KR101350746B1 - Conductive adhesive composition and conductive film using the same - Google Patents

Abstract

상기 식에서, n은 1 내지 100인 정수이고, m은 10 내지 1000인 정수이며, a는 1 내지 8인 정수이고, R은 도전성 고분자의 단량체이며, R¹은 탄소수 1 내지 10의 포화 또는 불포화 탄화수소 치환기이고, R², R³는 각각 독립적으로 -H 또는 -CH₃이다.
본 발명의 점착제 조성물을 이용하는 경우 폴리에스테르 필름에 도전성 고분자의 단량체를 치환체로 가지는 아크릴 단량체와 점착 특성을 부여하기 위한 단량체와의 공중합체를 얻은 후, 공중합체 측쇄에 달려 있는 도전성 고분자의 단량체를 커플링 반응시켜 도전성을 가지는 점착제 막을 형성하기 때문에, 도전성 고분자를 점착제내 분산시키는 공정이나 분산제 등의 추가첨가제의 투입 없이도 우수한 대전방지 기능을 발현하는 것이 가능하다.In the present invention, (a) 90 to 99.9 wt% of the (meth) acrylic monomer and 0.1 to 10 wt% of the acrylic monomer having a monomer of the conductive polymer as a substituent are copolymerized to 100 parts by weight of the acrylic copolymer represented by the following formula (1). ; (c) 0.01 to 10 parts by weight of a curing agent; And (d) 0.01 to 5 parts by weight of an oxidizing agent.
[Chemical Formula 1]

Wherein n is an integer of 1 to 100, m is an integer of 10 to 1000, a is an integer of 1 to 8, R is a monomer of a conductive polymer, and R ¹ is saturated of 1 to 10 carbon atoms Or an unsaturated hydrocarbon substituent, R ² , R ³ are each independently -H or -CH ₃ .
In the case of using the pressure-sensitive adhesive composition of the present invention, after obtaining a copolymer of an acrylic monomer having a monomer of a conductive polymer as a substituent on a polyester film and a monomer for imparting adhesive properties, the monomer of the conductive polymer depending on the side chain of the copolymer is coupled. Since an adhesive film having a conductivity is formed by ring reaction, it is possible to express excellent antistatic function without the step of dispersing the conductive polymer in the adhesive or adding an additional additive such as a dispersant.

Description

Conductive adhesive composition and conductive film using the same {CONDUCTIVE ADHESIVE COMPOSITION AND CONDUCTIVE FILM USING THE SAME}

The present invention relates to a conductive pressure-sensitive adhesive composition and a conductive film using the same, and more particularly, by using an acrylic monomer having a monomer of the conductive polymer as a substituent as a part of the copolymerization monomer in the manufacturing process of the pressure-sensitive adhesive copolymer, The present invention relates to a new conductive adhesive composition having an antistatic function and a conductive film using the same without undergoing a process of being dispersed in the adhesive.

A surface protective film is generally used for the purpose of preventing the wound and the dirt which arises at the time of processing and conveying a to-be-adhered body by using the adhesive layer apply | coated on the protective film side, ie, a to-be-adhered body.

Liquid crystal displays used in various applications are used with various optical films to realize their characteristics, and since the liquid crystal display products are treated as defects even in the minute damages and defects of such optical films, contamination and damage that may occur during manufacturing or distribution processes In order to prevent this, an adhesive film for surface protection is attached to the surface of the optical film and is strictly managed in the manufacturing process and distribution process.

In the polarizing plate used in the liquid crystal display panel, the surface attached to the pressure-sensitive adhesive layer of the surface protection film is protected by the surface protection film, and is subsequently peeled off and removed in the inspection process. At this time, since the protective film and the adhesive which comprise a surface protection film are comprised by the plastic material, electrical insulation is high and static electricity generate | occur | produces at the time of friction and peeling. At this time, if foreign matter is deposited on the surface by static electricity generated or voltage is applied to the liquid crystal in the state of static electricity remaining, the orientation of the liquid crystal molecules is lost and defects are caused because the panel is defective. In order to prevent such a phenomenon, various antistatic agents are used in the surface protection film.

