KR101411526B1 - bonding apparatus for flexible display panel - Google Patents

Abstract

The present invention relates to a bonding apparatus for bonding an FDP (Flexible Display Panel), which comprises a bonding tool, an insertion hole and a fastening means for attaching / detaching the bonding tool, A bonding module including a heater block indirectly transferring heat to the bonding tool; An X-axis angle adjustment section for adjusting an X-axis angle of the bonding tool, an X-axis wedge insertion hole for crossing the X-axis angle adjustment section, and a Y- A Y-axis wedge insertion hole for crossing the Y-axis angle adjustment incision, and a fixing hole for crossing the X, Y-axis angle adjustment incision and the X, Y-axis wedge insertion holes, A through hole having a diameter larger than the diameter of the fixing hole is formed and inserted into the X and Y axis wedge insertion holes so that the through hole is concentric with the fixing hole, And a flat deformation fixing member for fixing the wedge by tightening the X and Y axis wedge insertion holes and the wedge by tightening through the fixing holes and the through holes, Adjustment block; relates to a bonding apparatus provided with a wedge-shaped tool flatness control device characterized in that comprising: a.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a bonding apparatus having a wedge-

The present invention relates to a bonding apparatus, and particularly to a bonding apparatus which adopts a high-rigidity flat adjustment block having a convenient adjustment property for minimizing self-weight and maximizing rigidity for low-pressure bonding, thereby preventing the flatness- To a bonding apparatus having a wedge-shaped tool flatness adjusting device.

The liquid crystal display device is a display device that displays image information by using the electric and optical properties of liquid crystal injected into a liquid crystal panel. The display device has lower power consumption and lower weight than an electronic product made of a cathode ray tube (CRT) And has a small volume. Accordingly, the liquid crystal display device has been widely applied to various fields such as a display device of a portable computer, a monitor of a desktop computer, and a monitor of a high-definition video device.

2. Description of the Related Art [0002] Liquid crystal displays are classified into TN (Twisted Nematic) and STN (super-twisted nematic) types. In accordance with a driving method, an active matrix display system using switching elements and TN liquid crystals and a passive matrix (passive matrix) display method.

The active matrix display system uses a thin film transistor (TFT) as a switch to drive a liquid crystal display device. On the other hand, the passive matrix display method does not require a complicated circuit related thereto because it does not use a thin film transistor.

Such a liquid crystal display device is largely divided into a liquid crystal panel assembly and a backlight assembly. The liquid crystal panel assembly includes a liquid crystal panel in which two substrates, for example, a thin film transistor panel and a color filter panel are bonded together and a liquid crystal material having anisotropic permittivity is injected therebetween, and a liquid crystal panel formed by mounting on a liquid crystal panel by a COG A driving IC for applying a driving signal and a common voltage to the gate lines, the data lines and the common electrode formed on the liquid crystal panel, and a driving IC for connecting the driving IC and the printed circuit board for transmitting predetermined data and control signals to the driving IC Flexible printed circuit boards, and the like. Such a liquid crystal panel assembly is housed in a backlight assembly including a lamp assembly and various optical sheets to constitute a liquid crystal display device.

On the other hand, since the liquid crystal panel is a solid glass type, low pressure bonding is not required, so that the tool structure is made of a material having a high stiffness, that is, a high specific gravity, and low pressure bonding due to its own weight is impossible.

In addition, the tool flatness adjustment method is inconvenient in operation due to a large number of adjustment points by the method using a bolt, and there is a possibility that the product is defective due to flatness during operation.

<Reference Literature>

Korean Patent Registration No. 10-0457642 (November 18, 2004)

Korean Patent Registration No. 10-0888056 (2009.03.10.)

SUMMARY OF THE INVENTION It is an object of the present invention to provide a bonding apparatus having a wedge-shaped tool flatness adjusting device, which is capable of easily controlling the flatness of the pressing tool and the deformation of the adjusted flatness.

Another object of the present invention is to provide a bonding apparatus equipped with a wedge-shaped tool flatness adjusting device capable of low-pressure bonding to a flexible display panel while ensuring rigidity.

