KR101327299B1 - Energy Harvesting Device with High Power Density and Method of Manufacturing for the Same - Google Patents

Abstract

The present invention relates to an energy harvesting device having a high power density and a method of manufacturing the same. More particularly, energy is generated by inserting an elastic body and a piezoelectric body having a multi-layer structure stacked over a plurality of metal plates. And an energy harvesting device having a high power density for improving the mutual conversion between energy and increasing the density of power generated per unit area and unit pressure, and a method of manufacturing the same.
An energy harvesting element having a high power density according to the present invention includes a piezoelectric body, a plurality of metal plates positioned to face both ends of the piezoelectric body, and a plurality of elastic bodies positioned between the metal plates. The piezoelectric body includes a substrate, a piezoelectric layer formed on one surface of the substrate, an electrode layer formed on an upper surface of the piezoelectric layer, and an insulating layer formed on an upper surface of the electrode layer.
The present invention also provides a method of preparing a piezoelectric body having a multilayer structure, preparing a plurality of metal plates, placing a plurality of elastic bodies between the plurality of metal plates, and inserting the piezoelectric body between the plurality of metal plates. It consists of steps.

Description

Energy Harvesting Device with High Power Density and Method of Manufacturing for the Same}

The present invention relates to an energy harvesting device having a high power density and a manufacturing method thereof, and more particularly, by inserting an elastic body and a piezoelectric body having a multi-layer structure stacked over a plurality of times between a plurality of metal plates, thereby generating energy. And an energy harvesting device having a high power density for improving the mutual conversion between energy and increasing the density of power generated per unit area and unit pressure, and a method of manufacturing the same.

In general, piezoelectric materials have been applied to fields such as acoustic sensors and acceleration sensors using piezoelectric properties, and in particular, energy harvesting devices for storing and using generated power.

However, the energy harvesting device using the piezoelectric material has a problem that the amount of generated power is small, and there is a limit in increasing the amount of power consisting of a film, a fabric, a single layer form.

In the Korean Patent No. 10-2011-0094675, 'Piezoelectric Fabric and Micro-Power Energy Harvesting System Using the Piezoelectric Fabric,' the piezoelectric fabric includes a lower electrode layer formed by electrospinning conductive polymer material and a piezoelectric layer formed by electrospinning piezoelectric polymer material on the lower electrode layer. And an upper electrode layer formed by electrospinning a conductive polymer material on the piezoelectric layer.

As described above, the piezoelectric fabric is formed of an electrode layer, a piezoelectric layer, and an electrode layer in order, and have a three-layer structure. When electrospinning a piezoelectric fabric, there is a problem that only a voltage within a range of 5 to 50 kV can be radiated, and a higher density and a greater amount of voltage cannot be generated.

Accordingly, the present invention is to solve the above-described problems, by forming a piezoelectric body of the energy harvesting element in a multi-layer structure stacked over a number of times, by inserting together with an elastic body in a plurality of metal plates, energy generation And it is an object of the present invention to provide an energy harvesting device having a high power density to improve the mutual conversion between energy and to increase the density of power generated per unit area, unit pressure and a method of manufacturing the same.

In order to achieve the above object, the energy harvesting device having a high power density of the present invention, the piezoelectric material, a plurality of metal plates positioned to face both ends of the piezoelectric material and a plurality of elastic bodies located between the metal plate, characterized in that do.

The piezoelectric body includes a substrate, a piezoelectric layer formed on one surface of the substrate, an electrode layer formed on an upper surface of the piezoelectric layer, and an insulating layer formed on an upper surface of the electrode layer. The piezoelectric body may be formed in a cylindrical roll, rectangular folding type, or rectangular multi-layer structure, and the piezoelectric layer may be formed of pellets of PVDF, PVDF-TrFE, VDF-TrFE-CFE, or VDF-HFP. It forms using the piezoelectric polymer solution which any one piezoelectric polymer melt | dissolved.

In addition, the piezoelectric polymer solution is 10 to 20wt% by dissolving the piezoelectric polymer in methylethylketone or dimethylformamide solution.

The substrate is made of at least one of copper (Cu), zinc (Zn), magnesium (Mg), aluminum (Al), iron (Fe), tin (Sn), nickel (Ni), stainless steel, or bronze. It is a metal plate.

In addition, the electrode layer may be aluminum (Al), iron (Fe), nickel (Ni), chromium (Cr), titanium (Ti), molybdenum (Mo), silver (Ag), platinum (Pt), tungsten (W), It is made of a material of at least one of gold (Au), iridium (Ir) or copper (Cu).

The piezoelectric body may be inserted into a plurality of sheets between a plurality of metal plates, and the elastic body is made of a material of rubber, silicon, latex or iron, and has a spring, spiral, ball, or sponge shape. In addition, the metal plate is composed of a plurality of metal layers.

