KR101336582B1 - Loadport - Google Patents

Abstract

The present invention relates to a load port that can improve the efficiency of the operation of mounting the load port to the semiconductor transfer equipment (EFEM) and the separation or mounting for maintenance. The load port includes a base plate in contact with the semiconductor transport equipment (EFEM), a support portion protruding from one surface of the base plate to support a wafer cassette, and an alignment portion attached to a rear surface of the base plate, wherein the alignment portion has a center portion at a lower portion thereof. The left and right alignment members protruding toward and the front and rear alignment members which become narrower toward the outer lower side with respect to the rear surface are provided to guide the load port to the proper position when the load port is mounted on the semiconductor transport equipment (EFEM). Significantly improve the efficiency of the installation work on the transport equipment (EFEM) and the separation work from the semiconductor transport equipment (EFEM) for replacement due to maintenance and failure.

Description

Loadport {LOADPORT}

The present invention relates to a load port, and more particularly, to a load port that can be mounted in the correct position when mounting the load port to the semiconductor transport equipment.

In general, a semiconductor device is implemented by depositing and patterning various materials on a wafer, which is a substrate, in a thin film form, and for this, different processes such as deposition, etching, cleaning, and drying processes are required.

A device for transferring wafers is widely used to perform these steps. Among them, a load port is widely used to supply wafers in a cassette to a semiconductor transfer equipment (EFEM).

If the load port fails, the wafer cannot be supplied and the production line must be shut down. This situation can cause significant damage to production. To prevent this, spare load port should be provided and if a failure occurs, replace it immediately and restart the production line. However, there is a problem that a considerable time takes to mount the load port.

In addition, when the load port is mounted, it must be perfectly in close contact with the coupled portion of the semiconductor transfer equipment (EFEM), and the wafer is smoothly fed only when it is horizontal without tilting, and there is a problem that it takes much time to set it correctly.

In addition, since the load port has a considerable weight and is a sensitive device, damage may occur even with a small impact. In general, when the load port is transported, a worker lifts it by hand or moves it using a wheeled cart to increase the possibility of damage to the product. There is a problem.

In addition, there is a problem in that the load port is too heavy for the worker alone to lift or transport it, the manpower must be input.

Therefore, the present invention has been made in view of the above problems, the present invention is in close contact with the coupling surface of the semiconductor transport equipment (EFEM) when mounting the load port to induce horizontal and horizontal to minimize the setting work, mounting the load port or It provides a load port that can be replaced quickly by one worker when performing maintenance or replacement by failure.

The load port according to an embodiment of the present invention includes a base plate in contact with the semiconductor transfer equipment (EFEM), a support portion protruding from one surface of the base plate to support the wafer cassette, and an alignment portion attached to the rear surface of the wafer plate. The alignment part may include a left and right alignment member having a central portion protruding downward and a front and rear alignment member which is narrowed toward the outer lower portion with respect to the rear surface.

For example, the left and right alignment members may have any one of an inverted trapezoidal shape, a semicircle shape, and a triangular shape.

For example, the front and rear alignment members may have an inclination on one of an outer surface and an inner surface.

The left, right, or one side of the alignment member protrudes with an inclination, and an inclined surface is formed on the front, rear, or one side of the alignment member, and when the mounting member is mounted on one side of the semiconductor transfer equipment, the positions may be aligned with each other.

For example, the load port may further include a transfer unit capable of lifting and transferring the base plate.

For example, the transfer unit may include a wheel member for transferring the base plate, a height adjusting member capable of raising and lowering the load port, and a tilt member capable of tilting in one direction.

For example, the transfer unit may further include a foot brake which is formed under the transfer unit to reduce or stop the speed during the transfer.

According to such a load port, a single worker rather than a plurality of workers can be easily mounted to be in close contact with the coupling portion of the semiconductor transfer equipment (EFEM) to be horizontally mounted.

The left and right alignment members can easily induce left and right alignment by having any one of an inverted trapezoidal shape, a semicircle shape, and a triangular shape.

The front and rear alignment members may easily induce front and rear alignment by inclining the inner surface.

On the other hand, the left, right or one surface of the alignment member protrudes with an inclination and the inclined surface is formed on the front, rear or rear surface, it is possible to easily guide the left and right alignment and the front and rear alignment.

In addition, when the load port further includes a transfer unit capable of lifting and transferring the base plate, it is easy to transfer.

