KR101407627B1 - A Device of forming Metal patten and A Method of forming Metal patten using the same - Google Patents

Abstract

The present invention relates to a laser processing apparatus, A projection unit for focusing the laser light provided from the laser generation unit and reducing the size of the laser light; And an electrolytic bath irradiated with the laser beam through the projection unit, and a method of forming a metal pattern using the same. In addition, since the photolithography process can be eliminated, the process is simple, Can be solved, and a metal pattern excellent in pattern shape, precision, and productivity can be formed.

Description

[0001] The present invention relates to a metal pattern forming apparatus and a metal pattern forming method using the metal pattern forming apparatus,

The present invention relates to a metal pattern forming apparatus and a metal pattern forming method using the same, and more particularly, to a metal pattern forming apparatus for forming a metal pattern by a liquid phase reduction method using a laser and a metal pattern forming method using the same.

Generally, the conductive metal pattern is formed by forming a metal film on a substrate and then selectively removing the metal film.

In order to form the metal film, a vacuum evaporation method or a plating method is mainly used depending on the thickness of the metal film to be formed. In order to selectively remove the metal film, a photosensitive resist is formed on the metal thin film, A photolithographic patterning method is generally used in which a portion of a metal film is exposed and then dissolved using an etching solution.

Alternatively, a method in which a resist pattern is first formed on a substrate (substrate) using a photosensitive resist, a metal film is formed, and metal is removed from the upper portion of the resist through development, or the metal is plated only on the exposed portion of the substrate .

Particularly, the photolithography process has advantages in that the fine patterns to be formed are excellent in properties and the process is stable. However, many processes such as coating, exposure, development, and etching of a resist film are required, and many processes such as developing solution, etching solution, The use of such solutions is not only expensive but also causes environmental pollution.

For example, in the case of forming a copper thin film pattern, conventionally, a copper thin film formed by using a plating method may be attached to a substrate, and then a copper thin film pattern of a predetermined pattern may be formed through a photolithography method.

More specifically, a copper thin film having a predetermined thickness is formed on a temporary substrate by a plating method, the copper thin film is removed from the temporary substrate, and then the copper thin film is attached to the glass substrate.

After attaching a copper foil to the glass substrate, a photoresist is coated on the copper foil, and the photoresist is photographed using a photomask including a pattern to be formed. The photoresist is dissolved by using a developing solution, and the remaining photoresist is removed A copper thin film pattern of a desired shape can be formed.

However, such a conventional pattern forming method requires such a complicated process, and also has a problem that many kinds of solutions such as a plating solution, a photosensitizer, a developer, and an etching solution are used.

The present invention provides a method of forming a metal pattern that is environmentally friendly, simple, and economical compared to the conventional metal pattern forming process.

The objects of the present invention are not limited to the above-mentioned objects, and other objects not mentioned can be clearly understood by those skilled in the art from the following description.

According to an aspect of the present invention, A projection unit for focusing the laser light provided from the laser generation unit and reducing the size of the laser light; And an electrolytic bath irradiated with the laser beam passed through the projection unit.

Further, the present invention provides a metal pattern forming apparatus for focusing the laser light and reducing the size of the laser light, wherein the projection section includes an objective lens.

In addition, the present invention provides a metal pattern forming apparatus in which the projection section further comprises an eyepiece lens for adjusting magnification, and the combination of the eyepiece and the objective lens functions as a microscope.

The present invention also provides a metal pattern forming apparatus including an electrolytic solution containing a metal precursor.

The present invention also provides a metal pattern forming apparatus in which a base material is immersed in the electrolyte solution and the base material is irradiated with the laser beam to deposit a metal pattern in a region irradiated with the laser beam.

The present invention also provides a method of manufacturing a metal pattern, comprising: preparing a base substrate for forming a metal pattern; Immersing the base substrate in an electrolytic solution; Irradiating the base substrate with laser light generated from the laser generating unit; And irradiating the base material with the laser beam to form a metal pattern on the base material.

