KR101365996B1 - Method for evaluating degrading of flexible substrate structure - Google Patents

Abstract

The present invention provides an evaluation method for analyzing the deterioration characteristics of the flexible substrate structure under various conditions in one experiment. According to an aspect of the present invention, at least one surface of the flexible substrate structure having an object to be formed on the one side or the opposite side of the other surface, which is opposite to the one surface of the first plate and the second plate disposed so as to face each other; The second plate is reciprocally sliding in a direction parallel to the first plate, and a different stress mode is applied to each of a plurality of different regions of the flexible substrate structure while the second plate is reciprocally sliding; Includes, and at least one evaluation object is disposed in each of the plurality of different areas, there is provided a method for evaluating degradation characteristics of the flexible substrate structure.

Description

Method for evaluating deterioration characteristics of flexible substrate structure {Method for evaluating degrading of flexible substrate structure}

The present invention relates to a method for evaluating deterioration characteristics of a flexible substrate structure, and more particularly, to a method for evaluating the degree of deterioration of a flexible substrate structure subjected to repeated bending stress.

A flexible substrate is a substrate on which various components such as chips or passive components can be mounted. A flexible substrate is a substrate that can flexibly respond when the substrate needs to be moved or the substrate is bent to insert component components. It includes. Flexible substrates are also referred to as flexible substrates because they have a flexible flexibility. The flexible substrate may be manufactured using a polymer material, and may be classified into a single-sided substrate, a double-sided substrate, a multi-layered substrate, and the like according to the position and / or number of wiring circuit surfaces. Thin films for various functions may be formed on one surface of the flexible substrate. Furthermore, a plurality of active devices such as semiconductor chips and passive devices such as resistors and capacitors may be mounted as electronic devices.

The flexible substrate is flexibly deformed in response to a stress on the outside, and thus, the thin film or electronic elements formed on the flexible substrate also experience various stress states. For example, the flexible substrate is placed in an environment repeatedly subjected to bending stress, and thus the flexible substrate structure including the flexible substrate and the thin film and / or electronic elements formed thereon is subjected to various stresses. Therefore, it is essential to secure the reliability of the flexible substrate structure in advance to predict and test the properties of the thin film and / or electronic devices formed on the flexible substrate under such repeated bending stress, for example, the degradation characteristic.

However, the conventional method of analyzing the deterioration characteristics of the flexible substrate structure is time-consuming to analyze the deterioration characteristics of the stress of various conditions because only one stress is provided while bending the flexible substrate in opposite directions. The problem is that the cost of analysis increases.

Accordingly, the present invention has been made to solve the above problems, and provides an apparatus and method capable of analyzing the deterioration characteristics of the flexible substrate structure under various conditions in one experiment. This problem of the present invention has been presented by way of example, and therefore, the present invention is not limited to this problem.

 According to an aspect of the present invention, at least one surface of the flexible substrate structure having an object to be formed on the one side or the opposite side of the other surface, which is opposite to the one surface of the first plate and the second plate disposed so as to face each other; The second plate is reciprocally sliding in a direction parallel to the first plate, and a different stress mode is applied to each of a plurality of different regions of the flexible substrate structure while the second plate is reciprocally sliding; Includes, and at least one evaluation object is disposed in each of the plurality of different areas, there is provided a method for evaluating degradation characteristics of the flexible substrate structure.

In this case, the step of applying the different stress mode, the first stress mode applying step of continuously applying the stress to the first region of the flexible substrate structure; Applying a second stress mode in which stress is discontinuously applied to the second region of the flexible substrate structure disposed on both sides adjacent to the first region; And a third stress in which the stress is not continuously applied to the third region of the flexible substrate structure disposed opposite to the first region and adjacent to the second region during the reciprocating sliding movement of the second plate. It may include a mode applying step.

The first region of the flexible substrate structure may include a region that is bent while the second plate is reciprocally sliding, and thus keeps the pinched state.

The second region of the flexible substrate structure may include a region in which the flat state is alternately bent without being bent and bent while the second plate is reciprocally sliding.

