KR101383745B1 - High frequency transmission line using printed circuit board for improving MIMO anntena system - Google Patents

Abstract

The present invention relates to a high frequency transmission line using a printed circuit board for improving the performance of a multi-band antenna, a first ground layer (110) extending in one direction and electrically connected to a plurality of antennas, and the first ground layer ( A first dielectric layer 120 stacked on the first ground layer 110 and extending in the same direction as the first ground layer 110, a first dielectric layer 120 stacked on the first dielectric layer 120, and the first dielectric layer 120. Signal transmission lines 130 extending in the same direction and transmitting electrical signals of the plurality of antennas are stacked and configured, and the first ground layer 110 is a plurality of ground portions independently connected to the plurality of antennas, respectively. The first ground layer provided at a position corresponding to the plurality of ground portions separated from each other and deteriorating RF characteristics by the separation of the first ground layer 110. It is improved by the shape of the compensator of (110) or the complement of the signal transmission line (130).

Description

High frequency transmission line using printed circuit board for improving MIMO anntena system

The present invention relates to a high-frequency communication line, and more particularly to a high-frequency transmission line for connecting between the multi-band antenna and the main board with a printed circuit board for improving the performance of the multi-band antenna.

Recently, as wireless communication technology provides a high quality multimedia service together with a voice communication service through a mobile terminal for mobile communication, convergence with a next generation wireless communication service such as Long Term Evolution (LTE) has attracted much attention.

In general, a communication system based on a voice communication service uses a single input single output (SISO) system that uses only a single antenna element for narrowband channel characteristics within a limited frequency range. However, the SISO system using a single antenna requires a more advanced technology because many difficulties exist in transmitting a large amount of data at high speed in a narrowband channel.

Accordingly, there is a need for a multiple input multiple output (MIMO) technology, which is a next generation wireless transmission technology capable of driving each antenna independently using a plurality of antennas to transmit data transmission / reception rates at a lower error probability.

This MIMO system is widely used due to the advantage that the multiple antennas are used in the transmitting / receiving end, thereby enabling high-speed data transmission without further increasing the frequency allocation used by the entire system. have.

However, in such a MIMO system, severe signal distortion is caused by the sum of signals having different phases and magnitudes received through different paths, resulting in performance degradation of the antenna.

In addition, when a plurality of antennas are mounted in a limited space such as a mobile communication terminal, the distance between the antenna elements is inevitably narrowed, and thus high mutual coupling occurs due to electromagnetic waves radiated from each antenna element.

Therefore, the gain is relatively low due to the increase of electromagnetic mutual coupling between antenna elements, and the main cause of deterioration of the performance of the overall antenna is deteriorated, and it is very important to secure isolation characteristics between the antenna elements.

The present invention is to solve the problems of the prior art as described above, the present invention is to physically separate the ground of the antenna to minimize the interference between a plurality of antennas in a limited internal space, such as a mobile communication terminal.

Another object of the present invention is to connect an antenna and a main board through a high frequency transmission line using a printed circuit board in a mobile communication terminal.

According to a feature of the present invention for achieving the object as described above, the present invention is a first ground layer extending in one direction and electrically connected to a plurality of antennas, and laminated on the first ground layer and the first A first dielectric layer extending in the same direction as the ground layer and a signal transmission line stacked on the first dielectric layer and extending in the same direction as the first dielectric layer to transmit electrical signals of the plurality of antennas; The first ground layer is divided into a plurality of ground parts connected to the plurality of antennas independently of each other, and the RF characteristic degradation by the separation of the first ground layer is located at a position corresponding to the plurality of ground parts. By the compensation part of the first ground layer provided or the complementary part shape of the signal transmission line It is good.

The first ground layer is separated into a first ground portion connected to the first antenna and a second ground portion connected to the second antenna.

The compensating part of the first ground layer is formed to protrude in a direction in which the opposite ends of the first ground part and the second ground part formed by disconnecting the first ground layer are close to each other.

The complementary part of the signal transmission line is formed to be extended so as to increase in width at positions corresponding to spaced parts of the first ground part and the second ground part.

