KR101387690B1 - Sealing member for semiconductor equipment - Google Patents

Abstract

The present invention relates to a sealing member for semiconductor equipment. The sealing member for semiconductor equipment according to an embodiment of the present invention tightly fastens a first member (200) and a second member (300). The first member (200) has: an opening (251) at the upper part; a bottom (253) at the lower part; a groove (250) including a first side (255) and a second side (257) for connecting the opening (251) to the bottom (253), wherein the a distance between the first side (255) and the second side (257) is getting closer from the bottom (253) to the opening (251) of the groove (250); and a main body (100) which is formed into a circular ring shape with a hollow part (105) at the center, and is inserted into the groove (250). In a cross section of the main body (100), the top (110) is a curved line with a first radius of curvature (R1), and one side (130) inclines to increase a width (d) from the top (110) to the bottom (120), and the one side (130) and the bottom (120) are connected by a curved line with a second radius of curvature (R2), wherein, the first radius of curvature (R1) is greater than the second radius of curvature (R2), and an angle between the other side (140) and the bottom (120) is acute.

Description

Sealing member for semiconductor equipment {Sealing Member For Semiconductor Equipment}

The present invention relates to a sealing member for semiconductor equipment.

In general, sealing members such as O-rings are used as sealing means in pressure equipment, that is, industrial equipment operating at low / high pressure. In particular, in semiconductor equipment, it is necessary to maintain a vacuum in order to increase the average free path of gas molecules and to lower a boiling point, a vaporization point, a sublimation point, and the like, and sealing members such as O-rings are used to maintain such a vacuum.

For example, in order to keep the plate in contact with a chamber in a semiconductor facility to maintain a vacuum in the chamber, a groove is formed in the chamber, and an O-ring is inserted into the groove to seal between the chamber and the plate.

However, as disclosed in the patent document of the following prior art document, the O-ring according to the prior art has a problem that the cross section is formed in a circular shape, so that the contact area is narrow and not suitable for use in a high pressure environment. In order to solve this problem, a sealing member that can increase the contact area has been developed. In order to increase the contact area, a portion must be formed in a plane to correspond to the side of the groove formed in the chamber or plate. However, when torsion occurs in the sealing member, the plane is not completely in contact with the side of the groove, and the sealing force is weakened. Therefore, there is a demand for a need to prevent the occurrence of twisting in the sealing member.

KR 10-0577564 B1

The present invention is to solve the above problems of the prior art, an aspect of the present invention is to provide a sealing member for semiconductor equipment that can prevent the twist while at the same time enhance the sealing force.

The sealing member for semiconductor equipment according to the embodiment of the present invention seals between the first member and the second member, the first member has an opening that is open on the upper side, a bottom surface provided on the lower side, and the opening and the bottom A groove including a first side and a second side connecting the surface is formed, the groove closer to the opening from the bottom surface closer to the distance between the first side and the second side, the hollow portion in the center It is formed in the shape of a circular ring, including a main body inserted into the groove, when viewed based on the cross section, the main body extends in a curve having a first radius of curvature, the width from the upper surface to the lower surface One side is formed to be inclined so as to increase, and the one side and the bottom surface are connected by a curve having a second radius of curvature, and the first radius of curvature is larger than the second radius of curvature. On the other hand, the other side forms an acute angle with the lower surface.

In addition, in the sealing member for semiconductor equipment according to the embodiment of the present invention, the main body has one side, the other side, and the bottom surface extends in a straight line when viewed based on the cross section.

In addition, in the sealing member for semiconductor equipment according to the embodiment of the present invention, the angle between the other side and the lower surface of the main body is larger than the angle between one side and the lower surface of the main body.

In addition, in the sealing member for semiconductor equipment according to an embodiment of the present invention, the main body is connected by a curve having a third radius of curvature between the other side and the lower surface, the third radius of curvature It is smaller than the first radius of curvature and the second radius of curvature.