The third region of the flexible substrate structure may include a region that is not bent and continues to be flat while the second plate is reciprocally sliding.

The third region of the flexible substrate structure may include an area in continuous contact with the first plate or the second plate while the second plate is reciprocally sliding.

Meanwhile, the reciprocating sliding movement of the second plate in a direction parallel to the first plate may include the reciprocating period movement of the second plate with a constant amplitude with respect to the first plate.

In addition, the step of reciprocating sliding the second plate in a direction parallel to the first plate, the step of reciprocating sliding the second plate in a direction parallel to the first plate while maintaining the first plate fixed state It may include.

Also, the reciprocating sliding movement of the second plate in a direction parallel to the first plate may include the reciprocating sliding movement of the second plate relative to the first plate in a direction parallel to the first plate. Can be.

Meanwhile, the evaluation object may include a thin film, an active device, a passive device, a metal wiring, or a solar cell formed on at least one surface of the flexible substrate.

Meanwhile, the reciprocating sliding movement of the second plate in a direction parallel to the first plate may be performed in a predetermined atmosphere, and the predetermined atmosphere may include a high temperature atmosphere, a high humidity atmosphere, and a light irradiation atmosphere by an external light source. .

After the step of reciprocating sliding the second plate in a direction parallel to the first plate is completed, the step of evaluating the characteristics of the evaluation object disposed in the plurality of different areas.

Alternatively, the method may further include evaluating characteristics of evaluation objects disposed in the plurality of different regions during the reciprocating sliding movement of the second plate in a direction parallel to the first plate.

According to one embodiment of the present invention made as described above, it is possible to provide an apparatus and method capable of analyzing the deterioration characteristics of the flexible substrate structure under repeated bending stress in one experiment.

1 is a cross-sectional view illustrating a deterioration characteristic evaluation apparatus of a flexible substrate structure according to an embodiment of the present invention.
2 is a conceptual diagram illustrating a method for evaluating deterioration characteristics of a flexible substrate structure according to another embodiment of the present invention.
3 to 5 are graphs illustrating strains of respective regions of the flexible substrate structure on which the deterioration characteristic evaluation method according to another embodiment of the present invention is performed.
6 to 8 are scanning electron micrographs of the respective regions of the flexible substrate structure for performing the degradation characteristic evaluation method according to another embodiment of the present invention.
9 are graphs and scanning electron micrographs illustrating the deterioration characteristics of a flexible substrate structure according to the number of cycles (cycles) of reciprocating periodic motions in the deterioration characteristics evaluation method according to another embodiment of the present invention.
10 is a graph illustrating the deterioration characteristics of the flexible substrate structure according to the sliding distance of the reciprocating cycle motion in the deterioration characteristics evaluation method according to another embodiment of the present invention.
11 is a graph illustrating the deterioration characteristics of the flexible substrate structure according to the strain of the reciprocating cycle motion in the deterioration characteristics evaluation method according to another embodiment of the present invention.
12 is a plan view of a flexible substrate structure in which an electronic device is disposed in a deterioration characteristic evaluation method according to another embodiment of the present invention.

Hereinafter, the present invention will be described in detail with reference to the preferred embodiments of the present invention with reference to the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but will be implemented in various forms, and only the present embodiments are intended to complete the disclosure of the present invention and to those skilled in the art to fully understand the scope of the invention. It is provided to inform you. In the drawings, the components may be exaggerated or reduced in size for convenience of explanation.

Terms such as " top "or" bottom "referred to in the description of the present embodiment can be used to describe the relative relationship of certain elements to other elements as illustrated in the figures. That is, relative terms may be understood to include different directions of the structure apart from the directions depicted in the figures. For example, if the top and bottom of the structure are inverted in the figures, the elements depicted as being on the top surface of the other elements will have a direction on the bottom surface of the other elements. The term "topsheet " as used herein, therefore, may include both" top "and" bottom "directions, depending on the particular orientation of the figures.

