KR101338682B1 - Integrated module of communication circuit - Google Patents

Abstract

According to the present invention, a communication circuit integrated module includes a baseband unit for processing a transmission signal, a transceiver unit for demodulating a transmission signal, a filter unit for filtering a transmission signal, a power amplification module for amplifying the power of the transmission signal, and transmission and reception for separating transmission and reception signals. A single package including a separator may be formed, and the components may be mounted on a top layer of a multilayer structure substrate, and an inner layer of the substrate may include a plurality of resonance hole suppression via holes in a region where a slot structure is formed by a metal pattern.

According to the present invention, since a plurality of circuit elements can be implemented as a single package element, the mounting area on the substrate can be minimized, thereby allowing freedom in layout design of other external modules. In addition, by adopting a multi-layer substrate design technique, BGA design technique to minimize the interference between the substrate layer, it is easy to design the line pattern, it is possible to minimize the signal loss. In addition, since the signal of the parasitic component generated by the resonance phenomenon can be suppressed, there is an effect of preventing the occurrence of interference or loss of the signal.

Description

Integrated module of communication circuit

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a diagram illustrating a mode in which an electronic component is mounted on a communication module in a general multilayer substrate structure; Fig.

2 is a diagram illustrating a form in which a line pattern is formed on a communication module of a general multilayer substrate structure.

3 is a block diagram schematically illustrating a circuit configuration of a communication circuit integrated module according to an embodiment of the present invention.

4 is a diagram illustrating a form of a first substrate layer of a communication circuit integrated module according to an embodiment of the present invention.

5 is a view showing the form of the second substrate layer of the communication circuit integrated module according to an embodiment of the present invention.

6 is a view showing the form of a fourth substrate layer of a communication circuit integrated module according to an embodiment of the present invention.

FIG. 7 is a view showing the shape of a third substrate layer of the communication circuit integrated module according to the embodiment of the present invention; FIG.

8 is a view showing the form of a fifth substrate layer of a communication circuit integrated module according to an embodiment of the present invention.

9 is a view showing the form of a sixth substrate layer of the communication circuit integrated module according to the embodiment of the present invention.

10 is a perspective view illustrating a form in which a communication circuit integrated module according to an embodiment of the present invention is flip chip bonded on a main board.

Description of the Related Art

100: multi-band communication integrated module 110, 112, 113: first to third transmission and reception separation unit

120, 122, 124: first to third power amplifier module

130, 132, and 134: first to third filter parts

140: transceiver portion 150: base band portion

A, B, C, D, E, F: first to sixth substrate layers

B2, C2, D2, E2: Via Holes B1, C4, D1, E4, F1: Ground Pattern

B3, C3, D3, E3: Coppercut pattern C1, E1: Track pattern

C5, E5: Via hole for suppressing resonance mode

F2: BGA Pattern

The present invention relates to a communication circuit integrated module.

Currently, a mobile communication terminal using a multi-band communication module integrating transmission / reception terminals for processing a plurality of frequency bands into one module is widely used.

The multi-band communication module processes multi-band signals such as, for example, Universal Mobile Telecommunications System (W-CDMA) frequency band, Personal Communication Service (PCS) frequency band, and Digital Cellular Network (CDMA-800) frequency band. can do.

FIG. 1 is a view illustrating an example in which an electronic component is mounted on a communication module having a general multilayer board structure. An electronic component 10 is mounted on a top layer (a) of the substrate, and a bottom substrate (( b) a ground region b5 is formed.

The lower substrate includes a ground region b5 and a plurality of via holes b2, b3 and b4 are formed. The electronic component 10 is connected to the via holes b2, b3 and b4 of the innerlayer substrate via the via hole b1. As shown in FIG. At this time, the region where the electronic component 10 is mounted and the ground region b5 act as a kind of capacitor with the substrate serving as a dielectric therebetween, so that a signal of a parasitic component (for example, a harmonic component signal due to the resonant mode) do.

Therefore, in order to cancel the influence of the parasitic component signal, a via hole b2 (a via hole connected to the electronic component 10) of the lower layer substrate is formed in a form in which the copper foil in the peripheral region is removed Usually called a "copper cut").

