KR101342037B1 - A wafer storage have a enclosed type door equipment and a fume remove equipment - Google Patents

A wafer storage have a enclosed type door equipment and a fume remove equipment Download PDF

Info

Publication number
KR101342037B1
KR101342037B1 KR1020120124148A KR20120124148A KR101342037B1 KR 101342037 B1 KR101342037 B1 KR 101342037B1 KR 1020120124148 A KR1020120124148 A KR 1020120124148A KR 20120124148 A KR20120124148 A KR 20120124148A KR 101342037 B1 KR101342037 B1 KR 101342037B1
Authority
KR
South Korea
Prior art keywords
wafer storage
fume
door
slide
removing device
Prior art date
Application number
KR1020120124148A
Other languages
Korean (ko)
Inventor
우범제
Original Assignee
우범제
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 우범제 filed Critical 우범제
Priority to KR1020120124148A priority Critical patent/KR101342037B1/en
Application granted granted Critical
Publication of KR101342037B1 publication Critical patent/KR101342037B1/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The present invention relates to a wafer storage having a closed-type door device and a fume removing device. The purpose of the present invention is to maximize fume removal efficiency and to fundamentally prevent the inflow of external fume by forming a processing chamber of the wafer storage arranged between equipment front end modules (EFEM) as an independent space blocked from the outside. The wafer storage arranged between the EFEMs comprises: the closed-type door device symmetrically arranged in one side to open and close the processing chamber in which a cassette having multiple wafers is inputted; the fume removing device arranged under the processing chamber. Accordingly, the present invention maximizes the fume removal efficiency and fundamentally prevents the inflow of the external fume by forming the processing chamber of the wafer storage arranged between the EFEMs as the independent space blocked from the outside.

Description

Wafer storage with hermetic door and fume elimination device {A WAFER STORAGE HAVE A ENCLOSED TYPE DOOR EQUIPMENT AND A FUME REMOVE EQUIPMENT}

The present invention relates to a wafer storage, and more particularly, it is provided between an EFEM (Equipment Front End Module), the closed door device and the fume to remove the harmful gas during the transfer to the EFEM on one side and the EFEM on the other side A wafer storage device having a removal device.

In general, as shown in FIG. 1, the wafer fabrication process is performed on a wafer (WF) in which EFEM (MD) is completed, such as ionization implantation, thin film deposition, etching, and planarization in the semiconductor processing equipment (BS) on the left side. (RT) is laminated to a cassette (not shown) provided in the load port LP.

Then, the cassette is transferred to the side storage (SS) to remove harmful gases such as fumes generated during the process in the semiconductor processing equipment (BS).

As described above, the plurality of stacked wafers WF that have been primarily processed are transferred to the wafer storage WS before being transferred to the EFEM (Equpment Front End Module) Wait.

However, the above-described conventional wafer storage WS is simply another wafer transferred by the robot RT inside the EFEM MD in the process of waiting for a plurality of wafers WF stacked in a cassette. There was a problem of being polluted again by harmful gases such as fumes present in WF).

In addition, such contamination has a problem that leads to defects of the wafer by reacting with other contaminants generated in the subsequent process.

The present invention has been made to solve the conventional problems as described above, and an object of the present invention is to completely remove harmful gases such as fumes remaining on a wafer moving between EFEMs.

In addition, another object of the present invention is to prevent the wafer from being contaminated with contaminants present in the EFEM.

In addition, another object of the present invention is to form a wafer storage space outside, that is, an independent space blocked from the EFEM to maximize the fume removal efficiency and at the same time to block the influx of the fume from the outside.

The present invention made for this purpose;

Regarding the wafer storage provided between the EFEM and the EFEM,

The wafer storage device is provided on one side in a symmetrical manner, and a closed door device for opening and closing a process chamber into which a cassette provided with a plurality of wafers is inserted;

And a fume removing device provided below the process chamber.

Further, in the closed door device,

A door frame provided at one side of the fume removing device in a vertical direction;

A slide door vertically moving upward and downward from the inside of the door frame;

And a slide device for moving the slide door vertically and downward.