Further, in the process of describing the present embodiment, when it is mentioned that an element is located on another element, or is "electrically connected" to another element, Directly or (directly) electrically connected to the other component, but may also mean that one or more intervening components may be present therebetween. However, when an element is referred to as being "directly on" another element, "directly (electrically) connected" to another element, or "directly in contact" with another element, If there is no, it means that there are no intervening components in between.

In the following embodiments, the x-axis, the y-axis, and the z-axis are not limited to three axes on the orthogonal coordinate system, and can be interpreted in a broad sense including the three axes. For example, the x-axis, y-axis, and z-axis may be orthogonal to each other, but may refer to different directions that are not orthogonal to each other.

On the other hand, the flexible substrate structure is defined as including both the flexible substrate and the thin film, metal wiring, electronic devices formed to perform a specific function on the flexible substrate.

 In the present specification and claims, the thin film or the electronic device formed on the flexible substrate is an object to which the degree of deterioration of characteristics under repeated bending stress is evaluated, and all of them may be called evaluation objects.

For example, an electronic device as an evaluation object includes a device that is operated by an electrical signal such as a semiconductor device or a solar cell. As an example, the semiconductor device may include an active device such as a transistor or a passive device such as a resistor or a capacitor. In addition, the solar cell may include all the thin-film solar cells formed on one surface of the flexible substrate. However, this is exemplary, and of course, the subject of evaluation of the present invention is not limited thereto.

When a certain type of stress is applied to the evaluation object formed on the flexible substrate, deterioration of characteristics may occur. In the case of the thin film as an aspect of such deterioration, it may exhibit a phenomenon that the thin film falls from the flexible substrate due to the deterioration of adhesion. In the case where the object to be evaluated is an electronic device, there may be a case in which the electrical characteristics may deteriorate rapidly or the device may become inoperable. Particularly under repeated bending stresses, fatigue failure may occur due to crack generation and propagation.

On the other hand, the flexible substrate is a substrate on which the above-described evaluation object can be mounted, and includes a substrate that can flexibly respond when the substrate is to be moved or the substrate is bent to insert the electronic device. The flexible substrate may include, for example, a polymer material.

1 is a cross-sectional view illustrating an apparatus for evaluating deterioration characteristics of a flexible substrate structure usable for evaluating deterioration characteristics of a flexible substrate structure according to an embodiment of the present invention.

Referring to FIG. 1, the apparatus for evaluating deterioration characteristics of a flexible substrate structure includes a first plate 22 and a second plate 24 disposed to face each other at a predetermined distance d. The second plate 24 is capable of reciprocating sliding movement with respect to the first plate 22. For example, while the first plate 22 is fixed, the second plate 24 may move in the + x direction and then move back and forth in the − x direction. Of course, even when the first plate 22 moves, the second plate 24 moves relatively more relative to the first plate 22, thereby reciprocating the second plate 24 with respect to the first plate 22. Sliding movements can also be implemented. This reciprocating sliding movement may include a reciprocating periodic movement having a constant amplitude.

The flexible substrate structure 12 may be disposed between the first plate 22 and the second plate 24. In the present exemplary embodiment, the flexible substrate structure 12 may include the flexible substrate 14 and the thin film 16 formed on one surface of the flexible substrate 14 as an evaluation object.

The thin film 16 on the flexible substrate 14 may be formed on the flexible substrate 14 by coating, plating, physical vapor deposition (PVD), chemical vapor deposition (CVD) or atomic layer deposition (ALD). have. The thin film 16 on the flexible substrate 14 may include, for example, a copper thin film. In addition, the thin film 16 on the flexible substrate 14 may be composed of not only a single layer but also multiple layers.

One side on one side of the flexible substrate structure 12 may be coupled to the first plate 22, and the other side on the one side of the flexible substrate structure 12 may be coupled to the second plate 24. The one surface of the flexible substrate structure 12 coupled to the first plate 22 and the second plate 24 may be an upper surface of the thin film 16 on the flexible substrate 14. Coupling herein refers to any configuration in which the flexible substrate structure 12 is physically, chemically, structurally, mechanically reacted, adhered, adhered, adhered, supported, or fixed with the first plate 22 or the second plate 24. It can contain everything. The area and / or width of each of the two sides on one surface of the flexible substrate structure 12 in engagement with the first plate 22 or the second plate 24 is the amplitude of the reciprocating sliding motion of the second plate 24, the plates. (22, 24) can be determined in consideration of the separation distance and the like.

