KR101211668B1 - Super capacitor of surface mount type - Google Patents

Abstract

PURPOSE: A surface mounting type super capacitor is provided to improve airtightness for a space including a cell by sealing a lead with fluid molding resin after sealing the cell mounted on a wiring substrate with the lead. CONSTITUTION: A surface mounting type super capacitor(100) includes a wiring substrate(10), a cell, a lead(40), and a resin sealing part(50). The cell is installed on the upper surface(12) of the wiring substrate. An area having the cell is sealed by the lead. The lead is sealed by the resin sealing part. The cell includes a first electrode(21), a separation film(23), a second electrode(25), and electrolyte. The wiring substrate includes an insulated substrate body(11), and a circuit wiring pattern(13) formed on the substrate body.

Description

Super capacitor of surface mount type

FIELD OF THE INVENTION The present invention relates to super capacitors, and more particularly to surface mount supercapacitors that can be surface mounted on a substrate of an electronic device and provide improved hermetic reliability for the area in which the cell is mounted.

Electric vehicles such as various portable electronic devices require electric energy storage devices for systems that require a power supply device, or systems for regulating or supplying an overload occurring instantaneously. Such electric energy storage devices include Ni-MH. There are secondary batteries such as batteries, Ni-Cd batteries, lead acid batteries, and lithium secondary batteries, and supercapacitors, aluminum electrolytic capacitors, and ceramic capacitors having high power density and almost unlimited charge / discharge life.

In particular, the supercapacitor includes an electric double layer capacitor (EDLC), a pseudo capacitor, and a hybrid capacitor such as a lithium ion capacitor (LIC).

Here, the electric double layer capacitor is a capacitor using the electrostatic charge generated in the electric double layer formed at the interface of the different phases, and has a faster charge / discharge rate, higher charge / discharge efficiency, and excellent cycle characteristics than a battery whose energy storage mechanism depends on chemical reaction. It is widely used for backup power supply, and the potential as an auxiliary power source for electric vehicles in the future is also infinite.

A pseudo capacitor is a capacitor that converts and stores a chemical reaction into electrical energy by using a redox reaction of an electrode and an electrochemical oxide. The pseudocapacitor can store charge up to near the surface of the electrode material as compared to the double layer formed on the surface of the electrochemical double layer electrode, so that the storage capacity is about five times larger than that of the double layer capacitor. RuOx, IrOx, MnOx and the like are used as the metal oxide electrode materials.

The lithium ion capacitor is a new concept of a secondary battery system that combines the high power and long life characteristics of a conventional electric double layer capacitor with the high energy density of a lithium ion battery. The electric double layer capacitor using the physical adsorption reaction of the electric charge in the electric double layer is limited to various applications due to the low energy density despite the excellent output characteristics and lifetime characteristics. As a means of solving the problems of the electric double layer capacitor, a lithium ion capacitor using a carbon-based material capable of inserting and desorbing lithium ions as a negative electrode active material has been proposed. Thus, the potential of the cathode can be significantly lowered, and the cell voltage can be realized at a high voltage of 3.8 V or more, which is significantly improved compared to the 2.5 V of the conventional electric double layer capacitor, and can express high energy density.

The basic structure of such a supercapacitor is composed of an electrode having a relatively large surface area, an electrolyte, a current collector, and a separator, like a porous electrode, and applying a voltage of several volts across the unit cell electrode to apply ions in the electrolyte. The principle of operation is based on the electrochemical mechanism generated by the movement of electrons along the electric field and adsorbed on the electrode surface. These cells are sealed in upper and lower cases made of metal, and upper and lower terminals are attached to outer surfaces of the upper and lower cases.

However, the conventional supercapacitor requires a gasket and a coating material for insulation and airtightness of the upper and lower cases, as well as a coating and pressing process. Therefore, the assembly and productivity are deteriorated and the cost is high I have a problem.

In addition, since the upper and lower terminals have a structure that protrudes to the outside of the upper and lower cases, not only the size of the super capacitor is increased but also takes a lot of mounting space when mounting on the substrate of the electronic device.

And welding and deflection defects frequently occur in the process of attaching the upper and lower terminals.