Further, in the door frame,

A flange provided on one side of the fume removing device and provided in a direction perpendicular to the upper, lower, left, and right sides of the fume removing device, a slide rail provided symmetrically with respect to the left and right sides of the flange, A first frame including first and second openings formed in a vertical direction and a vertical direction;

A flange provided in a direction perpendicular to the four sides of the upper, lower, left, and right sides so as to engage in a symmetrical direction of the first frame, and a second frame having a third opening with the same standard as the first opening.

In addition, the first frame,

The fume removing device and the bolt further comprises a plurality of first bolt holes formed in the rim portion.

In addition, the second frame,

Further comprising a plurality of second bolt holes formed in the vertical direction, to facilitate coupling with the flange of the first frame.

In addition,

A slide groove is provided on both sides of the door frame so as to engage with the slide rails provided on the left and right sides of the door frame, and a mounting protrusion provided at the lower center of the slide groove.

In addition, the above-

Support brackets provided in the horizontal direction on both sides of the second opening, the mounting plate for interviewing the support bracket, both ends are coupled to the mounting plate, the slide rail is provided side by side, the length along the slide rail It consists of a rodless cylinder with a cylinder block moving in the direction.

In addition, the above-

A lifting cylinder provided in a longitudinal direction on the upper side of the second support bracket and having wire pulleys in forward and backward directions; One end of the guide roller is installed on the lower side of the first support bracket, and the other end of the guide roller is wound on the wire pulley by a plurality of turns. The guide roller is mounted on the mounting protrusion of the slide door through the guide roller Wire rope.

In addition, the above-

A support bracket disposed horizontally on both sides of the second opening,

A nut coupled to the support bracket so as to be rotatable at both ends thereof, a nut screwed to the screw and mounted on the mounting protrusion on the lower side of the slide door, and a speed reducer axially coupled to the lower end of the screw by coupling.

In addition,

An intake hopper provided at a lower side of the processing chamber;

A first body formed in a disk shape and provided at an upper portion of the intake hopper and having an inlet at the center thereof so as to allow air in the processing chamber to flow;

An air supply port formed in a direction perpendicular to the circulation unit, and an air supply port formed in a lower portion of the first body, An air outflow section formed at a position lower than the upper surface of the seat section so as to be spaced apart from the upper surface of the seat section by a predetermined distance and formed in a circular shape on the inner side of a section of the circulation section and a diffusion section whose inner diameter is enlarged in cross section to diffuse the air flowing through the air outflow section And the second body.

In addition, the inlet of the first main body may be formed,

And an induction slope part having an inner diameter gradually increased gradually from one side to the other side.

In addition, the circulation unit of the second main body may include:

It further includes a vortex forming portion formed on the bottom in cross section to minimize the resistance of the air fluid supplied to the air supply port, and to be quickly discharged through the air outlet.

In addition, the air outlet portion of the first body,

And a vortex accelerating part formed in a round shape in cross section so as to promote vortex formed in the circulation part and minimize resistance of the air fluid.

As described above, according to the present invention, there is an effect of completely removing harmful gases such as fumes remaining in the wafer moving between EFEMs.

In addition, there is an effect that the wafer is not contaminated by the closed door device provided on both sides to prevent contact with the contaminants present in the EFEM.

In addition, the wafer door is formed into an independent space blocked from the EFEM by an enclosed door device, thereby maximizing the efficiency of removing the fume and simultaneously blocking the inflow of the fume from the outside.

1 is a plan view of each equipment of a wafer manufacturing process equipped with a conventional wafer storage,
Figure 2 is a plan view of each equipment of the wafer manufacturing process equipped with a wafer storage equipped with a closed door device and a fume removing device according to the present invention,
3 is an exploded perspective view showing the configuration of a wafer storage with a closed door device and a fume removing device according to the present invention,
4 is a view as viewed from the direction “A” of FIG. 2,
FIG. 5 is a view showing the fume removing apparatus according to the present invention, as viewed from the direction of FIG. 3 "B"
6) to 6) are views sequentially showing the action of the wafer storage equipped with the closed door device and the fume removing device according to the present invention.
7 is a view showing another embodiment of the closed door device according to the present invention,
8 and 9 are views showing another embodiment of the closed door device according to the present invention.