The compensating part of the first ground layer is formed by engaging one end facing each other with the first ground part and the second ground part in an uneven shape.

The complementary part of the signal transmission line includes a complementary conductor part provided at both sides of the signal transmission line at a position corresponding to a spaced portion of the first and second ground parts.

The complementary conductor portion is formed in a zigzag shape or a shape that extends in a direction parallel to the longitudinal direction of the signal transmission line and is continuously switched in a direction orthogonal to the longitudinal direction of the signal transmission line.

The compensating part of the first ground layer includes a concentrating element part connecting between the first ground part and the second ground part formed by disconnecting the first ground layer.

Bonding sheets are provided on the first dielectric layer and extend in the same direction as the signal transmission lines at predetermined intervals on both sides of the signal transmission line, and on the signal transmission line and the bonding sheet. A dielectric layer is stacked, and a second ground layer to which the signal sea clip is connected is stacked on the second dielectric layer.

The antenna connection portion of the printed circuit board for electrical connection with the first antenna and the second antenna is composed of a pair of signal C-Clips having elasticity.

A reinforcing plate for height compensation of the printed circuit board is provided below the antenna connection unit.

In the high frequency transmission line using a printed circuit board for improving the performance of the multi-band antenna according to the present invention as described above, the following effects can be expected.

In the present invention, since the ground layer of the printed circuit board is physically separated and connected to each of a plurality of antennas, interference between the antennas is effectively prevented, thereby improving antenna reception characteristics.

In the present invention, since a plurality of antennas and a main board are connected by using a printed circuit board without a separate coaxial cable in a limited space such as inside a mobile communication terminal, the space utilization rate is improved, The design change is unnecessary, so the range of application is extended and compatibility is improved.

In addition, in the present invention, the RF characteristic degradation due to the physical separation of the ground layer can be compensated by the pattern (shape) deformation of the ground layer or the pattern (shape) deformation of the signal transmission line, thereby preventing the antenna efficiency decrease. There is also.

And, in the present invention, since the sea clip is used instead of the connector for connection with the antenna, the space utilization rate is improved, and the stable contact is also possible.

1 is a cross-sectional view showing the configuration of a preferred embodiment of a high frequency transmission line using a printed circuit board for improving the performance of a multi-band antenna according to the present invention.
2 is a plan view showing the configuration of the ground layer constituting the first embodiment of the present invention;
3 (a) and 3 (b) are plan views showing the structure of the signal transmission line and the ground layer, respectively, of the second embodiment of the present invention;
4 (a) and 4 (b) are plan views showing the structure of the signal transmission line and the ground layer, respectively, of the third embodiment of the present invention.
5 (a) and 5 (b) are plan views showing the configuration of the signal transmission line and the ground layer, respectively, of the fourth embodiment of the present invention;
6 (a) and 6 (b) are plan views showing the structure of the signal transmission line and the ground layer, respectively, of the fifth embodiment of the present invention;
7 is a plan view showing the configuration of the ground layer constituting the sixth embodiment of the present invention;
8 (a) and 8 (b) are a plan view and a side view of a printed circuit board constituting an embodiment of the present invention, respectively, showing a state in which a sea clip for electrical filtration is provided as a schematic bottom.

Hereinafter, with reference to the accompanying drawings a specific embodiment of a high-frequency transmission line using a printed circuit board for improving the performance of the multi-band antenna according to the present invention as described above will be described in detail. Like reference numerals in the drawings below refer to like elements.

1 is a cross-sectional view showing the configuration of a preferred embodiment of a high frequency transmission line using a printed circuit board for improving the performance of a multi-band antenna according to the present invention.

According to this, the high frequency communication line using the printed circuit board according to the embodiment of the present invention is composed of a printed circuit board. Here, the printed circuit board is a flexible printed circuit board (Flexible PCB).

Although not shown, the printed circuit board is formed at one end and electrically connected to the circuit module of the wireless terminal, and is formed at the other end and directly connected to the first antenna and the second antenna (not shown). An antenna connection unit and a module connection unit are connected to the antenna connection unit, and a signal transmission line 130 is formed to include a signal transmission unit for transmitting a signal.