The conductive polymer recently developed by Bayer has a low bandgap (1.6 to 1.7 eV) and has high transparency. Recently, polystyrene sulfonate (PSS) is used as the dopant and EDOT (3). , 4-ethylenedioxythiophene: 3,4-ethylenedioxythiopene) was polymerized in an aqueous solution to prepare PEDOT (3,4-polyethyldioxythiophene: 3,4-polyethyldioxythiopene) in the form of an aqueous solution, thereby providing transparency, electrical conductivity, and thermal stability. It shows the improvement of processability and dispersibility, and it is supplied under the product name of Baytron (P, PH, PAG) which is dispersed in a solvent such as water. There is an example in which such a PEDOT dispersion is dispersed in an adhesive to impart an antistatic function. However, in order to disperse the PEDOT polymerized in the aqueous solution into the adhesive, the use of other dispersants is necessary, and time and cost are involved. The use of a dispersant may have an effect such as a decrease in adhesive force, and may also lower the antistatic function due to a decrease in conductivity.

The present invention has been made to solve the above problems and to meet the above demands, and after obtaining a copolymer of an acrylic monomer having a monomer of the conductive polymer as a substituent and a monomer for imparting adhesive properties, Coupling reaction of the monomer of the conductive polymer to form a conductive adhesive film, it is not necessary to disperse the conductive polymer in the adhesive. The present invention was completed by confirming that an excellent antistatic function can be expressed as a result of coating and applying a pressure-sensitive adhesive on a polyester film.

An object of the present invention is to provide a new conductive pressure-sensitive adhesive composition imparted antistatic function without going through the process of dispersing the conductive polymer in the pressure-sensitive adhesive.

Another object of the present invention is to provide a conductive film using the conductive adhesive composition.

Conductive adhesive composition of the present invention for achieving the above object is (a) 90 to 99.9% by weight of the (meth) acrylic monomer and 0.1 to 10% by weight of the acrylic monomer having a monomer of the conductive polymer as a copolymer to the formula (1) To 100 parts by weight of the acrylic copolymer displayed; (b) 0.01 to 10 parts by weight of a curing agent; And (c) 0.01 to 10 parts by weight of oxidizing agent.

[Formula 1]

Wherein n is an integer of 1 to 100, m is an integer of 10 to 1000, a is an integer of 1 to 8, R is a monomer of a conductive polymer, and R ¹ is saturated of 1 to 10 carbon atoms Or an unsaturated hydrocarbon substituent, R ² , R ³ are each independently -H or -CH ₃ .

The monomer of the conductive polymer is one selected from thiophene, pyrrole, 3,4-ethylenedioxythiopene (EDOT), 3,4-propylenedioxythiophene (3,4-propylenedioxythiopene, ProDOT) It is preferable that it is above.

The conductive adhesive composition preferably further comprises at least one organic amine compound selected from the group consisting of piperidine, pyridine, triethylamine, trimethylamine and tributylamine.

The oxidizing agent is preferably at least one selected from the group consisting of trivalent iron (III) salt, H ₂ O ₂ , ammonium persulfate, alkali perborate and potassium permanganate.

The (meth) acrylic monomer,

50 to 80% by weight of soft alkyl (meth) acrylate; 5 to 45% by weight of a hard vinyl monomer; And 1 to 20% by weight of a vinyl monomer having a crosslinkable functional group.

The soft alkyl (meth) acrylate may be ethyl acrylate, n-propyl acrylate, n-butyl acrylate, n-pentyl acrylate, n-hexyl acrylate, n-heptyl acrylate, n-octyl acrylate, selected from the group consisting of n-octyl methacrylate, isooctyl acrylate, n-nonyl acrylate, n-decyl acrylate, dodecyl acrylate, 2-ethylhexyl acrylate and 4-methyl-2-pentyl acrylate It is preferable that it is at least one.

