KR101381649B1 - Apparatus and method for testing chip type super capacitor - Google Patents

Apparatus and method for testing chip type super capacitor Download PDF

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Publication number
KR101381649B1
KR101381649B1 KR1020110143867A KR20110143867A KR101381649B1 KR 101381649 B1 KR101381649 B1 KR 101381649B1 KR 1020110143867 A KR1020110143867 A KR 1020110143867A KR 20110143867 A KR20110143867 A KR 20110143867A KR 101381649 B1 KR101381649 B1 KR 101381649B1
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wiring board
test
board strip
unit
strip
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KR1020110143867A
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Korean (ko)
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KR20130093755A (en
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박용성
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비나텍주식회사
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/13—Energy storage using capacitors

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  • General Physics & Mathematics (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a test apparatus and method for a chip type super capacitor, and to quickly perform a test and classification process for super capacitors manufactured in a wiring board strip state. The test apparatus for a chip type super capacitor according to the present invention includes a wiring board strip loading part, a test part, and a sorting part. The wiring board strip stacking part is loaded with a wiring board strip having chip type super capacitors formed thereon using the wiring board. The test unit is connected to the external connection pads of the supercapacitors of the wiring board strip transferred from the wiring board strip loading unit, respectively, to test the supercapacitors. In addition, the classification unit transfers the wiring board strip on which the test process is completed in the test unit, and receives the test result from the test unit. According to the test result received, the classifier separates the good capacitors of the wiring board strip from the wiring board strip and moves them to the good storage box. The sorting unit moves the removed wiring board strip to the defective collection box.

Description

Apparatus and method for testing chip type super capacitor}

The present invention relates to a manufacturing technique of a supercapacitor, and more particularly, to a test apparatus and method for a chip type supercapacitor for classifying only good supercapacitors in a wiring board strip in which a plurality of supercapacitors are collectively formed.

In addition to various portable electronic devices, there is a demand for electric power storage devices for electric vehicles and electric energy storage devices for systems for controlling or supplying instantaneous overload. Ni-MH A secondary battery such as a Ni-Cd battery, a lead-acid battery, and a lithium secondary battery, and a super capacitor, an aluminum electrolytic capacitor, and a ceramic capacitor having a high output density and close to unlimited charge / discharge life.

In particular, the super capacitor includes an electric double layer capacitor (EDLC), a pseudo capacitor, and a hybrid capacitor such as a lithium ion capacitor (LIC).

Here, the electric double layer capacitor is a capacitor using an electrostatic charge phenomenon occurring in an electric double layer formed at the interface of different phases, and has a charge / discharge speed faster than that of a battery in which the energy storage mechanism depends on a chemical reaction, And it is widely used as a backup power source, and the potential as an auxiliary power source for electric vehicles in the future is also unlimited.

A pseudocapacitor is a capacitor that converts a chemical reaction into electrical energy using an electrode and an oxidation-reduction reaction of an electrochemical oxide. The pseudocapacitor has a storage capacity about 5 times larger than that of the electric double layer capacitor because the electric double layer capacitor can store the electric charge near the surface of the electrode material as compared with the electric double layer capacitor formed on the surface of the electrochemical double layer type electrode. As the metal oxide electrode material, RuOx, IrOx, MnOx and the like are used.

And the lithium ion capacitor is a new concept secondary battery system which combines the high output and long life characteristics of the existing electric double layer capacitors and the high energy density of the lithium ion battery. Electric double layer capacitors using the physical adsorption reaction of electric charges in the electric double layer have been limited in their application to various applications due to their low energy density despite excellent power characteristics and lifetime characteristics. As a means for solving the problem of such an electric double layer capacitor, a lithium ion capacitor using a carbon-based material capable of inserting and separating lithium ions as a negative electrode active material has been proposed. The lithium ion capacitor has a structure in which lithium ions, And the cell voltage can realize a high voltage of 3.8 V or more, which is much higher than that of the conventional electric double layer capacitor by 2.5 V, and can exhibit a high energy density.

The basic structure of such a supercapacitor is composed of an electrode having a relatively large surface area, an electrolyte, a current collector, and a separator, like a porous electrode, and applying a voltage of several volts across the unit cell electrode to apply ions in the electrolyte. The principle of operation is the electrochemical mechanism that is generated by moving along the electric field and adsorbed on the electrode surface. These cells are sealed in upper and lower cases made of metal, and upper and lower terminals are attached to outer surfaces of the upper and lower cases.