These problems result in lowering the functionality and usability of the supercapacitor.

Accordingly, it is an object of the present invention to provide a surface mount supercapacitor that can be surface mounted on a substrate of an electronic device and can improve productivity by simplifying the assembly process.

Another object of the present invention is to provide a surface mount supercapacitor capable of providing improved hermetic reliability for the space in which the cell is mounted.

In order to achieve the above object, the present invention provides a surface mount supercapacitor including a wiring board, a cell, a lead and a resin encapsulation. In the wiring board, a lead bonding pattern is formed around an electrode mounting region and the electrode mounting region on an upper surface thereof, and a plurality of external connection pads electrically connected to the electrode mounting region and the lead bonding pattern are respectively formed on a lower surface thereof. . The cell may include a first electrode bonded to and electrically connected to an electrode mounting region of the wiring board, a separator formed on the first electrode, a second electrode formed on the separator, and an electrolyte impregnated in the first and second electrodes. Equipped. The lead covers a cell mounted on the wiring board, and an inner surface thereof is bonded to the second electrode to be electrically connected, and an edge portion thereof is bonded to the lead bonding pattern of the wiring board to be electrically connected. The resin encapsulation portion is formed on an upper surface of the wiring board and is formed by covering the lead with a liquid molding resin.

In the surface mount supercapacitor according to the present invention, the resin encapsulation portion may be formed on an upper surface of the wiring board to include a bonding portion of the lead bonded to the lead bonding pattern.

In the surface mount supercapacitor according to the present invention, the resin encapsulation portion may have an outer side surface on the same side as the outer side surface of the wiring board.

In the surface mount supercapacitor according to the present invention, the resin encapsulation portion may have an outer surface located inside the outer surface of the wiring board.

In the surface mount supercapacitor according to the present invention, the resin encapsulation portion may be formed by a half molding method or a coating method.

In the surface mount supercapacitor according to the present invention, the molding resin for forming the resin encapsulation may include an epoxy resin.

In the surface mount supercapacitor according to the present invention, a pair of external connection pads are formed on a lower surface of the wiring board, and the length of the pair of external connection pads may be different.

In the surface mounted supercapacitor according to the present invention, the wiring board may have a ring shape in which the lead bonding pattern surrounds the electrode mounting region.

In the surface mounted supercapacitor according to the present invention, the wiring board may be electrically connected to the plurality of external connection pads by via holes penetrating through the electrode mounting region and the lead bonding pattern and the wiring board, respectively.

In the surface-mount supercapacitor according to the present invention, the lead bonding pattern to which the leads are bonded may be spaced apart from the electrode mounting region in which the first electrode is mounted.

In the surface mount supercapacitor according to the present invention, the wiring board may be formed with a groove filled with a liquid molding resin around a region to which the lead is bonded. The groove of the wiring board may be formed in a ring shape around a region to which the lead is joined, and may be formed to have a wider inner side than an inlet of the groove.

The present invention also provides a surface mount supercapacitor including a wiring board, a cell, a lead, and a resin encapsulation portion. The wiring board has an upper surface and a lower surface opposite to the upper surface. The cell includes a first electrode, a separator, a second electrode, and an electrolyte, and the first electrode is bonded to and electrically connected to the upper surface of the wiring board. The lead is bonded and sealed to the upper surface of the wiring board to cover the cell, and electrically connects the second electrode of the cell and the wiring board. The resin encapsulation portion is formed on an upper surface of the wiring board to cover the lead.

In the surface mount supercapacitor according to the present invention, the wiring board includes a substrate body having an upper surface and a lower surface opposite to the upper surface, an electrode mounting region formed on an upper surface of the substrate body, and the electrode mounting region. And a plurality of external connection pads formed at a periphery of the lead bonding pattern to which the leads are bonded, and a plurality of external connection pads formed at a lower surface of the substrate body and electrically connected to the electrode mounting region and the lead bonding pattern, respectively. have.

Since the supercapacitor according to the present invention has a structure in which a cell is mounted on a wiring board and then covered with a lead, the lead is sealed with a liquid molding resin, and an external connection pad is formed on the lower surface of the wiring board, thus assembling the supercapacitor. Productivity can be improved by simplifying the process, super capacitors can be surface-mounted on the board of the electronic device using external connection pads, super capacitor size can be reduced, and the mounting area when mounting on the board of the electronic device can be reduced. have.

