KR101394900B1 - Apparatus for cutting nonmetal-substrate and method for cutting nonmetal-substrate using the same - Google Patents

Abstract

Disclosed is a non-metallic substrate cutting apparatus for suppressing warpage when cutting a non-metallic substrate to improve straightness. A first initial cracker provided in the base unit to form an initial crack at a starting point of cutting the non-metallic substrate, and a second initial cracker provided in the base unit, A scribing unit for irradiating the beam and a second initial cracker provided in the base unit and forming an induction crack so as to be in line with the starting point on the opposite side of the starting point where the initial crack is formed, When the non-metal substrate is cut after the scribing is formed, the non-metal substrate can be cut straightly without warpage at the end portion.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to an apparatus for cutting a non-metal substrate, and a method for cutting a non-

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cutting apparatus for a non-metal substrate, and more particularly, to a device for cutting a non-metal substrate such as a glass substrate in a straight line and a method for cutting a non-metal substrate using the same.

In general, in the process of cutting a non-metallic substrate, particularly a glass substrate, a mechanical cutting method and a chemical cutting method are used to cut a glass substrate having a large area to a predetermined size.

The mechanical cutting method uses a diamond wheel or a sandblaster, and the wet cutting method is used as a chemical cutting method.

In the mechanical cutting method, fine cracks and particles are generated on the cut surface when the glass substrate is cut, and since the chemical cutting method uses chemicals, environmental pollution and processing time are long and the production amount is decreased.

In order to improve this, an initial crack was formed at a specific position of the glass substrate, and a laser beam was used to form a scribing along the initial crack to cut the glass substrate.

However, when the laser beam is irradiated onto the glass substrate, the laser beam must be accurately focused on the initial crack, but when the laser beam is irradiated in a shifted direction, the laser beam is not cut straight to the end portion of the glass substrate, .

Or, when a part of the glass substrate having a large area is cut, there is a problem that a warp phenomenon occurs at the end portion of the glass due to the imbalance of the load applied to the right and left of the glass substrate.

The problems caused by the bending phenomenon occurring at the end portion of the glass substrate described above are as follows. When the glass substrate is partially protruded due to the outward bending phenomenon of the end portion of the glass, You should invest more time to trim the area. In addition, due to the characteristics of the glass substrate, if a high load is applied to a part of the glass substrate, the corresponding region may be broken and a defect may occur.

In addition, since a glass substrate in which the end portion of the glass substrate is warped inward can not be partially commercialized due to the end portion where the warpage occurs, the product can not be partially commercialized and thus has a small display area There arises a problem to be commercialized.

Therefore, it is an object of the present invention to provide a cutting apparatus for a non-metal substrate which can cut a non-metal substrate in a straight line without bending, and a method for cutting a non-metal substrate using the same.

The apparatus for cutting a non-metallic substrate according to the present invention includes a base unit for receiving a non-metallic substrate to be cut, a first initial cracker provided in the base unit for forming an initial crack at a starting point at which the non- A scribing unit for irradiating a laser beam along an initial crack formed on the non-metallic substrate, and a second initializing unit provided on the base unit for forming an induction crack on the opposite side of the starting point where the initial crack is formed, And a cracker, wherein the base unit is composed of a first transfer plate and a second transfer plate, the first and second transfer plates being in close contact with each other before the non-metal substrate is cut, and after the scribing is formed by the scribing unit The first conveying plate and the second conveying plate are disposed on both sides of the non- Thereby transferring.

The first initial cracker may be located on an upper side or a lower side of the non-metallic substrate, and an initial crack may be formed on either the upper end or the lower end of the non-metallic substrate.

The second initial cracker is located on the upper side or the lower side of the non-metallic substrate, and induction cracks can be formed on either the upper end or the lower end of the non-metallic substrate.

The scribing unit may include a cooling unit for spraying and cooling the mist on the non-metallic substrate heated by the laser beam.

The first and second initial crackers may include a main body, a driving unit coupled to the main body and the base unit to transmit power for transferring the main body, and a driving unit connected to the main body to form an initial crack in the non- And the driving unit may use a servo motor or compressed air as a power source.

