KR101392813B1 - Reflow solder unit and surface mount technology system having the same - Google Patents

Abstract

Disclosed is a reflow solder unit of SMT equipment capable of preventing flexural deformation of a substrate during double-sided mounting. A pair of guide rails for supporting and moving both sides of a printed circuit board on which electronic parts are mounted; A plurality of guide rails disposed in a central portion of the guide rail for movement with the guide rails to support a central rear portion of the printed circuit board and movable between a first position supporting the printed circuit board and a second position spaced from the printed circuit board, A support unit having a support pin; An actuator for individually driving each of the plurality of support pins; And recognizing the position of the electronic components mounted on the back surface of the printed circuit board so that the support pins located in the portion where the electronic component is located among the plurality of support pins move to the second position, And a control unit for controlling the actuators to maintain the position.

Surface Mount, SMT, Reflow, Solder, Printed Circuit Board, PCB, Support, Warp, Prevention

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a reflow soldering unit and a reflow soldering unit,

The present invention relates to a surface mount technology (SMT), and more particularly to a reflow soldering method and a reflow soldering method for soldering a terminal (lead) of an electronic component mounted on a printed circuit board (PCB) And SMT equipment having the same.

In mounting an electronic component such as a transistor, a diode, a resistor, or an IC chip on a printed circuit board, the connection pattern of the printed circuit board and the terminal of the electronic component are soldered and electrically connected. The SMT equipment automatically mounts the above electronic components on a printed circuit board, and automatically connects the terminals of the mounted electronic components and the connection pattern of the printed circuit board with solder.

Such SMT equipment includes a loader unit, a printer unit for printing solder on a printed circuit board, a mounter unit for mounting electronic parts on a printed circuit board on which solder is printed, and a printed circuit board on which electronic parts are mounted, And a reflow solder unit and an unloader unit for melting the solder interposed between the connection pattern of the substrate and the terminal of the electronic component to electrically connect the connection pattern and the terminal of the electronic component.

The reflow solder unit includes a pair of guide rails for supporting and moving both sides of a printed circuit board on which electronic components are mounted, and a hot air unit for applying heat to the printed circuit board to be moved. The reflow solder unit may include a plurality of support pins positioned at approximately the center of the pair of guide rails and supporting a central portion of the printed circuit board to prevent bending deformation of the printed circuit board moved by the guide rails, And a support unit including the support member.

More specifically, in order to prevent the problem of bending of the printed circuit board due to hot air during reflow soldering due to the thinness of the printed circuit board and the softening of the printed circuit board, the central portion of the printed circuit board is supported by the above- Thereby preventing warpage of the substrate.

In the case of the SMT equipment having the above-described supporting unit, in the case of the single-sided mounting in which the electronic parts are mounted on only one side of the printed circuit board, it is possible to prevent the flexure of the printed circuit board by applying the supporting unit. In the case of a two-sided mounting in which electronic parts are mounted on both sides, the supporting unit can not be applied because the electronic parts already mounted on one side of the printed circuit board and the supporting unit may be interfered with thereby damaging the electronic parts.

As described above, conventionally, in the case of the two-sided mounting, when the electronic component is mounted on one side of the printed circuit board and then the electronic component is mounted on the other side of the printed circuit board, The problem of bending can not be prevented. When the printed circuit board is bent during reflow soldering, there may be a portion where the connection pattern of the printed circuit board and the terminal of the electronic component are not in close contact with each other, and a connection failure at this portion may occur.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a method of mounting electronic parts on both sides of a printed circuit board, The present invention is to provide a reflow solder unit and a SMT apparatus having the reflow solder unit capable of preventing flexural deformation of a printed circuit board by supporting a printed circuit board while avoiding an interference position of the printed circuit board.

According to an aspect of the present invention, there is provided a reflow soldering unit comprising: a pair of guide rails for supporting and moving both sides of a printed circuit board on which electronic components are mounted; A plurality of guide rails disposed in a central portion of the guide rail for movement with the guide rails to support a central rear portion of the printed circuit board and movable between a first position supporting the printed circuit board and a second position spaced from the printed circuit board, A support unit having a support pin; An actuator for individually driving each of the plurality of support pins; And recognizing the position of the electronic components mounted on the back surface of the printed circuit board so that the support pins located in the portion where the electronic component is located among the plurality of support pins move to the second position, And a control unit for controlling the actuators to maintain the position.

In the reflow solder unit of the present invention, the control unit can be configured to recognize the position of the electronic component mounted on the back surface of the printed circuit board based on the information of the printed circuit board layout designing step.

