KR101414449B1 - Method for printing micro pattern - Google Patents
Method for printing micro pattern Download PDFInfo
- Publication number
- KR101414449B1 KR101414449B1 KR1020130004560A KR20130004560A KR101414449B1 KR 101414449 B1 KR101414449 B1 KR 101414449B1 KR 1020130004560 A KR1020130004560 A KR 1020130004560A KR 20130004560 A KR20130004560 A KR 20130004560A KR 101414449 B1 KR101414449 B1 KR 101414449B1
- Authority
- KR
- South Korea
- Prior art keywords
- printing
- groove
- wire
- pattern
- mold
- Prior art date
Links
- 238000007639 printing Methods 0.000 title claims abstract description 127
- 238000000034 method Methods 0.000 title claims abstract description 29
- 239000000463 material Substances 0.000 claims abstract description 50
- 238000003825 pressing Methods 0.000 claims description 6
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- 230000001678 irradiating effect Effects 0.000 claims description 2
- 238000004049 embossing Methods 0.000 abstract 1
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 239000010949 copper Substances 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000013518 transcription Methods 0.000 description 1
- 230000035897 transcription Effects 0.000 description 1
- 238000010023 transfer printing Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
- H01L21/3043—Making grooves, e.g. cutting
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Computer Hardware Design (AREA)
- Mathematical Physics (AREA)
- Theoretical Computer Science (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
A fine pattern printing method for printing a fine pattern having a width of from nanometer to micrometer scale on a surface of a film or a plate is disclosed. The disclosed fine pattern printing method includes a groove forming step of forming a groove corresponding to a print pattern on a surface of a base member, a printing mold having an embossed pattern protruding from a groove by placing a wire thereon, A printing material applying step of applying a printing material to an upper surface of the printing mold to which the wire is fixed, and a step of applying a printing material to the printing medium by contacting the embossing pattern with the printing medium, And a printing material transferring step of transferring the printing material.
Description
The present invention relates to a method of printing a fine pattern having a width of from nanometer to micrometer scale.
In many electronic devices such as display devices and smart phones, fine patterns are formed on the surface of a film or a plate to form a circuit or a pattern. In order to form a circuit or a pattern on the surface of a film or a plate, a screen printing or a transfer printing method is usually used, but the precision is not enough to repeatedly implement a pattern having a fine width. On the other hand, although photolithography used in a semiconductor process is used as a method of forming a fine pattern, an expensive apparatus and equipment are required, and it is difficult to apply it to form a fine pattern in a flexible material such as a film There is a problem.
The present invention provides a fine pattern printing method for printing a fine pattern having a width of from nanometer to micrometer scale on the surface of a film or a plate.
The present invention provides a fine pattern printing method for printing a fine pattern using a printing mold formed by fixing a printing wire to a film or a plate.
According to the present invention, there is provided a method of manufacturing a printed wiring board, comprising the steps of: forming a groove corresponding to a printed pattern on a surface of a base member; forming a printing mold having an embossed pattern protruding by seating and fixing a wire in the groove; A printing material applying step of applying a printing material to an upper surface of the printing mold to which the wire is fixed; a printing material applying step of applying a printing material to an upper portion of the relief pattern by contacting the relief pattern with a printing medium; And a step of transferring the printing material onto the medium.
The wire may have any one of circular, oval, and polygonal cross-sections.
The base member may be a film or a flat plate.
The print medium may be a film or a flat plate.
The groove forming step may include pressing the surface of the base member using a roller having a protrusion corresponding to the groove on the outer circumferential surface.
The groove forming step may include irradiating a laser onto the surface of the base member.
The printing mold forming step may include the step of bonding the wire to the groove using an adhesive.
According to the fine pattern printing method of the present invention, it is possible to easily print a fine pattern having a width of nanometer to micrometer scale on the surface of a film or a plate at a lower cost than photolithography . In addition, a fine pattern can be printed on a flexible material.
1 to 5 are sectional views sequentially illustrating a method for printing a fine pattern according to an embodiment of the present invention.
Fig. 6 is a sectional view showing a modification of Fig. 2. Fig.
FIG. 7 is a cross-sectional view showing an example of an apparatus in which a printing material is applied to a printing mold and a process in which a printing material is transferred to a printing medium continuously in the fine pattern printing method of the present invention.
Hereinafter, a method of printing a fine pattern according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings. The terminology used herein is a term used to properly express the preferred embodiment of the present invention, which may vary depending on the intention of the user or operator or the custom in the field to which the present invention belongs. Therefore, the definitions of these terms should be based on the contents throughout this specification.