The first plate 22 and the second plate 24 may be arranged so that a portion of the flexible substrate structure 12 is bent therebetween to maintain the pinched state. The second plate 24 may be configured to be capable of reciprocating periodic motion with a constant amplitude in the direction parallel to the first plate 22 (in the ± x direction in FIG. 1). A part of the flexible substrate structure 12 is bent between the plates 22 and 24, so that the second plate 24 reciprocates sliding in the direction parallel to the first plate 22 while maintaining the state of the flexible substrate. The structure 12 may be divided into a region where the stress is continuously applied, a region where the stress is discontinuously applied, and a region where the stress is not continuously applied. Therefore, according to the apparatus for evaluating deterioration characteristics of a flexible substrate structure according to an embodiment of the present invention, an advantageous effect of evaluating the deterioration characteristics of the flexible substrate structure 12 to which stresses of various conditions are applied in one experiment can be expected. .

The apparatus for evaluating deterioration characteristics of the flexible substrate structure may further include a measuring unit 26 connected to each of the first plate 22 and the second plate 24 to measure electrical resistance of the flexible substrate structure 12. Can be. Fatigue-prone flexible substrate structure 12, for example, thin film 16 on flexible substrate 14, may generate cracks therein such that the electrical resistance of thin film 16 may change. Therefore, by measuring the electrical resistance of the flexible substrate structure 12, the deterioration characteristics of the flexible substrate structure 12 can be indirectly evaluated.

Hereinafter, a method for evaluating deterioration characteristics of a flexible substrate structure according to another embodiment of the present invention will be described. Degradation characteristics evaluation method of the flexible substrate structure according to another embodiment of the present invention can be implemented using the degradation characteristics evaluation apparatus of the flexible substrate structure according to an embodiment of the present invention described above, but the description will be mainly focused on this, The technical idea is not limited thereto.

2 is a conceptual diagram illustrating a method for evaluating deterioration characteristics of a flexible substrate structure according to an embodiment of the present invention. Since the description of the first plate 22, the second plate 24, and the flexible substrate structure 12 is the same as the region described with reference to FIG. 1, overlapping regions are omitted.

Referring to FIG. 2, in the method for evaluating deterioration characteristics of a flexible substrate structure according to an exemplary embodiment of the present invention, a flexible substrate structure 12 may be prepared by preparing a first plate 22 and a second plate 24 facing each other apart from each other. In the first step of preparing a), both sides of one side of the flexible substrate structure 12 are respectively attached to the first plate 22 and the second plate 24 while maintaining a state where a part of the flexible substrate structure 12 is bent. To engage, the second plate 24 reciprocally slides in a direction parallel to the first plate 22 and a second step of placing the flexible substrate structure 12 between the first plate 22 and the second plate 24. A third step of moving.

The reciprocating sliding movement of the second plate 24 in a direction parallel to the first plate 22 may include the reciprocating periodic movement of the second plate 24 with a constant amplitude with respect to the first plate 22. Can be. For example, when the second plate 24 has a constant amplitude and reciprocating cycle with respect to the first plate 22, the flexible substrate structure 12 disposed between the first plate 22 and the second plate 24. ) Alternately repeats the state shown in (a) of FIG. 2 and the state shown in (b) a plurality of times (for example, (a) → (b) → (a) → (b) (a) → (b) → (a) → (b) ...)

The reciprocating sliding movement of the second plate 24 in the direction parallel to the first plate 22 may be performed by maintaining the fixed state of the first plate 22 in the direction parallel to the first plate 22. 24 may comprise a reciprocating sliding movement. In a modified embodiment, the step of reciprocating sliding the second plate 24 in a direction parallel to the first plate 22 may be achieved by the second plate 24 being moved by the first plate 22 even if the first plate 22 is moved. By moving more relative relative to), the second plate 24 may comprise a reciprocating sliding movement relative to the first plate 22.