Since the thus formed capper cut acts as a gap in the ground region b5 in which the electromagnetic field signal can leak (the parasitic component canceling function of the capper cut and the grounding function are in a trade-off relationship), the function of the ground region b5 becomes unstable .

In addition, the copper cuts are grouped in adjacent areas and are formed as a slot structure (point-to-point shape, acting as a kind of line, and unlike a designer's intention, they can be seen as a fictitious structure that occurs by chance when several metal structures are adjacent to each other. This slot structure causes a harmonic signal in resonance mode.

2 is a diagram illustrating a form in which a line pattern is formed on a communication module having a general multilayer substrate structure.

2 (a), a line pattern c is formed to connect electronic components to a circuit, and the ends of the line pattern c are adjacent to each other to form a closed loop (slot structure) see.

2B is a view showing a closed loop shape (slot structure) that is possible by combining the line pattern c shown in FIG. 2 (a) Structure (c1, c2, c3, c4) can be combined.

In fact, when measuring the various areas of the substrate, a large number of electromagnetic signals are measured, which is caused by various resonance shapes (slot structures) c1, c2, c3, and c4, causing resonances of various orders of harmonic signals (slots). Differentiation depending on the length of the structure).

As such, the multi-layered substrate has various metal patterns for mounting and electrically connecting electronic components, and the metal patterns form an unintended slot structure, so that a parasitic component signal is generated.

Due to this parasitic component signal, the communication module has a great vulnerability in processing multi-band signals.

The present invention provides a multi-layer communication circuit integrated module having a multi-band signal by minimizing the mounting area of the mobile communication terminal and improving the signal processing function by integrating circuit elements for processing a multi-band signal into a single package device.

In addition, the present invention provides a communication circuit integrated module that can suppress the parasitic signal due to the resonance mode by designing the structure and shape of the metal pattern such as the line pattern, ground pattern, copper cut pattern, bonding pattern in a new way do.

According to the present invention, a communication circuit integrated module includes a baseband unit for processing a transmission signal, a transceiver unit for demodulating a transmission signal, a filter unit for filtering a transmission signal, a power amplification module for amplifying the power of the transmission signal, and transmission and reception for separating transmission and reception signals. A single package including a separator may be formed, and the components may be mounted on a top layer of a multilayer structure substrate, and an inner layer of the substrate may include a plurality of resonance hole suppression via holes in a region where a slot structure is formed by a metal pattern.

Hereinafter, a communication circuit integrated module according to an exemplary embodiment of the present invention will be described in detail with reference to the accompanying drawings.

3 is a block diagram schematically illustrating a circuit configuration of a communication circuit integrated module 100 according to an embodiment of the present invention.

Referring to FIG. 3, the communication circuit integrated module 100 according to an embodiment of the present invention may include a first transmission / reception separator 110, a second transmission / reception separator 112, a third transmission / reception separator 114, and a first power source. Amplification module (PAM) 120, the second power amplifier module 122, the third power amplifier module 124, the first filter unit 130, the second filter unit 132, the third It comprises a filter unit 134, transceiver unit 140 and the base band unit 150, in the embodiment of the present invention, the first transmission and reception separation unit 110, the first power amplifier module 120, The first filter unit 130 processes a UMTS (Universal Mobile Telecommunications System (W-CDMA)) signal using a frequency of about 2.1 GHz band, the second transmission and reception separation unit 112, the second power amplifier module 122, The second filter unit 132 processes a personal communication service (PCS) signal using a frequency of about 1.9 GHz band.

In addition, the third transmission / reception separation unit 114, the third power amplifier module 124, and the third filter unit 134 process a DCN signal using a frequency of about 800 MHz band. .

The switch 300 is connected to the antenna 200, and selectively opens and closes the signal path to separate the band signals of the DCN, PCS, and UMTS and transmits them in both directions.

The transmission and reception separation unit (110, 112, 114), for example, may be provided with a device such as a duplexer, and performs the function of separating the transmission and reception signals of the corresponding band, the power amplifier module (120, 122, 124) is a transceiver The power of the RF transmission signal transmitted from the unit 140 is amplified and transmitted to the transmission and reception separation unit (110, 112, 114).