Further, the reflow solder unit of the present invention may include a scanner unit for scanning a position of an electronic component mounted on a back surface of the printed circuit board, wherein the control unit is configured to read the scanning information of the scanner unit So as to recognize the position of the electronic component mounted on the back surface of the printed circuit board.

Further, the reflow solder unit of the present invention may include a sensor unit that senses the entry of the printed circuit board into the pair of guide rails, and the control unit controls the entrance of the printed circuit board by the sensor unit And may be configured to control the actuator in synchronization with sensing.

In addition, in the reflow solder unit of the present invention, the plurality of support pins may be configured to be rotatable about the axis at the first position and the second position, respectively, And a second stopper for fixing the support pin at the second position.

Further, in the reflow solder unit of the present invention, each of the support pins includes a first fin portion at one side with respect to the axis, and a second fin portion at the other side that is longer than the first fin portion and biased to one side with respect to the first fin portion Lt; / RTI >

Further, in the reflow solder unit of the present invention, the plurality of support pins may be configured to be movable up and down to the first position and the second position, respectively.

Further, in the reflow solder unit of the present invention, the actuator may be composed of an electromagnetic solenoid, a hydraulic cylinder, a motor, a magnet, or the like.

According to another aspect of the present invention, there is provided an SMT apparatus including: a loader unit for moving a printed circuit board to an SMT equipment area; A printer unit for printing solder on connection patterns of the printed circuit board; A mount unit for mounting electronic components on the printed circuit board on which the solder is printed; A reflow solder unit having the above-described characteristics for melting and bonding the solder interposed between the connection pattern and the terminal of the electronic component by applying heat while moving the printed circuit board on which the electronic component is mounted; And an unloader unit for moving the printed circuit board on which the electronic component is mounted to the outside of the SMT equipment area.

According to the reflow soldering unit of the present invention and the SMT equipment having the same, when the electronic component is mounted on the other surface of the substrate after the electronic component is mounted on one surface of the substrate in the case of mounting the substrate on both surfaces, It is possible to support the central portion of the substrate by using the support pins of the support units located on other parts of the mounted board surface except for the part where the electronic components are located, so that the bending deformation of the printed circuit board can be prevented. Therefore, it is possible to prevent the terminal connection failure which may be caused by the deformation of the printed circuit board in the conventional double-sided mounting reflow soldering.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the following description of the present invention, detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear.

1, the SMT equipment employing the reflow solder unit according to an embodiment of the present invention includes a loader unit 10, a solder printer unit 20, a mounter unit 30, a reflow solder unit (40), an unloader unit (50), and the like.

The loader unit 10 moves the printed circuit board 60 into the working area A of the equipment and the unloader unit 50 is mounted on the printed circuit board 60 on which the electronic parts 70 are mounted Out of the work area A in Fig. The solder printer unit 20 prints the solder on the connection patterns (not shown) of the printed circuit board 60 on which the electronic component 70 is mounted, And various kinds of electronic parts 70 to be mounted on the printed circuit board 60 are aligned and mounted. Between the connection pattern of the printed circuit board 60 and the terminal of the electronic component 70 mounted on the printed circuit board 60 by the mounter unit 30 (not specifically shown in the figure) Solder is interposed.

The loader unit 10, the solder printer unit 20, the mounter unit 30 and the unloader unit 50 as described above are not largely different from general SMT equipment and are not related to the gist of the present invention. A detailed description will be omitted.

The reflow solder unit 40 applies hot air while moving the printed circuit board 60 on which the plurality of electronic components 70 are mounted to apply heat to the connection pattern of the printed circuit board 60 and the terminals of the electronic component 70 The solder is melted to connect the connection pattern and terminals so that they are electrically connected.

2 to 4, the reflow solder unit 40 includes a pair of guide rails 41 and 42, a hot air unit 43, a support unit 44, an actuator 45, (46) and the like.

The guide rails 41 and 42 support and move both sides of the printed circuit board 60 which is moved in a state where the electronic components 70 are mounted on the mounter unit 30. The hot air unit 43 applies a hot air of a predetermined temperature (a temperature at which the solenoid melts) to the moving printed circuit board 60 as described above. Thereby, the solder interposed between the connection pattern of the printed circuit board 60 and the terminal of the electronic component 70 is melted to connect the connection pattern to the terminal.

The support unit 44 includes a plurality of support pins 44-1, 44-2, 44-3, 44-3, 44-3, 44-3, 44-4, 44-4, and 44-5. The plurality of support pins 44-1, 44-2, 44-3, 44-4, and 44-5 are connected to the printed circuit board 60 on both sides by the guide rails 41, And the printed circuit board 60 is prevented from being bent by hot air while moving along with the guide rails 41 and 42. [ The plurality of support pins 44-1, 44-2, 44-3, 44-4, and 44-5 are connected to a first position for supporting the printed circuit board 60 in accordance with a feature of the present invention, And a second position spaced apart from the substrate 60 by a predetermined distance.

