KR101381225B1 - Probe apparatus for inspecting small electronic components - Google Patents

Probe apparatus for inspecting small electronic components Download PDF

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Publication number
KR101381225B1
KR101381225B1 KR1020130151299A KR20130151299A KR101381225B1 KR 101381225 B1 KR101381225 B1 KR 101381225B1 KR 1020130151299 A KR1020130151299 A KR 1020130151299A KR 20130151299 A KR20130151299 A KR 20130151299A KR 101381225 B1 KR101381225 B1 KR 101381225B1
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South Korea
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electronic component
terminals
jig
terminal
circuit board
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KR1020130151299A
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Korean (ko)
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심학보
김선호
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주식회사 한산테크
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G01R1/07328—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support for testing printed circuit boards
    • G01R1/07335—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support for testing printed circuit boards for double-sided contacting or for testing boards with surface-mounted devices (SMD's)
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2601—Apparatus or methods therefor

Abstract

The present invention relates to a probing apparatus for a small electronic component. The probing apparatus includes a terminal aligning means that may align terminals of a circuit board (PCB) to a testing jig even when the terminals are slightly misaligned from the mounting position while the electronic component is automatically mounted and soldered, thus enhancing test accuracy. Further, since the probes are brought in exact contact with the terminals, uneven wear and bending may be prevented. For such purpose, in the probing apparatus for testing a small electronic component according to the present invention, a circuit board having an electronic component soldered by a surface mounting technology (SMT) machine is placed on a portion of a jig means where the electronic substrate is supposed to be seated, and a rotating means hinge-coupled with the jig means is rotated along a circular arc, so that probes provided at the rotating means are brought in contact with the terminals of the electronic component, thus allowing the testing equipment to be circuitarily connected with the electronic component. The jig means includes a terminal aligning means that rotates through an auxiliary hinge part, so that it is overlapped between the jig means and the rotating means. The terminal aligning means includes terminal pores through which the terminals of the electronic component are inserted to allow the electronic component to be fixed to a predetermined position. Accordingly, the probes are vertically brought in contact with the terminals, respectively.

Description

소형 전자부품 검사용 프로브장치{Probe apparatus for inspecting small electronic components}Probe apparatus for inspecting small electronic components

본 발명은 소형 전자부품 검사용 프로브장치에 관한 것으로서, 더욱 상세하게는 표면실장기술(SMT) 머신에서 소형화된 전자부품을 회로기판(PCB)에 자동으로 실장하고 납땜하는 과정에서 단자들의 실장위치가 미세하게 틀어지더라도 검사용 지그에 회로기판의 단자들 위치를 잡아주는 단자정렬수단을 마련함으로써, 전자부품 검사의 정밀도가 향상되고, 또한 프로브들이 단자들과 정확하게 접촉되므로 프로브들의 편마모 및 휨불량이 발생되지 않는 소형 전자부품 검사용 프로브장치에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a probe device for inspecting a small electronic component, and more particularly, a mounting position of terminals in a process of automatically mounting and soldering a miniaturized electronic component on a circuit board (PCB) in a surface mount technology (SMT) machine. Providing terminal alignment means for positioning the terminals of the circuit board in the inspection jig even if the wire is twisted finely, the accuracy of electronic component inspection is improved, and the probes are brought into contact with the terminals precisely, so that the wear and bending of the probes are poor. The present invention relates to a probe device for inspecting a small electronic component that is not generated.

일반적으로 휴대폰이나 노트북 등에 사용되는 LCM(large core memory) 같은 소형 전자부품은 연성회로기판(Flexible Printed Circuit Board)에 장착된다. 이는 얇고 자유로운 굴곡성과 함께 무게가 매우 가볍기 때문에 전자기기의 협소한 공간에 효율적인 배열이 가능하여 전자제품의 경박단소화 및 디지털화에 따라 그 수요가 매년 급격히 증가하고 있다.In general, small electronic components such as large core memory (LCM), which are used in mobile phones and laptops, are mounted on flexible printed circuit boards. Since it is thin and freely bent and very light in weight, efficient arrangement is possible in a narrow space of electronic devices, and the demand is rapidly increasing every year according to the light and small size and digitalization of electronic products.