The present invention also provides a method of preparing a piezoelectric body having a multilayer structure, preparing a plurality of metal plates, placing a plurality of elastic bodies between the plurality of metal plates, and inserting the piezoelectric body between the plurality of metal plates. It consists of steps.

The preparing of the piezoelectric layer of the multi-layer structure may include preparing a substrate, preparing a piezoelectric polymer solution, immersing the substrate in the piezoelectric polymer solution to form a piezoelectric layer, and piezoelectric on one surface of the substrate. Removing the layer, forming an electrode layer on an upper surface of the piezoelectric layer formed on the other surface of the substrate, forming an insulating layer on the upper surface of the electrode layer, and forming the substrate on which the insulating layer is formed into a multi-layer structure. Consists of steps.

In the preparing of the piezoelectric polymer solution, the piezoelectric polymer is dissolved in methylethylketone or dimethylformamide solution to prepare a piezoelectric polymer solution of 10 to 20 wt%. In addition, the piezoelectric polymer is any one of pellets of PVDF, PVDF-TrFE, VDF-TrFE-CFE or VDF-HFP.

In the forming of the electrode layer, the electrode layer may be thermally evaporated, E-beam evaporation, RF or DC sputter, E-beam, Electro-plating, Chemical. It is formed by any one of chemical vapor deposition.

Further, the step of forming the piezoelectric layer may be made of either dip coating or dip-drawing coating.

In the step of making the substrate having the insulating layer formed into a multi-layer structure, the substrate on which the insulating layer is formed is wound one or more times to form a cylindrical roll, or a rectangular folding type or a rectangular stacked layer type. Bend as much as possible to form a multi-layer structure.

As described above, according to the present invention, an energy harvesting device having a high power density is formed by stacking a piezoelectric body in a multi-layer structure and inserting a plurality of metal plates together with an elastic body to generate energy and energy. It can improve the mutual conversion and increase the density of power generated per unit area and unit pressure.

Therefore, the energy harvesting device having such a high power density has a high power density compared to the manufacturing cost and the size of the device, thereby leading to industrial development and economic effects.

1 is a perspective view of an energy harvesting device having a high power density according to an embodiment of the present invention.
2 to 5 are cross-sectional views illustrating a manufacturing process of a piezoelectric body according to an embodiment of the present invention.
6 is a perspective view illustrating a piezoelectric body having a multilayer structure according to an embodiment of the present invention.
7 is a flowchart illustrating a method of manufacturing an energy harvesting device having a high power density according to an embodiment of the present invention.
8 is a flowchart illustrating a step of preparing a piezoelectric body having a multi-layer structure according to an embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the like elements throughout.

1 is a perspective view of an energy harvesting device having a high power density according to an embodiment of the present invention.

As shown in FIG. 1, the energy harvesting device 100 having a high power density is between a piezoelectric body 130, a plurality of metal plates 110 positioned to face both ends of the piezoelectric body 130, and the metal plate 110. It is composed of a plurality of elastic body 120 is located.

The metal plate 110 may be made of a single metal layer or may be made of a plurality of metal layers.

In addition, a single or a plurality of piezoelectric members 130 may be inserted between the plurality of metal plates 110.

The elastic body 120 in one embodiment of the present invention is a spring shape of the iron material (Spring), but the present invention is not limited thereto, and may be made of a material of rubber, silicon or latex material.

In addition, the elastic body 120 may have a spiral shape, a ball shape, or a sponge shape. Typically, the elastic body 120 is excellent in elasticity, which means the property to return to its original state when the volume and shape is changed, and the external pressure is lost when the external pressure is lost. Therefore, the elastic body 120 helps the metal plate 110 and the piezoelectric body 130 where the positional change occurs due to external pressure to be restored to the original position when the external pressure is lost. The piezoelectric body 130 has a piezoelectric direct effect for converting mechanical energy into electrical energy and a piezoleconic converse effect for converting electrical energy into mechanical energy.

In addition, the piezoelectric body 130 of the multi-layer structure is a cylindrical roll type wound the piezoelectric body once or plural times, but the present invention is not limited thereto. Both multi-layer structures can be formed.

2 to 5 are cross-sectional views illustrating a manufacturing process of the piezoelectric body 130 according to an embodiment of the present invention.

2 to 5, the piezoelectric body 130 includes a substrate 131, a piezoelectric layer 132 formed on one surface of the substrate 131, and an electrode layer formed on an upper surface of the piezoelectric layer 132. 133 and an insulating layer 134 formed on the upper surface of the electrode layer 133.

The substrate 131 preferably uses stainless steel, but is not limited to copper (Cu), zinc (Zn), magnesium (Mg), aluminum (Al), iron (Fe), tin (Sn), Both materials of at least one of nickel (Ni) or bronze are possible.