SUMMARY OF THE INVENTION [0008]

A bonding apparatus for bonding an FDP (Flexible Display Panel)

A bonding tool,

A bonding module including an insertion hole for attaching and detaching the bonding tool and a fastening means at a lower portion thereof and a heater block having a heating means therein to indirectly transmit heat to the bonding tool;

Coupled to the bonding module,

An X-axis angle adjusting section for adjusting an X-axis angle of the bonding tool,

An X-axis wedge insertion hole crossing the X-axis angle adjustment incision,

A Y-axis angle adjusting section for adjusting the Y-axis angle of the bonding tool,

A Y-axis wedge insertion hole that intersects the Y-axis angle adjustment cutout,

A fixing hole is formed which crosses the X and Y axis angle adjusting cutout portions and the X and Y axis wedge insertion holes,

A plurality of through holes each having a diameter larger than the diameter of the fixing hole are formed and inserted into the X and Y axis wedge insertion holes so that the through holes are concentric with the fixing holes, A wedge for adjusting the gap of the shaft angle adjusting incision,

A flat adjustment block including a flat deformation fixing member for fixing the wedge by closely contacting the wedge with the X and Y axis wedge insertion holes by tightening through the fixing holes and the through holes;

The present invention relates to a bonding apparatus having a wedge-shaped tool flatness adjusting device.

According to the bonding apparatus provided with the wedge-shaped tool flatness adjusting device according to the present invention, the configuration using the wedge is adopted to adjust the angle of the X and Y axis of the bonding tool, so that the flatness of the bonding tool can be easily adjusted.

Further, when the flatness adjustment of the bonding tool using the wedge according to the present invention is completed, a fixing member for preventing the flatness of the bonding tool from being deformed is adopted, so that the flatness of the bonding tool whose flatness is controlled can be prevented , Bonding reliability is improved.

In addition, by adopting the structure of reducing the weight of the bonding tool and the flatness control block with the stiffness, low-pressure bonding to the flexible display panel is possible, and the rigidity can be ensured.

1 is a view illustrating a bonding apparatus equipped with a wedge-shaped tool flatness adjusting apparatus according to the present invention,
Fig. 2 is a right side view of Fig. 1,
FIG. 3 is an enlarged view of a bonding module of a bonding apparatus having a wedge-shaped tool flatness adjusting apparatus according to the present invention,
FIG. 4 is an assembly diagram of a bonding module of a bonding apparatus having a wedge-shaped tool flatness adjusting apparatus according to the present invention,
FIG. 5 is an enlarged view of a flat adjustment block of a bonding apparatus having a wedge-shaped tool flatness adjusting device according to the present invention,
Fig. 6 is a left sectional view of Fig. 1,
Fig. 7 is an enlarged view of a portion A in Fig. 6,
8 is a view showing the wedge and the flat deformation fixing member in the view of Fig. 7,
FIGS. 9 and 10 are diagrams showing an operation relationship of the flat adjustment block deformed according to the movement of the wedge; FIG.

The present invention relates to a bonding apparatus for bonding an FDP (Flexible Display Panel), and more particularly, to a bonding apparatus for bonding a flexible display panel (FDP) by adopting a high rigidity flat adjusting block having a small adjustment weight for minimizing self weight and maximizing rigidity, (Hereinafter, referred to as a 'bonding apparatus 100') equipped with a wedge-shaped tool flatness adjusting device which can prevent the flatness-adjusting easiness and the deformation of the adjusted flatness.

The bonding apparatus 100 includes a bonding tool 10, an insertion hole 21 for attaching and detaching the bonding tool 10, and fastening means at a lower portion thereof and having a heating means therein, A bonding module (30) including a heater block (20) indirectly transferring heat to the heat block (20);

A cutting unit having a gap for adjusting the angle of the X and Y axes of the bonding tool 10, a wedge insertion hole formed across the cutout, and a wedge insertion hole inserted into the wedge insertion hole to adjust a gap between the cutouts And a flat adjustment block (70) including an angle adjusting unit each having a wedge and coupled with the bonding module.

Here, the flat adjustment block 70 further includes a fixing hole passing through the incision part and the wedge insertion hole, and the wedge further has a through hole larger than the diameter of the fixing hole. The wedge is inserted into the wedge insertion hole And a flat deformation fixing member for fixing the wedge by inserting the through hole of the wedge so as to be concentric with the fixing hole and pressing the wedge insertion hole through the through hole and the wedge to closely contact the wedge .

In the meantime, the bonding apparatus 100 according to the present invention includes a bonding tool 10, an insertion hole 21 for attaching / detaching the bonding tool 10, and fastening means, A bonding module (30) including a heater block (20) indirectly transferring heat to the bonding tool (10);

An X-axis angle adjustment cut-out portion 41 for adjusting an X-axis angle of the bonding tool 10, coupled to the bonding module 30, and an X-axis wedge portion 41, A Y-axis angle adjusting section 51 for adjusting the Y-axis angle of the bonding tool 10 and a Y-axis wedge insertion hole 51 crossing the Y-axis angle adjusting section 51, And a fixing hole 71 is formed to intersect the X and Y axis angle adjusting portions 41 and 51 and the X and Y axis wedge insertion holes 42 and 52. The fixing hole 71 Holes 45a and 55a having a diameter larger than the diameter are formed and inserted into the X and Y axis wedge insertion holes 42 and 52 so that the through holes 45a and 55a are concentric with the fixing holes 71 A wedge 45,55 for adjusting the clearance of the X and Y axis angle adjusting portions 41 and 51 while moving within the inner diameter range of the through holes 45a and 55a, And the through holes (45a, 55a) to tighten the X, Y It can comprise a; brought into close contact with a wedge insertion hole (42,52) and said wedges (45,55) planar adjustment block comprising a flat deformed securing member 60 for securing the spokes (70).