In addition, the supercapacitor according to the present invention covers and seals a cell mounted on a wiring board with a lead, and seals the lead again with a liquid molding resin, thereby providing high airtightness to the space in which the cell is mounted. As a result, even if a poor bonding occurs between the lead and the wiring board, leakage of electrolyte may be prevented from occurring through the interface between the wiring board and the lead.

1 is a partially cutaway perspective view illustrating a surface mount supercapacitor according to a first exemplary embodiment of the present invention.
2 is a sectional view taken along the line 2-2 in Fig.
3 is a plan view showing a lower surface of the supercapacitor of FIG.
4 is a flowchart illustrating a method of manufacturing a surface mount supercapacitor according to a first embodiment of the present invention.
5 is a cross-sectional view illustrating a surface mount supercapacitor according to a second exemplary embodiment of the present invention.
6 is a plan view illustrating a surface mount supercapacitor according to a third exemplary embodiment of the present invention.
7 is a cross-sectional view taken along line 7-7 of FIG.

In the following description, only parts necessary for understanding the embodiments of the present invention will be described, and the description of other parts will be omitted so as not to obscure the gist of the present invention.

The terms and words used in the present specification and claims should not be construed as limited to ordinary or dictionary meanings and the inventor is not limited to the meaning of the terms in order to describe his invention in the best way. It should be interpreted as meaning and concept consistent with the technical idea of the present invention. Therefore, the embodiments described in the present specification and the configurations shown in the drawings are merely preferred embodiments of the present invention, and are not intended to represent all of the technical ideas of the present invention, so that various equivalents And variations are possible.

Hereinafter, with reference to the accompanying drawings will be described in detail an embodiment of the present invention.

First Embodiment

1 is a partially cutaway perspective view illustrating a surface mount supercapacitor according to a first exemplary embodiment of the present invention. FIG. 2 is a cross-sectional view taken along the line 2-2 of FIG. 1. And FIG. 3 is a plan view showing a lower surface of the supercapacitor of FIG.

1 to 3, the surface mount supercapacitor 100 according to the first embodiment includes a wiring board 10, a cell 20, a lid 40, and a resin encapsulation 50. do. The supercapacitor 100 has the cell 20 mounted on the upper surface 12 of the wiring board 10, the region in which the cell 20 is mounted is sealed with the lead 40, and then the lead 40 is closed again. It has a double sealing structure sealed by the resin sealing part 50. As shown in FIG. In this case, the cell 20 includes a first electrode 21, a separator 23, a second electrode 25, and an electrolyte.

The wiring board 10 is a printed circuit board including an insulating substrate body 11 and a circuit wiring pattern 13 formed on the substrate body 11. [

The substrate body 11 has a top surface 12 and a bottom surface 14 opposite the top surface 12 and can be made of an insulating material. As the material of the substrate body 11, FR4 or a ceramic material can be used. Such a substrate body 11 can be manufactured in the form of a rectangular plate.

The circuit wiring pattern 13 is formed on the lower surface 14 of the substrate body 11 and the electrode mounting area 15 and lead bonding pattern 17 formed on the upper surface 12 of the substrate body 11 And a plurality of external connection pads 18. The electrode mounting region 15 is formed at the central portion of the upper surface 12 of the substrate body 11. [ The lead bonding pattern 17 is formed around the electrode mounting region 15. [ The plurality of external connection pads 18 are formed on the lower surface of the substrate body 11, and the electrode mounting region 15 and the lead bonding pattern 17 are formed by via holes 19 passing through the substrate body 11. And are electrically connected respectively.

At this time, the lead bonding pattern 17 is formed in a ring shape surrounding the electrode mounting region 15 and is spaced apart from the electrode mounting region 15 by a predetermined interval. The plurality of external connection pads 18 may be provided in pairs to correspond to the first and second electrodes 21 and 25 of the cell 20. The pair of external connection pads 18a and 18b may be formed in different lengths so that an operator can easily distinguish terminals connected to the first and second electrodes 21 and 25 after the super capacitor 100 is manufactured. have.