The printed circuit board of FIG. 1 is a flexible printed circuit board having a stacked structure, in which a ground layer, a dielectric layer, and a signal transmission line 130 are stacked, and the stacked structure may be repeated.

Usually, a ground layer is formed at the lowermost layer, and a dielectric layer is stacked thereon, and a signal transmission line 130 for transmitting a high frequency signal is stacked thereon, and again on the signal transmission line 130. Dielectric layers are stacked, and ground layers are disposed thereon. The ground layer on the upper floor usually plays the role of ground, and the ground layer on the lower layer is connected to the ground via vias.

The outermost surface of the laminated structure of the printed circuit board is covered by a cover layer (not shown). The shorter width of the signal transmission line 130 is smaller than the shorter width of the ground layer and the dielectric layer. The printed circuit board may have a micro strip line structure or a strip line structure.

The ground layer and the signal transmission line 130 are made of a metallic material (eg, copper), and the dielectric layer is made of a dielectric material (eg, poly-imide). The high frequency signal transmitted through the first antenna and the second antenna is transmitted to the signal transmission line 130 of the signal transmission unit through the antenna connection unit, and the signal transmission line 130 is connected to the module connection unit so that the high frequency signal is connected to the module connection unit. It is transmitted to the circuit module of the wireless terminal through.

Looking at the laminated structure of the printed circuit board in detail, as shown in Figure 1, the first ground layer 110 is provided on the bottom layer, the first dielectric layer 120 is stacked on top of it, A signal transmission line 130 narrower than the width of the first dielectric layer 120 is stacked thereon.

The bonding sheet 140 is stacked on both sides of the signal transmission line 130 on the upper surface of the first dielectric layer 120. The second dielectric layer 200 is again stacked on the bonding sheet 140, and the second ground layer 300 is stacked thereon. Originally, cover layers are stacked on the top and bottom layers of the second ground layer 300 and the first ground layer 110.

In general, in order to transmit a signal having a high frequency characteristic, the ground around the signal transmission line 130 through which the high frequency signal is transmitted is shielded so that the high frequency signal does not leak.

As shown in FIG. 2, the second ground layer 300 is disposed on the uppermost surface, and the long oval-shaped portion in the center of the second ground layer 300 has the second ground layer 300 removed. This is for impedance matching. Accordingly, the portion of the second ground layer 300 is removed, the second dielectric layer 200 provided in the lower layer is exposed.

A signal transmission line 130 is disposed below the center portion from which the second ground layer 300 is removed, although not shown in FIG. 2 by the second dielectric layer 200.

In this case, as shown in FIG. 2, the second ground layer 300 is spaced apart from the middle thereof. This is the second ground layer 300 is physically separated so that the ground of the first antenna and the second antenna constituting the present invention can be made independently. Of course, although not shown, the first ground layer 110 may likewise be separated.

As the second ground layer 300 is physically separated as described above, the second ground layer 300 is divided into a first ground portion 310 and a second ground portion 320. Separating the second ground layer 300 in this way, in applying the multiple input multiple output (MIMO) technique of the present invention, through isolation between antenna elements, through different paths by a plurality of antennas This is to prevent serious signal distortion from being generated by the sum of signals having different phases and magnitudes received.

However, the present invention has the following structure in order to prevent the RF characteristic reduction such as insertion loss caused by the physically separated second ground layer 300.

First, as shown in FIG. 2, compensators 315 and 325 of the first ground layer 110 are provided at positions corresponding to 330 between the first ground portion 310 and the second ground portion 320. The compensators 315 and 325 protrude in a direction in which the opposite ends of the first ground part 310 and the second ground part 320 formed by disconnecting the first ground layer 110 are close to each other.

More precisely, the compensators 315 and 325 may be spaced apart from the space 330 between the first ground part 310 and the second ground part 320, and the first ground part 310 and the second ground part. A portion of the portions 320 facing each other protrude in a direction close to each other, thereby reducing the spaced space 330 as much as possible. By forming such a pattern, false impedance or increased insertion loss generated from separated grounds can be improved. For reference, reference numerals 131 and 138 denote front and rear ends that are enlarged for signal characteristics, and 231 and 235 denote second dielectric layers that are exposed under the second ground layer 300 to correspond thereto.