In addition, the filter unit 130, 132, 134 filters the signal of the noise component mixed in the process of the transmission signal is modulated by the transceiver unit 140, and filters the filtered transmission signal by the power amplification module 120, 122, 124. To pass.

The transceiver unit 140 processes the signal transmitted from the baseband unit 150 as an RF signal capable of transmitting a signal of each frequency band, and the baseband unit 150 includes an ADC, a DAC, an FFT circuit, an error correction circuit, and the like. To convert / process the analog signal into a digital signal.

Such circuit elements are implemented on a multi-layered substrate such as, for example, a metal core printed circuit board (MCPCB), mounted on a top layer (see FIG. 4; A), and via holes B2, C2, D2, and E2. It is electrically connected to the inner layer through.

4 is a diagram illustrating a form of a first substrate layer A of the communication circuit integrated module 100 according to an exemplary embodiment of the present invention.

Referring to FIG. 4, a first transmission and reception separation unit 110, a second transmission and reception separation unit 112, and a third transmission and reception separation unit 114 are mounted along the left side surface of the first substrate layer (top layer) A. The first power amplification module 120, the second power amplification module 122, and the third power amplification module 124 are vertically arranged to the right side thereof.

The first filter unit 130 and the second filter unit 132 are disposed on the right side of the first power amplifier module 120, the second power amplifier module 122, and the third power amplifier module 124 arranged vertically. The third filter unit 134 is vertically arranged in a line.

The base band part 150 is mounted on the upper right side of the remaining area, that is, on the right side surface of the first substrate layer A, and the transceiver part 140 is mounted beneath it.

The circuit arrangement design considering the isolation between the components is a very important factor in improving the transmission and reception function, and in particular, the isolation of the transceiver unit 140 and the transmission / reception separation unit 110, 112, and 114 that generate a lot of interference is the most important. Since it is a factor, it arranges and opposes the opposite side end part of the 1st board | substrate layer A. As shown in FIG.

In this way, the transmission and reception separation unit (110, 112, 114), power amplifier module (120, 122, 124), filter unit (130, 132, 134), transceiver unit 140, baseband unit 150, Unlike the structure that is mounted on the main board in the state of an individual device chip, it can be implemented as a single package chip by modularizing and molding a series of circuits.

5 is a view showing the shape of the second substrate layer (B) of the communication circuit integrated module 100 according to an embodiment of the present invention, Figure 6 is a communication circuit integrated module 100 according to an embodiment of the present invention The figure which shows the form of the 4th board | substrate layer (D) of this figure.

The communication circuit integrated module 100 according to the present invention has the first substrate layer A on which the components are mounted as a top layer, and has a second substrate layer B, a third substrate layer C, and a fourth substrate thereunder. The substrate layer (D), the fifth substrate layer (E), and the sixth substrate layer (F) are positioned in this order. In describing each substrate layer, substrate layers having similar structures will be described together.

The second substrate layer B shown in FIG. 5 and the fourth substrate layer D shown in FIG. 6 are the first substrate layer A, the third substrate layer C, and the fifth substrate layer (the ground layer). E) It blocks the radio wave interference between and performs the grounding function of the circuit elements connected through the via holes B2 and D2.

In the second substrate layer and the fourth substrate layer, a copper foil layer is stacked on a dielectric layer, and a part of the copper foil layer is etched to form via holes B2 and D2 and copper cut patterns B3 and D3. Ground patterns B1 and D1 are formed.

The copper cut patterns B3 and D3 are patterns in which a parasitic component generated in a peripheral ground region is reduced by cutting a metal structure. For example, the copper cut patterns B3 and D3 may be formed on a conductor component between the first substrate layer A and the third substrate layer C. As a result, a capacitor phenomenon can be generated and a resonance phenomenon can be prevented from occurring due to the capacitor component.

7 is a view showing the shape of the third substrate layer (C) of the communication circuit integrated module 100 according to an embodiment of the present invention, Figure 8 is a communication circuit integrated module 100 according to an embodiment of the present invention. The figure which shows the form of the 5th board | substrate layer E of FIG.

In the third substrate layer C illustrated in FIG. 7 and the fifth substrate layer E illustrated in FIG. 8, a copper foil layer is stacked on a dielectric layer, and a portion of the copper foil layer is etched to form via holes C2 and E2 and a copper cut. The patterns C3 and E3, the line patterns C1 and E1, and the resonance mode suppressing via holes C5 and E5 are formed, and the ground patterns C4 and E4 are formed in other areas.