이러한 소형 전자부품은 표면실장기술(SMT) 머신에서 자동으로 납땜되는데, SMT 머신은 부품을 공급하는 부품공급기(Feeder)와, 부품을 흡착하는 진공흡착장치와, 상기 진공흡착장치를 상하, 좌우로 이동시키는 이동수단과, 상기 진공흡착장치와 이동수단을 통해 이동하는 부품의 위치 및 방향을 확인하고 체크한 후 교정하는 비젼(Vision)으로 이루어진다. 상기 부품공급기에는 테이프앤릴(tape-and-reel)이 사용되는데, 테이프앤릴은 부품을 정렬하여 진공흡착장치의 진공헤드가 부품을 정확하게 픽업할 수 있도록 해주는 부분이다. 진공픽업된 부품은 회로기판의 납땜위치에 정확하게 놓이고, 이후 리플로우(Reflow)납땜 장비에서 230℃ 내지 290℃에서 납땜된다.These small electronic components are automatically soldered by a surface mount technology (SMT) machine. The SMT machine has a component feeder for supplying components, a vacuum adsorption apparatus for adsorbing components, and the vacuum adsorption apparatus up, down, left, and right. It comprises a moving means for moving, and the vision (Vision) to check and check the position and direction of the components moving through the vacuum adsorption device and the moving means. A tape-and-reel is used for the component feeder, which is a portion that aligns the components so that the vacuum head of the vacuum adsorption unit picks up the components accurately. The vacuum picked up part is placed exactly at the soldering position of the circuit board and then soldered at 230 ° C. to 290 ° C. in a reflow soldering equipment.

이러한 소형 전자부품의 납땜과정에서 불량유무를 검사하기 위하여 프로브장치가 사용된다. 상기 프로브장치는 검사장비와 전자부품을 회로적으로 연결하여 검사에 필요한 각종 신호를 전달하기 위한 것으로서, 종래 공개특허 제10-2010-0011378호 및 국내특허 제1230447호에는 회로기판을 올려 고정하기 위한 지그수단 및 회로기판의 단자부와 접촉되는 프로브들이 구비된 회전수단이 힌지축으로 연결된 프로브장치가 제안된 바 있다.A probe device is used to check for defects in the soldering process of such small electronic components. The probe device is a circuit for connecting various inspection equipment and electronic components to transmit various signals necessary for inspection, and is conventionally disclosed in Korean Patent Laid-Open Publication Nos. 10-2010-0011378 and 1230447 for fixing a circuit board. There has been proposed a probe device in which a rotating means including a jig means and probes in contact with a terminal portion of a circuit board is connected by a hinge axis.

이들 종래의 기술들은 상기 회전수단이 지그수단에 대하여 힌지축을 기준으로 원호상으로 회전되면서 프로브들이 단자들과 접촉되어 검사장비와 전자부품을 회로적으로 연결하였다.These conventional techniques are connected to the test equipment and the electronic component by the probes in contact with the terminals while the rotating means is rotated in an arc shape about the hinge axis with respect to the jig means.

그러나 표면실장기술을 이용한 납땜과정에서 회로기판에 소형 전자부품이 정확하게 놓이지 않고 좌우측으로 미세하게 틀어져 납땜자리의 오차가 발생될 수 있다. 종래에는 납땜자리가 틀어진 상태의 회로기판이 상기 지그수단에 단순히 놓인 상태에서 별도의 고정수단 없이 회전수단의 하강으로 프로브들이 단자들과 접촉되기 때문에 정확한 위치의 접촉이 어려웠다. 즉 직경이 10 ~ 40㎛의 매우 작은 프로브들이 단자들과 정확한 위치에서 접촉되기 어려워서 프로브들의 편마모가 발생되고, 접촉불량으로 검사가 정확하게 이뤄지지 않는 등의 문제점이 있었다.However, in the soldering process using the surface mount technology, the small electronic components are not precisely placed on the circuit board, but are minutely twisted to the left and right, so that an error in the soldering spot may occur. Conventionally, since the probes are in contact with the terminals by the lowering of the rotating means without a separate fixing means in a state where the circuit board with the soldering position is simply placed on the jig means, the contact of the correct position is difficult. That is, very small probes having a diameter of 10 to 40 μm have difficulty in contacting the terminals at the correct positions, causing uneven wear of the probes, and poor inspection due to poor contact.