3 (a) and 3 (b) show, in plan view, the configuration of the signal transmission line and the second ground layer constituting the second embodiment of the present invention, respectively.

As shown in the drawing, at the position corresponding to the space 330 where the first ground portion 310 and the second ground portion 320 of the second ground layer 300 are spaced apart from each other, the signal transmission line 130 Complementary portion 138 is formed. The complementary part 138 is formed by expanding a width of a part of the signal transmission line 130 and at the position corresponding to the first grounding part 310 and the second grounding part 320. 130) is to improve the amount of transmitted signal to improve the false impedance or increased insertion loss generated from the separated ground.

In the present embodiment, as shown in FIG. 3, the complementary part 138 is formed to be enlarged in a substantially circular shape, but the shape thereof is not necessarily limited thereto, and various modifications in which the width of the signal transmission line 130 is enlarged are possible. Do.

4 (a) and 4 (b) respectively show, in plan view, the configuration of the signal transmission line and the second ground layer constituting the third embodiment of the present invention.

As described above, in the third embodiment, the insertion loss is improved through the compensators 316 and 326 of the second ground layer 300 without changing the signal transmission line 130. Specifically, the compensating parts 316 and 326 are formed by engaging one end of the first ground part 310 and the second ground part 320 facing each other in an uneven shape.

That is, in the third embodiment, the compensators 316 and 326 are formed in a shape in which one end of the first ground part 310 and the second ground part 320 facing each other protrudes and is concave. As a result of engagement, the separation distance between the first ground portion 310 and the second ground portion 320 may be reduced. In addition, the false impedance and increased insertion loss generated from the ground separated from this shape are improved.

5 (a) and 5 (b) show, in plan view, the configuration of the signal transmission line and the second ground layer constituting the fourth embodiment of the present invention, respectively.

As shown in FIG. 4, in the fourth exemplary embodiment, deterioration of the RF characteristic is improved through the complementer 500 of the signal transmission line 130 without changing the second ground layer 300.

Specifically, the supplementary part 500 is a complementary conductor part provided at both sides of the signal transmission line 130 at positions corresponding to parts spaced apart from each other of the first ground part 310 and the second ground part 320. It consists of 500. The complementary conductor unit 500 is provided in pairs on both sides of the signal transmission line 130 and is composed of a conductor.

Since the second dielectric layer 200 constituting the printed circuit board is formed very thinly, even if the second ground layer 300 and the signal transmission line 130 form different layers, the second dielectric layer 200 The second dielectric layer 200 and the signal transmission line 130 may be a kind of capacitor to generate coupling between the second ground layer 300 and the second dielectric layer 200. This coupling is made possible by the complementary conductor portion 500 which is a conductor. In addition, false impedance or increased insertion loss generated from the ground separated from this phenomenon can be improved.

6 (a) and 6 (b) respectively show, in plan view, the configuration of the signal transmission line and the second ground layer constituting the fifth embodiment of the present invention.

As shown in the drawing, in the fifth embodiment, the shape of the complementary conductor part 500 of the fourth embodiment is formed in the tooth shape 600. More precisely, the complementary conductor part 600 extends in a direction parallel to the longitudinal direction of the signal transmission line 130 and is continuously shaped in a direction orthogonal to the longitudinal direction of the signal transmission line 130. Or it is formed in a zigzag shape.

Accordingly, the complementary conductor part 600 performs a kind of inductor function unlike the supplementary conductor part 500 of the fourth embodiment. That is, the complementary conductor part 600 becomes a kind of inductor by its sawtooth-shaped characteristic, and forms a magnetic field around the signal transmission line 130 to store the flow of signals as a magnetic field around. Accordingly, the false impedance or increased insertion loss generated from the separated ground can be improved.

For reference, reference numerals A and B shown in FIGS. 3A, 4A, 5A, and 6A may refer to a first grounding unit 310 and a second grounding unit 320. Like), it indicates the part that performs the grounding function.