In addition, in the sealing member for semiconductor equipment according to an embodiment of the present invention, the groove has a fourth radius of curvature between the first side and the bottom surface in contact with one side of the body when viewed based on the cross section. The fourth radius of curvature is smaller than the second radius of curvature.

In addition, in the sealing member for semiconductor equipment according to the embodiment of the present invention, the width of the bottom surface of the groove is larger than the width of the bottom surface of the main body.

In addition, in the sealing member for semiconductor equipment according to the embodiment of the present invention, before the second member presses the main body, one side of the main body is in contact with the first side, the other side is the second side Spaced apart from.

In addition, in the sealing member for semiconductor equipment according to the embodiment of the present invention, the angle between one side and the bottom surface of the main body corresponds to the angle between the first side surface and the bottom surface of the groove.

In addition, in the sealing member for semiconductor equipment according to the embodiment of the present invention, before the second member presses the main body, the upper surface of the main body protrudes from the groove.

Further, in the sealing member for semiconductor equipment according to the embodiment of the present invention, after the second member presses the main body, the upper surface of the main body contacts the second side surface.

In addition, in the sealing member for semiconductor equipment according to the embodiment of the present invention, the angle between one side and the lower surface of the main body is 80 degrees or more and less than 90 degrees.

In addition, in the sealing member for semiconductor equipment according to the embodiment of the present invention, when viewed on the basis of the cross-section, the first separation line projection is formed on the curve having the second radius of curvature,

A second separation line protrusion is formed at the lower end of the other side of the main body.

The features and advantages of the present invention will become more apparent from the following detailed description based on the accompanying drawings.

Prior to that, terms and words used in the present specification and claims should not be construed in a conventional and dictionary sense, and the inventor may properly define the concept of the term in order to best explain its invention It should be construed as meaning and concept consistent with the technical idea of the present invention.

According to the present invention, by designing a sealing member for semiconductor equipment to have a structure suitable for the groove formed in the shape of a dove tail (Dove Tail), there is an advantage that can prevent the torsion while enhancing the sealing force.

1 is an exploded perspective view of a sealing member for semiconductor equipment according to an embodiment of the present invention;
2 is a cross-sectional view of a sealing member for semiconductor equipment according to an embodiment of the present invention;
3 is a cross-sectional view of the first and second members according to an embodiment of the present invention;
4 is a plan view of a first member according to an embodiment of the present invention;
5A to 5B are cross-sectional views before the sealing member for semiconductor equipment according to the embodiment of the present invention is inserted into the first member and pressed into the second member,
6 is a cross-sectional view after the sealing member for semiconductor equipment according to the embodiment of the present invention is inserted into the first member and pressed into the second member, and
7A to 7B are cross-sectional views illustrating a process of sealing a door valve and a chamber by a sealing member for semiconductor equipment according to an embodiment of the present invention; and
8A to 8B are cross-sectional views of a sealing member for semiconductor equipment according to an embodiment of the present invention in which first and second split line protrusions are formed.

BRIEF DESCRIPTION OF THE DRAWINGS The objectives, specific advantages and novel features of the present invention will become more apparent from the following detailed description taken in conjunction with the accompanying drawings, in which: FIG. It should be noted that, in the present specification, the reference numerals are added to the constituent elements of the drawings, and the same constituent elements are assigned the same number as much as possible even if they are displayed on different drawings. Also, the terms "first "," second ", and the like are used to distinguish one element from another element, and the element is not limited thereto. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS In the following description of the present invention, detailed description of related arts which may unnecessarily obscure the gist of the present invention will be omitted.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a cutaway perspective view of a sealing member for semiconductor equipment according to an embodiment of the present invention, Figure 2 is a cross-sectional view of the sealing member for semiconductor equipment according to an embodiment of the present invention, Figure 3 is a first view according to an embodiment of the present invention 1 and 2 are cross-sectional views, and FIG. 4 is a plan view of the first member according to the embodiment of the present invention.