2 to 5, the wafer storage WS according to the present invention includes a sealed door device 10 and a fume removing device 50.

The closed door device (hereinafter referred to as “door device”) 10 is provided symmetrically on both sides of the wafer storage WS, and includes a door frame 100, a slide door 200, and a slide device 300. (The door apparatus 10 provided on both sides of the wafer storage WS described above will only be described on the configuration of either side.)

The door frame 100 is provided on one side of the wafer storage WS in a vertical direction and includes first and second frames 110 and 130.

Referring to FIG. 1, the first frame 110 is provided with flanges 111 at right angles to four sides of the top, bottom, left and right sides, and flanges 111 are provided in the left and right vertical directions among the flanges 111. Slide rail 113 is provided in the inner vertical direction of the symmetry.

On the other hand, the first and second openings 115 and 117 are provided in the vertical direction of the first frame 110.

The first opening 115 is formed to be opened and closed by a slide door 200 described later and the second opening 117 is formed for smooth operation of a slide device 300 described later.

As described above, in the first frame 110, a plurality of first bolt holes 119 are formed at edge portions of the first frame 110 to facilitate bolt fastening.

It is preferable to use a washer head drill piece for the first bolt hole 119 and the second bolt hole 135 of the second frame 130 to be described later.

The above-mentioned washer-type hair-drill piece (aka, a drill piece) is formed by integrally forming a drill on the end of the screw, and the drill of the screw end described above is tightened without a separate drill.

The second frame 130 is provided with flanges 131 at right angles to four sides of the upper, lower, left, and right sides so as to be coupled in the symmetrical direction of the first frame 110. The second frame 130 Is formed in a rather large standard so that the flange 131 on the outside of the flange 111 of the first frame 110 can be provided.

The second frame 130 has a third opening 133 of the same size as the first opening 115 of the first frame 110. The first and third openings 115 and 133, Is opened / closed by the slide door 200 described later in the operation to be described later.

Although not shown, the first and third openings 115 and 133 are preferably provided with a seal for sealing the slide door 200 to be described later.

In addition, the flange 133 has a second bolt hole 135 is formed at equal intervals to facilitate coupling with the first frame 110 by the washer head drill piece.

The slide door 200 is provided inside the door frame 100.

The slide door 200 is provided with slide grooves 210 symmetrically on both sides so as to engage with the slide rails 113 provided in the vertical direction on both left and right sides of the flange 111 of the first frame 110 .

It is preferable to apply grease to the slide groove 210 to smoothly lubricate the slide rail 113.

A mounting protrusion 230 is provided on the lower side of the slide door 200. The mounting protrusion 230 facilitates easy sliding of the slide door 200 with the slide device 300 Respectively.

The slide device 300 includes a support bracket 310 and a rodless cylinder 330.

The support bracket 310 is provided symmetrically on the lower and upper sides of the second opening 117.

A rodless cylinder 330 is provided between the support brackets 310. The rodless cylinder 330 includes a mounting plate 331, a slide rail 333, and a cylinder block 335.

The mounting plate 331 is engaged with the support bracket 310 by a bolt (not shown) and is prevented from flowing.

As described above, at least one slide rail 333 having both ends coupled to the mounting plate 331 provided in the up and down directions is provided side by side, and sliding along the slide rail 333 moves the cylinder block vertically. 335 is provided.

Although not shown in the drawing, the cylinder block 335 is provided with a magnet for a switch and moves up and down by the magnetism of the magnet.

On the other hand, the fume removing device 50 is roughly divided into a first main body 500 and a second main body 600.

The first body 500 is formed in a disk shape, and an inlet 510 is formed at the center of the first body 500 so that external air can be introduced.

The inlet 510 is formed with an induction slope part 511 whose inner diameter gradually increases gradually from the lower side to the upper side with reference to the illustrated direction.

It is preferable that the induction slant part 511 is formed at a large angle as much as possible so as to allow as much external air as possible.