본 발명은 종래의 문제점을 감안하여 개발한 것으로서, 본 발명의 목적은 표면실장기술(SMT) 머신에서 소형화된 전자부품을 회로기판(PCB)에 자동으로 실장하고 납땜하는 과정에서 단자들의 실장위치가 미세하게 틀어지더라도 검사용 지그에 회로기판의 단자들 위치를 잡아주는 단자정렬수단을 마련함으로써, 전자부품 검사의 정밀도가 향상되고, 또한 프로브들이 단자들과 정확하게 접촉되므로 프로브들의 편마모 및 휨불량이 발생되지 않는 소형 전자부품 검사용 프로브장치를 제공함에 있다.The present invention was developed in view of the conventional problems, and an object of the present invention is to provide a mounting position of terminals in a process of automatically mounting and soldering a miniaturized electronic component on a circuit board (PCB) in a surface mount technology (SMT) machine. Providing terminal alignment means for positioning the terminals of the circuit board in the inspection jig even if the wire is twisted finely, the accuracy of electronic component inspection is improved, and the probes are brought into contact with the terminals precisely, so that the wear and bending of the probes are poor. The present invention provides a probe device for inspecting a small electronic component that does not occur.

이를 위하여 본 발명은 지그수단의 표면에 마련된 회로기판자리에 전자부품이 표면실장기술(SMT) 머신에 의해 납땜된 회로기판을 올려놓고 상기 지그수단과 힌지축으로 연결된 회전수단을 원호상으로 회전시켜, 상기 회전수단에 마련된 프로브들이 상기 전자부품의 단자들과 접촉되어 검사장비와 전자부품이 회로적으로 연결되는 소형 전자부품 검사용 프로브장치에 있어서, 상기 지그수단에는 보조힌지부를 통하여 회동되는 단자정렬수단을 마련하여 상기 지그수단과 상기 회전수단의 사이에서 포개지도록 하되, 상기 단자정렬수단에는 상기 전자부품의 단자들이 내주면에 끼워져 상기 전자부품이 위치고정되도록 하는 단자구멍을 구비하여 상기 프로브들과 단자들이 수직으로 일대일 접촉되도록 한 특징이 있다.To this end, the present invention is to place a circuit board soldered by the surface mount technology (SMT) machine to the circuit board provided on the surface of the jig means and to rotate the rotating means connected to the jig means and the hinge axis in an arc shape. In the probe device for inspecting a small electronic component in which the probes provided on the rotating means are in contact with the terminals of the electronic component and the inspection equipment and the electronic component are connected to each other, wherein the jig means is rotated through an auxiliary hinge part. Means are provided to overlap between the jig means and the rotating means, the terminal alignment means is provided with a terminal hole for the terminals of the electronic component is fitted into the inner circumferential surface to fix the position of the electronic component to the probes and the terminal Feature to have one-to-one contact vertically.

본 발명에 따르면 소형 전자부품이 납땜된 회로기판이 놓이는 지그수단에 전자부품의 단자들을 잡아주는 수단이 구비된다. 상기 단자들을 잡아주는 단자정렬수단은 단자들이 끼워지는 단자구멍을 갖는데, 단자구멍의 내주면으로 단자들의 측면이 접촉되어 단자들이 좌우측 및 전후측 방향으로 유동되지 않는다. 따라서 회로기판이 지그수단의 회로기판자리에 놓인 뒤 상기 단자정렬수단에 의해 단자들이 고정되므로 프로브블록의 프로브들이 단자들과 일대일 정확하게 대응되어 접촉된다.According to the present invention, a means for holding the terminals of the electronic component is provided in the jig means on which the circuit board on which the small electronic component is soldered is placed. The terminal aligning means for holding the terminals has a terminal hole into which the terminals are inserted, and the side surfaces of the terminals contact the inner circumferential surface of the terminal hole so that the terminals do not flow in left and right and front and rear directions. Therefore, since the terminal is fixed by the terminal aligning means after the circuit board is placed in place of the circuit board of the jig means, the probes of the probe block are in one-to-one correspondence with the terminals.