However, in the case of the coin type, the conventional supercapacitor requires gaskets and coating materials for insulation and airtightness of the upper and lower cases, as well as application and crimping processes, thereby requiring assembly and productivity. Not only is it degraded, but it is also costly.

Further, since the upper and lower terminals are protruded to the outside of the upper and lower cases, the size of the supercapacitor is increased, and the mounting space occupies a lot of mounting space on the substrate of the electronic apparatus.

And welding and deflection defects frequently occur in the process of attaching the upper and lower terminals.

These problems result in lowering the functionality and usability of the supercapacitor.

In order to solve this problem, a cell is formed by stacking a first electrode, a separator, and a second electrode on a wiring board made of plastic material, and seals the space of the wiring board on which the cell is mounted with a lid to cover the electronic device. A chip type super capacitor capable of surface mounting on a substrate has been proposed.

The chip type supercapacitor is manufactured using a wiring board strip capable of manufacturing a plurality of batches, and separates individual supercapacitors from the wiring board strip on which the manufacturing process is completed. The test process for each supercapacitor is classified as good or bad.

In order to perform the test process after classifying the individual supercapacitors on the wiring board strip, the separate supercapacitors must be stored in a test tray, and the test tray containing the supercapacitors is tested. Since the test must be transferred to the device to perform the test, it takes a long time from the separation to the individual supercapacitor to the test process.

In addition, since the process of separating the individual supercapacitors is performed before the test process, the situation of performing the process of separating all the supercapacitors formed on the wiring board strip.

Accordingly, an object of the present invention is to provide a test apparatus and method for a chip type super capacitor that can reduce the manufacturing process time of the super capacitor using the wiring board strip.

Another object of the present invention is to provide a test apparatus and method for a chip type super capacitor which performs a test process on a super capacitor formed on a wiring board strip before the separation process and performs the separation process according to the test result.

In order to achieve the above object, the present invention provides a test apparatus for a chip type super capacitor including a wiring board strip loading part, a test part, and a sorting part. The wiring board strip stacking part is loaded with a wiring board strip having chip type super capacitors formed thereon using the wiring board. The test unit is connected to external connection pads of the supercapacitors of the wiring board strip transferred from the wiring board strip loading unit, respectively, and performs the test on the supercapacitors. The classification unit transfers a wiring board strip on which the test process is completed in the test unit, receives a test result from the test unit, and according to the received test result, a good quality of the super capacitors of the wiring board strip is the wiring board. The strip is removed from the strip and transferred to a good storage box, and the wiring board strip from which the good is removed is moved to the defective collection box.

In the test apparatus of the chip type super capacitor according to the present invention, the test unit includes a test head, a test substrate, and a test controller. The test head inputs and outputs a testi signal. The test substrate is provided on a surface of the test head facing the external connection pads of the super capacitors of the wiring board strip, and is electrically connected to each of the external connection pads by mechanical contact to input and output the test signal. It includes a probe pin (probe pin) of. The test controller generates a test signal for testing the supercapacitors of the wiring board strip and outputs the test signal to the test head, and receives a result value of the supercapacitors for the output test signal through the test head. The failure of the capacitors is determined, and the determined test result is transmitted to the classification unit.

In the testing device for a chip-type super capacitor according to the present invention, the sorting unit is installed at a position corresponding to the super capacitors of the wiring board strip, and includes a plurality of punchers each independently driven. In this case, a punching machine installed at a position corresponding to a good product among the supercapacitors of the wiring board strip according to the received test result punches the supercapacitor and separates it from the wiring board strip.

The present invention also provides a stacking step of stacking a wiring board strip having chip type supercapacitors formed thereon using a wiring board in a wiring board strip stacking unit; A test unit configured to be connected to external connection pads of the super capacitors of the wiring substrate strip transferred from the wiring board strip loading unit and perform a test on the super capacitors; And when the test board completes the test process, the wiring board strip is transferred, and when a test result is received from the test unit, a classification unit according to the received test result is a good quality of the super capacitors of the wiring board strip. It provides a test method for a chip-type supercapacitor comprising a; separating from the transfer to the good storage box, the wiring board strip is removed the good good to move to the defective collection.