The first main body 500 is coupled to the second main body 600. The second main body 600 includes a seating portion 610, a circulation portion 630, an air supply port 650, 670 and a spreader 690.

The seating portion 610 is formed as a circular groove so that the lower outer side of the first body 500 is inserted.

The circulation part 630 is formed as a circular groove on the inner side of the cross section of the seating part 610 and has a semicircular vortex forming part 631 formed on the bottom part of the groove with reference to the illustrated direction.

The vortex forming portion 631 minimizes the resistance of the air fluid supplied to the air supply port 650 to be described later and forms a vortex so that the air fluid can be quickly discharged through the air outlet portion 670.

The air supply port 650 is formed at only one position in the direction perpendicular to the circulation unit 630. Nipple as a piping material, not shown, is coupled to supply compressed air from an air compressor.

The air supply port 650 may be installed at only one place because air circulates smoothly in the circulation unit 630.

On the other hand, the air outflow portion 670 is formed at a position lower than the upper surface of the seat portion 610 so as to be spaced apart from the lower side of the first body 500 by a predetermined distance, A portion 671 is formed.

The vortex accelerating part 671 is also formed in a round shape in cross section so that the compressed air supplied to the air supply port 650 can promote eddy current formed in the circulating part 630 and minimize resistance of the air fluid .

Thus, the air flowing out through the air outflow portion 670 is further amplified through the diffusion portion 690.

The diffusion width of the air is amplified as the inner diameter of the diffusion portion 690 gradually increases toward the lower side with reference to the illustrated direction and the amplified air flows into the diffusion portion 690 of the exhaust system 10 according to the present invention (See the " W " mark in FIG. 5) floating around the corners of the square, that is, the periphery of the square.

Subsequently, the operations and effects of the hermetic door device 10 and the fume removing device 50 of the wafer storage WS according to the present invention will be described with reference to FIGS. .

First, referring to a), the cassette CT with the plurality of wafers WF is placed in the process chamber ST of the wafer storage WS.

At this time, the slide door 200 on one side into which the cassette CT is inserted is in a state waiting on the lower side, and the cassette CT is easily inserted, and the slide door on the other side symmetrically provided ( 200 is provided on the upper side and is in a closed state.

When the insertion of the cassette CT is completed as described above, the cylinder block 335 of the rodless cylinder 330 is moved upward by the magnetic force along the slide rail 333 as shown in (b) The slide door 200 integrally formed with the mounting protrusion 230 coupled with the cylinder block 335 is moved upward and closed.

As such, when the process chamber ST of the wafer storage WS is shielded from the outside, the fume removing operation is performed by the fume removing apparatus 50 according to the present invention, and the fume removing operation is completed.

Referring to FIGS. 6B and 5, the fume removing device 50 according to the present invention is not shown when the process chamber ST is closed due to the slide door 200 being closed. According to the signal of the controller, the air supplied from the air compressor (not shown) to the fume removing device 50 is supplied through the air supply port 650 according to the present invention.

The air circulates in an annular circulation portion 630 when viewed from a plane, and vortices are formed in the vortex forming portion 631 provided at the bottom of the circulation portion 630, and the first body 500 is located on the upper side. It is discharged at a high speed through the air outlet 670 which is spaced a predetermined distance from the bottom of the.

The air outflow portion 670 also has a round top shape to minimize the resistance of the air formed by the vortex forming portion 631, thereby facilitating vortex flow.

In this way, the air fluid that is further accelerated by the formed vortex is diffused and discharged through the diffusion portion 690 without resistance.

That is, the air introduced at a constant speed is vortex by the action of the circulation unit 630, the air outlet 670, the diffusion unit 670, etc. of the fume dehumidifier 50 according to the present invention. Formed and spread and discharge at a faster rate.

Accordingly, the air that is diffused through the diffusion portion 290 of the exhaust device 10 according to the present invention and quickly discharged is also exhausted while absorbing the air floating around (see the “W” mark in FIG. 5).