The cell 20 is mounted in the electrode mounting region 15, and the cell 20 includes a first electrode 21, a separator 23, a second electrode 25, and an electrolyte. The first electrode 21 is bonded to the electrode mounting region 15 via the first bonding member 31 and electrically connected thereto. The separator 23 is stacked on the first electrode 21. The second electrode 25 is stacked on the separator 23. The electrolyte is impregnated into the first and second electrodes 21 and 25. In this case, the first electrode 21 and the second electrode 25 are one of an anode or a cathode and have different polarities. As the first bonding member 31, as the adhesive having electrical conductivity, a carbon paste, a conductive polymer, a silver-epoxy adhesive, or the like may be used, but is not limited thereto. The first bonding member 31 may be provided in the form of a liquid or a sheet. Such a cell 20 may be a cell forming a hybrid capacitor such as an electric double layer capacitor, a pseudo capacitor, and a lithium ion capacitor.

The lead 40 covers the cell 20 mounted on the upper surface 12 of the wiring board 10 to seal the region in which the cell 20 is mounted to the outside. That is, the lead 40 covers the cell 20 mounted on the wiring board 10, and the inner surface of the lead 40 is joined to the second electrode 25 by the second bonding member 33 and electrically connected thereto. The portion is bonded to the lead bonding pattern 17 of the wiring board 10 via the third bonding member 35 and electrically connected thereto. The lead 40 is made of a metal material having good electrical conductivity, and may be composed of a cover portion 41 and a bonding portion 43. The cover part 41 has an internal space 45 into which the cell 20 is inserted, and the second electrode 25 is connected to the second bonding member 33 on the bottom surface 47 of the internal space 45. It is joined together and connected electrically. The joining portion 43 is integrally formed with the edge portion of the lid portion 41 and is electrically connected to the lead joining pattern 17 via the third joining member 35. The joining portion 43 may be formed to be bent outward at an edge portion of the lid portion 41.

Accordingly, in the supercapacitor 100 according to the first embodiment, the first electrode 21 of the cell 20 has the lower surface 14 of the wiring board 10 through the electrode mounting region 15 and the via hole 19. It is electrically connected to an external connection pad 18 formed at. The second electrode 25 of the cell 20 is an external connection pad 18 formed on the bottom surface 14 of the wiring board 10 through the lead 40, the lead bonding pattern 17, and the via hole 19. Is electrically connected to the

In this case, the second and third bonding members 33 and 35 may be electrically conductive adhesives, and carbon paste, solder paste, conductive polymer, silver-epoxy adhesive, and the like may be used, but the present invention is not limited thereto. In particular, the third bonding member 35 may be formed on the lead bonding pattern 17 of the wiring board 10 by a printing method. The reason why the third bonding member 35 is formed on the lead bonding pattern 17 of the wiring board 10 by the printing method is to standardize the coating amount and the bonding area of the third bonding member 35 to bond the leads 40 to each other. This is to prevent the third bonding member 35 from spreading to the electrode mounting region 15 in the process of joining the lead 40 while maintaining the bonding state more stably. The joining portion 43 of the other lead 40 can be joined to the lead bonding pattern 17 of the wiring board 10 by a welding method using ultrasonic waves or high frequency waves.

The resin encapsulation part 50 is formed on the upper surface 12 of the wiring board 10 to cover the lead 40 with a liquid molding resin. The resin encapsulation unit 50 provides airtightness to the space in which the cell 20 is mounted, together with the lid 40, and functions to protect the lid 40 from the external environment. The resin encapsulation unit 50 may be formed through a molding process using a liquid molding resin. As the molding resin, a material capable of withstanding the resin sealing unit 50 at a temperature acting in a flow solding in which the supercapacitor 100 is mounted on a substrate of an electronic device after being dried or cured is used. It is preferable, for example, an epoxy resin can be used. The resin sealing portion 50 can be formed by a half molding method or a coating method.