1 is a perspective view showing a load port coupled to a semiconductor transport equipment (EFEM) according to an embodiment of the present invention.
FIG. 2 is an exploded perspective view showing that the load port is coupled to the semiconductor transport equipment (EFEM) shown in FIG. 1.
3 is a perspective view showing left and right alignment members.
4 is a perspective view showing the front and rear alignment members.
5 is a perspective view showing the front, rear, left and right alignment members.
6 is a perspective view showing a transfer unit according to another embodiment.
7 is a side view showing an operating state of the load port by the transfer unit shown in FIG.

The present invention is capable of various modifications and various forms, and specific embodiments are illustrated in the drawings and described in detail in the text. It should be understood, however, that the invention is not intended to be limited to the particular forms disclosed, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention.

The terms first, second, etc. may be used to describe various elements, but the elements should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In the present application, the terms "comprising" or "having ", and the like, are intended to specify the presence of stated features, integers, steps, operations, elements, parts, or combinations thereof, But do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, parts, or combinations thereof.

Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs.

Terms such as those defined in commonly used dictionaries are to be interpreted as having a meaning consistent with the meaning in the context of the relevant art and are to be interpreted as ideal or overly formal in meaning unless explicitly defined in the present application Do not.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Reference will now be made in detail to the preferred embodiments of the present invention, examples of which are illustrated in the accompanying drawings.

1 is a perspective view showing a load port coupled to a semiconductor transfer equipment (EFEM) according to an exemplary embodiment of the present invention, Figure 2 is a load port coupled to the semiconductor transfer equipment (EFEM) shown in Figure 1 3 is a perspective view showing left and right alignment members, and FIG. 4 is a perspective view showing front and rear alignment members.

1 to 2, the load port 100 according to an embodiment of the present invention includes a base plate 110, a support 120, and an alignment 130.

The base plate 110 is installed so that at least part thereof may be attached to the semiconductor transport equipment (EFEM). One surface of the base plate 110 is preferably in close contact with the one surface of the semiconductor transfer equipment (EFEM) to be horizontal. One side of the base plate 110 may be formed to open and close a pod F so that the semiconductor wafer may be transferred into the semiconductor transfer equipment EFEM.

On the other hand, the pod (F) can be opened and closed with a motor and a gear inside the load port (100). Alternatively, the pod F may be driven through a pneumatic cylinder or a hydraulic cylinder. Since the interior of the semiconductor transport equipment (EFEM) maintains a clean room, it is preferable that the pod (F) is completely isolated from the outside for cleanliness of the semiconductor transport equipment (EFEM).

The support part 120 puts the wafer cassette 10 so that the wafer cassette 10 containing the semiconductor can be transferred into the semiconductor transfer equipment EFEM through the pod F. Located close to the bottom, the base plate 110 is formed to protrude in the opposite direction of the surface coupled to the semiconductor transfer equipment (EFEM).

The support part 120 includes the cassette coupling plate 121 to which one side is coupled to the wafer cassette 10.

The cassette coupling plate 121 is installed to be coupled to the upper surface of the support portion 120, it is preferable to have a flat plate shape so that the wafer cassette 10 can be seated.

The cassette coupling plate 121 may have a fastening protrusion 122 to fix the wafer cassette 10. Threads may be formed on the outer circumference of the fastening protrusion for a more secure coupling. Alternatively, irregularities may be formed in place of the fastening protrusions.

The alignment unit 130 may induce the load port 100 to be coupled to the set position even when the load port 100 is coupled to the semiconductor transfer equipment (EFEM) even in a slightly off position. At least one alignment unit 130 is installed on the upper portion of the base plate 110. For example, the alignment unit 130 may be formed to be symmetrical with respect to the center of the top of the base plate 110.

In addition, the alignment unit 130 may be formed at three or more spaced apart at regular intervals on the top of the base plate 110. The alignment unit 130 should use a solid material to support the weight of the load port, it is preferable to use a high hardness among the metal material.

The alignment unit 130 may include left and right alignment members 132 coupled to one side of the upper end of the base plate 110, and front and rear alignment members 134 coupled to the other side of the left and right alignment members 132. have.

A part of the left and right alignment members 132 protrudes to one side and a second left and right sloped surface having an inclined surface symmetrical to the first left and right sloped surface 132a and the first left and right sloped surface 132a on both sides of the protruding portion ( 132b) is formed, the lower portion may be formed to have a horizontal surface (132c) to maintain the horizontal level of the load port 100, the protruding portion of the left and right alignment member 132 may form a trapezoidal shape. .

Correspondingly, left and right seating members 132 ′ having an inverted trapezoid shape corresponding to the protruding portions of the left and right alignment members 132 may be formed at one side of the semiconductor transport equipment EFEM. On the contrary, the protrusions of the left and right alignment members 132 may be formed with trapezoidal grooves, and the inverted trapezoidal grooves of the left and right seating members 132 'may be formed with trapezoidal protrusions.