The actuator 45 is provided to move the plurality of support pins 44-1, 44-2, 44-3, 44-4, and 44-5 individually. The actuator 45 may include an electromagnetic solenoid, a hydraulic cylinder, a motor, and a magnet. The actuator 45 may correspond to the support pins 44-1, 44-2, 44-3, 44-4, As shown in FIG.

The control unit 46 recognizes the position of the electronic components 70 mounted on the back surface of the printed circuit board 60 and detects the positions of the plurality of support pins 44-1, 44-2, 44-3, (For example, 44-3 in Fig. 3) located at the position where the electronic component 70 is located moves to the second position and the remaining support pins (e.g., 3, 44-2, 44-4) controls the actuator 45 to maintain the first position.

The control unit 46 can also recognize the position of the electronic components 70 mounted on the back surface of the printed circuit board 60 based on the information 80 of the layout design stage of the printed circuit board 60 have. The control unit 46 receives the scanning information from the scanner unit 90 that is arranged to scan the position of the electronic components 70 mounted on the back surface of the printed circuit board 60, The position of the electronic component 70 mounted on the rear surface of the electronic component 70 can be recognized.

The control unit 46 recognizing the position information of the electronic parts 70 mounted on the back surface of the printed circuit board 60 from the component placement information 80 of the layout design stage of the board or the scanner unit 90 The actuators 45 connected to the respective support pins 44-1, 44-2, 44-3, 44-4, and 44-5 are controlled individually according to the positions of the electronic components 70, (For example, 44-2 in Fig. 3), which is located at a position away from the electronic component 70 And 44-4 are made to support the central portion of the printed circuit board 60 by maintaining the first position. Since the center portion of the printed circuit board 60 can be supported even in the case of the double-sided mounting, the warping of the printed circuit board 60 during soldering can be suppressed.

On the other hand, when the support pins 44-1, 44-2, 44-3, 44-4, and 44-5 are moved as described above, the entry timing of the printed circuit board 60 and the support pins 44-1, 2, 44 - 4, 44 - 4, and 44 - 5 are not synchronized, some of the support pins and the electronic component may interfere with each other. In order to prevent this, in the present invention, when the control unit 46 controls the movement of the support pins 44-1, 44-2, 44-3, 44-4, and 44-5, 41-2, 44-3, 44-4, and 44-5 in response to the board entrance detection signal of the sensor unit 100 installed in front of the support pins 44-1, To control the movement of the object.

That is, the sensor unit 100 detects the entry of the printed circuit board 60 entering the reflow solder unit 40 from the mounter unit 30, And the control unit 46 outputs the drive signal of the actuator 45 in synchronization with the signal to generate an interference phenomenon between the electronic component 70 mounted on the back surface of the printed circuit board 60 and the support pins .

Fig. 5 shows an example of a support pin 44-1 constituting a support unit 44 which is a substantial part of the present invention. Although only one support pin 44-1 is shown in Fig. 5, all the support pins 44-1, 44-2, 44-3, 44-4, and 44-5 have the same structure and operation.

As shown in FIG. 5, the support pin 44-1 is moved in a first position (indicated by a solid line) and a second position (indicated by a dashed line in FIG. The support pin 44-1 has a first fin portion 44a on one side of the axis 110 and a second fin portion 44b on the other side of the first fin portion 44a that is longer than the first fin portion 44a. And a 2-pin portion 44b. In this embodiment, an electromagnetic solenoid, a motor, or the like can be preferably used as the actuator 45. [

The position of the support pin 44-1 is fixed by the first stopper 120 at the first position and fixed by the second stopper 130 at the second position. The movement of the support pin 44-1 in the B direction at the first position is prevented by the second pin portion 44b which is biased to one side (left side in the figure) with respect to the first pin portion 44a . That is, due to the gravity difference between the first stopper 120 and the first fin portion 44a and the second fin portion 44b with respect to the shaft 110, the support pin 44-1 is moved to the first position The printed circuit board 60 can be stably supported without moving arbitrarily.

Fig. 6 shows another embodiment of the support pin 44-1 '. As shown in FIG. 6, the support pin 44-1 'moves up and down to the first position and the second position. In Fig. 6, the dotted line position is the first position and the solid line position is the second position. In the present embodiment, an electromagnetic solenoid, a hydraulic cylinder, a cam mechanism, a magnet, or the like may be preferably used as the actuator 45.