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Reference will now be made in detail to the preferred embodiments of the present invention, examples of which are illustrated in the accompanying drawings.

FIG. 1 illustrates a bonding apparatus 100 according to the present invention in which only the bonding module 30 and the flat adjustment block 70, which are features of the present invention, are shown as being activated.

FIG. 2 is a right side view of FIG. 1, and FIG. 3 is an enlarged view of the bonding module 30 of FIG. 1. FIG. 4 is a sectional view of a bonding tool 10, Fig.

Specifically, the bonding tool 10 is formed with a hole 11 to be fixed to the insertion hole 21 of the heater block 20 by fastening means (for example, a bolt 22) To the heater block 20.

In the bonding module 30, the heater block 20 is equipped with a heating means (e.g., a heater 23) to transmit heat to the bonding tool 10, Is inserted in the insertion hole (21), and the area of contact with the heater block (20) is large and the thermal conductivity is improved.

In addition, if a bonding failure occurs due to foreign matter adhesion or wear of the bonding tool 10, the bonding tool 10 can be replaced with a new bonding tool 10.

5 is an enlarged view of the flat adjustment block 70, FIG. 6 is a left sectional view of FIG. 1, FIG. 7 is an enlarged view of a portion A of FIG. 6, And FIG. 9 is a view showing the operation of the flat adjustment block 70, which is deformed according to the movement of the wedges 45 and 55. As shown in FIG.

The flat adjustment block 70 is coupled to the bonding module 30,

An X-axis angle adjusting section 41 for adjusting the X-axis angle of the bonding tool 10,

An X-axis wedge insertion hole 42 crossing the X-axis angle adjusting cutout 41,

A Y-axis angle adjusting section 51 for adjusting the Y-axis angle of the bonding tool 10,

A Y-axis wedge insertion hole 52 crossing the Y-axis angle adjustment cutout 51,

A fixing hole 71 is formed to cross the X and Y axis angle adjusting portions 41 and 51 and the X and Y axis wedge insertion holes 42 and 52,

Holes 45a and 55a which are larger than the diameter of the fixing hole 71 are formed and inserted into the X- and Y-axis wedge insertion holes 42 and 52, respectively, and the through holes 45a and 55a are inserted into the fixing hole The wedges 45 and 55 are inserted concentrically with the through holes 45a and 55a and adjust the gap of the X and Y axis angle adjusting portions 41 and 51 while moving within the inner diameters of the through holes 45a and 55a. ,

The X-and Y-axis wedge insertion holes 42 and 52 and the wedges 45 and 55 are brought into close contact with each other by fixing the wedge through the fixing hole 71 and the through holes 45a and 55a, Member (60).

The flat adjustment block 70 is connected to the bonding module 30 and a flat adjustment block 70 is provided between the flat adjustment block 70 and the bonding module 30 so that the heat of the bonding module 30 A configuration for preventing transmission may be added.

In detail, each configuration of the flat adjustment block 70 will be described in detail.

The X-axis angle adjusting section 41 for adjusting the X-axis angle, the X-axis wedge insertion hole 42 and the X-axis wedge 45 are provided with a Y-axis angle adjusting section 51 Axis wedge insertion hole 52 and the Y-axis wedge 55. Therefore, the Y-axis angle adjusting portion 51 and the Y-axis wedge insertion hole 52 Only the engagement relationship and the operation relationship of the Y-axis wedge 55 will be described.

5, the Y axis angle adjusting section 51 for adjusting the Y axis angle of the bonding tool 10 includes a gap adjusting cutout section 51a, a gap adjusting center hole 51b, Hole 51c.

The Y-axis wedge insertion hole 52 is formed to cross the gap adjusting cutout portion 51a of the Y-axis angle adjusting cutout portion 51, the gap adjusting center hole 51b and the gap adjusting extension hole 51c, And has a conical shape in which the inner diameter gradually increases toward the gap adjusting cutout portion 51a with reference to the adjustment extension hole 51c side.