In addition, the left and right alignment members 132 and the left and right seating members 132 ′ may include at least one through hole 133 which may be fastened by a fixing bolt. For example, the left and right alignment members 132 and the left and right seating members 132 ′ are formed with three through holes 133 which are concentric with each other, and two through holes 133 are fixed bolts 134a. Coupled to the load port 100 or the semiconductor transfer equipment (EFEM), respectively, and the load port 100 is aligned with the semiconductor transfer equipment (EFEM) and then completely fixed to the left and right alignment members 132 and left and right. The left and right alignment members 132 and the left and right seating members 132 'may be fixed to each other through the through screws 134b in the remaining concentric through holes 133 formed in the seating members 132'. .

Meanwhile, referring to another embodiment of the left and right alignment members 132 with reference to FIGS. 3B and 3C, the parts contacting each other when the left and right alignment members 232 and the seating member 132 ′ are coupled to each other. May be formed as a semicircular surface 232a forming a curve of a semicircle. The semi-circular surface 232a forms a curved surface as a whole, so that the friction part is formed when the load port 100 is seated on the semiconductor transport equipment (EFEM), so that it can be seated smoothly. Can reduce the impact.

In another embodiment, the coupling portion between the left and right alignment members 332 and the seating member 132 ′ may be formed of a first left and right sloped surface 332a and a second left and right sloped surface 332b having a triangular shape with the same inclination angle. . Alternatively, on the contrary, the triangular protrusions of the left and right alignment members 332 may be formed as inverted triangular grooves, and the inverted triangular grooves of the seating member 132 'may be formed as triangular protrusions. .

The front and rear alignment member 134 may include a first front and rear slope surface 132a.

The front and rear alignment members 134 may be formed to have a first front and rear slope surface 132a so that the load port 100 may be closely coupled to the semiconductor transport equipment EFEM.

The front and rear seating members 134 ′ may be formed at one side of the semiconductor transport equipment EFEM to correspond to the first front and rear slope surfaces 134a. This is because when the front and rear inclined surface 134a is seated on the inclined surface formed on the front and rear seating member 134 ', the weight of the load port 100 is applied to the front and rear alignment member 132 and the seating member 134' while the inclined surface is in contact with the inclined surface. When applied, the load port 100 may be formed to slide along the inclined surface by the weight, and the sliding phenomenon may have the effect that the load port 100 is in close contact with the semiconductor transport equipment (EFEM).

Meanwhile, referring to another embodiment of the front and rear alignment member 134 with reference to FIG. 4B, the side portions of the front and rear alignment members and the front and rear seating members corresponding to the front and rear alignment members may be formed to have a triangular shape. have.

5 illustrates another embodiment of the alignment unit 130.

The alignment unit 130 may be formed of the front and rear left and right alignment members 330.

The front and rear left and right alignment members 330 realize the functions of the front and rear alignment members 134 and the left and right alignment members 132 as one member when the load port 100 is mounted on the semiconductor transport equipment (EFEM). It can be formed to be. The first left and right inclined surfaces 332a and the second left and right inclined surfaces 332b prevent the mounting of the load port 100 to the left or the right, and the horizontal surface 332c prevents the load port 100 and the semiconductor transfer equipment (EFEM) from being mounted. The combined portion of) may be formed to be horizontal. The first front and rear slopes 334a, the second front and rear slopes 334b, and the third front and rear slopes 334c are formed to be in close contact with the coupling surface when the load port 100 is coupled to the semiconductor transfer equipment EFEM. In addition, the mounting portion 130 ′ formed in the semiconductor transfer equipment (EFEM) is also preferably made of a corresponding shape so that the front, rear, left, and right alignment members 334 can be seated. In addition, at least one of the front, rear, left and right alignment members 330 may be installed at an upper portion of the load port. For example, two left and right alignment members may be installed to be symmetrical to both sides with respect to the upper center of the load port.

6 is a perspective view illustrating a transfer unit 400 according to another embodiment, and FIG. 7 is a side view illustrating an operation state of the load port 100 by the transfer unit 400 illustrated in FIG. 6.

6 to 7, the transfer unit 400 according to another embodiment of the present invention is used to mount the load port 100 to a transfer and semiconductor transfer equipment (EFEM), and the load port 100. Combined with the lower portion of the load port 100 can be transported.

The conveying unit 400 is provided at a lower portion of the wheel member 410, which enables the conveyance, and the height adjusting member 420, which can be transported up and down when the load port 100 is mounted on the semiconductor conveying equipment (EFEM), the rod. When the port 100 is mounted on the semiconductor transfer equipment (EFEM), it includes a tilt member 430 to facilitate the mounting of the alignment portion 130 to the seating portion (130 ').