따라서 표면실장기술(SMT)머신에서 자동으로 납땜된 전자부품들의 단자들 위치가 좌우측으로 미세하게 틀어지더라도 프로브들과의 접촉불량이 발생되지 않으며 프로브들의 편마모가 감소되어 수명이 연장되고 장치의 신뢰성이 향상되는 등의 이점이 있다.Therefore, even if the positions of the terminals of the electronic components that are automatically soldered by the surface mount technology (SMT) machine are slightly misaligned to the left and right, contact failures with the probes are not generated and the wear and tear of the probes are reduced, thereby extending the life and reliability of the device. There are advantages such as being improved.

도 1은 본 발명 한 실시예의 프로브장치의 분리 사시도
도 2는 본 발명 한 실시예의 프로브장치의 조립 사시도
도 3은 본 발명 한 실시예의 단자정렬수단의 평면도
도 4는 본 발명 한 실시예의 단자정렬수단과 프로브블록의 결합 단면도1 is an exploded perspective view of a probe device of one embodiment of the present invention;
Figure 2 is an assembled perspective view of the probe device of one embodiment of the present invention
3 is a plan view of a terminal alignment means of an embodiment of the present invention;
4 is a cross-sectional view of the terminal alignment means and the probe block in accordance with an embodiment of the present invention;

도 1 내지 도 4에서 본 발명 한 실시예의 프로브장치는 회로기판(50)이 놓이는 회로기판자리(11)가 마련된 지그수단(10)이 구비된다. 회로기판자리(11)는 회로기판(50)이 놓이면 좌우측 및 전후측으로 미세하게 유동될 수 있는 간격을 가지면서 지그수단(10)의 표면에서 회로기판(50)의 외형과 동일하게 꺼진 형태이다. 그리고 지그수단(10)의 한쪽 끝단에는 회전수단(20)이 구비된다. 회전수단(20)과 지그수단(10)은 지그힌지부(12) 및 회전힌지부(21)들에 힌지축(22)이 결합되어 회전수단(20)이 지그수단(10)에 포개지게 회전되는 구성이다.1 to 4, the probe device of the embodiment of the present invention is provided with a jig means 10 provided with a circuit board seat 11 on which the circuit board 50 is placed. The circuit board seat 11 is shaped to be turned off in the same manner as the external shape of the circuit board 50 on the surface of the jig means 10 while having a space that can be minutely flowed to the left and right and front and rear sides when the circuit board 50 is placed. And one end of the jig means 10 is provided with a rotating means 20. The rotating means 20 and the jig means 10 are hinge shafts 22 coupled to the jig hinge portion 12 and the rotating hinge portions 21 so that the rotating means 20 is superimposed on the jig means 10. It is a configuration.

회전수단(20)에는 상기 회로기판자리(11)에 놓이는 회로기판(50)의 전자부품(51)과 대응되는 위치에 프로브블록(30)이 구비된다. 프로브블록(30)은 다수의 프로브(31)들이 전자부품(51)의 단자(52)들과 일대일 대응되는 위치에 구비되고, 프로브(31)들은 스프링(34)으로 승강되는 보호캡(32)의 안쪽으로 내장된다.The rotation means 20 is provided with a probe block 30 at a position corresponding to the electronic component 51 of the circuit board 50 placed on the circuit board seat 11. The probe block 30 is provided with a plurality of probes 31 at one-to-one correspondence with the terminals 52 of the electronic component 51, and the probes 31 are lifted with a spring 34 to protect the cap 32 It's built inward.

상기 지그수단(10)에는 상기 회전수단(20)과 직교되는 방향으로 여닫히는 단자정렬수단(40)이 구비된다. 상기 단자정렬수단(40)은 상기 회전수단(20)의 밑면으로 놓이는데, 지그수단(10)의 상기 회로기판자리(11) 후방 양쪽으로 구비된 보조힌지부(44)에 단자힌지부(41)가 회동가능하게 연결된다. 그리고 단자정렬수단(40)에는 상기 전자부품(51)의 단자(52)들이 끼워지는 단자구멍(43)을 갖는 지지판(42)이 구비되는데, 상기 지지판(42)은 상기 보호캡(32)의 하단을 받쳐준다. 미설명부호 13은 지그수단(10)에 마련된 고정레버, 23은 회전수단(20)에 마련되고 상기 고정레버(13)에 걸려 회전수단(20)을 지그수단(10)에 고정하는 걸림턱이다.The jig means 10 is provided with a terminal alignment means 40 which opens and closes in a direction orthogonal to the rotation means 20. The terminal aligning means 40 is placed on the bottom of the rotating means 20, the terminal hinge portion 41 to the auxiliary hinge portion 44 provided on both sides of the back of the circuit board seat 11 of the jig means 10. ) Is rotatably connected. In addition, the terminal aligning means 40 is provided with a supporting plate 42 having a terminal hole 43 into which the terminals 52 of the electronic component 51 are fitted. The supporting plate 42 is formed of the protective cap 32. Support the bottom. Reference numeral 13 is a fixing lever provided on the jig means 10, 23 is a locking jaw provided on the rotating means 20 and is caught by the fixing lever 13 to fix the rotating means 20 to the jig means 10. .