In the test method of the chip-type super capacitor according to the present invention, the sorting unit is installed at a position corresponding to the super capacitors of the wiring board strip, and includes a plurality of punchers each independently driven. In the sorting step, a punching machine installed at a position corresponding to a good product among the supercapacitors of the wiring board strip according to the received test result punches the supercapacitor and separates it from the wiring board strip.

According to the present invention, after performing the test process for the super capacitor formed on the wiring board strip, the classification process is performed according to the test result, and in particular, the separation process is performed only for the super capacitor determined as good test result. This can shorten the manufacturing time of the super capacitor. In addition, there is an advantage that the classification of the defective supercapacitor can be performed quickly by the wiring board strip.

1 is a block diagram illustrating an apparatus for testing a chip type super capacitor according to an exemplary embodiment of the present invention.
FIG. 2 is a plan view illustrating a wiring board strip loaded on the wiring board strip loading part of FIG. 1.
FIG. 3 is a cross-sectional view taken along line 3-3 of FIG. 2 and illustrates a supercapacitor formed on a wiring board strip.
FIG. 4 is a diagram illustrating a state in which the supercapacitor formed on the wiring board strip is collectively tested in the test unit of FIG. 1.
5 and 6 are views showing a process of separating the good by punching according to the test result in the classification unit of FIG.

In the following description, only parts necessary for understanding the embodiments of the present invention will be described, and the description of other parts will be omitted so as not to obscure the gist of the present invention.

The terms and words used in the present specification and claims should not be construed as limited to ordinary or dictionary meanings and the inventor is not limited to the meaning of the terms in order to describe his invention in the best way. It should be interpreted as meaning and concept consistent with the technical idea of the present invention. Therefore, the embodiments described in the present specification and the configurations shown in the drawings are merely preferred embodiments of the present invention, and are not intended to represent all of the technical ideas of the present invention, so that various equivalents And variations are possible.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a block diagram illustrating an apparatus for testing a chip type super capacitor according to an exemplary embodiment of the present invention. FIG. 2 is a plan view illustrating a wiring board strip loaded on the wiring board strip loading part of FIG. 1. 3 is a cross-sectional view taken along line 3-3 of FIG. 2 and illustrates a supercapacitor formed on a wiring board strip.

1 to 3, the test apparatus 200 of the chip type super capacitor 100 according to the present embodiment manufactures the super capacitors 100 collectively using the wiring board strip 50. The wiring board strip stacking unit 110, the test unit 120 and the classification unit 130 is configured to include. The wiring board strip loading part 110 is loaded with the wiring board strip 50 on which the chip-type super capacitors 100 using the wiring board 10 are formed. The test unit 120 performs a test on the supercapacitors 100 formed on the wiring board strip 50 transferred from the wiring board strip loading unit 110. The classification unit 130 performs classification on the supercapacitors 100 formed on the wiring board strip 50 transferred from the test unit 120 according to the test result of the test unit 120.

As described above, the test apparatus 200 of the chip type supercapacitor 100 according to the present exemplary embodiment performs the test in the state of the wiring board strip 50 on which the supercapacitors 100 are formed, and performs the classification process according to the test result. Therefore, the manufacturing process time of the chip type super capacitor 100 can be shortened. That is, after performing the test process for the super capacitor 100 formed on the wiring board strip 50, the classification process is performed according to the test result, but the separation process is performed only for the super capacitor 100 determined as good test results. do. This may shorten the manufacturing process time of the supercapacitor 100. In addition, there is an advantage that the classification of the defective supercapacitor can also be performed quickly in units of the wiring board strip 50.

The test apparatus 200 of the chip type super capacitor 100 according to the present embodiment will be described in detail as follows. The test apparatus 200 is a device for testing and classifying the supercapacitor 100 after the process of forming the supercapacitor 100 on the wiring board strip 50 is completed.

The wiring board strip loading part 110 is loaded with the wiring board strip 50 on which the formation process of the supercapacitor 100 is completed. Here, the wiring board strip 50 has a structure in which a plurality of wiring boards 10 are collectively formed to manufacture the plurality of supercapacitors 100. That is, in the wiring board strip 50, the wiring boards 10 for each supercapacitor 100 are arranged and formed in an m × n matrix (m and n are natural numbers), and the plurality of wiring boards 10 are cut regions 51. Separated by.