The hard vinyl monomers are methyl acrylate, methyl methacrylate, ethyl methacrylate, propyl methacrylate, isopropyl acrylate, butyl methacrylate, isobutyl acrylate, benzyl acrylate, vinyl acetate, styrene and It is preferable that it is any one or more selected from the group consisting of acrylonitrile.

The monomer having a crosslinkable functional group is preferably a vinyl monomer containing a carboxyl group, a hydroxyl group, or nitrogen in addition to the vinyl functional group as a polymer unit in the monomer.

The conductive film of the present invention is prepared by applying the conductive pressure-sensitive adhesive composition to one surface of the base film and then performing a drying process.

The method for producing a surface protective film for achieving the object of the invention is obtained by obtaining a copolymer of an acrylic monomer having a monomer of a conductive polymer as a substituent on a polyester film and a monomer for imparting adhesive properties, and then depending on the copolymer side chain. Since the conductive polymer is formed by coupling the monomer of the conductive polymer to form a conductive adhesive film, there is an advantage in that it is possible to express an excellent antistatic function without the step of dispersing the conductive polymer in the adhesive or adding an additional additive such as a dispersant.

The conductive adhesive composition of the present invention

(a) 90 to 99.9 weight percent of the (meth) acrylic monomer and 0.1 to 10 weight percent of the acrylic monomer having a monomer of the conductive polymer as a substituent, relative to 100 parts by weight of the acrylic copolymer copolymerized;

(b) 0.01 to 10 parts by weight of a curing agent; And

(c) 0.1 to 10 parts by weight of an oxidizing agent.

[Acrylic Copolymer]

The acrylic copolymer used in the conductive adhesive composition of the present invention is a copolymer of 90 to 99.9% by weight of the (meth) acrylic monomer and 0.1 to 10% by weight of the acrylic monomer having a monomer of the conductive polymer as a substituent, which is represented by the following Chemical Formula 1 Polymer is:

[Formula 1]

Wherein n is an integer of 1 to 100, m is an integer of 10 to 1000, a is an integer of 1 to 8, R is a monomer of a conductive polymer, and R ¹ is saturated of 1 to 10 carbon atoms Or an unsaturated hydrocarbon substituent, R ² , R ³ are each independently -H or -CH ₃ .

The acrylic copolymer is a copolymer of 90 to 99.9 wt% of the (meth) acrylic monomer and 0.1 to 10 wt% of the acrylic monomer having a monomer of the conductive polymer as a substituent.

As the (meth) acrylic monomer used to prepare the copolymer, a conventional (meth) acrylic monomer used in an acrylic pressure-sensitive adhesive may be used. Preferably, (meth) acrylic acid ester having an alkyl group having 1 to 12 carbon atoms is used.

Particularly preferably, the monomer is used in combination in the form in which the soft monomer and the hard monomer are copolymerized in order to impart adhesion and cohesion to the acrylic copolymer.

Specifically, the (meth) acrylic monomer may include 50 to 80% by weight of a soft alkyl (meth) acrylate; 5 to 45% by weight of a hard vinyl monomer; And 1 to 20% by weight of a vinyl monomer having a crosslinkable functional group.

In the above, the criteria for distinguishing between soft and hard are classified based on the glass transition temperature (Tg) of the homopolymer, and if the glass transition temperature of the polymerized monomer is 0 ° C. or more, the hard monomer is less than 0 ° C.

The soft alkyl (meth) acrylate functions to increase the flexibility in the polymer to lower Tg and increase tacky. Examples of the soft alkyl (meth) acrylate include ethyl acrylate, n-propyl acrylate, n-butyl acrylate, n-pentyl acrylate, n-hexyl acrylate, Octyl acrylate, n-octyl methacrylate, isooctyl acrylate, n-nonyl acrylate, n-decyl acrylate, dodecyl acrylate, 2-ethylhexyl acrylate, . The monomers may be used singly or in combination of two or more.

The soft alkyl (meth) acrylate is preferably mixed in 50 to 80% by weight of the total weight of the (meth) acrylic monomer mixture. If the content of the soft monomer does not reach 50% by weight, if the content of the soft monomer does not reach 50% by weight, there is a problem in tackyness, and if it exceeds 80%, there is a problem of deterioration of adhesive force.