Finally, FIG. 7 is a plan view showing the configuration of the second ground layer constituting the sixth embodiment of the present invention.

As shown in the drawing, the compensating part of the second ground layer 300 includes a concentrating element 700 provided between the first ground part 310 and the second ground part 320. The concentrator 700 generally refers to a resistor, an inductor, or a capacitor used when implementing a circuit. By the concentrating element 700, the first grounding part 310 and the second grounding part 320 are indirectly connected, so that the RF characteristic degradation due to the separation of the first ground layer 110 may be improved. .

On the other hand, as shown in Figure 8, the antenna connection portion of the printed circuit board for the electrical connection with the first antenna and the second antenna may be a pair of signal seam 800 (C-Clip) having elasticity.

More precisely, the second ground layer 300 to which the signal seam 800 is connected is stacked on the second dielectric layer 200. In this case, the height compensation of the printed circuit board is provided below the antenna connection part. Reinforcement plate 900 may be provided.

In the past, when a connector is used to connect an antenna and a communication line, a process difficulty or a space problem occurs due to the process of mounting the connector on the communication line and the volume of the connector itself. However, the sea clip 800 is mounted on the communication line, and the antenna can be contacted while pressing while pressing the sea clip 800 to make sure that the contact is solved.

As shown, the printed circuit board may be provided with a plug (P). The plug P is for electrical connection with the main board, and is coupled with a jack (not shown) provided on the main board to perform a connection between the printed circuit board and the main board.

It is to be understood that the invention is not limited to the disclosed embodiment, but is capable of many modifications and variations within the scope of the appended claims. It is self-evident.

In the above-described embodiment, the second ground layer 300 has been described as an example, but the same may be applied to the first ground layer 110, and the compensation unit and the signal transmission line 130 of the second ground layer 300 are used. ) May also be applied.

110: first ground layer 120: first dielectric layer
130: signal transmission line 140: bonding sheet
200: dielectric layer 300: second ground layer
310: first ground portion 320: second ground portion

Claims (12)