As shown in FIGS. 1 to 4, the sealing member for semiconductor equipment according to the present exemplary embodiment seals between the first member 200 and the second member 300, and above the first member 200. A groove 250 including an open opening 251, a bottom surface 253 provided below, and a first side 255 and a second side 257 connecting the opening 251 and the bottom 253. ) Is formed, the groove 250 is closer to the opening 251 from the bottom surface 253, the distance between the first side 255 and the second side 257 is closer, the hollow portion 105 in the center It is formed in a circular ring shape, including a main body 100 is inserted into the groove 250, when viewed based on the cross section, the main body 100 has a top surface 110 is the first radius of curvature R ₁ 1 side surface 130 is formed to be inclined so that the width (d) increases from the upper surface 110 to the lower surface 120 from the upper surface 110, the second side between the side surface 130 and the lower surface 120 Radius of curvature (R ₂ ) The first radius of curvature R ₁ is larger than the _second radius of curvature R ₂ , and the other side surface 140 forms an acute angle B with the lower surface 120.

The main body 100 of the sealing member for semiconductor equipment serves to seal between the first member 200 and the second member 300, it may be formed of an elastomer. For example, the main body 100 of the sealing member for semiconductor equipment is nitrile rubber (NBR), ethylene propylene (EPM.EPDM), acrylic rubber (ACM, ANM), butyl rubber (IIR), natural rubber (NR), synthetic It may be formed of any sealing component known in the art such as natural rubber (IR), styrene rubber (SBR), butadiene rubber (BR), cloprone rubber (CR), fluorine rubber (FKM), perfluoro rubber (FFKM), and the like. .

The main body 100 of the sealing member for semiconductor equipment is formed in a circular ring shape so that the hollow portion 105 is formed in the center as a whole (see FIG. 1), and is inserted into the groove 250 formed in the first member 200 ( 3). As shown in FIG. 2, the main body 100 has a top surface 110 formed in a curved surface, and one side surface 130, the other side surface 140, and a bottom surface 120 are formed in a flat surface. That is, when the main body 100 is viewed based on the cross section, the upper surface 110 extends in a curved line, and the one side surface 130, the other side surface 140, and the lower surface 120 extend in a straight line. In addition, one side surface 130 of the main body 100 is formed to be inclined so as to increase the width (d) from the upper surface 110 to the lower surface 120, the other side 140 of the main body 100 is the lower surface 120 It is formed to be inclined to form an acute angle (B). At this time, the angle B between the other side 140 and the lower surface 120 of the main body 100 is larger than the angle A between the one side 130 and the lower surface 120 of the main body 100. In addition, when the main body 100 is viewed based on a cross section, the upper surface 110 extends in a curve having a _first radius of curvature R ₁ . In this case, the center of the first radius of curvature R ₁ of the upper surface 110 may be disposed at a position lower than the uppermost end of the one side surface 130 and the uppermost end of the other side surface 140, and the upper surface 110 may be one side. It may extend completely from the top of the side surface 130 to the top of the other side 140. In addition, the body 100 may be connected to be rounded between one side 130 and the lower surface 120, and between the other side 140 and the lower surface 120. Specifically, when the main body 100 is viewed based on a cross section, the one side 130 and the bottom surface 120 are connected by a curve having a _second radius of curvature R ₂ , and the other side 140 and the bottom surface ( 120 may be connected by a curve having a _third radius of curvature R ₃ . The first radius of curvature R ₁ of the upper surface 110, the second radius of curvature R ₂ between one side 130 and the lower surface 120, and between the other side 140 and the lower surface 120 Comparing the _third radius of curvature R ₃ , the first radius of curvature R ₁ of the upper surface 110 is larger than the _second radius of curvature R ₂ between the one side 130 and the lower surface 120, The third radius of curvature R ₃ between the other side 140 and the lower surface 120 is the first radius of curvature R ₁ of the upper surface 110 and the second curvature between the one side 130 and the lower surface 120. It is small compared to the radius R ₂ . That is, the first radius of curvature R ₁ of the upper surface 110 → the second radius of curvature R ₂ between one side 130 and the lower surface 120 → the _first between the other side 140 and the lower surface 120 3 The size decreases in the order of radius of curvature (R ₃ ).