As said hard alkyl (meth) acrylate, methyl acrylate, methyl methacrylate, ethyl methacrylate, propyl methacrylate, isopropyl acrylate, butyl methacrylate, isobutyl acrylate, benzyl, for example. Acrylate, vinyl acetate, styrene, acrylonitrile and the like. The monomers may be used singly or in combination of two or more.

Hard alkyl (meth) acrylates function to increase the cohesion of the bulk and improve the cohesion in the polymer. The hard alkyl (meth) acrylate is preferably mixed at a ratio of 5 to 45% by weight based on the total weight of the (meth) acrylic monomer mixture. If the content of the hard monomer does not reach 5% by weight, there is a problem of bulk cohesion and adhesive force, and if it exceeds 45% by weight, there is a problem of inferior tacky property as the initial adhesive force.

On the other hand, as the acrylic monomer, a vinyl monomer having a crosslinkable functional group is preferably added as a part of the copolymerized composition. The monomer having a crosslinkable functional group reacts with the crosslinking agent to perform a function of imparting a cohesive force or an adhesive strength by a strong chemical bond so that the cohesive force of the pressure-sensitive adhesive is not broken at high temperature or high humidity.

The crosslinkable functional group refers to a vinyl-based monomer containing a carboxyl group, a hydroxyl group, or nitrogen in addition to the vinyl functional group as a polymerization unit in the monomer. As this use, for example, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 6-hydroxyhexyl (meth) acryl Monomers containing a hydroxyl group such as latex, 2-hydroxyethylene glycol (meth) acrylate, or 2-hydroxypropylene glycol (meth) acrylate; Monomers containing a carboxyl group such as (meth) acrylic acid, maleic acid, or fumaric acid; Or monomers containing nitrogen such as acrylamide, N-vinylpyrrolidone or N-vinylcaprolactam. These may be used alone or in combination of two or more.

Preferably, the vinyl monomer having a crosslinkable functional group is contained in an amount of 1 to 20% by weight based on the total weight of the meta) acrylic monomer mixture. If the content is less than 1% by weight, there is a problem in that cohesive failure is likely to occur at high temperature or high humidity conditions, while if it exceeds 20% by weight, the compatibility is reduced to reduce the flow characteristics.

A (meth) acrylic monomer having a monomer of a conductive polymer which is another component constituting the acrylic copolymer as a substituent is an acrylic monomer represented by the following Chemical Formula 2:

(2)

Wherein a is an integer from 1 to 8,

,

,

및

로 구성된 군으로부터 선택되는 하나 이상이며, R²는 -H 또는 -CH₃이다.R is silver

,

,

And

At least one selected from the group consisting of, R ² is -H or -CH ₃ .

The monomers of the conductive polymer in the above are functional groups represented by the substituent R. The (meth) acrylic monomer having a monomer of the conductive polymer as a substituent is copolymerized with another acrylic monomer, and then diluted and coated on a polyester film, followed by drying of the solvent and expression of conductivity by coupling reaction of the conductive polymer monomer with an oxidant. A thin film is formed to perform an antistatic function.

The monomer of the conductive polymer is connected to (meth) acryl by an alkyl chain having 1 to 8 carbon atoms. When the carbon number is connected by a long chain of more than 8, the intramolecular thiophene density may be lowered, and thus the probability of reacting with polythiophene may be reduced, and the planarity of the polythiophene may be reduced due to the long chain.

As the monomer of the conductive polymer, solely selected from thiophene, pyrrole, 3,4-ethylenedioxythiopene (EDOT), and 3,4-propylenedioxythiopene (ProDOT) Or it can mix and use 2 or more types.

It is preferable that content of the (meth) acrylic-type monomer which has a monomer of the said conductive polymer as a substituent in the weight of a (meth) acrylic-type copolymer is 0.1 to 10 weight%. If the content of the (meth) acrylic monomer having a monomer of the conductive polymer as a substituent does not reach 0.01% by weight, there is a problem in that the surface resistance is increased. When the content of the conductive polymer exceeds 10% by weight, the transparency of the pressure-sensitive adhesive is deteriorated.