A method of cutting a non-metallic substrate according to the present invention includes: forming an initial crack at a position where cutting of a non-metallic substrate starts; Forming an induced crack at a position where cutting of the non-metallic substrate ends; Forming a scribing line on the non-metallic substrate by irradiating a laser beam through a scribing unit sequentially from an initial cracked portion of the non-metallic substrate to the induction cracking direction; And cutting the non-metallic substrate along a pre-formed scribing line by the laser beam when the laser beam is irradiated to the induction crack position, wherein the pre- The first transfer plate and the second transfer plate of the base unit positioned below the non-metal substrate are separated from each other when the non-metal substrate is transferred to both sides of the non- .

Meanwhile, in the non-metal substrate cutting method according to an embodiment of the present invention, after the laser beam is irradiated to the induction crack position, the laser beam is further irradiated from the induction crack position of the non-metal substrate to the cut- .

For example, the laser beam can be irradiated onto the non-metallic substrate while moving the scribing unit.

In another example, the laser beam can be irradiated onto the non-metallic substrate while the non-metallic substrate is being moved.

On the other hand, the laser beam can be irradiated to the non-metal substrate while moving the non-metal substrate and the scribing unit in opposite directions.

In addition, the laser beam can be sequentially irradiated from the portion where the cutting of the non-metallic substrate is finished to the initial crack direction or the induction crack direction.

As described above, the apparatus for cutting a non-metal substrate according to an embodiment of the present invention and the method for cutting a non-metal substrate using the same may form an initial crack by a first initial cracker and an induction crack through a second initial cracker on the opposite side , The induction cracks are formed to be in line with the initial cracks, and scribing is formed, and there is an advantage that the nonmetal substrate can be cut straightly without warpage at the end portions when cutting the nonmetal substrate.

1 is a schematic perspective view for explaining an apparatus and a method for cutting a non-metallic substrate according to the first embodiment.
FIG. 2 is a schematic structural view showing the operation of a cutting apparatus for a nonmetal substrate according to the first embodiment.
FIG. 3 is a schematic structural view showing the operation of a cutting apparatus for a non-metallic substrate according to the first embodiment.
FIG. 4 is a schematic view showing the operation of a cutting apparatus for a nonmetal substrate according to the first embodiment.
FIG. 5 is a schematic view showing the operation of a cutting apparatus for a non-metallic substrate according to the first embodiment.
FIG. 6 is a schematic view showing the operation of a cutting apparatus for a non-metal substrate according to the first embodiment.
7 is a schematic block diagram showing the operation of the cutting apparatus for a non-metallic substrate according to the first embodiment.

The present invention is capable of various modifications and various forms, and specific embodiments are illustrated in the drawings and described in detail in the text. It is to be understood, however, that the invention is not intended to be limited to the particular forms disclosed, but on the contrary, is intended to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the invention.

The terms first, second, etc. may be used to describe various elements, but the elements should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise. In the present application, the terms "comprising" or "having ", and the like, are intended to specify the presence of stated features, integers, steps, operations, elements, parts, or combinations thereof, But do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, parts, or combinations thereof.

Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs.

Terms such as those defined in commonly used dictionaries are to be interpreted as having a meaning consistent with the meaning in the context of the relevant art and are to be interpreted as ideal or overly formal in meaning unless explicitly defined in the present application Do not.

Hereinafter, a configuration of a cutting apparatus for a non-metallic substrate according to the present invention will be described with reference to the drawings.

≪ Embodiment 1 >

1 is a schematic perspective view of a cutting apparatus for a non-metallic substrate according to the first embodiment.

1, the apparatus for cutting a non-metallic substrate according to the present invention may include a base unit 100, a first initial cracker 200, a scribing unit 300, and a second initial cracker 400 .

A non-metal substrate (G) to be cut is accommodated in the upper surface of the base unit (100). For example, a non-metal substrate G is placed on the upper surface of the base unit 100. Although not shown, the base unit 100 may be provided with a transfer member (not shown) to transfer the non-metal substrate G. Here, the conveying member (not shown) may be a conveyor. Alternatively, the base unit 100 may be raised or lowered using a cylinder or a motor so that the height of the base unit 100 can be adjusted. This can be used to set more optimal conditions as the production automation process changes, that is, in the process of re-setup to produce new items. Alternatively, if it is assumed that the non-metal substrate G supplied in the previous process is supplied from the bottom, the base unit 100 transfers the non-metal substrate G down to the scribing unit 300, After the substrate is supplied, it can be transferred to the upper portion and transferred to the scribing unit 300 in close proximity.