The chip type supercapacitors 100 formed on the wiring board strip 50 each include a wiring board 10, a cell 20, and a lid 40. The supercapacitor 100 has a structure in which a cell 20 is mounted on an upper surface 12 of a wiring board 10 and a region in which the cell 20 is mounted is sealed with a lead 40. In this case, the cell 20 includes a first electrode 21, a separator 23, a second electrode 25, and an electrolyte.

The wiring board 10 is a printed circuit board including an insulating substrate body 11 and a circuit wiring pattern 13 formed on the substrate body 11. [

The substrate body 11 has a top surface 12 and a bottom surface 14 opposite the top surface 12 and can be made of an insulating material. As the material of the substrate body 11, FR4 or a ceramic material can be used. Such a substrate body 11 can be manufactured in the form of a rectangular plate.

The circuit wiring pattern 13 is formed on the lower surface 14 of the substrate body 11 and the electrode mounting area 15 and lead bonding pattern 17 formed on the upper surface 12 of the substrate body 11 And a plurality of external connection pads 18. The electrode mounting region 15 is formed at the central portion of the upper surface 12 of the substrate body 11. [ The lead bonding pattern 17 is formed around the electrode mounting region 15. [ The plurality of external connection pads 18 are formed on the lower surface of the substrate body 11, and the electrode mounting region 15 and the lead bonding pattern 17 are formed by via holes 19 passing through the substrate body 11. And are electrically connected respectively.

At this time, the lead bonding pattern 17 is formed in a ring shape surrounding the electrode mounting region 15, and is formed at a predetermined distance from the electrode mounting region 15. The plurality of external connection pads 18 may be provided in pairs to correspond to the first and second electrodes 21 and 25 of the cell 20. The pair of external connection pads 18a and 18b may be formed in different lengths so that an operator can easily distinguish terminals connected to the first and second electrodes 21 and 25 after being manufactured by the supercapacitor 100. have.

The cell 20 is mounted in the electrode mounting region 15, and the cell 20 includes a first electrode 21, a separator 23, a second electrode 25, and an electrolyte. The first electrode 21 is bonded to the electrode mounting region 15 via the first bonding member 31 and electrically connected thereto. The separator 23 is stacked on the first electrode 21. The second electrode 25 is stacked on the separator 23. The electrolyte is impregnated into the first and second electrodes 21 and 25. In this case, the first electrode 21 and the second electrode 25 are one of an anode or a cathode and have different polarities. As the first bonding member 31, as the adhesive having electrical conductivity, a carbon paste, a conductive polymer, a silver-epoxy adhesive, or the like may be used, but is not limited thereto. The first bonding member 31 may be provided in the form of a liquid or a sheet. Such a cell 20 may be a cell forming a hybrid capacitor such as an electric double layer capacitor, a pseudo capacitor, and a lithium ion capacitor.

The lead 40 covers the cell 20 mounted on the upper surface 12 of the wiring board 10 to seal the region in which the cell 20 is mounted to the outside. That is, the lead 40 covers the cell 20 mounted on the wiring board 10, and the inner surface of the lead 40 is joined to the second electrode 25 by the second bonding member 33 and electrically connected thereto. The portion is bonded to the lead bonding pattern 17 of the wiring board 10 via the third bonding member 35 and electrically connected thereto. The lead 40 is made of a metal material having good electrical conductivity, and may be composed of a cover portion 41 and a bonding portion 43. The cover part 41 has an internal space 45 into which the cell 20 is inserted, and the second electrode 25 is connected to the second bonding member 33 on the bottom surface 47 of the internal space 45. It is joined together and connected electrically. The joining portion 43 is integrally formed with the edge portion of the lid portion 41 and is electrically connected to the lead joining pattern 17 via the third joining member 35. The joining portion 43 may be formed to be bent outward at an edge portion of the lid portion 41.

Accordingly, in the supercapacitor 100 according to the first embodiment, the first electrode 21 of the cell 20 has the lower surface 14 of the wiring board 10 through the electrode mounting region 15 and the via hole 19. It is electrically connected to an external connection pad 18 formed at. The second electrode 25 of the cell 20 is an external connection pad 18 formed on the bottom surface 14 of the wiring board 10 through the lead 40, the lead bonding pattern 17, and the via hole 19. Is electrically connected to the

In this case, the second and third bonding members 33 and 35 may be electrically conductive adhesives, and carbon paste, solder paste, conductive polymer, silver-epoxy adhesive, and the like may be used, but the present invention is not limited thereto. In particular, the third bonding member 35 may be formed on the lead bonding pattern 17 of the wiring board 10 by a printing method. The reason why the third bonding member 35 is formed on the lead bonding pattern 17 of the wiring board 10 by the printing method is to standardize the coating amount and the bonding area of the third bonding member 35 to bond the leads 40 to each other. This is to prevent the third bonding member 35 from spreading to the electrode mounting region 15 in the process of joining the lead 40 while maintaining the bonding state more stably. The joining portion 43 of the other lead 40 can be joined to the lead bonding pattern 17 of the wiring board 10 by a welding method using ultrasonic waves or high frequency waves.