8, the flat adjustment block 70 is formed with a fixing hole 71 which crosses the Y axis angle adjusting portion 51 and the Y axis wedge insertion hole 52. The fixing hole 71 Also intersects the X-axis angle adjusting section 41 and the X-axis wedge insertion hole 42. [

A wedge 55 is inserted into the Y-axis wedge insertion hole 52. The wedge 55 has an outer circumferential surface corresponding to the inner circumferential surface of the Y-axis wedge insertion hole 52 as shown in FIG. 7, 71, and an adjustment hole 55b having a tab is formed at one side thereof. The adjustment hole 55b is engaged with the bolt 59. When the bolt 59 is rotated, the bolt 59 itself does not move and the Y-axis wedge 55 It moves.

That is, as shown in FIG. 9, when the bolt 59 is rotated in the same direction as (3), the Y-axis wedge 55 is moved to the left. At this time, the interval of the Y-axis angle adjusting unit 51 is reduced, so that the lower side of the flat adjusting block is turned in the direction of?, And the bonding module 30 interlocked with the flat adjusting block is also turned.

On the other hand, as shown in FIG. 10, when the bolt 59 is rotated in the same direction as the arrow 4, the Y-axis wedge 55 is moved to the right. At this time, the interval of the Y-axis angle adjusting section 51 is increased, so that the lower side of the flat adjustment block is twisted in the direction of?. Therefore, the bonding module 30 interlocked with the flat adjustment block 70 is also distorted.

The range of deflection of the flat adjustment block 70 in the directions of ⑤ and ⑥ is determined by the inner diameter of the flat deformation fixing member 60 fastened to the fixing hole 71 and the through holes 45a and 55a of the wedges 45 and 55, (L) of the inner circumferential surface

When the flatness adjustment of the bonding tool 10 is completed through the flat adjustment block 70, the flat deformation fixing member 60 is tightened so that the adjusted flatness is not deformed.

When the flat deformation fixing member 60 is tightened, the X- and Y-axis wedge insertion holes 42 and 52 and the outer peripheral surfaces of the X and Y-axis wedges 45 and 55 come in close contact with each other. To prevent movement.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is evident that many alternatives, modifications, and variations will readily occur to those skilled in the art without departing from the spirit and scope of the invention. Therefore, it should be understood that the disclosed embodiments are to be considered in an illustrative rather than a restrictive sense, and that the true scope of the invention is indicated by the appended claims rather than by the foregoing description, and all differences within the scope of equivalents thereof, .

100: bonding device
10: bonding tool 20: heater block
21: insertion hole 30: bonding module
41: X-axis angle adjusting section 42: X-axis wedge insertion hole
51: Y-axis angle adjusting section 52: Y-axis wedge insertion hole
45, 55: wedge 45a, 55a: through hole
60: flat deformation fixing member 70: flat adjustment block
71: Fixing hole

Claims (3)

In a bonding apparatus 100 for bonding an FDP (Flexible Display Panel)
A bonding tool 10,
A heater block 20 having an insertion hole 21 for attaching and detaching the bonding tool 10 and a fastening means at a lower portion thereof and having heating means therein to indirectly transmit heat to the bonding tool 10 (30);
Coupled to the bonding module 30,
An X-axis angle adjusting section 41 for adjusting the X-axis angle of the bonding tool 10,
An X-axis wedge insertion hole 42 crossing the X-axis angle adjusting cutout 41,
A Y-axis angle adjusting section 51 for adjusting the Y-axis angle of the bonding tool 10,
A Y-axis wedge insertion hole 52 crossing the Y-axis angle adjustment cutout 51,
A fixing hole 71 is formed to cross the X and Y axis angle adjusting portions 41 and 51 and the X and Y axis wedge insertion holes 42 and 52,
Holes 45a and 55a which are larger than the diameter of the fixing hole 71 are formed and inserted into the X- and Y-axis wedge insertion holes 42 and 52, respectively, and the through holes 45a and 55a are inserted into the fixing hole And two wedges 45,55 inserted into the through holes 45a and 55a so as to be concentric with the through holes 45a and 55a and adjusting the clearance of the X and Y axis angle adjusting portions 41 and 51 while moving within the inner diameters of the through holes 45a and 55a. )Wow,
The X and Y axis wedge insertion holes 42 and 52 and the wedges 45 and 55 are brought into close contact with each other through the fixing hole 71 and the through holes 45a and 55a to fix the two wedges A flat adjustment block (70) including a flat deformation fixing member (60);
Wherein the wedge-shaped tool flatness adjusting device comprises a wedge-shaped tool flatness adjusting device.
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