The flexible substrate structure 12 may have a different stress mode applied to each of a plurality of different regions while the second plate 24 reciprocally slides in a direction parallel to the first plate 22. have. Here, the stress mode refers to a form of stress that is repeatedly applied in a specific region of the flexible substrate structure 12 during the reciprocating sliding movement of the second plate 24.

In the present exemplary embodiment, the flexible substrate structure 12 may have a plurality of regions in which different stress modes appear while the second plate 24 is reciprocally sliding.

For example, it may include a first region 16c that is bent to maintain a bent state while repeatedly alternating the state shown in (a) of FIG. 2 and the state shown in (b) a plurality of times. Can be.

Further, the flexible substrate structure 12 is in the state shown in (a) and (b) of FIG. 2 during the reciprocating sliding movement of the second plate 24 in the direction parallel to the first plate 22. While repeatedly alternating the illustrated state a plurality of times, it may include the third regions 16a and 16e to maintain the flat state without bending.

Furthermore, the flexible substrate structure 12 is in the state shown in (a) and (b) of FIG. 2 during the reciprocating sliding movement of the second plate 24 in the direction parallel to the first plate 22. While repeatedly alternating the illustrated state a plurality of times, it may include a second region (16b, 16d) is bent and bent state and the flat state alternates.

The second regions 16b and 16d of the flexible substrate structure 12 may be disposed between the first region 16c and the third regions 16a and 16e and may be disposed on both sides adjacent to the first region 16c. . The third regions 16a and 16e of the flexible substrate structure 12 are disposed outwardly adjacent to the first regions 16c and adjacent to the second regions 16b and 16d with respect to the second regions 16b and 16d. Can be.

The third regions 16a and 16e of the flexible substrate structure 12 are either the first plate 22 or the second plate while the second plate 24 reciprocally slides in a direction parallel to the first plate 22. And an area in continuous contact with 24. As described above, different stress modes may be applied to the plurality of different regions.

3 to 5 are graphs illustrating strains of respective regions of the flexible substrate structure on which the degradation characteristic evaluation method according to the embodiment of the present invention is performed. 6 to 8 are scanning electron micrographs of respective regions of the flexible substrate structure on which the deterioration characteristic evaluation method according to another embodiment of the present invention is performed.

2, 3, and 6, the second region 16b of the flexible substrate structure 12 having the deterioration characteristic evaluation method according to another embodiment of the present invention is illustrated in FIG. 2A. While the state shown in (a) of FIG. 2 and the state shown in (b) are alternately repeated a plurality of times with the initial state as the initial state, the stress is discontinuously applied and has a constant value k. Strain also appears discontinuously and repeatedly. This is called the second stress mode. In this case, fatigue damage due to the application of repeated bending stresses appears in the second region 16b of the flexible substrate structure 12.

2, 4, and 7, the first region 16c of the flexible substrate structure 12 having the deterioration characteristic evaluation method according to another embodiment of the present invention is illustrated in FIG. 2A. During the alternating state of the state shown in (a) of FIG. 2 and the state shown in (b) a plurality of times with the initial state as the initial state, since the stress is continuously applied continuously, a strain having a constant value k strain) also appear continuously. This is called the first stress mode. In this case, in the first region 16c of the flexible substrate structure 12, there is no deterioration in characteristics due to the continuous application of a constant load due to repeated bending stress. However, deterioration of the characteristics may occur as a constant load is applied.

2, 5, and 8, the second region 16d of the flexible substrate structure 12 having the deterioration characteristic evaluation method according to another embodiment of the present invention is illustrated in FIG. 2A. Strain having a constant value k because stress is discontinuously applied while repeatedly alternating the state shown in FIG. 2A and the state shown in FIG. 2B with the state set as an initial state. The strain also appears discontinuously and repeatedly. In this case, fatigue damage due to the application of repeated bending stresses appears in the second region 16d of the flexible substrate structure 12.