In addition, the base unit 100 may include a first conveying plate 110 and a second conveying plate 120 so that the base plate 100 may extend to both sides of the line along which the non-metallic substrate G is cut.

The first transfer plate 110 and the second transfer plate 120 are in close contact with each other before the non-metallic substrate G is cut. After the scribing S is formed, the non- The first transfer plate 110 and the second transfer plate 120 are transferred to both sides so that the non-metal substrate G can be smoothly cut. For example, when the non-metallic substrate G is cut, the first conveying plate 110 and the second conveying plate 120 are conveyed to both sides to prevent the cut non-metallic substrates G from colliding with each other do. In this way, the non-metal substrate G can be prevented from being damaged due to an impact or from generating chipping or particles.

The first initial cracker 200 is installed in the base unit 100 to form an initial crack 201 at a starting point at which the non-metallic substrate G is cut. The first initial cracker 200 may be located on either the top or the bottom of the non-metallic substrate G. [ Of course, as the first initial cracker 200 is located in one of the upper and lower portions of the base unit 100, an initial crack 201 is formed at either the upper end or the lower end of the non-metallic substrate G. [

The first initial cracker 200 may include a main body 210, a driving unit 220, and an end unit 230.

The main body 210 can be moved up and down by the driving unit 210 in combination with the driving unit 210. In addition, the end device 230 is coupled to the lower part. The body 210 may be made of a metal material,

The driving unit 220 is coupled to the base unit 100 at one side. For example, the base unit 100 and the driving unit 220 may be male and female threads and threads. The driving unit 220 may include an actuator (not shown) that can linearly move on one side of the main body 210 so that the main body 210 can be lifted and lowered. In more detail, the driving unit may include a screw (not shown) that generates rotational motion through a servo motor (not shown) and converts the rotational motion into a linear motion to move the main body 210 up and down . Or the linear motor (not shown). Alternatively, compressed air may be supplied to an air cylinder (not shown) to raise and lower the main body 210.

The end device 230 is coupled to the lower portion of the main body 210. In more detail, the end device 230 is rotatably hinged to the lower portion of the body. The end device 230 may be in the form of a circular disk. The end device 230 may be coupled with a tip made of a material having a high hardness at a portion contacting the non-metal substrate G so that a small stress can be applied to the non-metal substrate G to generate small cracks. For example, the tip can be made of industrial diamond.

The scribing unit 300 is installed in the base unit 100 and irradiates a laser beam L along an initial crack 201 formed on the nonmetal substrate G. [ The scribing unit 300 scribes the non-metal substrate G using a laser beam L. The scribing unit 300 scribes the non- The scribing unit 300 is positioned on a non-metallic substrate G placed on the base unit 100 and irradiates the non-metallic substrate G with a laser beam L. Although not shown, the scribing unit 300 may include means for adjusting the intensity of the laser beam L. [ In addition, though not shown, the scribing unit 300 may further include irradiation range adjusting means for irradiating the laser beam L broadly or narrowly. To this end, the scribing unit 300 may be provided with a plurality of lenses.

The cooling unit 310 can cool mist by spraying mist M onto the non-metallic substrate G heated by the laser beam L.

The cooling unit 310 is installed adjacent to the scribing unit 300 or installed on one side of the scribing unit 300. The cooling unit 310 may be connected to a coolant storage tank (not shown) for storing a coolant. Here, purified water can be used as the cooling liquid. The cooling unit 310 converts the cooling liquid stored in the cooling liquid storage tank (not shown) into a mist of small particles in the non-metallic substrate G and injects the mist into the non-metallic substrate G heated by the scribing unit 300, (G).

The second initial cracker 400 is installed in the base unit 100 and forms an induction crack 401 so as to be in line with the starting point on the opposite side of the starting point where the initial crack 201 is formed. The second initial cracker 400 may be coupled to the base unit such that the second initial cracker 400 may be positioned on either the top or the bottom of the non-metallic substrate. As a matter of course, as the second initial cracker 400 is located either on the non-metallic substrate or on the lower substrate, the induced crack is also formed on either the upper or lower end of the non-metallic substrate on which the second initial cracker is located .

The second initial cracker 200 may include a main body 410, a driving unit 420, and an end unit 430.