[Multifunctional Curing Agent]

The curing agent added to the conductive adhesive composition of the present invention serves to increase the cohesive force of the pressure-sensitive adhesive composition to improve the adhesion.

As the curing agent, a curing agent used in a conventional acrylic pressure-sensitive adhesive may be used. Examples of the curing agent known in the art include a polyfunctional organic curing agent and a polyfunctional metal chelate. Examples of the organic curing agent include an epoxy curing agent, an isocyanate curing agent, an imine curing agent, and the like. Of these, isocyanate curing agents are preferred.

The multifunctional metal chelate is a structure in which a polyvalent metal ion has a covalent bond or a coordinating bond with an organic compound. As the polyvalent metal ion, for example, Al, Cr, Zr, Co, Cu, Fe, Ni, V, Zn , In, Ca, Mg, Mn, Y, Ce, Sr, Ba, Mo, La, Sn, Ti and the like. Examples of the organic compound covalently bonded or coordinated include alkyl esters, alcohol compounds, carboxylic acid compounds, ether compounds, ketone compounds, and the like.

The content of the curing agent in the conductive adhesive composition of the present invention is preferably 0.01 to 10 parts by weight of the curing agent based on 100 parts by weight of the acrylic copolymer. If the content of the curing agent does not reach 0.01 parts by weight, the cohesive force of the pressure-sensitive adhesive is dropped, there is a problem of the pressure-sensitive adhesive, if it exceeds 10 parts by weight, there is a problem that the initial cohesive force drops tacky property.

[Oxidizer]

In the present invention, the oxidizing agent is a composition added for the purpose of oxidatively coupling the monomers of the conductive polymer. Iron (III) salts such as FeCl ₃ , iron (III) salts of organic acids such as Fe (OTs) ₃ , H ₂ O ₂ , alkali and ammonium persulfates, alkali perborates and potassium permanganate. Of these, persulfate and iron (III) salts do not have a corrosive action and thus have a significant technical advantage in use. Illustrative reaction of oxidatively coupling a conductive polymer conductor by using iron (III) salt is shown in Scheme 1 below:

[Reaction Scheme 1]

In Scheme 1, thiophene is oxidized by iron salt as an oxidizing agent to form a radical cation, and a cationic radical reacts with each other to form a dimer, and two H + are removed to reduce to thiophene. The reaction takes place continuously, causing polymerization. In theory, oxidative polymerization of thiophene requires 2.25 equivalents of oxidizing agent per mole of thiophene of formula (I) (see, eg, J. Polymer Science Part A Polymer Chemistry, volume 26, pages 1287-1294 (1988)). ). In practice, an excess of 0.1 to 2 equivalents of oxidant per polymerized unit is used, based on 100 parts by weight of the total weight of the acrylic copolymer as a whole. It is used in the ratio of 0.1-10 weight part.

[Additional composition]

An amine compound may be further added to the composition for the purpose of improving the storage stability of the oxidizing agent. Amine compounds used for this purpose include, for example, piperidine, pyridine, triethylamine, trimethylamine, tributylamine and the like. The amount of the amine compound is preferably used in a ratio of 5 to 50 parts by weight based on 100 parts by weight of the oxidizing agent. If the content of the amine compound is less than 5 parts by weight, there is a problem that polymerization of the thiophene occurs during the preparation of the precursor polymer solution. If the content of the amine compound exceeds 50 parts by weight, the thiophene polymerization does not occur due to the remaining amine after coating the precursor polymer. There is a problem that does not lower.

The solution prepared by mixing the precursor polymer containing thiophene with an oxidizing agent and an amine does not cause polymerization because the amine prevents oxidative coupling of thiophene by the oxidizing agent. When the precursor polymer is coated and dried, the amine vaporizes and polymerization of thiophene by the oxidant begins.