The method may further include, after forming the metal pattern on the base substrate, determining whether a desired metal pattern is formed on the base substrate, and when the desired metal pattern is formed, And when the desired metal pattern is not formed, the irradiation of the laser beam is repeated.

According to the present invention as described above, since the photolithography process can be excluded, it is possible to solve not only a simple process but also a problem of causing environmental pollution.

Further, in the present invention, by adopting a method in which a metal pattern is formed by a chemical reduction method in a region irradiated with a laser beam, the pattern shape, precision, and productivity are superior to general electroless plating methods.

1 is a schematic view showing a metal pattern forming apparatus according to the present invention.
2 is a flowchart showing a method of forming a metal pattern according to the present invention.
3 is a photograph showing the copper precipitation state according to Experimental Example 1. Fig.
4 is a photograph showing the copper precipitation state according to Experimental Example 2. Fig.
5 is a photograph showing the copper precipitation state according to Experimental Example 3. Fig.
FIG. 6A is a graph showing the relationship between the power of the laser and the line width of the metal pattern according to the electrolyte composition, and FIG. 6B is a graph showing the relationship between the resistivity of the metal pattern and the power of the laser and the composition of the electrolyte.

BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention and the manner of achieving them will become apparent with reference to the embodiments described in detail below with reference to the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Is provided to fully convey the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Reference will now be made in detail to the preferred embodiments of the present invention, examples of which are illustrated in the accompanying drawings. &Quot; and / or "include each and every combination of one or more of the mentioned items. ≪ RTI ID = 0.0 >

Although the first, second, etc. are used to describe various components, it goes without saying that these components are not limited by these terms. These terms are used only to distinguish one component from another. Therefore, it goes without saying that the first component mentioned below may be the second component within the technical scope of the present invention.

The terminology used herein is for the purpose of illustrating embodiments and is not intended to be limiting of the present invention. In the present specification, the singular form includes plural forms unless otherwise specified in the specification. The terms " comprises "and / or" comprising "used in the specification do not exclude the presence or addition of one or more other elements in addition to the stated element.

Unless defined otherwise, all terms (including technical and scientific terms) used herein may be used in a sense commonly understood by one of ordinary skill in the art to which this invention belongs. Also, commonly used predefined terms are not ideally or excessively interpreted unless explicitly defined otherwise.

The terms spatially relative, "below", "beneath", "lower", "above", "upper" And can be used to easily describe a correlation between an element and other elements. Spatially relative terms should be understood in terms of the directions shown in the drawings, including the different directions of components at the time of use or operation. For example, when inverting an element shown in the figures, an element described as "below" or "beneath" of another element may be placed "above" another element . Thus, the exemplary term "below" can include both downward and upward directions. The components can also be oriented in different directions, so that spatially relative terms can be interpreted according to orientation.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a schematic view showing a metal pattern forming apparatus according to the present invention.

1, the apparatus for forming a metal pattern according to the present invention includes a laser generating unit 20, a projection unit 40 for focusing the laser light provided from the laser generating unit and reducing the size of the laser light, And an electrolytic bath 50 to which laser light passed through the electrolytic bath 40 is irradiated.

More specifically, the laser generation unit 20 provides an energy source for depositing a metal pattern, which will be described later, in the formation of the metal pattern according to the present invention.

The laser generated in the laser generating portion may include at least one selected from the group consisting of a helium-neon laser, an argon ion laser, a krypton ion laser, a helium-cadmium ion laser, a carbon dioxide laser, an excimer laser, But may be a laser including one or more selected from the group consisting of a laser, a diode pump laser, an organic dye laser, a chemical laser, a free electron laser, an X-ray laser, and a variable wavelength laser, Therefore, the present invention is not limited to the kind of the laser.

Meanwhile, it is possible to use a method known in the general laser technology to generate the laser in the laser generating part.

For example, the laser generating unit may generate raw laser light that has not been processed, and the laser generating unit may include a laser generating tube (not shown). Each of the laser generating tubes includes an upper electrode and a lower electrode, and is filled with Ar, Cl, He, or Ne gas. The size of the raw laser light may be about 12 mm x 36 mm, and the pulse retention time may be about 20 ns, but the kind of the laser light is not limited in the present invention.