The main body 410 can be moved up and down by the driving unit 410 in combination with the driving unit 410. In addition, the end device 430 is coupled to the lower part. The body 410 may be made of a metal material,

The driving unit 420 is coupled to the base unit 100 at one side. For example, the base unit 100 and the driving unit 420 may be male and female threads and threads. The driving unit 420 may include an actuator (not shown) that can linearly move on one side of the main body 410 so as to move up and down the main body 410. In more detail, the driving unit 420 may include a screw (not shown) that generates a rotational motion through a servo motor (not shown) and converts the rotational motion into a linear motion, , It can be lowered. Or the linear motor (not shown). Alternatively, compressed air may be supplied to an air cylinder (not shown) to raise and lower the main body 410.

The end device 430 is coupled to the lower portion of the main body 410. In more detail, the end device 430 rotatably hinges to the lower portion of the main body 410. The end device 430 may be in the form of a circular disk. The end device 430 may be coupled with a tip made of a material having a high hardness at a portion contacting the non-metal substrate G so that a small stress can be applied to the non-metal substrate G to generate a small crack. For example, the tip can be made of industrial diamond.

Hereinafter, a method for cutting a non-metallic substrate using a cutting apparatus for a non-metallic substrate according to the present invention will be described in detail with reference to FIGS. 2 to 7.

7 is a block diagram for explaining a cutting process of a non-metallic substrate according to the first embodiment of the present invention.

2 to 6, in order to cut the non-metallic substrate G by the cutting method of the non-metallic substrate according to the first embodiment of the present invention, first, as shown in FIG. 2, And the non-metallic substrate G is transferred to the base unit 100 in an aligned state.

Next, as shown in FIG. 3, the first initial cracker 200 forms an initial crack 201 at a position where the cutting of the non-metallic substrate G starts (S10). The second initial cracker 400 forms an induced crack 401 at an opposite position to the initial crack 201 formed on the non-metallic substrate G (S20). At this time, it is preferable that the initial crack 201 and the induced crack are formed in a straight line. Alternatively, the first initial cracker 200 and the second initial cracker 400 may simultaneously form an initial crack 201 and an induced crack 401 at both ends of the non-metallic substrate G, respectively.

By forming the induction cracks as described above, it is possible to prevent the opposite end of the initial crack from being bent and cut at an arbitrary time when the non-metal substrate G is cut.

After the initial crack 201 and the induced crack 401 are formed, the initial crack 201 and the induced crack 401 are sequentially formed in the direction of the induced crack 401 from the portion where the initial crack 201 of the nonmetal substrate G is formed, The laser beam L is irradiated through the unit 300 to form a scribe S on the non-metallic substrate G (S30). When the scribing unit irradiates the laser beam L onto the non-metallic substrate G, the non-metallic substrate G is heated to a high temperature by the laser beam L, The purified water in the cooling unit 310 is converted into mist and sprayed on the non-metallic substrate.

The laser beam L is irradiated from the initial crack 201 to the position of the induction crack 401 and then irradiated with the laser beam L from the induction crack 401 position of the nonmetal substrate G to the initial crack 201 ) Can be investigated once more. This is because the non-metal substrate G has a more clean cut surface by repeatedly irradiating the laser beam L so that occurrence of chipping or particles can be further reduced, The substrate can be cut more quickly.

Alternatively, the laser beam L may be irradiated onto the non-metal substrate G while the scribing unit 300 is moved. Alternatively, the laser beam L may be irradiated onto the non-metallic substrate G while the non-metallic substrate G is being moved. The laser beam L may be irradiated onto the non-metal substrate G while the non-metal substrate G and the scribing unit 300 are moved in opposite directions.

The non-metallic substrate G can be cut more quickly through the above-described method.

Alternatively, the laser beam L may be sequentially irradiated in the direction of the initial crack 201 or the direction of the induction crack 401 from the portion where the cutting of the non-metallic substrate G is terminated. For example, when the scribing unit 300 finishes forming the scribing S in the direction of the induction crack 401, the scribing unit 300 moves in the direction of the induction crack 401 toward the initial crack 201, (S) can be sequentially formed. In this way, once the cutting operation of one non-metallic substrate G is completed, it is moved back to the initial setting position and transferred to the opposite side from the position where the work is finished without cutting the next non-metallic substrate G to form the scribing S So that the working time can be shortened.

5, when the laser beam L is irradiated to the position of the induction crack 401, the laser beam L is irradiated to the initial crack 201 at a time point along the scribing S formed by the laser beam L, The substrate G is cut (S40).