In this case, the resin encapsulation part 50 includes the joint portion of the lead 40 bonded to the lead bonding pattern 17 in order to secure stable airtightness between the lead 40 and the wiring board 10. It is formed on the upper surface 12 of the wiring board 10 to cover. The outer surface 51 of the resin encapsulation portion 50 may be located on the same surface as the outer surface 11a of the wiring board 10.

As described above, the supercapacitor 100 according to the first embodiment is mounted with the cell 20 on the wiring board 10 and then covered with the lead 40, the lead 40 is sealed again with a liquid molding resin, and the wiring board is Since a plurality of external connection pads 18 are formed on the lower surface 14 of 10, the assembly process of the supercapacitor 100 can be simplified to improve productivity, and the supercapacitor 100 can be plural. Surface mounting on the substrate of the electronic device using the external connection pad 18 of the, can reduce the size of the super capacitor 100 and the mounting area when the surface is mounted on the substrate of the electronic device.

In addition, the supercapacitor 100 according to the first embodiment has a structure in which the cell 20 mounted on the upper surface 12 of the wiring board 10 is double-sealed by using the leads 40 and the resin sealing unit 50. Since it is possible to secure a high airtightness for the space in which the cell 20 is mounted. As a result, even if a poor bonding occurs between the lead 40 and the wiring board 10, the electrolyte impregnated in the cell 20 may be prevented from leaking through the interface between the wiring board 10 and the lead 40. have.

A method of manufacturing the supercapacitor 100 according to the first embodiment will be described below with reference to FIGS. 1 to 4. 4 is a flowchart illustrating a method of manufacturing the surface mount supercapacitor 100 according to the first embodiment of the present invention.

First, the wiring board 10 is prepared (S71). The wiring board 10 may be provided in the form of a strip from which a plurality of supercapacitors may be manufactured. That is, in the strip-shaped wiring board 10, the circuit wiring pattern 13 for each supercapacitor 100 is arranged and formed in an m × n matrix (m and n are natural numbers) on the substrate body 11.

Next, the first electrode 21 is bonded to the electrode mounting region 15 of the wiring board 10 via the first bonding member 31 (S73).

On the other hand, the second electrode 25 is bonded to the lead 40 via the second bonding member 33 (S75). That is, the second electrode 25 is bonded to the bottom surface 47 of the inner space 45 of the lid part 41. Subsequently, a liquid electrolyte is injected to sufficiently impregnate the second electrode 25 into the inner space 45 of the lead 40 (S77). Next, the separator 23 is stacked on the second electrode 25 (S79).

In addition to the process of bonding the first electrode 21 to the wiring board 10, the process of stacking the second electrode 25 and the separator 23 on the lead 40 may be performed. In order to reduce the manufacturing process time of the super capacitor 100, the two processes are performed together in parallel. In the present manufacturing method, an example in which the separator 23 is laminated on the second electrode 25 is disclosed. Alternatively, the separator 23 may be laminated on the first electrode 21.

Next, the lead 40 is bonded to the upper surface 12 of the wiring board 10 (S81). That is, the joining portion 43 of the lead 40 is joined to the lead joining pattern 17 of the wiring board 10 via the third joining member 35. At this time, the second electrode 25 and the separator 23 formed in the inner space 45 of the lead 40 are stacked on the first electrode 21 to form the cell 20.

Next, a resin molding 50 is formed by injecting a liquid molding resin so as to cover the lead 40 formed on the upper surface 12 of the wiring board 10 (S83). In this case, the resin encapsulation unit 50 may be formed by a half molding method or a potting method.

In addition, an individual supercapacitor 100 may be obtained by cutting the strip-shaped wiring board 10 with a cutter (S85). That is, the supercapacitor 100 according to the first embodiment is manufactured by cutting the strip-shaped wiring board 10 by the regions to which the leads 40 are bonded and separating them into individual supercapacitors 100. Alternatively, the wiring board 10 having a strip shape may be punched with a puncher for each region to which the leads 40 are bonded to be separated into individual supercapacitors 100.

Second Embodiment

Meanwhile, in the first embodiment, an example in which the resin encapsulation portion 50 is formed in a rectangular box shape is disclosed, but is not limited thereto. For example, as shown in FIG. 5, the resin encapsulation part 150 may be formed along the outer surface of the lead 140.