The optical system may include an optical system (not shown) for processing the raw laser light generated from the laser generating unit, and the optical system may include a plurality of mirrors and lenses to reduce or increase the pulse holding time Alternatively, the laser beam can be adjusted to a desired size. However, the present invention does not limit the inclusion of the optical system.

In this case, the present invention may include a laser power supply unit 10 for supplying power to the laser generation unit 20, but the present invention does not limit the presence or absence of the laser power supply unit.

1, the laser light provided from the laser generation unit is provided to the projection unit 40, wherein the laser light is provided to the projection unit, The laser light may be reflected through the first reflection mirror 30 to be provided to the projection unit. However, the present invention does not limit the presence or absence of the first reflection mirror.

The projection unit 40 may include an objective lens 41 through which the laser beam can be focused and the size of the laser beam can be reduced.

In the present invention, the projection unit 40 may include an eyepiece lens 43 which is mounted on one side so as to be movable up and down and adjusts magnification of an object. The user may use the eyepiece 43, Through the objective lens 41, the irradiation state of the laser light can be confirmed in real time.

That is, the combination of the eyepiece lens and the objective lens has the same function as the microscope, whereby the irradiation state of the laser light can be observed in real time.

In the present invention, the objective lens not only functions as a part of a laser irradiation device that focuses laser light and reduces the size of the laser light, but also can function as a part of an observation device such as a microscope by being combined with the eyepiece lens.

At this time, it is preferable that the objective lens is located in the irradiation path of the laser light, and it is preferable that the position where the user observes the irradiation state of the laser light avoids the irradiation path of the laser light.

That is, it is preferable that the irradiation path of the laser beam and the observation path of the user are different from each other. Therefore, it is preferable that the objective lens is combined with the eyepiece lens in the observation path of the user so as to function as a microscope, It is preferable to include a mirror 42.

1, the laser light passing through the projection unit 40 is irradiated to the electrolytic bath 50, and in the present invention, the electrolytic bath 50 is provided with an electrolytic solution 60 for metal precipitation by chemical reduction .

At this time, a base material 70 is immersed in the electrolyte solution 60, and a laser beam is irradiated onto the base material 70, whereby a metal pattern is deposited in a region irradiated with the laser beam, .

That is, in forming the metal pattern by the metal pattern forming apparatus according to the present invention, the metal pattern is formed by reducing the liquid metal of the electrolyte including the metal precursor. In this case, Can be provided by one laser beam.

Generally, electroless plating is also referred to as chemical plating or autocatalytic plating. The electroless plating is a method of autocatalytically reducing metal ions in a metal salt aqueous solution without being supplied with electric energy from the outside, And the metal is deposited on the surface.

That is, the conventional electroplating refers to a plating method in which metal ions dissolved in an electrolytic solution are precipitated on the surface of an article to be plated by flowing an electric current through an article to be plated as an anode. The electroless plating is performed by plating Method.

Therefore, the electroless plating is widely used for surface plating of a base material having a material such as plastic which can not supply electricity or is difficult to supply electricity. As described above, electroless plating is different from the conventional electroplating method in that electrons It is necessary to perform a separate electronic exchange process for the precipitation of ions in the electrolyte solution.

At this time, a reducing agent for supplying electrons to the metal ion for the electron exchange process may be included in the electrolyte solution. The activation energy of the reduction reaction may be reduced to such an extent that the reducing agent contacts the metal ion to be precipitated or plated, There is a problem that the plating effect can not be obtained because the metal ions are precipitated and precipitated from all the sites of the electrolytic solution rather than the metal ions are precipitated only on the surface of the base substrate.

However, in the method of forming a metal pattern according to the present invention, the reduction reaction of a metal ion by a reducing agent present in an electrolyte solution together with a metal ion is effectively performed by irradiating laser light as an activation energy source, Metal ions are selectively precipitated, and a desired metal pattern can be precipitated along the irradiation path of the laser light.