이처럼 구성된 본 발명 한 실시예의 프로브장치는 상기 단자정렬수단(40)이 지그수단(10)에 포개지면 단자구멍(43)들이 지그수단(10)의 회로기판자리(11) 위쪽으로 놓인다. 이때 단자구멍(43)들은 검사대상 전자부품(51)의 단자(52)들이 모두 끼워질 수 있도록 단자정렬수단(40)의 지지판(42)에 천공된다. 회로기판자리(11)에 검사대상 회로기판(50)을 올려놓고 단자정렬수단(40)을 회동시켜 지그수단(10)에 포개면 단자구멍(43)의 내주면으로 전자부품(51)의 단자(52)들 측면이 밀착된 상태로 끼워진다.In the probe device according to the embodiment of the present invention configured as described above, when the terminal alignment means 40 overlaps the jig means 10, the terminal holes 43 are placed on the circuit board seat 11 of the jig means 10. At this time, the terminal holes 43 are drilled in the support plate 42 of the terminal alignment means 40 so that all the terminals 52 of the electronic component 51 to be inspected can be fitted. The circuit board 50 to be inspected is placed on the circuit board seat 11, and the terminal alignment means 40 is rotated so that the inner peripheral surface of the terminal hole 43 overlaps with the jig means 10. 52) The sides are fitted in close contact.

단자구멍(43)으로 단자(52)들이 끼워지는 과정에서 회로기판(50)은 회로기판자리(11)에서 미세하게 움직이면서 자리를 잡는다. 이후 회전수단(20)을 닫아 지그수단(10) 및 단자정렬수단(40)에 포개면 도 4에서와 같이 프로브블록(30)의 보호캡(32) 끝단이 단자정렬수단(40)의 지지판(42)과 닿으면서 스프링(34)의 압축되는데, 이때 프로브블록(30)이 계속 하강하여 프로브(31)들이 단자(52)들과 일대일 접촉된다.In the process of inserting the terminals 52 into the terminal holes 43, the circuit board 50 is moved while being minutely moved in the circuit board seat 11. After the rotation means 20 is closed to the jig means 10 and the terminal alignment means 40, the end of the protective cap 32 of the probe block 30 as shown in Figure 4 the support plate of the terminal alignment means 40 ( While contacting 42, the spring 34 is compressed, at which time the probe block 30 continues to descend so that the probes 31 are in one-to-one contact with the terminals 52.

보호캡(32)의 하단은 단자(52)들을 감싸는 형태로 밑면에 단자수용공간(33)이 마련되는데, 이 단자수용공간(33)의 내주면에 단자(52)들의 측면이 닿지 않도록 해야 상기 지지판(42)의 단자구멍(43)들 내주면에 단자(52)들의 측면이 닿을 때 방해를 주지 않는다.The lower end of the protective cap 32 is provided with a terminal accommodating space 33 at the bottom in a form surrounding the terminals 52, and the side of the terminal 52 should not come into contact with the inner circumferential surface of the terminal accommodating space 33. The side surfaces of the terminals 52 do not interfere when the inner circumferential surfaces of the terminal holes 43 of the 42 come into contact with each other.

따라서 상기 지지판(42)의 단자구멍(43) 내주면에 단자(52)들이 밀착되어 전자부품(51)의 위치가 항상 일정하게 지그수단(10)에 고정되기 때문에 회전수단(20)을 회전시켜 지그수단(10)에 포개면 프로브(31)들이 단자(52)들과 정확한 위치에서 수직으로 접촉되므로 프로브(31)들의 편마모가 감소되고 접촉불량이 발생되지 않는다.Therefore, since the terminals 52 are in close contact with the inner circumferential surface of the terminal hole 43 of the support plate 42, and the position of the electronic component 51 is always fixed to the jig means 10, the jig rotates by rotating the rotation means 20. Since the probes 31 superimposed on the means 10 are in vertical contact with the terminals 52 at the correct position, uneven wear of the probes 31 is reduced and no contact failure occurs.