The drying method for vaporizing the amine compound is not particularly limited, and for example, a method known in the art such as hot air drying may be used.

[Conductive Film]

In addition, the present invention provides a surface protection film is applied to the pressure-sensitive adhesive layer containing the acrylic conductive pressure-sensitive adhesive composition on at least one side of the base film showing the antistatic properties.

The substrate for the protective film of the present invention can be used without limitation as long as it is commonly used in the art. Preferably a PET film is used in which transparency can be achieved. The substrate may be subjected to corona discharge treatment so as to introduce a polar group on the surface of the film prior to the application of the pressure-sensitive adhesive composition to improve adhesion or coating property of the coating layer and the film.

There is no particular limitation regarding the method of application, and it is possible to use various methods known in the art, for example, a meyer bar method, gravure coating, and the like.

It is preferable that the thickness of application | coating is 1-50 micrometers. If the coating thickness is less than 1 μm, there is a problem of increase in adhesive force and surface degradation, and if it is more than 50 μm, there is a problem of haze increase, which is not preferable.

Hereinafter, the present invention will be described in more detail with reference to Examples. These examples are intended to illustrate the present invention in more detail, and the scope of the present invention is not limited to these examples.

Example 1

1. Acrylic Copolymer Preparation

70% by weight of n-butyl acrylate, 20% by weight of methyl acrylate, 5% by weight of acrylic acid, and 5% by weight of 2-hydroxyethyl acrylate were mixed in a 1L reactor equipped with a high speed stirrer, a titrator, a cooling device, and a thermometer. 1 weight% of the acrylic monomer having EDOT, 100 weight parts of ethyl acetate and 0.05 weight part of azobisisonitrile (AIBN) were added to 100 weight parts of the mixture, followed by stirring with a high speed stirrer at room temperature for 1 hour with nitrogen gas. After refluxing and polymerization at 70 ° C. for 12 hours, an acrylic pressure-sensitive adhesive resin having an EDOT group, which is a monomer of the conductive polymer, as a substituent was prepared.

The acrylic monomer having the EDOT as a substituent is a monomer represented by the following Chemical Formula 3:

(3)

2. Preparation of conductive adhesive composition

5 parts by weight of Fe (OTs) ₃ and 1 part by weight of toluene diisocyanate were added to 100 parts by weight of the acrylic copolymer, and diluted with a nonvolatile content of 20% by weight in an ethyl acetate / methylethylketone (volume ratio 50:50) mixture. An adhesive composition was prepared.

[Example 2]

An adhesive composition was prepared under the same conditions as in Example 1 except that 5 wt% of an acrylic monomer having EDOT, which is a monomer of the conductive polymer, as a substituent was added.

[Example 3]

An adhesive composition was prepared under the same conditions as in Example 1 except that 10% by weight of an acrylic monomer having EDOT as a substituent of the conductive polymer was added thereto.

Example 4

A pressure-sensitive adhesive composition was prepared under the same conditions as in Example 1 except that a copolymer resin containing 1% of an acrylic monomer having a structure of Formula 4, wherein EDOT, a monomer of the conductive polymer, was substituted with thiophene was prepared.

[Chemical Formula 4]

[Example 5]

An adhesive composition was prepared under the same conditions as in Example 1 except that a copolymer resin containing 5% of an acrylic monomer (EDOT-MA) in which EDOT, a monomer of the conductive polymer, was substituted with thiophene was prepared.

[Example 6]

An adhesive composition was prepared under the same conditions as in Example 1 except that a copolymer resin containing 10% of an acrylic monomer (T-MA) in which EDOT, a monomer of the conductive polymer, was substituted with thiophene was prepared.

Comparative Example 1

Except that the addition of the monomer of the conductive polymer was omitted, the pressure-sensitive adhesive composition was prepared under the same conditions as in Example 1.

[Comparative Example 2]

An adhesive composition was prepared under the same conditions as in Example 2 except that 5 parts by weight of the oxidizing agent Fe (OTs) ₃ was omitted.