At this time, physical stress is applied to the non-metal substrate G to be cut. Alternatively, the first transfer plate 110 and the second transfer plate 120 included in the base unit 100 may be transferred to both sides, and the non-metal substrate G may be cut.

 As shown in FIG. 6, the non-metal substrate G is cut and transferred from the base unit 100 to the next process. At this time, the base unit 100 is supplied with a non-metal substrate G to be cut after the cut non-metal substrate G is transported to the outside.

Meanwhile, in the method for cutting a non-metallic substrate according to an embodiment of the present invention, an initial crack is formed by a first initial cracker and an induced crack is formed through a second initial cracker on the opposite side, Metal scribing is formed and the non-metal substrate can be cut straightly without warpage at the end when cutting the non-metal substrate.

While the present invention has been described in connection with what is presently considered to be practical and exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

(G): non-metallic substrate (100): base unit
(200): first initial cracker (210): main body
(220): driving part (230): end device
(300): scribing unit (310): cooling unit
(311): Cooling nozzle (L): Laser beam
(M): mist (S): scribing
(400): second initial cracker (401): induced crack

Claims (12)

A base unit for receiving a non-metallic substrate to be cut;
A first initial cracker installed in the base unit to form an initial crack at a starting point at which the non-metal substrate is cut;
A scribing unit installed on the base unit and irradiating a laser beam along an initial crack formed on the non-metallic substrate; And
A second initial cracker installed in the base unit and forming an induction crack so as to be in line with the starting point on the opposite side of the starting point where the initial crack is formed;
, ≪ / RTI >
The base unit includes:
Wherein the first and second transfer plates are in close contact with each other before the non-metal substrate is cut, and after the scribing is formed by the scribing unit, when the non-metal substrate is cut, And the second transfer plate are respectively transferred to both sides. The apparatus of claim 1, wherein the first initial cracker comprises:
Wherein the non-metal substrate is located at an upper side or a lower side of the non-metal substrate, and an initial crack is formed in either the upper end or the lower end of the non-metal substrate. The apparatus of claim 1, wherein the second initial cracker comprises:
Wherein the non-metal substrate is located on an upper side or a lower side of the non-metal substrate, and induction cracks are formed on either the upper end or the lower end of the non-metal substrate. The apparatus according to claim 1, wherein the scribing unit comprises:
And a cooling unit for spraying mist on a non-metallic substrate heated by the laser beam to cool the non- The apparatus of claim 1, wherein the first and second initial crackers
main body;
A driving unit coupled to the main body and the base unit to transmit power to the main body so as to be conveyed; And
And an end device coupled to the body to form an initial crack in the non-metallic substrate. 6. The apparatus according to claim 5,
Wherein a servo motor or compressed air is used as a power source. Forming an initial crack at a position where cutting of the non-metallic substrate is started;
Forming an induced crack at a position where cutting of the non-metallic substrate ends;
Forming a scribing line on the non-metallic substrate by irradiating a laser beam through a scribing unit sequentially from an initial cracked portion of the non-metallic substrate to the induction cracking direction; And
Wherein when the laser beam is irradiated to the induction crack position, the non-metallic substrate is cut along the pre-formed scribing by the laser beam at the start of the initial crack,
, ≪ / RTI >
In the step of cutting the non-metallic substrate along the pre-formed scribing,
Wherein the first transfer plate and the second transfer plate of the base unit located below the non-metal substrate prevent the non-metal substrates from being collided with each other when the non- Way. 8. The method of claim 7,
Further comprising the step of irradiating the laser beam once more from the induction crack position of the non-metallic substrate to the end of cutting after the laser beam is irradiated to the induction crack position. 9. The method according to claim 7 or 8,
Wherein the laser beam is irradiated onto the non-metal substrate while moving the scribing unit. 9. The method according to claim 7 or 8,
Wherein the laser beam is irradiated onto the non-metal substrate while the non-metal substrate is being moved. 9. The method according to claim 7 or 8,
Wherein the laser beam is irradiated to the non-metal substrate while moving the non-metal substrate and the scribing unit in directions opposite to each other. 9. The method according to claim 7 or 8,
Wherein the laser beam is sequentially irradiated from a portion where the cutting of the non-metal substrate is terminated to an initial crack direction or an induction crack direction.

Images