In the case of the single-sided mounting in which the electronic component 70 is mounted on only one side of the printed circuit board 60, the SMT equipment having the reflow solder unit according to the present invention having the above- All supporting pins 44-1, 44-2, 44-3, 44-4, and 44-5 maintain the first position to support the central portion of the printed circuit board 60, because there are no electronic components.

However, in the case of the two-sided mounting, the printed circuit board 60 enters the guide rails 41 and 42 of the reflow solder unit 40 in order to mount the electronic components on one surface and further mount the electronic components on the back surface. The control unit 46 selectively moves the plurality of support pins 44-1, 44-2, 44-3, 44-4, and 44-5 in synchronization with the entry of the printed circuit board 60 3) of the support pin (44-2 in Fig. 3) is moved to the second position in the portion where the electronic component 70 is located and the support pin -4 maintains the first position so as to support the central portion of the printed circuit board 60.

Therefore, even when the electronic parts are mounted on one surface of the printed circuit board 60 and the electronic parts are mounted on the other surface, the central portion of the printed circuit board 60 can be supported, It is possible to prevent connection failure due to warping of the printed circuit board.

The invention has been described in an illustrative manner. The terms used herein are for the purpose of description and should not be construed as limiting. Various modifications and variations of the present invention are possible in light of the above teachings. Accordingly, the present invention may be freely practiced within the scope of the claims, unless otherwise specified.

FIG. 1 is a schematic view of an SMT equipment employing a reflow solder unit according to an embodiment of the present invention; FIG.

FIG. 2 is a plan view schematically showing a reflow solder unit extracted from the SMT equipment of FIG. 1;

3 is a cross-sectional view taken along line A-A in Fig. 2,

4 is a block diagram of a reflow solder unit according to an embodiment of the present invention;

5 is a view showing an example of a support pin constituting a support unit which is a substantial part of the present invention and its operation,

6 is a view showing another example of the support pin constituting the support unit which is the main part of the present invention and its operation.

Description of the Related Art

10, a loader unit 20, a solder printer unit

30, a mounter unit 40, a reflow solder unit

41, 42, a guide rail 43,

44: support unit 44-1 - 44-5; support pin

45, an actuator 46,

50, an unloader unit 60, a printed circuit board

70, an electronic component 90, a scanner unit

100, a sensor unit 110,

120,

Claims (11)

A pair of guide rails for supporting and moving both sides of the printed circuit board on which the electronic parts are mounted; A plurality of guide rails disposed in a central portion of the guide rail for movement with the guide rails to support a central rear portion of the printed circuit board and movable between a first position supporting the printed circuit board and a second position spaced from the printed circuit board, A support unit having a support pin; An actuator for individually driving each of the plurality of support pins; And Recognizing the position of the electronic components mounted on the back surface of the printed circuit board so that the support pins located at the portion where the electronic component is located among the plurality of support pins move to the second position, And a control unit for controlling the actuator to maintain the actuator, Wherein the plurality of support pins are rotatably driven to the first position and the second position about an axis, respectively. The method according to claim 1, Wherein the control unit recognizes the position of the electronic component mounted on the back surface of the printed circuit board based on the information of the printed circuit board layout designing step. The method according to claim 1, And a scanner unit for scanning a position of an electronic component mounted on a back surface of the printed circuit board, Wherein the control unit recognizes the position of the electronic component mounted on the back surface of the printed circuit board based on the scanning information of the scanner unit. The method according to claim 1, And a sensor unit for detecting entry of the printed circuit board into the pair of guide rails, Wherein the control unit controls the actuator in synchronization with detection of entry of the printed circuit board by the sensor unit. The method according to claim 1, A first stopper for fixing the support pin at the first position, and a second stopper for fixing the support pin at the second position. delete 6. The method of claim 5, Each of the support pins includes a first fin portion on one side of the axis and a second fin portion on the other side of the first fin portion which is longer than the first fin portion and biased to one side with respect to the first fin portion. delete delete The method according to claim 1, Wherein the actuator includes any one selected from an electromagnetic solenoid, a hydraulic cylinder, a motor, and a magnet. A loader unit for loading the printed circuit board into the SMT equipment area; A printer unit for printing solder on connection patterns of the printed circuit board; A mount unit for mounting electronic components on the printed circuit board on which the solder is printed; A method of manufacturing a printed circuit board according to any one of claims 1 to 5, 7, and 10, wherein heat is applied while moving the printed circuit board on which the electronic component is mounted to melt the solder interposed between the connection pattern and the terminal of the electronic component A reflow solder unit according to any one of claims 1 to 6; And And an unloader unit for unloading the printed circuit board on which the electronic component is mounted to the outside of the SMT equipment area.

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