metal salt, the reducing agent used was oxygen, , A complexing agent, and a humectant, to an electroless nickel plating solution containing titanium oxide (product of purified gold) and TYZOR NPZ (product of DuPont) as an additive capable of being blackened at about 80 to 85 ° C For about 5 minutes to obtain a black nickel plating layer having a thickness of about 0.1 to 0.2 탆.
After this black nickel treatment, post treatment (HCR-100, product of WYMITE Co., Ltd.) was carried out as occasion demands to enhance the environmental resistance. This post treatment was carried out in a solution containing a trivalent chromium salt as a main component and a wettable additive , And after black nickel plating was completed, treatment was carried out at room temperature for about 1 minute to secure properties.
Example 3 (Blackening step of metal mesh composed of black nickel layer / copper layer / black nickel layer)
The first step for obtaining a black nickel layer is degreasing, which is an acid degreasing solution (SAC-502, a product of WYMITE Co., Ltd.) comprising a weakly acidic substance such as organic acid and a surfactant to remove oxide film and contamination on the surface of a substrate such as PET, For about 1 minute at about 40 < 0 > C.
After degreasing, a catalyst (Cata 584, manufactured by Wiemote Co., Ltd.) is subjected to electroless nickel plating. Other catalysts such as palladium sulfate such as palladium chloride may be used as the main component of the catalyst. In this case, the metal palladium concentration is about 25 ppm at room temperature for about 30 seconds.
The electroless nickel plating (CF-100) for blackening after the catalytic treatment was carried out by using a nickel sulfate salt as a metal salt and adding a blackening agent to the composition composed of a functional additive such as a reducing agent, a stabilizer, a complexing agent, Treated with an electroless nickel plating solution containing zinc stearate, titanium oxide (purified gold) and TYZOR 131 (manufactured by DuPont) as an additive that can be added at a temperature of about 80 to 85 ° C for about 5 minutes, Of black nickel plating layer.
A copper layer was formed on the black nickel layer by sputtering.
The copper layer was again electroless black nickel treated to form a black nickel layer.
A metal mesh pattern was formed on the material having the structure of the above-mentioned black nickel layer / copper layer / black nickel layer, and the process of Example 2 was carried out to blacken.
In order to enhance the environmental resistance, after treatment (HCR-100, a product of WYMITE Co., Ltd.) was carried out. This post treatment was a solution containing a trivalent chromium salt as a main component and a wettable additive, After the completion of the reaction, treatment was carried out at room temperature for about 1 minute to secure characteristics. The medicines mentioned above refer to representative products, and various products exhibiting the same functions can be applied.
It has been confirmed that the metal mesh produced by the above embodiments has excellent electrical characteristics and optical characteristics.
While the present invention has been described in connection with what is presently considered to be the most practical and preferred embodiment, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the invention. Therefore, the embodiments described in the present invention are not intended to limit the scope of the present invention but to limit the scope of the present invention. The scope of protection of the present invention should be construed according to the claims, and all technical ideas within the scope of equivalents should be construed as falling within the scope of the present invention.
101: transparent substrate 102: nickel-copper layer
103: copper layer 104: nickel-copper layer
105: Blackening layer
201: transparent substrate 202: nickel-copper layer
203
205: Blackening layer
301: transparent substrate 302: nickel-copper layer
303: Copper layer 304: Blackening layer
401: transparent substrate 402: black nickel layer
403: copper layer 404: black nickel layer
405: Blackening layer
Claims (11)
Treating the polymer transparent substrate with an acid degreasing solution;
Catalytically treating one surface of the polymer transparent substrate treated with the acid degreasing solution with a solution containing palladium;
Forming a first black nickel layer on one surface of the catalyst-treated polymer transparent substrate by electroless plating;
Forming a copper layer over the first black nickel layer;
Forming a second black nickel layer on the copper layer by electroless plating;
Forming a metal mesh pattern having a first black nickel layer, a copper layer and a second black nickel layer on the second black nickel layer using a photosensitive resin;
Forming a nickel layer on upper and side portions of the pattern of the metal mesh by processing the polymer transparent substrate on which the metal mesh pattern is formed by an electroless plating method in which a catalyst processing step is omitted; And
And forming a third black nickel layer on the nickel layer by an electroless plating method in which a catalyst treatment step is omitted
A method of manufacturing a metal mesh for a touch screen sensor in which upper, lower and both sides of a metal mesh pattern are blackened.
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| CN108603301A (en) * | 2016-01-29 | 2018-09-28 | 住友金属矿山株式会社 | The manufacturing method of melanism plating solution and conductive board |
| CN108762578A (en) * | 2018-06-12 | 2018-11-06 | 信利光电股份有限公司 | A kind of metal grill touch screen and its preparation process |
| CN108762578B (en) * | 2018-06-12 | 2024-05-28 | 信利光电股份有限公司 | Metal grid touch screen and preparation process thereof |
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