The line patterns C1 and E1 electrically connect the devices mounted on the first substrate layer A. In this case, the via holes C2 and E2 connect the line patterns C1 and the fifth substrate layer of the third substrate layer. The line pattern E1 is connected between layers, or the ground pattern B1 of the second substrate layer and the ground pattern D1 of the fourth substrate layer are connected to the ground terminals of the devices.

The resonance mode suppressing via holes C5 and E5 prevent the resonance phenomenon from occurring in the regions C6 and E6 having the slot structure, which will be described later.

FIG. 9 is a diagram illustrating a shape of a sixth substrate layer F of the communication circuit integrated module 100 according to an exemplary embodiment of the present invention.

A ball grid array (BGA) pattern F1 is formed on the sixth substrate layer F illustrated in FIG. 9, and the elements of the first substrate layer A may include via holes B2, C2, D2, and E2 of each layer. It has a structure that is energized with the BGA pattern (F1) of the sixth substrate layer (F), through the vertical wiring structure can simplify the structure of the line patterns (C1, E1), the degree of freedom in the layout design of the device Is secured.

In addition, according to the BGA pattern (F1), unlike the conventional wire bonding method, it can be mounted on the other external substrate by flip chip bumping method, and thus the communication circuit integrated module 100 according to the present invention through the BGA pattern (F1) Substrate size can be further reduced.

FIG. 10 is a perspective view exemplarily illustrating a form in which the communication circuit integrated module 100 is flip chip bonded on the main board G according to an exemplary embodiment of the present invention.

Referring to FIG. 10, a form in which a communication circuit integrated module 100 according to the present invention is flip chip bonded to another external substrate (eg, a main board of a mobile communication terminal) G is illustrated. A conductive ball (bumper) F3 is bound to the BGA pattern F1 of (F), and is connected to the bonding pattern G1 of the bumping main board through a flip chip bonding machine.

Here, bumping is a material such as a metal member or solder member such as gold on an aluminum pad on a semiconductor wafer. Refers to the process of forming (D3)).

Hereinafter, the design structure of the metal pattern for suppressing generation of the parasitic component signal will be described.

Metal patterns such as the line patterns C1 and E1, via holes B2, C2, D2 and E2, copper cut patterns B3, C3, D3 and E3, and ground patterns B1, C4, D1, E4, and F1. May form a sort of a Peruvian to form a slot structure, which causes a resonance mode to generate a parasitic signal such as a harmonic signal.

When the parasitic component signal is generated, the components installed in the top layer cause an interference phenomenon with the processed triple band signals or cause loss of each band signal.

In particular, the influence of the slot structure by the line patterns (C1, E1) is the greatest occurs, it can be seen that the various slot structures can be combined in the "C6" region and the "E6" region of FIG. .

However, the communication circuit integrated module 100 according to the present invention has a plurality of resonance mode suppressing via holes C5 and E5 in an area in which a slot structure is formed by a metal pattern, that is, areas such as “C6” and “E6”. By arranging, it is possible to block the generation of harmonic signals.

The resonance mode suppressing via holes C5 and E5 not only prevent the resonance mode from occurring by shifting the shape of the slot structure, but also absorb the resonance signal.

The resonance mode suppressing via holes C5 and E5 are formed on the ground patterns C4 and E4 of the third and fifth substrate layers C and C, respectively.

In addition, the communication circuit integrated module 100 according to the present invention may avoid the slot structure by differentiating one or more factors of the size, length, and bending angle of the metal pattern and distributing the metal patterns, for example, the ground pattern B1. , The resonance signal band can be changed by changing the circumferential length of the C4, D1, E4, and F1 and the circumferential length of the unavoidable slot structure (for example, the structure by the line patterns C1 and E1).

By making the resonance signal band different from the harmonic signal of the UMTS, PCS and DCN signals, it is possible to prevent the interference phenomenon.

For example, in the case of a DCN signal in the 800 MHz band, the size corresponding to the fourth order (fourth harmonic signal) of the wavelength? Is "(3 × 10 ⁸ ) ÷ (800 × 10 ⁶ ) Divided by the root value of the substrate permittivity (about 5), which is calculated as about 15 cm.