5 is a cross-sectional view illustrating a surface mount supercapacitor 200 according to a second embodiment of the present invention.

Referring to FIG. 5, the supercapacitor 200 according to the second embodiment is the same as the supercapacitor 100 according to the first embodiment except for the resin encapsulation part 150 formed in the lead 140. Therefore, the resin sealing unit 150 formed in the lead 140 will be described below.

The resin encapsulation unit 150 is formed to coat an outer surface of the lead 140. The resin encapsulation unit 150 may be formed by a coating method of applying a liquid molding resin to the lead 140. The resin encapsulation part 150 includes the joint part 143 of the lead 140 bonded to the lead bonding pattern 117 to secure the airtight reliability between the lead 140 and the wiring board 10. Is formed on the upper surface 112 of the wiring board 110 to cover the.

The resin encapsulation part 150 may be formed in an area inside the upper surface 112 of the wiring board 110. That is, the resin encapsulation part 150 may be formed on the upper surface 112 of the wiring board 110 inside the outer surface 111a of the wiring board 110. The reason for forming in this way is to suppress the mechanical stress acting on the portion where the resin sealing portion 150 and the lead 140 are joined in the process of manufacturing the super capacitor 200. That is, the supercapacitor 200 is manufactured by using a plurality of wiring board strips in a batch, and in particular, after completing the molding process, the wiring board strips are cut by a cutter or a puncher to separate the individual supercapacitors 200. . At this time, since the mechanical stress may act on the portion where the resin sealing portion 150 and the lead 140 are bonded in the process of cutting the wiring board strip by a cutter or a punching machine, in order to suppress such a mechanical stress from acting The wiring board strip may be cut at a predetermined interval from a portion where the resin encapsulation part 150 is formed. As a result, the resin encapsulation part 150 is formed in an area inside the upper surface 112 of the wiring board 110.

Third Embodiment

6 is a plan view illustrating a surface mount supercapacitor 300 according to a third exemplary embodiment of the present invention. 7 is a cross-sectional view taken along line 7-7 of FIG. In this case, the illustration of the resin encapsulation part 250 covering the lead 240 is omitted.

6 and 7, the supercapacitor 300 according to the third embodiment includes a wiring board 210, a cell 220, a lead 240, and a resin encapsulation part 250. In the shooter capacitor 300, the cell 220 is mounted on the upper surface 212 of the wiring board 210, the region in which the cell 220 is mounted is sealed with the lead 240, and then the lead 240 is again attached. It has a double sealing structure sealed with the resin sealing part 240.

In particular, the wiring substrate 210 may form a groove 216 at an interface with the resin encapsulation part 250. In this case, the groove 216 may be formed to have a ring shape surrounding the outside of the lead 240. The grooves 216 may be formed continuously or discontinuously. The groove 216 is formed to surround an outer portion of the lead bonding pattern 217. In the third embodiment, an example in which the grooves 216 are formed continuously is disclosed.

The reason why the groove 216 is formed in the upper surface 212 of the wiring board 210 is to increase the coupling force between the wiring board 210 and the resin encapsulation part 250, while the lead 240 and the wiring board 210 are formed. Even if a bonding failure occurs between the electrodes, the electrolyte impregnated in the cell 220 rides on the interface between the wiring board 210 and the lead 240 more effectively to prevent leakage. That is, when leakage occurs along the interface between the wiring board 210 and the lead 240, the leakage may again flow along the interface between the wiring board 210 and the resin encapsulation part 250. However, when the groove 216 is formed as in the third embodiment, since the bonding force between the wiring board 210 and the resin sealing unit 250 may be improved, leakage of leakage may be prevented from counting out of the resin sealing unit 250. . In addition, even if the leakage fluid moves along the interface between the wiring board 210 and the resin sealing portion 250, when the groove 216 is formed as in the third embodiment, the leakage fluid is made long by a path through which the leakage fluid can flow. Counting out of the suture 250 can be suppressed.

In addition, the groove 216 uses a molding resin filled in the groove 216 to perform a kind of lock function for firmly coupling the wiring board 210 and the resin encapsulation part 250, and more effectively the lock function. The inside may be formed wider than the inlet so that it can be carried out.