1 to 5 are sectional views sequentially illustrating a method for printing a fine pattern according to an embodiment of the present invention. The fine pattern printing method of the present invention is a method of printing a fine pattern having a width of nanometer to micrometer scale on a print medium in the form of a film or a flat plate. Referring to FIGS. 1 to 5, a method for printing a fine pattern according to an embodiment of the present invention includes a groove forming step, a printing mold forming step, a printing material applying step, and a printing material transferring step.
Referring to FIG. 1, the groove forming step is a step of forming a
The
However, the formation of the
Referring to FIG. 2, the print mold forming step includes the steps of: placing a
The
Referring to FIG. 3, the step of applying the printing material is a step of applying the
4, the printing material transfer step includes contacting the
According to the pressing strength, it is possible to determine the width of the
Accordingly, the width of a print pattern to be patterned on the
5, a print pattern is formed on the
Fig. 6 is a sectional view showing a modification of Fig. 2. Fig. 6, a
FIG. 7 is a cross-sectional view showing an example of an apparatus in which a printing material is applied to a printing mold and a process in which a printing material is transferred to a printing medium continuously in the fine pattern printing method of the present invention. Referring to FIG. 7, the
The
The
The
While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the scope of the present invention. Therefore, the true scope of protection of the present invention should be defined only by the appended claims.
10: Base 15: Wire
17: Printing mold 20: Printing material
22: slot coater 25: print medium
25: unwinding roller 46: transfer roller
Claims (7)
A printing mold forming step of placing a wire on the groove and fixing the wire to form a printing mold having a protruding relief pattern;
Applying a printing material onto an upper surface of the printing mold to which the wire is fixed; And
And a printing material transferring step of transferring the printing material applied on the upper portion of the relief pattern to the printing medium by contacting the relief pattern with the printing medium.
Wherein the cross section of the wire is one of circular, elliptical, and polygonal.
Wherein the base member is a film or a flat plate.
Wherein the print medium is a film or a flat plate.
Wherein the groove forming step includes pressing the surface of the base member using a roller having a projection corresponding to the groove on an outer circumferential surface thereof.
Wherein the groove forming step includes irradiating a laser onto a surface of the base member.
Wherein the printing mold forming step comprises adhering the wire to the groove using an adhesive.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020130004560A KR101414449B1 (en) | 2013-01-15 | 2013-01-15 | Method for printing micro pattern |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020130004560A KR101414449B1 (en) | 2013-01-15 | 2013-01-15 | Method for printing micro pattern |
Publications (1)
Publication Number | Publication Date |
---|---|
KR101414449B1 true KR101414449B1 (en) | 2014-07-04 |
Family
ID=51740970
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020130004560A KR101414449B1 (en) | 2013-01-15 | 2013-01-15 | Method for printing micro pattern |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR101414449B1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020079620A1 (en) * | 2018-10-17 | 2020-04-23 | 3M Innovative Properties Company | Printing patterns via die cutting |
KR102396765B1 (en) * | 2020-11-18 | 2022-05-10 | 김호민 | Pressed pattern producing apparatus using magnetic units |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20000035503A (en) * | 1998-11-17 | 2000-06-26 | 알프레드 엘. 미첼슨 | Replicating a nanoscale pattern |
KR20030094654A (en) * | 2002-06-07 | 2003-12-18 | 엘지.필립스 엘시디 주식회사 | A printing machine for organic luminescence layer of OLED |
KR101051448B1 (en) | 2010-10-26 | 2011-07-22 | 한국기계연구원 | Transparent electrode manufacturing method using metal pattern based print and transparent electrode thereby |
KR101150959B1 (en) | 2011-01-17 | 2012-05-29 | (주)피엔티 | Apparatus for forming pattern on light guide panel |
-
2013
- 2013-01-15 KR KR1020130004560A patent/KR101414449B1/en active IP Right Grant
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20000035503A (en) * | 1998-11-17 | 2000-06-26 | 알프레드 엘. 미첼슨 | Replicating a nanoscale pattern |
KR20030094654A (en) * | 2002-06-07 | 2003-12-18 | 엘지.필립스 엘시디 주식회사 | A printing machine for organic luminescence layer of OLED |
KR101051448B1 (en) | 2010-10-26 | 2011-07-22 | 한국기계연구원 | Transparent electrode manufacturing method using metal pattern based print and transparent electrode thereby |
KR101150959B1 (en) | 2011-01-17 | 2012-05-29 | (주)피엔티 | Apparatus for forming pattern on light guide panel |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020079620A1 (en) * | 2018-10-17 | 2020-04-23 | 3M Innovative Properties Company | Printing patterns via die cutting |
KR102396765B1 (en) * | 2020-11-18 | 2022-05-10 | 김호민 | Pressed pattern producing apparatus using magnetic units |
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