And dividing it by "4" corresponding to the degree of the harmonic signal, it is calculated as about 3.6 cm.

Therefore, in the layout design of the line patterns C1 and E1, if there is an unavoidable slot structure, the fourth order of the DCN signal is arranged by arranging the line patterns C1 and E1 so that the circumferential length of the slot structure is not 3.6 cm. It is possible to prevent the harmonic signal from resonating.

In addition, the communication circuit integrated module 100 according to the present invention may suppress the resonance phenomenon by slightly changing the thickness and the bending angle of the line patterns C1 and E1.

Meanwhile, when looking at the copper cut patterns B3, C3, D3, and E3 formed on each of the substrate layers B, C, D, and E, the size of the copper cut patterns B3, C3, and D3 can be seen. By minimizing the size of E3), the frequency band in which the resonance mode can be generated can be increased.

When the size of the copper cut patterns B3, C3, D3, and E3 is minimized, the electromagnetic shielding function of the ground patterns B1, C4, D1, E4, and F1 may be improved.

In addition, the communication circuit integrated module 100 according to the present invention distributes and arranges the via holes C5 and E5 and the copper cut patterns B3, C3, D3 and E3, thereby avoiding the slot structure or the module structure in the resonance mode. Can react insensitively.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, It will be understood that various modifications and applications not illustrated in the drawings are possible. For example, each component specifically shown in the embodiments of the present invention can be modified and implemented. It is to be understood that all changes and modifications that come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

According to the communication circuit integrated module according to the present invention, since a plurality of circuit elements may be implemented as a single package element, the mounting area on the substrate may be minimized, thereby providing a degree of freedom in layout design of other external modules.

In addition, according to the present invention, the multilayer substrate design technique and the BGA design technique are introduced to minimize the interference between the substrate layers, the design of the line pattern is easy, and the signal loss can be minimized.

In addition, according to the present invention, it is possible to suppress the signals of parasitic components such as harmonic signals generated by the resonance phenomenon, it is possible to prevent the occurrence of interference or loss of signals between the transmission and reception signals, signals of various bands It works.

Claims (9)

A first substrate layer on which a baseband unit, a transceiver unit, a transceiver, a power amplifier module, and a filter unit are mounted; A second substrate layer and a fourth substrate layer on which a ground pattern is formed; A third substrate layer and a fifth substrate layer on which line patterns are formed; And It includes a multilayer structure substrate consisting of a sixth substrate layer on which a BGA (Ball Grid Array) pattern is formed, The base band part, the transceiver part, the transmission and reception separation unit, the power amplifier module and the filter unit form a single package, mounted on a first substrate layer corresponding to the top layer of the multilayer structure substrate, And a via hole for suppressing resonance mode in an area in which a slot structure is formed by a metal pattern in an inner layer of the multilayer structure substrate. The method of claim 1, wherein the transmission and reception separation unit, the power amplifier module and the filter unit Communication circuit integrated module provided with a plurality to process a multi-band transmission and reception signal. The method of claim 1, The base band unit is mounted on the upper right side of the substrate, the transceiver unit is mounted on the lower right side of the substrate, the transmission and reception separation unit is mounted on the left side of the substrate, the power amplifier module is mounted to the right side of the transmission and reception separation unit, The filter unit is a communication circuit integrated module mounted to the right side of the power amplifier module. The method of claim 1, wherein the transmission and reception signal is Communication circuit integration module including at least one of the UMTS signal, PCS signal, DCN signal. delete The metal pattern according to claim 1, The communication circuit integrated module avoiding the slot structure by differentiating and distributing one or more factors of size, length, and bending angle. 7. The slot structure of claim 6, wherein the slot structure to be avoided A communication circuit integrated module having a slot structure of a size corresponding to a harmonic component of a used frequency wavelength. The metal pattern according to claim 1, A communication circuit integrated module including at least one of a line pattern, a ground pattern, a copper cut pattern, and a bonding pattern. The via hole of claim 1, wherein the via hole for suppressing the resonance mode Communication circuit integrated module formed in the ground region of the slot structure is formed.

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