[Comparative Example 2]

A pressure-sensitive adhesive composition was prepared under the same conditions as in Example 2 except that 10 parts by weight of pyridin was omitted.

3. Preparation of adhesive film

After applying the acrylic pressure-sensitive adhesive composition having a monomer of the conductive polymer prepared according to the embodiment and the comparative example as a substituent on a 100mm PET film with a thickness of 25mm, it is allowed to stand at room temperature for 1 minute, 5 minutes by hot air of 100 ^° C. After drying, the adhesive film was prepared by laminating with a 38 mm release film. The used adhesive sheet was evaluated by the following test method.

[evaluation]

1. Measurement of glass transition temperature (Tg)

DuPont's differential scanning calorimetry (DSC 2910) was measured using a temperature increase rate of 10 ℃ / min was measured in the range of -100 ~ 30 ℃.

2. 180 ° peeling strength measurement

The protective films prepared in Examples 1 to 6 and Comparative Examples 1 and 2 were prepared according to JIS Z 0237 on the triacetyl cellulose (TAC, manufactured by Fujifilm, Japan) surface and the antiglare layer (AG, manufactured by DNP, Japan) of the polarizing plate. After attaching with a roller of 2 kg, it measured using the tensile tester at 180 degree angle and the peeling speed of 0.3 m / min and 30 m / min.

3. Measurement of surface resistance

The surface resistance was measured in accordance with JIS K7194 after installing a sample in the environment of temperature of 23 degreeC, and humidity of 50% RH using an antistatic measuring device (Mitsubishi Corporation: model name MCP-T600).

Component Furtherance Example 1 Example 2 Example 3 Example 4 Example 5 Example 6

(Meth) acrylic
Copolymer component n-BA 69wt% 65wt% 60wt% 69wt% 65wt% 60wt% MA 20wt% 20wt% 20wt% 20wt% 20wt% 20wt% AA 5 wt% 5 wt% 5 wt% 5 wt% 5 wt% 5 wt% 2-HEA 5 wt% 5 wt% 5 wt% 5 wt% 5 wt% 5 wt% EDOT-MA 1wt% 5 wt% 10wt% T-MA 1wt% 5 wt% 10wt%
Pressure-sensitive adhesive composition
ingredient
(Parts by weight) Acryl
Resin 100 100 100 100 100 100 TDI One One One One One One Fe (OTs) ₃ 5 5 5 5 5 5 Pyridine 10 10 10 10 10 10

Component Furtherance Comparative Example 1 Comparative Example 2 Comparative Example 3

(Meth) acrylic
Copolymer component n-BA 65wt% 65wt% 70wt% MA 20wt% 20wt% 20wt% AA 5 wt% 5 wt% 5 wt% 2-HEA 5 wt% 5 wt% 5 wt% EDOT-MA 5 wt% 5 wt% T-MA
Pressure-sensitive adhesive composition
ingredient
(Parts by weight) Acryl
Resin 100 100 100 TDI One One One Fe (OTs) ₃ 5 Pyridine 10

Example 1 Example 2 Example 3 Example 4 Example 5 Example 6 Gel fraction (%) 61 62 61 64 63 65 Tg ( ^o C) -25 -26 -30 -31 -23 -25 Peel force
(gf / 25 mm) 0.3m / min 7 6 5 6 7 8 30m / min 101 102 106 102 105 106 Surface resistance (/) 1.110 ⁸ 2.310 ⁷ 7.910 ⁶ 2.310 ⁹ 9.610 ⁸ 1.310 ⁸

Comparative Example 1 Comparative Example 2 Comparative Example 3 Gel fraction (%) 55 65 64 Tg ( ^o C) -28 -27 -33 Peel force
(gf / 25 mm) 0.3m / min 5 7 10 30m / min 108 105 110 Surface resistance (/) 3.110 ¹³ 2.510 ¹⁰ 2.310 ¹³

As can be seen in Table 3 and Table 4, when comparing the results of the film using the acrylic pressure-sensitive adhesive composition of Examples 1 to 6 it is shown that the surface resistance is lower when the acrylic monomer having EDOT as a substituent than thiophene is applied. It was found that the surface resistance value was lowered as the monomer amount of the conductive polymer was increased.