At this time, the base substrate 70 may be a substrate (substrate) selected from the group consisting of glass, a silicon wafer, a metal substrate, an acrylic polymer, a polycarbonate polymer, a cycloolefin polymer (COP), an epoxy polymer and an ester polymer film However, the type of the base substrate is not limited in the present invention.

The electrolytic solution may be at least one selected from the group consisting of copper (Cu), silver (Ag), chromium (Cr), nickel (Ni), iron (Fe ), Cobalt (Co), and alloys thereof. However, the type of the electrolyte solution is not limited in the present invention.

For example, the electrolytic solution includes an ion source and a reducing agent for forming a metal pattern by a metal reduction reaction, and may further include a pH adjusting agent.

More specifically, for example, assuming that the metal pattern to be formed is a copper wiring, the ion source may be at least one selected from CuSO ₄ , CuO, CuCl ₂ , and Cu (NO ₃ ) ₂ , , Hypophosphite, borohydride, and hydrazine. The pH adjuster may be at least one selected from the group consisting of KOH, NaOH, Ca (OH) ₂ and NH ₄ OH.

Meanwhile, the electrolyte according to the present invention may include a light absorption promoter capable of promoting the absorption of the laser light, and the light absorption promoter may include a dichromate such as sodium bichromate or potassium bichromate. This will be described in connection with experimental examples.

At this time, although not shown in the figure, the stage may include a stage for supporting the electrolyzer, and the stage may be movable in X, Y, and Z directions.

On the other hand, the reference numeral 80 is a screen, and laser light irradiated to the electrolytic bath can be projected.

Hereinafter, a method for forming a metal pattern using the apparatus for forming a metal pattern according to the present invention will be described.

2 is a flowchart showing a method of forming a metal pattern according to the present invention.

Referring to FIG. 2, first, a base material for forming a metal pattern is prepared, and the base material is immersed in an electrolyte (S110). At this time, the electrolytic solution can be accommodated in the electrolytic bath.

The base substrate may be a substrate (substrate) selected from the group consisting of glass, a silicon wafer, a metal substrate, an acrylic polymer, a polycarbonate polymer, a cycloolefin polymer (COP), an epoxy polymer and an ester polymer film, But the kind of the base substrate is not limited in the present invention.

On the other hand, since the method of forming a metal pattern according to the present invention is formed by a metal reduction reaction, the base substrate may be made of a material such as plastic which can not supply electricity or is difficult to supply.

The electrolytic solution may be at least one selected from the group consisting of copper (Cu), silver (Ag), chromium (Cr), nickel (Ni), iron (Fe ), Cobalt (Co), and alloys thereof. However, the type of the electrolyte solution is not limited in the present invention.

For example, the electrolytic solution contains an ion source and a reducing agent, and may further include a pH adjusting agent. In particular, in the present invention, by including a light absorption promoter capable of promoting absorption of laser light, It can proceed more efficiently. Since this is the same as described above, a detailed description will be omitted.

Next, the base substrate is irradiated with the laser light generated from the laser generating portion (S120).

At this time, laser light is irradiated onto the base substrate to form a metal pattern.

The laser generated in the laser generating portion may include at least one selected from the group consisting of a helium-neon laser, an argon ion laser, a krypton ion laser, a helium-cadmium ion laser, a carbon dioxide laser, an excimer laser, But may be a laser including one or more selected from the group consisting of a laser, a diode pump laser, an organic dye laser, a chemical laser, a free electron laser, an X-ray laser, and a variable wavelength laser, Therefore, the present invention is not limited to the kind of the laser. Since this is the same as described above, a detailed description will be omitted below.

On the other hand, as described above, the reduction reaction of the metal ions by the reducing agent present in the electrolyte solution together with the metal ions requires activation energy above a certain level. In the present invention, by providing such an activation energy source through the laser light, Metal ions are selectively precipitated selectively on the surface of the base substrate to which the light is irradiated, and a metal pattern of a desired shape can be deposited.

At this time, in the present invention, by including the light absorption promoter capable of promoting the absorption of the laser light into the electrolytic solution, formation of the metal pattern can be more efficiently proceeded. This means that a metal pattern can be formed well without causing defects of the base substrate, which will be described later.