Meanwhile, referring to FIG. 2, the third regions 16a and 16e of the flexible substrate structure 12 having the deterioration characteristic evaluation method according to another exemplary embodiment of the present invention are shown in FIG. 2A. In the initial state, while the state shown in (a) of FIG. 2 and the state shown in (b) are alternately repeated a plurality of times, the stress is not continuously applied, so that the strain remains at zero (0). The value appears. This is called the third stress mode. In this case, since constant stress is continuously applied in the third regions 16a and 16e of the flexible substrate structure 12, fatigue damage due to deterioration of other characteristics or application of repeated bending stresses does not appear.

9 are graphs and scanning electron micrographs illustrating the deterioration characteristics of a flexible substrate structure according to the number of cycles (cycles) of reciprocating periodic motions in the deterioration characteristics evaluation method according to another embodiment of the present invention. Referring to FIG. 9, cracking does not occur until the number of cycles (cycles) of reciprocating cycles reaches a predetermined threshold value, but the occurrence of crack propagation above the threshold value is exponential. To increase. As a result, the resistance R / R0 of the thin film is rapidly increased. R ₀ is a thin film resistance before evaluation, and R is a thin film resistance after evaluation.

10 is a graph illustrating deterioration characteristics of the flexible substrate structure according to the sliding distance of the second plate 24 during the reciprocating period movement in the deterioration characteristics evaluation method according to another embodiment of the present invention. Referring to FIG. 10, the larger the sliding distance, the smaller the number of cycles (cycles) of reciprocating periodic motions in which a crack occurs. This is judged as the size of the second regions 16b and 16d subjected to repeated bending stress increases.

11 is a graph illustrating the deterioration characteristics of the flexible substrate structure according to the strain of the reciprocating cycle motion in the deterioration characteristics evaluation method according to another embodiment of the present invention. Referring to FIG. 11, the larger the strain of the reciprocating periodic motion, the smaller the number of cycles (cycles) of the reciprocating periodic motion that a crack occurs.

In the embodiments described so far, the flexible substrate structure 12 may be applied to the structure including the flexible substrate 14 and the thin film 16 on the flexible substrate 14, but the technical spirit of the present invention is not limited thereto.

12 is a plan view of a flexible substrate structure in which an electronic device is disposed in a deterioration characteristic evaluation method according to another embodiment of the present invention. Referring to FIG. 12, in the modified embodiment of the present invention, the flexible substrate structure 12 to which the deterioration characteristic evaluation apparatus and the evaluation method may be applied may include a flexible substrate 14, a thin film 16 on the flexible substrate 14, and a thin film. And an electronic device thin film transistor 34 disposed on 16. In this case, the flexible substrate structure 12 may further include a wiring circuit and a pad part 32 connected to the thin film transistor 34.

The thin film transistor 34 may be disposed on the first regions 16c, the second regions 16b and 16d, and the third regions 16a and 16e of the flexible substrate structure, respectively. Therefore, when the flexible substrate structure 12 is tested using the above-described method, the thin film transistors 34 disposed in the first to third regions 16c, 16b, 16d, 16a, and 16e may have the first stress mode or the like. It is under the third stress mode.

In this case, by performing the test for a predetermined time and evaluating the electrical characteristics of the thin film transistors 34 disposed in each region, it is possible to evaluate the deterioration of the characteristics of the thin film transistors 34 under three different stress modes by one test. have. For example, the gate threshold voltage, the contact resistance, or the dielectric breakdown voltage of the gate insulating film of the thin film transistor 34 can be compared with each other.

 In this case, since the thin film transistors disposed in the third regions 16a and 16b are not subjected to repeated bending stresses or constant continuous stresses, normal operation is expected. The electrical characteristics measured by the thin film transistors are referred to as reference values. Can be assumed. Therefore, based on this, the electrical characteristics of the thin film transistors disposed in the second regions 16b and 16d and the third regions 16a and 16e are measured and compared with each other, so that when a constant stress is applied and a repetitive bending stress is applied. It is possible to evaluate the deterioration pattern of the thin film transistor at the time.