As such, when the removal of the fume gas remaining on the wafer WF is completed, as shown in (c) of FIG. 6, the slide door 200 provided on the other side is opened and the cassette CT is provided on the other side. Moving to EFEM (not shown), the subsequent process proceeds.

As described above, the wafer storage WS according to the present invention is made by removing the fume from the inside of the process chamber ST while being shielded from the outside by the hermetic door device 10 and the fume removing device 50. In addition, the efficiency of fume removal was improved.

Further, since the fume removing operation is performed in a state of being shielded from the outside, the inflow of fumes from the outside is originally blocked.

Furthermore, the fume removal apparatus 50 according to the present invention can exhaust air without a separate power source, thereby reducing the maintenance cost.

Further, since it is not a device operated by a power source, it can be used almost semi-permanently without any trouble, and can be used semi-permanently by the circulation part 630, the air outflow part 670, the diffusion part 690, So that a dead zone is not formed and the exhaust efficiency is improved.

7 shows another embodiment of the hermetic door device 10 slide device 300 according to the present invention (hereinafter, the door frame 100 and the slide door 200 having the same configuration as the embodiment). The description of the components is omitted, and the reference numerals of the components are different from each other.

As shown in the drawing, the slide apparatus 300 is provided with first and second support brackets 310 and 320 in the horizontal direction on the lower and both sides of the second opening 117.

The first support bracket 310 is provided symmetrically on the upper side of the second support bracket 320 and a guide roller 343 is provided on the lower side thereof.

An elevating cylinder 341 is provided on the upper side of the second supporting bracket 320 and a wire pulley 342 is provided in the front and rear directions of the elevating cylinder 341.

One end of the wire rope 345 is mounted on the rear side of the lifting cylinder 341 and the other end is wound many times on the wire pulley 342 provided before and after the lifting cylinder 341, And is attached to the mounting protrusion 230 of the slide door 200 through the guide roller 343. [

As shown in the figure, the wire pulley 342 is formed in a double row in which the wire rope 345 is wound, and the wire rope 345 is repeatedly wound. Therefore, as a principle of the composite pulley, The moving distance of the slide door 200 is increased as compared with the short stroke distance (stroke) of the cylinder 341. [

8 shows another embodiment of the closed door device 10 according to the present invention. The supporting bracket 310 is provided on both sides of the second opening 117, The screw 351 is coupled so that both ends are rotatable, and the nut 353 is screwed to the screw 351.

The lower end of the screw 351 is axially coupled to the output shaft 350a of the speed reducer 350 by a coupling 355. [

Accordingly, as the screw 351 rotates in accordance with the rotation of the speed reducer 350 and the nut 353 screwed with the screw 351 moves upward and downward, the slide door 200 also moves upward and downward Move.

Meanwhile, the closed door device 10 according to the present invention can also achieve the desired object according to the present invention by using a screw-up type screw jack 370 in place of the speed reducer 350, Of course it is.

It is to be understood that the present invention is not limited to the specific exemplary embodiments described above and that various modifications may be made by those skilled in the art without departing from the spirit and scope of the invention as defined in the appended claims. And such modified embodiments are within the scope of the claims of the present invention.

1: wafer storage 10: closed door device
100: door frame 200: slide door
300: slide device
50: Fume removing device
500: first body 510: inlet
600: second body 610: seat part
630: circulation part 650: air supply port
670: air outflow portion 690: diffusion portion

Claims (13)