On the other hand, as shown in Figure 3, the first member 200 and the second member 300 is a kind of semiconductor equipment that is sealed with the main body 100 of the sealing member for semiconductor equipment, all kinds of semiconductors need sealing. It may be a facility. Here, the groove 250 recessed in the thickness direction may be formed in the first member 200 to allow the main body 100 to be inserted therein. Here, the groove 250 is a space designed to prevent the main body 100 of the sealing member for semiconductor equipment from being arbitrarily deformed and to maintain a stable seal at the initial position. In detail, the groove 250 includes an opening 251 open at an upper side, a bottom surface 253 provided at a lower side, and a first side surface 255 and a second connecting the opening 251 and the bottom surface 253. Side 257. In addition, the groove 250 may be formed such that a distance between the first side surface 255 and the second side surface 257 is closer to the opening 251 from the bottom surface 253. That is, the groove 250 may be formed in a dove tail shape. Meanwhile, as shown in FIG. 4, the first side 255 of the groove 250 forms a relatively inner loop, and the second side 257 of the groove 250 forms a relatively outer loop. That is, when the first member 200 is viewed in a plan view, the first side surface 255 of the groove 250 is disposed relatively inward, and the second side surface 257 of the groove 250 is relatively outward. To be deployed.

As shown in FIG. 5A, after the main body 100 is inserted into the groove 250 of the first member 200 described above, as shown in FIG. 6, the second member 300 is the main body 100. When pressing, the main body 100 seals between the first member 200 and the second member 300 while elastically deforming. Here, the width W ₁ of the bottom surface 253 of the groove 250 may be larger than the width W ₂ of the bottom surface 120 of the main body 100 (see FIG. 5A). Therefore, when the main body 100 is inserted into the groove 250, the inside of the groove 250 may be left as a part of the empty space, and the main body 100 may be easily inserted into the groove 250. In addition, before the second member 300 presses the main body 100, the main body 100 has one side surface 130 in contact with the first side surface 255 of the groove 250, and the other side surface 140 has Spaced apart from the second side 257. This is because one side surface 130 of the body 100 contacts the first side surface 255 of the groove 250 disposed inward by the elastic force of the body 100 itself. In this case, as shown in FIG. 5B, the angle A between one side 130 and the bottom surface 120 of the main body 100 is between the first side 255 and the bottom surface 253 of the groove 250. It may correspond to the angle (C) of. That is, the inclination of one side surface 130 of the main body 100 may correspond to the inclination of the first side surface 255 of the groove 250. As such, when the inclination of the one side surface 130 of the main body 100 corresponds to the inclination of the first side surface 255 of the groove 250, the first side surface 130 and the groove 250 of the main body 100 may be removed. The contact area between the one side 255 can be maximized, thereby enhancing the sealing force. However, the inclination of the one side surface 130 of the main body 100 corresponds to the inclination of the first side surface 255 of the groove 250 does not mean that the two are mathematically the same, but is generated in the manufacturing process It includes a slight change in inclination due to processing error.

Meanwhile, before the second member 300 presses the main body 100 (see FIG. 5A), the upper surface 110 of the main body 100 protrudes from the groove 250. Therefore, when the second member 300 presses the main body 100 (see FIG. 6), the upper surface 110 of the protruding main body 100 comes into contact with the second member 300 and the first member 200. The second member 300 is sealed. In addition, before the second member 300 presses the main body 100 (see FIG. 5A), the upper surface 110 of the main body 100 is spaced apart from the second side surface 257, but the second member 300 When the main body 100 is pressed (see FIG. 6), the upper surface 110 contacts the second side surface 257 while the main body 100 is elastically deformed (see Y in FIG. 6). Therefore, the main body 100 may completely close the groove 250, and prevent the leakage of the groove 250 along the groove 250, thereby enhancing the sealing force.