10 : 지그수단 11 : 회로기판자리
12 : 지그힌지부 20 : 회전수단
21 : 회전힌지부 22 : 힌지축
30 : 프로브블록 31 : 프로브
32 : 보호캡 40 : 단자정렬수단
41 : 단자힌지부 42 : 지지판
43 : 단자구멍 50 : 회로기판
51 : 전자부품 52 : 단자10: jig means 11: circuit board seat
12: jig hinge portion 20: rotation means
21: hinge hinge 22: hinge axis
30: probe block 31: probe
32: protective cap 40: terminal alignment means
41: terminal hinge portion 42: support plate
43: terminal hole 50: circuit board
51: electronic component 52: terminal

Claims (2)

삭제delete 지그수단의 표면에 마련된 회로기판자리에 전자부품이 표면실장기술(SMT) 머신에 의해 납땜된 회로기판을 올려놓고 상기 지그수단과 힌지축으로 연결된 회전수단을 원호상으로 회전시켜, 상기 회전수단에 마련된 프로브블록의 프로브들이 상기 전자부품의 단자들과 접촉되어 검사장비와 전자부품이 회로적으로 연결되도록 하되, 상기 지그수단에는 보조힌지부를 통하여 회동되는 단자정렬수단을 마련하여 상기 지그수단과 상기 회전수단의 사이에서 포개지도록 하고, 상기 단자정렬수단에는 상기 전자부품의 단자들이 내주면에 끼워져 상기 전자부품이 위치고정되도록 하는 단자구멍을 구비하여 상기 프로브들과 단자들이 수직으로 일대일 접촉되도록 한 소형 전자부품 검사용 프로브장치에 있어서,
상기 프로브블록에는 프로브들을 보호하는 보호캡이 승강가능하게 구비되고,
상기 단자정렬수단에는 상기 단자구멍이 형성되고 상기 보호캡의 밑면을 받쳐주는 지지판이 구비되며,
상기 보호캡의 밑면에는 상기 단자들과 간섭되지 않게 단자들을 수용하는 단자수용공간이 마련됨을 특징으로 하는 소형 전자부품 검사용 프로브장치.On the circuit board seat provided on the surface of the jig means, a circuit board soldered by a surface mount technology (SMT) machine is placed on the circuit board, and the rotating means connected to the hinge means by the jig means is rotated in an arc shape to the rotating means. Probes of the provided probe block are in contact with the terminals of the electronic component to be connected to the inspection equipment and the electronic component, but the jig means is provided with a terminal alignment means that is rotated through the auxiliary hinge to the jig means and the rotation A small electronic component arranged so as to overlap between the means, and the terminal alignment means having a terminal hole for inserting the terminals of the electronic component into the inner circumferential surface to fix the position of the electronic component. In the probe device for inspection,
The probe block is provided with a lifting cap to protect the probes,
The terminal aligning means is provided with a supporting plate for forming the terminal hole and supporting the bottom surface of the protective cap,
Probe apparatus for inspecting small electronic components, characterized in that the lower surface of the protective cap is provided with a terminal accommodating space for accommodating the terminals so as not to interfere with the terminals.
KR1020130151299A 2013-12-06 2013-12-06 Probe apparatus for inspecting small electronic components KR101381225B1 (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20080105557A (en) * 2007-05-31 2008-12-04 정영석 Socket for testing a camera module
KR20100011378A (en) * 2008-07-25 2010-02-03 삼성전기주식회사 Pogo pin jig for testing a camera module and test method therewith
KR101230447B1 (en) * 2012-11-19 2013-02-06 프라임텍 주식회사 Jig for testing camera module

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20080105557A (en) * 2007-05-31 2008-12-04 정영석 Socket for testing a camera module
KR20100011378A (en) * 2008-07-25 2010-02-03 삼성전기주식회사 Pogo pin jig for testing a camera module and test method therewith
KR101230447B1 (en) * 2012-11-19 2013-02-06 프라임텍 주식회사 Jig for testing camera module

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