Next, it is determined whether a desired metal pattern is formed on the base substrate (S130).

That is, in the present invention, in the case where a desired predetermined metal pattern is not formed by one laser light irradiation, it is possible to form a predetermined metal pattern by repeatedly irradiating laser light. Therefore, in the present invention, The irradiation of the laser beam is terminated, and when the desired metal pattern is not formed, irradiation of the laser beam can be repeated.

As shown in FIG. 1, the laser light is focused on an eyepiece 43, which is installed on one side of the projection unit 40 and is movable upward and downward to adjust the magnification of the object, It is possible to confirm in real time whether or not a predetermined metal pattern is formed through the objective lens 41 which can be reduced.

As described above, unlike the conventional metal pattern formation, in the present invention, since the photolithography process through which the resist film is coated, exposed, developed, and etched can be eliminated, the process is simple, Can be solved.

Further, in the present invention, the pattern shape, precision, and productivity are superior to the general electroless plating method by employing the metal precipitation method according to the chemical reduction of the method in which the metal pattern is formed in the region irradiated with the laser beam.

Hereinafter, preferred experimental examples according to the present invention will be described. However, the present invention is not limited to the experimental examples.

[Experimental Example 1]

A SiO ₂ substrate, which is a non-conductive base material for forming a metal pattern, was pretreated to prepare a base substrate. The pretreatment is firstly washed with distilled water, firstly dried with high-pressure N ₂ , immersed in a mixture of H ₂ SO ₄ and K ₂ Cr ₂ O ₇ to remove organic and inorganic substances on the surface, After the second washing with distilled water, the second drying with high pressure N ₂ was carried out.

The base substrate was immersed in an electrolytic bath containing an electrolytic solution, and the base substrate was irradiated with a laser at a power of 250 mW using a CW Ar ⁺ laser as a laser source. At this time, CuSO ₄ was used as an ion source, HCHO was used as a reducing agent, and NaOH was used as a pH adjusting agent.

After the irradiation of the laser beam according to the conditions of Experimental Example 1 was performed once, the stage supporting the electrolytic bath was moved in the X and Y directions twice, and again the stage supporting the electrolytic bath was moved in the X and Y directions And irradiated up to 5 times by the method of three times of irradiation.

[Experimental Example 2]

A SiO ₂ substrate, which is a non-conductive base material for forming a metal pattern, was pretreated to prepare a base substrate. The pretreatment was carried out under the same conditions as in Experimental Example 1.

The base substrate was immersed in an electrolytic bath containing an electrolytic solution, and the base substrate was irradiated with a laser at a power of 250 mW using a CW Ar ⁺ laser as a laser source. At this time, CuSO ₄ was used as an ion source, HCHO was used as a reducing agent, and NaOH was used as a pH adjusting agent. Potassium dichromate (K ₂ Cr ₂ O ₇ ) was used as a light absorption promoter to promote the absorption of laser light.

After the irradiation of the laser beam according to the conditions of Experimental Example 2 was performed once, the stage supporting the electrolytic bath was moved in the X and Y directions twice, and again the stage supporting the electrolytic bath was moved in the X and Y directions And irradiated up to 5 times by the method of three times of irradiation.

[Experimental Example 3]

A SiO ₂ substrate, which is a non-conductive base material for forming a metal pattern, was pretreated to prepare a base substrate. The pretreatment was carried out under the same conditions as in Experimental Example 1.

The base substrate was immersed in an electrolytic bath containing an electrolytic solution, and the base substrate was irradiated with a laser at a power of 250 mW using a CW Ar ⁺ laser as a laser source. At this time, the electrolytic solution used was CuCl ₂ as an ion source, polyethylene glycol as a reducing agent, and NaOH as a pH adjusting agent.

After the irradiation of the laser beam according to the conditions of Experimental Example 3 was performed once, the stage supporting the electrolytic bath was moved in the X and Y directions three times, and again the stage supporting the electrolytic bath was moved in the X and Y directions And 5 times.