In the wafer storage provided between the EFEM and the EFEM,
The wafer storage unit is provided in both sides in the vertical direction in a symmetrical type, a closed door device for opening and closing the process chamber into which the cassette is provided with a plurality of wafers;
Wafer storage with a closed door device and a fume removal device comprising a fume removal device provided on the lower side of the process chamber. The method of claim 1,
In the closed door device,
A door frame vertically installed on one side of the fume removing device;
A slide door vertically moving upward and downward from the inside of the door frame;
Wafer storage device having a closed door device and a fume removing device comprising a slide device for moving the slide door in the vertical direction. 3. The method of claim 2,
The door frame includes:
A flange provided on one side of the fume removing device and provided in a direction perpendicular to the upper, lower, left, and right sides of the fume removing device, a slide rail provided symmetrically with respect to the left and right sides of the flange, A first frame including first and second openings formed in a vertical direction and a vertical direction;
A sealed type comprising a flange provided at four right, upper, lower, left, and right sides to engage in the symmetrical direction of the first frame, and a second frame having a third opening formed in the same standard as the first opening. Wafer storage with door and fume removal. The method of claim 3, wherein
The first frame,
The wafer storage device provided with a closed door device and a fume removing device further comprising a plurality of first bolt holes formed in the edge portion to facilitate fastening of the fume removing device and the bolt. The method of claim 3, wherein
The second frame,
And a second bolt hole formed in a plurality of vertical and vertical directions to facilitate engagement with the flange of the first frame. 3. The method of claim 2,
The slide door includes:
Sealed door device and fume removing device, characterized in that the slide groove is provided symmetrically on both sides so as to be coupled to the slide rail provided in the vertical direction of the left and right sides of the door frame, and the mounting protrusion provided in the lower center. Wafer storage. 4. The method according to claim 2 or 3,
The slide device includes:
Support brackets provided in the horizontal direction on both sides of the second opening, the mounting plate for interviewing the support bracket, both ends are coupled to the mounting plate, the slide rail is provided side by side, the length along the slide rail Wafer storage with a closed door device and a fume removing device characterized in that the cylinder block moving in the direction. 8. The method of claim 7,
The slide device includes:
First and second support brackets provided in the horizontal direction on both sides of the second opening, and in a longitudinal direction on the upper side of the second support bracket, and a lifting cylinder having wire pulleys in the front and rear directions; The guide roller and one end provided on the lower side of the first support bracket are mounted to the rear of the lifting cylinder, and the other end is pulled by the wire pulley multiple times in a pulley manner, and is mounted to the mounting protrusion of the slide door via the guide roller. Wafer storage with a closed door device and a fume removal device comprising a wire rope. 4. The method according to claim 2 or 3,
The slide device includes:
A support bracket disposed horizontally on both sides of the second opening,
A screw coupled to the support bracket so as to be rotatable at both ends, a nut screwed to the screw and mounted to a mounting protrusion below the slide door, and a reducer axially coupled by coupling with a lower end of the screw. Wafer storage with hermetic door system and fume removal system. The method of claim 1,
The fume removal device comprises:
An intake hopper provided at a lower side of the processing chamber;
A first body formed in a disk shape and provided at an upper portion of the intake hopper and having an inlet at the center thereof so as to allow air in the processing chamber to flow;
A seating portion formed as a circular recess to insert the lower outer side of the first body, a circulation portion formed as a circular recess in the inner side of the seating portion, an air supply port formed in a right angle direction of the circulation portion, and a lower side of the first body; The upper end of the cross section is formed at a position lower than the upper surface of the seating portion so as to be spaced apart by a predetermined distance, and the air outlet portion formed in a circular shape on the inside of the cross section of the circulation portion, and the diffusion portion whose diameter in diameter is enlarged so that the air flowing out through the air outlet portion is diffused. Wafer storage having a closed door device and a fume removing device comprising a second body made of. The method of claim 10,
The inlet
Wafer storage with a closed door device and a fume removing device further comprises an inclined inclined portion of the inner diameter is gradually increased from one side to the other side. The method of claim 10,
The circulation unit includes:
The wafer stow having a closed door device and a fume removing device further includes a vortex forming part formed at the bottom of the cross section so as to minimize resistance of the air fluid supplied to the air supply port and allow rapid discharge through the air outlet. Lazy. The method of claim 10,
The air-
Wafer storage with a closed door device and a fume removing device further comprises a vortex facilitator formed in a round shape in the upper end so as to promote the vortex formed in the circulation and minimize the resistance of the air fluid.