On the other hand, the embodiments disclosed in the specification and drawings are merely presented specific examples to aid understanding, and are not intended to limit the scope of the present invention. It will be apparent to those skilled in the art that other modifications based on the technical idea of the present invention are possible in addition to the embodiments disclosed herein.

10: wiring board 11: substrate body
12: upper surface 14: lower surface
13: Circuit wiring pattern 15: Electrode mounting area
17: lead bonding pattern 18: external connection pad
19: via hole 20: cell
21: first electrode 23: separator
25: second electrode 31: first bonding member
33: second bonding member 35: third bonding member
40: lid 41: lid portion
43: joint 50, 150: resin sealing
216: groove 100, 200, 300: super capacitor

Claims (14)

A wiring board having a lead bonding pattern formed around an electrode mounting region and the electrode mounting region on an upper surface thereof, and a plurality of external connection pads electrically connected to the electrode mounting region and the lead bonding pattern on a lower surface thereof, respectively;
A cell having a first electrode bonded to and electrically connected to an electrode mounting region of the wiring board, a separator formed on the first electrode, a second electrode formed on the separator, and an electrolyte impregnated in the first and second electrodes. ;
A lead covering a cell mounted on the wiring board, the inner surface of the wiring board being bonded to the second electrode and electrically connected, and an edge portion of the lead board connected to the lead bonding pattern of the wiring board;
A resin encapsulation portion formed on an upper surface of the wiring board and covering the lead with a liquid molding resin;
Surface-mount super capacitor, comprising a. The method of claim 1, wherein the resin sealing portion,
And a surface mount supercapacitor formed on an upper surface of the wiring board to include a junction portion of the lead bonded to the lead junction pattern. The method of claim 2, wherein the resin sealing portion
Surface mount type super capacitor, characterized in that the outer surface is located on the same surface as the outer surface of the wiring board. The method of claim 2, wherein the resin sealing portion
Surface mounted supercapacitor, characterized in that the outer surface is located inward than the outer surface of the wiring board. The method of claim 1, wherein the resin sealing portion,
A surface mounted super capacitor, which is formed by a half molding method or a coating method. The method of claim 1,
The molding resin forming the resin sealing portion comprises an epoxy resin. The method of claim 1, wherein the wiring board
And a pair of external connection pads formed on a lower surface thereof, wherein the pair of external connection pads have different lengths. The method of claim 1, wherein the wiring board,
And the lead junction pattern is formed in a ring shape surrounding an electrode mounting region. The method of claim 1, wherein the wiring board,
And a via hole penetrating through the electrode mounting region and the lead bonding pattern and the wiring board, respectively, to the plurality of external connection pads. The method of claim 1,
And a lead bonding pattern to which the leads are bonded from an electrode mounting region in which the first electrode is mounted is spaced apart from each other by a predetermined interval. The method of claim 1,
The wiring board has a surface-mounted super capacitor, characterized in that a groove filled with a liquid molding resin is formed around a region where the lead is joined. The method of claim 11, wherein the groove of the wiring board,
The surface-mounted super capacitor is formed in a ring shape around the region where the lead is bonded, the inner side is wider than the inlet of the groove. A wiring board having an upper surface and a lower surface opposite the upper surface;
A cell including a first electrode, a separator, a second electrode, and an electrolyte, wherein the first electrode is bonded to and electrically connected to an upper surface of the wiring board;
A lead bonded to and sealed by an upper surface of the wiring board to cover the cell, the lead electrically connecting the second electrode of the cell and the wiring board;
A resin encapsulation portion formed on an upper surface of the wiring board so as to cover the lead;
Surface-mount super capacitor, comprising a. The method of claim 13, wherein the wiring board,
A substrate body having an upper surface and a lower surface opposite the upper surface;
An electrode mounting region formed on an upper surface of the substrate body and to which the first electrode of the cell is bonded;
A lead bonding pattern formed around the electrode mounting region and to which the leads are bonded;
A plurality of external connection pads formed on a lower surface of the substrate body and electrically connected to the electrode mounting region and the lead bonding pattern, respectively;
Surface-mount super capacitor, comprising a.

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