The formation of the metal pattern according to Experimental Examples 1 to 3, that is, copper deposition on the base substrate is shown in FIGS.

3 is a photograph showing the copper precipitation state according to Experimental Example 1. Fig.

Referring to FIG. 3, in the case where the number of times of irradiation with the laser light is once and twice, only the defect is generated in the base substrate, the deposition of copper hardly occurs, and when the number of irradiation of the laser light is three, Copper was deposited non - uniformly at the site of occurrence.

The occurrence of defects in the base substrate is expected to cause defects because energy is concentrated on the base substrate due to less absorption of the laser in the electrolyte. Nevertheless, during the 4th and 5th irradiation, It can be seen that it is good.

Therefore, although defects are generated in the base substrate due to the energy concentration of the laser light, it can be confirmed that copper deposition can be performed in a good state as the number of times of irradiation with the laser light is increased.

4 is a photograph showing the copper precipitation state according to Experimental Example 2. Fig.

Referring to FIG. 4, when the number of times of irradiation with the laser beam is once and twice, almost no copper precipitation occurs, but no defect occurs in the base substrate.

That is, it is expected that energy absorption can be prevented from being concentrated on the base substrate by including a light absorption promoter for promoting light absorption of the laser light in the electrolyte and absorbing the laser in the electrolyte solution.

On the other hand, in Experimental Example 2, when the number of times of irradiation with the laser beam was three, copper was deposited non-uniformly on the base substrate, but copper precipitation was good at four times of irradiation and five times of irradiation.

Therefore, it can be confirmed that as the number of irradiation of the laser beam is increased, copper precipitation in a good state is possible, and it is also confirmed that the generation of defects in the base substrate due to the energy of the laser beam can be suppressed.

5 is a photograph showing the copper precipitation state according to Experimental Example 3. Fig.

Referring to FIG. 5, when the number of times of irradiation with laser light is one, copper precipitation did not occur satisfactorily, but it was found that relatively good precipitation occurred in comparison with Experimental Examples 1 and 2.

 Further, it can be seen that copper is well precipitated even when the number of irradiation times of the laser light is three, and it can be seen that a very uniform and dense line is formed when the number of times of laser light irradiation is five.

Experimental Examples 1 and 2 correspond to the aqueous electrolyte composition, and Experimental Example 3 corresponds to the composition of the organic solvent-based electrolytic solution. Thus, it can be confirmed that copper precipitation in a satisfactory state is possible even by varying the composition of the electrolytic solution.

FIG. 6A is a graph showing the relationship between the power of the laser and the line width of the metal pattern according to the electrolyte composition, and FIG. 6B is a graph showing the relationship between the resistivity of the metal pattern and the power of the laser and the composition of the electrolyte.

First, as shown in FIG. 6A, the line width of the metal pattern to be formed increases as the laser power increases.

It can also be seen that the line width of the metal pattern is different depending on the composition of the electrolytic solution, that is, whether the ion source is CuSO _{4 which} is an aqueous system composition or CuCl _{2 which} is an organic solvent system composition.

Specifically, when the laser power is 200 mW or less, the line width of the metal pattern in the case of CuCl ₂ is larger than the line width of the metal pattern in the case of CuSO _{4 as the} laser power is increased, but when the laser power is 300 mW or more, In the present invention.

That is, it can be seen from FIG. 6A that a metal pattern having a line width suitable for each application can be formed according to the conditions of the laser power and electrolyte composition.

Next, as shown in FIG. 6B, it can be seen that as the laser power increases, the resistance of the formed metal pattern decreases, that is, the conductivity increases.

In addition, the composition of the electrolytic solution, that is, the ion source that the water-based composition of CuSO _4, and found to be different from the resistance of the metal pattern, depending on whether the organic solvent-based compositions of CuCl _2, measurement results, the case of CuCl ₂ CuSO ₄ , it can be seen that the conductivity is excellent.

That is, it can be seen from FIG. 6B that a metal pattern having a resistance or conductivity suitable for each application can be formed according to the conditions of the laser power and the electrolyte composition.