delete delete A first ground layer extending in one direction and electrically connected to the plurality of antennas,
A first dielectric layer stacked on the first ground layer and extending in the same direction as the first ground layer;
A signal transmission line stacked on the first dielectric layer and extending in the same direction as the first dielectric layer to transmit electrical signals of the plurality of antennas,
The first ground layer is divided into a plurality of ground portions that are independently connected to the plurality of antennas to minimize interference between the plurality of antennas,
The compensating part of the first ground layer or the complementing part of the signal transmission line is formed at a position corresponding to the plurality of ground parts, so that the RF characteristic degradation due to the separation of the first ground layer is improved.
The first ground layer is separated into a first ground portion connected to the first antenna and a second ground portion connected to the second antenna,
The compensation part of the first ground layer is printed to improve the performance of the multi-band antenna, characterized in that the first ground layer formed by disconnecting the first ground layer formed by the first ground layer is protruded in a direction closer to each other High frequency transmission line using circuit board. A first ground layer extending in one direction and electrically connected to the plurality of antennas,
A first dielectric layer stacked on the first ground layer and extending in the same direction as the first ground layer;
A signal transmission line stacked on the first dielectric layer and extending in the same direction as the first dielectric layer to transmit electrical signals of the plurality of antennas,
The first ground layer is divided into a plurality of ground portions that are independently connected to the plurality of antennas to minimize interference between the plurality of antennas,
The compensating part of the first ground layer or the complementing part of the signal transmission line is formed at a position corresponding to the plurality of ground parts, so that the RF characteristic degradation due to the separation of the first ground layer is improved.
The first ground layer is separated into a first ground portion connected to the first antenna and a second ground portion connected to the second antenna,
The complementary part of the signal transmission line is formed to be extended to increase the width at a position corresponding to the spaced apart portions of the first ground portion and the second ground portion is a printed circuit board for improving the performance of the multi-band antenna High frequency transmission line. A first ground layer extending in one direction and electrically connected to the plurality of antennas,
A first dielectric layer stacked on the first ground layer and extending in the same direction as the first ground layer;
A signal transmission line stacked on the first dielectric layer and extending in the same direction as the first dielectric layer to transmit electrical signals of the plurality of antennas,
The first ground layer is divided into a plurality of ground portions that are independently connected to the plurality of antennas to minimize interference between the plurality of antennas,
The compensating part of the first ground layer or the complementing part of the signal transmission line is formed at a position corresponding to the plurality of ground parts, so that the RF characteristic degradation due to the separation of the first ground layer is improved.
The first ground layer is separated into a first ground portion connected to the first antenna and a second ground portion connected to the second antenna,
The compensation part of the first ground layer is a high-frequency transmission line using a printed circuit board for improving the performance of the multi-band antenna, characterized in that the end facing each other the first ground portion and the second ground portion is formed in an uneven shape. A first ground layer extending in one direction and electrically connected to the plurality of antennas,
A first dielectric layer stacked on the first ground layer and extending in the same direction as the first ground layer;
A signal transmission line stacked on the first dielectric layer and extending in the same direction as the first dielectric layer to transmit electrical signals of the plurality of antennas,
The first ground layer is divided into a plurality of ground portions that are independently connected to the plurality of antennas to minimize interference between the plurality of antennas,
The compensating part of the first ground layer or the complementing part of the signal transmission line is formed at a position corresponding to the plurality of ground parts, so that the RF characteristic degradation due to the separation of the first ground layer is improved.
The first ground layer is separated into a first ground portion connected to the first antenna and a second ground portion connected to the second antenna,
The supplementary part of the signal transmission line is configured for complementary conductor parts provided on both sides of the signal transmission line at positions corresponding to spaced apart portions of the first grounding part and the second grounding part. High frequency transmission line using circuit board. The method of claim 6, wherein the complementary conductor portion is formed in a zigzag shape or a shape that extends in a direction parallel to the longitudinal direction of the signal transmission line and is continuously switched in a direction orthogonal to the longitudinal direction of the signal transmission line. High frequency transmission line using printed circuit board for performance improvement of multiband antenna. A first ground layer extending in one direction and electrically connected to the plurality of antennas,
A first dielectric layer stacked on the first ground layer and extending in the same direction as the first ground layer;
A signal transmission line stacked on the first dielectric layer and extending in the same direction as the first dielectric layer to transmit electrical signals of the plurality of antennas,
The first ground layer is divided into a plurality of ground portions that are independently connected to the plurality of antennas to minimize interference between the plurality of antennas,
The compensating part of the first ground layer or the complementing part of the signal transmission line is formed at a position corresponding to the plurality of ground parts, so that the RF characteristic degradation due to the separation of the first ground layer is improved.
The first ground layer is separated into a first ground portion connected to the first antenna and a second ground portion connected to the second antenna,
The compensation unit of the first ground layer is a printed circuit board for improving the performance of a multi-band antenna, characterized in that the first ground layer is formed of a lumped element portion connecting between the first ground portion and the second ground portion formed by disconnection High frequency transmission line. The bonding sheet according to any one of claims 3 to 8, wherein a bonding sheet extending on the first dielectric layer in the same direction as the signal transmission line at predetermined intervals from the signal transmission line on both sides of the signal transmission line. Equipped,
A second dielectric layer is stacked on the signal transmission line and the bonding sheet;
A high frequency transmission line using a printed circuit board for improving the performance of a multi-band antenna, characterized in that the second dielectric layer is laminated on the second dielectric layer is connected to the signal sea clip. 10. The method of claim 9, wherein the antenna connection portion of the printed circuit board for the electrical connection between the first antenna and the second antenna is characterized in that it is composed of a pair of signal C-Clip having elasticity High frequency transmission line using printed circuit board for antenna performance improvement. The high frequency transmission line using the printed circuit board for improving the performance of the multi-band antenna, characterized in that the reinforcing plate for the height compensation of the printed circuit board is provided below the antenna connection. The high frequency transmission line of claim 11, wherein the printed circuit board is a flexible printed circuit board.

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