In addition, as shown in FIG. 5C, when viewed in the cross section, the groove 250 may be connected by a curve having a _fourth radius of curvature R ₄ between the first side 255 and the bottom surface 253. The fourth radius of curvature R ₄ may be smaller than the _second radius of curvature R ₂ between one side 130 and the bottom surface 120 of the main body 100. That is, the second radius of curvature R ₂ between one side 130 and the bottom surface 120 of the main body 100 is the fourth curvature between the first side 255 and the bottom 253 of the groove 250. It may be larger than the radius (R ₄ ). As such, the second radius of curvature R ₂ between the one side 130 and the bottom 120 of the main body 100 is the fourth between the first side 255 and the bottom 253 of the groove 250. When larger than the radius of curvature R ₄ , when the second member 300 presses the main body 100 (see FIG. 6), a sufficient volume of the main body 100 is in contact with the first side surface 255 of the groove 250. It can be pushed in between the bottom surface 253 to further enhance the sealing force.

7A to 7B are cross-sectional views illustrating a process of sealing a door valve and a chamber by a sealing member for semiconductor equipment according to an exemplary embodiment of the present invention.

As shown in FIGS. 7A to 7B, the above-described first member 200 and second member 300 may be a chamber 500 sealed by the door valve 400 and the door valve 400 in a semiconductor facility. have. Here, the door valve 400 opens and closes the gate 550 of the chamber 500 through the vertical movement and the horizontal movement. Accordingly, the door valve 400 is in contact with the chamber 500 in a substantially diagonal direction while simultaneously moving up and down and left and right movements (see the arrow in FIG. 7A), so that the door valve 400 is inserted into the groove 250 of the door valve 400. Rotational force may be applied to the main body 100 of the sealing member for semiconductor equipment (see arrow of FIG. 7B). Due to such rotational force, torsion may occur in the main body 100 of the sealing member for semiconductor equipment, and the torsion of the main body 100 may weaken the sealing force. However, since the sealing member for semiconductor equipment according to the present embodiment is designed such that the other side 140 of the main body 100 forms an acute angle B with the lower surface 120 (see enlarged view of FIG. 7A), the main body 100 Torsional resistance moment (Tortional Resisting Moment) is increased compared to the other side 140 of the perpendicular to the lower surface (120). Therefore, it is possible to effectively prevent the occurrence of torsion in the main body 100 of the sealing member for semiconductor equipment. Here, when the angle B between the other side 140 and the bottom surface 120 of the main body 100 is too small, the volume of the main body 100 may decrease rapidly. Therefore, the angle B between the other side 140 and the bottom surface 120 of the main body 100 may be, for example, 80 degrees or more and less than 90 degrees.

However, as described above, the first member 200 and the second member 300 are exemplary as the door valve 400 and the chamber 500, and the first member 200 and the second member 300 are exemplary. Is not necessarily limited to the door valve 400 and the chamber 500, of course, may be any kind of semiconductor equipment requiring sealing.

8A to 8B are cross-sectional views of a sealing member for semiconductor equipment according to an embodiment of the present invention in which first and second split line protrusions are formed.

In order to manufacture a sealing member for semiconductor equipment, a molding process is generally used, and when the molding process is performed, a separating line protrusion may be formed along the boundary line of the mold, and the separating line protrusion prevents stable sealing. There is a concern. However, in the sealing member for semiconductor equipment according to the present embodiment, since the separation line protrusions (first and second separation line protrusions 150 and 160) are disposed inside the grooves 250, they are completely blocked from the fluid, thereby preventing a stable sealing. There is no. Specifically, as shown in FIG. 8A, the first dividing line protrusion 150 is formed in a curve having a _second radius of curvature R ₂ when viewed based on a cross section, and the second dividing line protrusion 160 is a main body. It is formed at the lower end of the other side 140 of (100). Therefore, as shown in FIG. 8B, the second member 300 presses the main body 100 so that the upper surface 110 of the main body 100 contacts the second side surface 257 (see Y). When the 100 completely closes the groove 250, the first and second dividing line protrusions 150 and 160 are completely blocked from the fluid. As a result, the sealing member for semiconductor equipment according to the present embodiment has advantages in that the first and second separation line protrusions 150 and 160 are completely blocked from the fluid, and thus there is no fear of impairing the sealing.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the same is by way of illustration and example only and is not to be construed as limiting the present invention. It is obvious that the modification or improvement is possible.