According to the experimental example described above, it can be seen that formation of a metal pattern suitable for each application is sufficiently possible depending on conditions of the laser power and the electrolyte composition.

In addition, the formation of the metal pattern according to the present invention is not only simple in process, but also can solve the problem of causing environmental pollution. In comparison with the general electroless plating method, pattern shape, precision and productivity great.

While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be understood. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive.

10: power supply unit 20: laser generator
30: first reflection mirror 40: projection part
41: objective lens 42: second reflection mirror
43: eyepiece lens 50: electrolytic bath
60: electrolyte 70: base substrate

Claims (13)

A laser generator;
A projection unit for focusing the laser light provided from the laser generation unit and reducing the size of the laser light; And
And an electrolytic bath to which the laser light having passed through the projection part is irradiated,
Wherein the electrolytic bath includes an electrolytic solution, the electrolytic solution includes a metal ion source and a reducing agent,
The base material is immersed in the electrolyte solution and the base material is irradiated with the laser beam so that a metal pattern is deposited on the region irradiated with the laser beam,
The reason why the metal pattern is precipitated in the region irradiated with the laser beam upon irradiation with the laser beam on the base substrate is that,
The metal ion is selectively precipitated on the surface of the base substrate to which the laser light is irradiated by irradiating the laser light with an activating energy source for the reduction reaction of the metal ion by the reducing agent present in the electrolyte solution together with the metal ion And the metal pattern is deposited along the irradiation path of the laser beam. The method according to claim 1,
And a first reflection mirror positioned between the laser generating unit and the projection unit. The method according to claim 1,
Wherein the projection section includes an objective lens,
Wherein the objective lens functions as a laser irradiation device that focuses the laser beam and reduces the size of the laser beam. The method of claim 3,
The projection unit may further include an eyepiece lens for adjusting magnification,
Wherein the combination of the eyepiece and the objective lens functions as an observation device,
Wherein the objective lens not only functions as a part of the laser irradiation apparatus but also functions as a part of the observation apparatus. 5. The method of claim 4,
And a second reflection mirror positioned between the eyepiece and the path of the objective lens. delete delete Preparing a base substrate for forming a metal pattern;
Immersing the base substrate in an electrolytic solution;
Irradiating the base substrate with laser light generated from the laser generating unit; And
And forming a metal pattern on the base substrate by irradiating the base substrate with the laser light,
Wherein the electrolytic bath includes an electrolytic solution, the electrolytic solution includes a metal ion source and a reducing agent,
Wherein the step of forming the metal pattern on the base substrate by irradiating the laser beam onto the base substrate comprises:
The metal ion is selectively irradiated to the surface of the base substrate to which the laser light is irradiated by irradiating the laser light with an activating energy source of the reduction reaction of the metal ion by the reducing agent present in the electrolyte solution together with the metal ion And the metal pattern is deposited along the irradiation path of the laser light. 9. The method of claim 8,
After forming the metal pattern on the base substrate,
And determining whether a desired metal pattern is formed on the base substrate,
Wherein the irradiation of the laser beam is terminated when the desired metal pattern is formed and the irradiation of the laser beam is repeated when the desired metal pattern is not formed. 9. The method of claim 8,
Wherein the electrolytic solution is made of at least one material selected from the group consisting of copper (Cu), silver (Ag), chrome (Cr), nickel (Ni), iron (Fe), cobalt (Co) and alloys thereof. 9. The method of claim 8,
Wherein the electrolytic solution further comprises a pH adjusting agent. 12. The method of claim 11,
Wherein the electrolytic solution further comprises a light absorption promoter for promoting the absorption of laser light. 13. The method of claim 12,
The ion source is _{CuSO 4, CuO, CuCl 2,} Cu (NO 3) and at least one member selected from among _2, and at least one kind of the reducing agent is an aldehyde, selected from hypophosphite, borohydride salts, and hydrazine, wherein the pH adjusting agent Is at least one species selected from the group consisting of KOH, NaOH, Ca (OH) ₂ and NH ₄ OH, and the light absorption promoter is sodium bichromate or potassium bichromate.

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