The wheel member 410 is preferably formed of a circular wheel coupled to the lower bottom surface of the transfer unit 400 to transfer the transfer unit 400. As the wheel material of the wheel member 410, it is preferable to use a material excellent in shock absorption. A pair of the front wheel or the rear wheel of the wheel member 410 may be formed to be rotatable to adjust the direction. In addition, it may be formed to include a brake (not shown) on the outside of the wheel to correspond to the situation to be stopped at a specific position.

The height adjusting member 420 is formed to raise and lower the load port 100.

At least one height adjusting member 420 may be installed at one side of the transfer part 400. For example, the height adjusting member 420 may be installed at both sides of the upper plate 401 of the transfer unit 400. An upper portion of the height adjusting member 420 may be formed with a fastening member such as a protrusion which may be fastened with the load port 100. A power transmission device (not shown) formed of a motor (not shown) and a gear (not shown) may be further included in the transfer part 400 to move up and down the height adjusting member 420. Alternatively, the hydraulic cylinder (not shown) or the pneumatic cylinder (not shown) may be coupled to one side of the height adjusting part 420 to raise and lower the height adjusting member 420 by using hydraulic pressure or pneumatic pressure.

The tilt member 430 is formed to be rotated based on a predetermined axis so as to smoothly seat the alignment unit 130.

At least one tilt member 430 may be installed at one side of the transfer part 400. For example, the tilt member 430 may be installed at both sides of the upper plate 401 of the transfer part 400. An upper portion of the tilt member 430 may form a locking step for rotating the load port 100 raised by the height adjusting member 420. A power transmission device (not shown) formed of a motor (not shown) and a gear (not shown) may be further included in the transfer part 400 to rotate the tilt member 430.

On the other hand, the transfer unit 400 may further include a foot brake 440 that can reduce or stop the speed when the load port 100 is transported after lifting the lower portion.

The foot brake 440 is installed below the transfer unit 400 and may be connected to one side by means for pressing the wheel member 410 and a wire (not shown). For example, pressing members (not shown) coupled with rubber packing (not shown) may be formed on both side surfaces of the wheel member 410. When the foot brake 440 is operated using a foot, the pressing member may be formed. (Not shown) pressurizes both sides of the wheel member 410, and the rubber packing coupled to one side of the pressing member causes friction with pressure on the side of the wheel member 410 and the rotational force of the wheel member 410 Can be suppressed.

The foot brake 440 is preferably formed in a wide shape so as to be easily stepped on, and may be used by bending a bar-shaped pedal or a metal rod into a square shape or the like.

While the present invention has been described in connection with what is presently considered to be practical and exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit and scope of the invention.

100: load port 110: base plate
120: support portion 130: alignment portion
132: left and right alignment member 134: front and rear alignment member
400: transfer unit 410: wheel member
420: height adjustment member 430: tilt member

Claims (7)

A base plate in contact with the semiconductor transfer equipment (EFEM);
A support part protruding from one surface of the base plate to support a wafer cassette;
Left and right alignment members attached to the base plate and having protruding portions having first and second left and right inclined surfaces formed on both sides thereof, and front and rear alignment members attached to the base plate and provided with inclined surfaces formed to be narrower toward the bottom. Alignment unit comprising a;
Grooves formed in the semiconductor transport equipment and corresponding to the protruding portions of the left and right alignment members are formed, and when the base plate is placed on the semiconductor equipment, the protruding portions of the left and right alignment members slide along the grooves. Left and right seating members to align the base plate left and right; And
When the base plate is placed on the semiconductor equipment, the inclined surface is provided on the semiconductor transport equipment so that the front and rear alignment members slide closely to the semiconductor transport equipment along the inclined surface, so that the base plate is aligned back and forth. Load port including front and rear seating members. The method according to claim 1,
The left and right alignment member has a load port characterized in that it has one of an inverted trapezoidal shape, a triangular shape. The method according to claim 1,
The front and rear alignment member has a load port, characterized in that having any one of a triangular shape, a right triangle shape. delete The method according to claim 1,
A load port, characterized in that it further comprises; a transfer unit for lifting and transporting the base plate. The method of claim 5, wherein the transfer unit,
A wheel member for conveying the load port;
A height adjusting member capable of raising and lowering the load port; And a tilt member capable of tilting in one direction. The method of claim 5, wherein the transfer unit
The load port is formed in the lower portion of the transfer port characterized in that it further comprises a foot brake that can reduce or stop the speed.

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