Meanwhile, as a modified embodiment, the degree of degradation of the thin film transistor may be evaluated in real time by monitoring the electrical properties of the thin film transistor in-situ during the test process by using the measuring unit 26 of the degradation characteristic evaluation device of the flexible substrate structure. Can be.

In the above embodiment, the evaluation method in the air under normal room temperature has been described. As a modified embodiment, it is also possible to create a specific atmosphere in order to accelerate the evaluation result or to evaluate deterioration characteristics in a specific atmosphere. For example, an external heat source may be used to create a high temperature atmosphere, or water vapor may be supplied to provide a high humidity atmosphere. As another example, an external light source may be installed to provide a light irradiation atmosphere.

The foregoing description of specific embodiments of the invention has been presented for purposes of illustration and description. It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit and scope of the invention as defined by the appended claims. Do.

22: first plate
24: second plate
12: flexible substrate structure
14: flexible substrate
16: thin film

Claims (14)

Coupling both side portions of the one surface of the flexible substrate structure having at least one surface to which the evaluation object is formed or opposite surfaces of the other surface to the first plate and the second plate disposed to face each other;
The second plate is reciprocally sliding in a direction parallel to the first plate, and a different stress mode is applied to each of a plurality of different regions of the flexible substrate structure while the second plate is reciprocally sliding; Include,
At least one evaluation object is disposed in each of the plurality of different regions,
The step of applying the different stress mode,
Applying a first stress mode in which stress is continuously applied to the first region of the flexible substrate structure;
Applying a second stress mode in which stress is discontinuously applied to the second region of the flexible substrate structure disposed on both sides adjacent to the first region; And
A third stress mode during which the second plate is reciprocally sliding, in which stress is not continuously applied to the third region of the flexible substrate structure disposed opposite to the first region and disposed outwardly adjacent the second region Applying step;
Lt; / RTI >
The first region of the flexible substrate structure includes a region that is bent and continues to be in a rest state while the second plate is reciprocally sliding,
The second region of the flexible substrate structure includes a region in which the flat state is alternately bent without being bent and bent while the second plate is reciprocally sliding,
The third region of the flexible substrate structure includes a region that is maintained while being flat without being bent while the second plate is reciprocally sliding,
Degradation characteristics of the flexible substrate structure comparing the measurement characteristics of the evaluation object disposed in the first region or the measurement characteristics of the evaluation object disposed in the second region based on the measurement characteristics of the evaluation object disposed in the third region. Assessment Methods. delete delete delete delete The method of claim 1,
And the third region of the flexible substrate structure includes a region in continuous contact with the first plate or the second plate while the second plate is reciprocally sliding. The method of claim 1,
The reciprocating sliding movement of the second plate in a direction parallel to the first plate,
And the second plate reciprocating cyclically having a constant amplitude with respect to the first plate. The method of claim 1,
The reciprocating sliding movement of the second plate in a direction parallel to the first plate,
And the second plate reciprocally sliding in a direction parallel to the first plate while maintaining the fixed state of the first plate. The method of claim 1,
The reciprocating sliding movement of the second plate in a direction parallel to the first plate,
And reciprocating sliding the second plate relative to the first plate in a direction parallel to the first plate. The method of claim 1,
The evaluation target object includes a thin film formed on at least one surface of the flexible substrate, an active device, a passive device, a metal wiring, or a solar cell, deterioration characteristics evaluation method of a flexible substrate structure. The method of claim 1,
A method for evaluating deterioration characteristics of a flexible substrate structure, wherein the reciprocating sliding movement of the second plate in a direction parallel to the first plate is performed in a predetermined atmosphere. delete The method of claim 1,
Evaluating deterioration characteristics of the flexible substrate structure after the step of reciprocating sliding the second plate in a direction parallel to the first plate is completed, evaluating characteristics of evaluation objects disposed in the plurality of different regions. Way. The method of claim 1,
And evaluating characteristics of evaluation objects disposed in the plurality of different regions during the reciprocating sliding movement of the second plate in a direction parallel to the first plate.

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