It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

100: main body 105: hollow part
110: upper surface 120: lower surface
130: one side 140: the other side
150: first split line protrusion 160: second split line protrusion
200: first member 250: groove
251: opening 253: bottom surface
255: first side 257: second side
300: second member 400: door valve
500: chamber 550: gate
R ₁ : first radius of curvature R ₂ : second radius of curvature
R ₃ : 3rd radius of curvature R ₄ : 4th radius of curvature
d: width of main body
A: Angle between one side and lower surface of the body
B: Angle between the other side and the bottom of the body
C: angle between first side and bottom surface
X: first radius of curvature
Z: contact part
W ₁ : width of bottom surface
W ₂ : width of lower surface

Claims (12)

In the sealing member for semiconductor equipment which seals between a 1st member and a 2nd member,
The first member is formed with an opening open at an upper side, a bottom surface provided at a lower side, and a groove including a first side surface and a second side surface connecting the opening and the bottom surface, and the groove is formed from the bottom surface. The distance between the first side and the second side closer to the opening,
It is formed in a circular ring shape so that the hollow portion is formed in the center, and includes a main body inserted into the groove,
Based on the cross section, the main body has an upper surface extending in a curve having a first radius of curvature, and one side is formed to be inclined so as to increase in width from the upper surface to the lower surface, and a second radius of curvature is formed between the one side and the lower surface. Connected to each other having a curved line, the first radius of curvature is larger than the second radius of curvature, and the other side forms an acute angle with the lower surface,
Based on the cross section, the main body is connected by a curve having a third radius of curvature between the other side and the lower surface, and the third radius of curvature is smaller than that of the first radius of curvature and the second radius of curvature. Sealing member.
The method according to claim 1,
The main body is a sealing member for a semiconductor device in which one side, the other side, and the bottom surface extends in a straight line based on the cross section.
The method according to claim 1,
Sealing member for a semiconductor device having a larger angle between the other side and the lower surface of the body than the angle between one side and the lower surface of the main body.
delete The method according to claim 1,
Based on the cross section, the groove is connected by a curve having a fourth radius of curvature between the first side and the bottom surface contacting one side of the main body, and the fourth radius of curvature is greater than the second radius of curvature. Sealing member for small semiconductor equipment.
The method according to claim 1,
The width of the bottom surface of the groove is greater than the width of the lower surface of the main body sealing member for semiconductor equipment.
The method of claim 6,
Before the second member presses the body,
The main body has a sealing member for a semiconductor device, one side of which is in contact with the first side, the other side is spaced apart from the second side.
The method according to claim 1,
And an angle between one side and a bottom surface of the main body corresponds to an angle between the first side surface and the bottom surface of the groove.
The method according to claim 1,
Before the second member presses the body,
The upper surface of the main body is a sealing member for semiconductor equipment protruding from the groove.
The method according to claim 1,
After the second member presses the main body,
An upper surface of the body is in contact with the second side sealing member for semiconductor equipment.
The method according to claim 1,
Sealing member for a semiconductor device is an angle between one side and the lower surface of the main body is more than 80 degrees and less than 90 degrees.
The method according to claim 1,
Based on the cross section, a curve having the second radius of curvature is formed with a first dividing line protrusion,
Sealing member for a semiconductor device is provided with a second separation line projection on the lower end of the other side of the main body.

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