1 and 4, the test unit 120 is connected to the external connection pads 18 of the supercapacitors 100 of the wiring board strip 50 transferred from the wiring board strip loading unit 110, respectively. Connected to perform tests on the supercapacitors 100. 4 is a diagram illustrating a state in which the super capacitors 100 formed on the wiring board strip 50 are collectively tested in the test unit 120 of FIG. 1.

The test unit 120 includes a test controller 121, a test head 123, and a test substrate 125. The test controller 121 is a controller that controls the overall operation of the test unit 120. The test controller 121 controls the test performance on the supercapacitors 100 formed on the wiring board strip 50. The test head 123 inputs and outputs a test signal between the test controller 121 and the test substrate 125. The test board 125 is installed on the surface of the test head 123 facing the external connection pads 18 of the supercapacitors 100 of the wiring board strip 50, and mechanically attached to the external connection pads 18, respectively. And a plurality of probe pins 127 electrically connected by a contact to input and output a test signal.

In this case, the test controller 121 generates a test signal necessary for the test of the supercapacitor 100 and outputs it to the test head 123, and outputs a result value of the supercapacitors 100 with respect to the output test signal. Received through the to determine the failure of the corresponding super capacitor 100. The test controller 121 transmits the test results for the super capacitors 100 to the classification unit 130 in units of the wiring board strip 50.

The test head 123 receives a test signal from the test controller 121 and transmits the test signal to the test substrate 125. The test head 123 receives the output signal based on the transmitted test signal and transmits the test signal to the test controller 121. .

The test board 125 includes a plurality of probe pins 127 corresponding to the external connection pads 18 of the supercapacitors 100 formed on the wiring board strip 50. The probe pin 127 is elastic so as to stably contact the external connection pad 18. The probe pin 127 may be used as long as it is an elastic medium while providing an electrical path such as a pogo pin, various types of springs, a conductive elastomer, and the like.

The classification unit 130 will be described with reference to FIGS. 1, 5, and 6 as follows. 5 and 6 are views showing a process of separating the good by punching according to the test result in the classification unit 130 of FIG.

The classification unit 130 transfers the wiring board strip 50 in which the test process is completed in the test unit 120, and receives a test result from the test unit 120. The classification unit 130 separates the good products from the supercapacitors 100 of the wiring board strip 50 from the wiring board strip 50 according to the received test result and moves them to the good storage box 140. In addition, the classification unit 130 moves the wiring board strip 50b from which the good product is removed to the defective product collection box 150.

The sorting unit 130 is installed at positions corresponding to the supercapacitors 100 of the wiring board strip 50, and includes a plurality of punchers 135 that can be independently driven. The classification unit 130 punches the supercapacitor 100 with a punching machine 135 installed at a position corresponding to a good product among the supercapacitors 100 of the wiring board strip 50 according to the received test result. Separate from 50. For example, as shown in FIGS. 5 and 6, of the four supercapacitors 100a, 100b, 100c, 100d from the left, the first and third supercapacitors 100a, 100c are good and the second and fourth supercapacitors. When the capacitors 100b and 100d are defective, the first and third punchers 131 and 133 disposed on the first and third supercapacitors 100a and 100c are disposed in the first and third supercapacitors 100a and 100b. The outer cut regions 51 are punched to separate the first and second supercapacitors 100a and 100c from the wiring board strip 50. In this case, since the second and fourth punchers 132 and 134 do not operate, as shown in FIG. 6, the second and fourth supercapacitors 100b and 100d remain in the wiring board strip 50b.

As described above, the test apparatus 200 according to the present embodiment performs the test process in the state of the wiring board strip 50, and then, according to the test result, only the good product is separated from the wiring board strip 50, and the good product is separated and the defective product remains. And the wiring board strip 50b are removed together. This may shorten the manufacturing process time of the supercapacitor 100. In addition, there is an advantage that the classification of the defective super capacitor 100 can be performed quickly in units of the wiring board strip 50.