KR1020120124148A 2012-11-05 2012-11-05 A wafer storage have a enclosed type door equipment and a fume remove equipment KR101342037B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020120124148A KR101342037B1 (en) 2012-11-05 2012-11-05 A wafer storage have a enclosed type door equipment and a fume remove equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020120124148A KR101342037B1 (en) 2012-11-05 2012-11-05 A wafer storage have a enclosed type door equipment and a fume remove equipment

Publications (1)

Publication Number Publication Date
KR101342037B1 true KR101342037B1 (en) 2013-12-16

Family

ID=49988430

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020120124148A KR101342037B1 (en) 2012-11-05 2012-11-05 A wafer storage have a enclosed type door equipment and a fume remove equipment

Country Status (1)

Country Link
KR (1) KR101342037B1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160011346A (en) * 2014-07-22 2016-02-01 우범제 Exhaust Accelerator For A Semiconductor Manufacturing Equipment
KR20200144643A (en) 2019-06-19 2020-12-30 (주)아이솔루션 A Cleaning Apparatus for Removing a Hume on a Wafer and a Cleaning Method Using the Same
KR20210158665A (en) 2020-06-24 2021-12-31 주식회사 저스템 Purifier apparatus for efem and method thereof
KR20220114815A (en) 2021-02-09 2022-08-17 주식회사 저스템 Efem having air flow equalizing apparatus

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160011346A (en) * 2014-07-22 2016-02-01 우범제 Exhaust Accelerator For A Semiconductor Manufacturing Equipment
KR101593070B1 (en) 2014-07-22 2016-02-11 우범제 Exhaust Accelerator For A Semiconductor Manufacturing Equipment
KR20200144643A (en) 2019-06-19 2020-12-30 (주)아이솔루션 A Cleaning Apparatus for Removing a Hume on a Wafer and a Cleaning Method Using the Same
KR20210158665A (en) 2020-06-24 2021-12-31 주식회사 저스템 Purifier apparatus for efem and method thereof
KR20220114815A (en) 2021-02-09 2022-08-17 주식회사 저스템 Efem having air flow equalizing apparatus

Similar Documents

Publication Publication Date Title
KR101404621B1 (en) A side storage have a enclosed type door equipment and a fume remove equipment
KR102597978B1 (en) Storage device for storing wafer cassettes for use with batch furnaces
KR101342037B1 (en) A wafer storage have a enclosed type door equipment and a fume remove equipment
TWI814621B (en) porter room
JP2020088394A (en) Substrate processing apparatus for processing substrate
KR101652270B1 (en) Tools and methods for processing microelectronic workpices using process chamber designs that easily transition between open and closed modes of operation
US7635244B2 (en) Sheet-like electronic component clean transfer device and sheet-like electronic component manufacturing system
KR20170054226A (en) Wafer transfer microclimate techniques and apparatuses, including horizontal slot implementations and/or travelling showerheads
US20020134060A1 (en) Air management system and method for chemical containment and contamination reduction in a semiconductor manufacturing facility
TWI517950B (en) Transfer robot and equipment front end module including transfer robot
KR20170091661A (en) Substrate processing systems, apparatus, and methods with substrate carrier and purge chamber environmental controls
US20060045669A1 (en) Clean room, local cleaning system, methods of use thereof, and clean room monitoring system
US20160314997A1 (en) Loadlock apparatus, cooling plate assembly, and electronic device processing systems and methods
TWI434365B (en) Substrate treatment apparatus
KR101989204B1 (en) Device and method for processing wafer shaped articles
JPH04269824A (en) Vertical type heat-treating device
TW201639019A (en) Substrate treatment device and substrate treatment method
JPH04269825A (en) Vertical type heat-treating device
KR20130064493A (en) Substrate cooling apparatus and substrate treating facility uncluding the unit
KR101453820B1 (en) An air exhauster of the equipment front end module
JP2024511972A (en) Increased number of load ports on the factory interface with robots moving on the track
JP2006279055A (en) Semiconductor manufacturing device
US6379428B1 (en) Method for reducing particle concentration within a semiconductor device fabrication tool
KR20060117393A (en) Manufacturing system of flat panel display
JP2015230921A (en) Substrate processing apparatus

Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20161212

Year of fee payment: 6

FPAY Annual fee payment

Payment date: 20191023

Year of fee payment: 7