Although the present invention has been described in detail only with respect to the embodiments described, it will be apparent to those skilled in the art that various modifications and variations are possible within the technical scope of the present invention, and such modifications and modifications belong to the appended claims.

In the pressure-sensitive adhesive composition of the present invention, after obtaining a copolymer of an acrylic monomer having a monomer of a conductive polymer as a substituent on a polyester film and a monomer for imparting adhesive properties, a coupling reaction of the monomer of the conductive polymer depending on the side chain of the copolymer is carried out. To form a conductive adhesive film. Therefore, it is possible to prepare a protective film having an antistatic function easily without the need to use a process and a dispersant to disperse the conductive polymer in the pressure-sensitive adhesive, this technology can be used in various applications in addition to the pressure-sensitive adhesive for the protective film.

Claims (9)

(a) 90 to 99.9 wt% of the (meth) acrylic monomer and 0.1 to 10 wt% of the acrylic monomer having the monomer of the conductive polymer as a substituent are copolymerized to 100 parts by weight of the acrylic copolymer represented by the following formula (1);
[Chemical Formula 1]

Wherein n is an integer of 1 to 100, m is an integer of 10 to 1000, a is an integer of 1 to 8, R is a monomer of a conductive polymer, and R ¹ is saturated of 1 to 10 carbon atoms Or an unsaturated hydrocarbon substituent, R ² , R ³ are each independently -H or -CH ₃ )
(b) 0.01 to 10 parts by weight of a curing agent; And
(c) 0.1 to 10 parts by weight of oxidizing agent; conductive adhesive composition containing. The method of claim 1, wherein the monomer of the conductive polymer is thiophene, pyrrole, 3,4-ethylenedioxythiopene (EDOT), 3,4-propylenedioxythiopene (3,4-propylenedioxythiopene, ProDOT) is one or more selected from the above, the conductive adhesive composition. The conductive adhesive composition according to claim 1, further comprising at least one organic amine compound selected from the group consisting of piperidine, pyridine, triethylamine, trimethylamine and tributylamine. The conductive adhesive composition according to claim 1, wherein the oxidizing agent is at least one selected from the group consisting of trivalent iron (III) salt, H ₂ O ₂ , ammonium persulfate, alkali perborate and potassium permanganate. The method according to claim 1, wherein the (meth) acrylic monomer,
50 to 80% by weight of soft alkyl (meth) acrylate;
5 to 45% by weight of a hard vinyl monomer; And
The conductive pressure-sensitive adhesive composition, characterized in that a mixture consisting of; 1 to 20% by weight of a vinyl monomer having a crosslinkable functional group. The method of claim 5, wherein the soft alkyl (meth) acrylate is ethyl acrylate, n-propyl acrylate, n- butyl acrylate, n-pentyl acrylate, n-hexyl acrylate, n-heptyl acrylate, n-octyl acrylate, n-octyl methacrylate, isooctyl acrylate, n-nonyl acrylate, n-decyl acrylate, dodecyl acrylate, 2-ethylhexyl acrylate and 4-methyl-2-pentyl acrylate The conductive adhesive composition, characterized in that any one or more selected from the group consisting of a rate. The method of claim 5, wherein the hard vinyl monomer is methyl acrylate, methyl methacrylate, ethyl methacrylate, propyl methacrylate, isopropyl acrylate, butyl methacrylate, isobutyl acrylate, benzyl acrylate And vinyl acetate, styrene and acrylonitrile, any one or more selected from the group consisting of the conductive adhesive composition. The conductive adhesive composition according to claim 5, wherein the monomer having a crosslinkable functional group is a vinyl monomer containing a carboxyl group, a hydroxyl group, or nitrogen in addition to the vinyl functional group as a polymer unit in the monomer. A conductive film prepared by applying the conductive pressure-sensitive adhesive composition of claim 1 to one surface of the base film and then performing a drying process.