It should be noted that the embodiments disclosed in the present specification and drawings are only illustrative of specific examples for the purpose of understanding, and are not intended to limit the scope of the present invention. It will be apparent to those skilled in the art that other modifications based on the technical idea of the present invention are possible in addition to the embodiments disclosed herein.

10: wiring board 20: cell
40: lead 50: wiring board strip
51: cutting area 100: super capacitor
110: wiring board strip loading part 120: test part
121: test controller 123: test head
125: test board 127: probe pin
130: classification unit 135: punching machine
140: good goods loading box 150: bad goods loading box
200: Super Capacitor Test Device

Claims (5)

A wiring board strip stacking unit on which a wiring board strip on which chip type super capacitors are formed using a wiring board is mounted;
A test unit connected to external connection pads of the supercapacitors of the wiring board strip transferred from the wiring board strip stacker to test the supercapacitors;
In the test unit, a wiring board strip in which a test process is completed is transferred, and a test result is received from the test unit, and according to the received test result, good quality of the super capacitors of the wiring board strip is separated from the wiring board strip. Includes a sorting unit for moving to the good storage box, the wiring board strip is removed the good good to move to the defective collection;
Wherein,
And a plurality of punching machines installed at positions corresponding to the super capacitors of the wiring board strip, each of which can be independently driven.
A punching device installed at a position corresponding to a good product among the supercapacitors of the wiring board strip according to the received test result, and punches the supercapacitor to separate from the wiring board strip. . The method of claim 1, wherein the test unit,
A test head for inputting and outputting a test signal;
A plurality of probe pins installed on a surface of a test head facing the external connection pads of the supercapacitors of the wiring board strip, and electrically connected to the external connection pads by mechanical contact, respectively, to input and output the test signal. a test substrate comprising a pin);
Generates a test signal for testing the super capacitors of the wiring board strip and outputs the test signal to the test head, and receives a result value of the super capacitors with respect to the test signal output to the test head through the test head. A test controller for determining whether a defect is in the quantity and transmitting the determined test result to the classification unit;
Test device for a chip-type super capacitor, characterized in that it comprises a. delete delete A stacking step of stacking a wiring board strip having chip type super capacitors formed thereon using the wiring board on the wiring board strip stacking unit;
A test unit configured to be connected to external connection pads of the super capacitors of the wiring substrate strip transferred from the wiring board strip loading unit and perform a test on the super capacitors;
When the test board completes the test process, the wiring board strip is transferred, and when the test result is received from the test unit, the classification unit according to the received test result, the good quality of the super capacitors of the wiring board strip from the wiring board strip. And a sorting step of separating and moving the goods into a good storage box, wherein the wiring board strip from which the goods are removed is transferred to a defective goods collection box.
The sorting unit is installed at a position corresponding to the super capacitors of the wiring board strip, each of the plurality of punching machines capable of driving independently; includes;
In the sorting step, a chip type puncher installed at a position corresponding to a good product among the supercapacitors of the wiring board strip according to the received test result of punching the supercapacitor to separate from the wiring board strip Test method of super capacitors.
KR1020110143867A 2011-12-27 2011-12-27 Apparatus and method for testing chip type super capacitor KR101381649B1 (en)

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CN110252690A (en) * 2019-07-16 2019-09-20 南通江海储能技术有限公司 A kind of supercapacitor automatic aging testing, sorting all-in-one machine

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0727822A (en) * 1993-07-12 1995-01-31 Sharp Corp Frame test handler
JP2003243463A (en) * 2002-02-15 2003-08-29 Tdk Corp Inspection method and manufacturing method of semiconductor element, surface acoustic wave element and wafer
KR20100077630A (en) * 2008-12-29 2010-07-08 주식회사 케이에스비 Manufacturing method of electric double layer capacitor

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0727822A (en) * 1993-07-12 1995-01-31 Sharp Corp Frame test handler
JP2003243463A (en) * 2002-02-15 2003-08-29 Tdk Corp Inspection method and manufacturing method of semiconductor element, surface acoustic wave element and wafer
KR20100077630A (en) * 2008-12-29 2010-07-08 주식회사 케이에스비 Manufacturing method of electric double layer capacitor

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