In addition, the piezoelectric layer 132 may be formed using a piezoelectric polymer solution in which the piezoelectric polymer is dissolved.

In the present invention, pellets of PVDF-TrFE can be used as the piezoelectric polymer. In addition, pellets of PVDF, VDF-TrFE-CFE or VDF-HFP can be used.

In this case, the piezoelectric layer 132 is obtained by dissolving the piezoelectric polymer in a methyl ethyl ketone or a dimethylformamide solution to dry a solution of 10 to 20 wt%.

The electrode layer 133 is made of aluminum (Al), but the present invention is not limited thereto, but iron (Fe), nickel (Ni), chromium (Cr), titanium (Ti), molybdenum (Mo), and silver (Ag). , Platinum (Pt), tungsten (W), gold (Au), iridium (Ir) or copper (Cu) may be made of any one or more of the materials.

6 is a perspective view illustrating a piezoelectric body having a multilayer structure according to an embodiment of the present invention.

As illustrated in FIG. 6, the piezoelectric body 130 is formed by rolling a piezoelectric layer 132, an electrode layer 133, and an insulating layer 134 formed on one surface of a substrate in a cylindrical roll shape to form a plurality of metal plates 110. To be inserted in between. The cylindrical roll-type piezoelectric body 130 has a multi-layer structure because the substrate 131, the piezoelectric layer 132, the electrode layer 133, and the insulating layer 134 are stacked several times. Can be. Therefore, the energy harvesting device 100 having the high power density of the present invention using the piezoelectric body 130 may improve energy generation and mutual conversion between energy, and increase the density of power generated per unit area and unit pressure.

On the other hand, the piezoelectric body 130 may be formed in a multi-layer structure of rectangular folding type or rectangular layered type.

7 is a flowchart illustrating a method of manufacturing an energy harvesting device having a high power density according to an embodiment of the present invention.

As shown in FIG. 7, the method of manufacturing the energy harvesting device 100 having a high power density includes preparing a piezoelectric material having a multi-layer structure (S101) and preparing a plurality of metal plates (S102). And (S103) positioning a plurality of elastic bodies between the plurality of metal plates. The piezoelectric body may be inserted into a plurality of metal plates (S104).

In the preparing of the plurality of metal plates (S102), preferably, two metal plates 110 are prepared, but not limited thereto. In addition, the step (S103) of placing the plurality of elastic bodies 120 between the plurality of metal plates 110 preferably includes four elastic bodies between two metal plates, but is not limited thereto. 120 may be positioned between the plurality of metal plates 110.

In addition, when the elastic body 120 is a spring type, the surface of the metal plate 110 and the longitudinal direction of the spring may be orthogonal to each other.

In the step S104 of inserting the piezoelectric body 130 between the plurality of metal plates 110, the piezoelectric body 130 may be manually inserted between the two metal plates 110 on which the elastic body 120 is positioned. It can be inserted using or. At this time, the height of the piezoelectric body 130 is configured not to be higher than the height of the elastic body 120, it can be inserted between the two sheets of metal plate (110).

8 is a flowchart illustrating a step of preparing a piezoelectric body 130 having a multi-layer structure according to an embodiment of the present invention.

As shown in FIG. 8, the piezoelectric body 130 may include preparing a substrate (S101a), preparing a piezoelectric polymer solution (S101b), and immersing the substrate 131 in the piezoelectric polymer solution. Drying to form the piezoelectric layer 132 (S101c), heating the substrate on which the piezoelectric layer 132 is formed to 100 to 150 ℃ (S101d), the piezoelectric layer 132 on one surface of the substrate 131 Removing (S101e), forming the electrode layer 133 on the upper surface of the piezoelectric layer 132 formed on the other surface of the substrate 131 (S101f), the insulating layer 134 is formed on the upper surface of the electrode layer 133 The step S101g and the step of forming the substrate 131 on which the insulating layer 134 is formed may be a multi-layer structure (S101h).

The preparing of the substrate (S101a) is a step of preparing the substrate 131 of a metal material, preferably using stainless steel, but is not limited to copper (Cu), zinc (Zn), magnesium ( Mg), aluminum (Al), iron (Fe), tin (Sn), nickel (Ni) or bronze any one or more of the materials are possible.

In the preparing of the piezoelectric polymer solution (S101b), the piezoelectric polymer is dissolved in a methylethylketone solution to make a piezoelectric polymer solution of preferably 10 to 20 wt%. If the concentration of the piezoelectric polymer solution is less than 10 wt%, the piezoelectric layer 132 may not be formed to a predetermined thickness on the substrate 131, and when the piezoelectric polymer solution exceeds 20 wt%, the piezoelectric layer 132 may be peeled from the substrate. . In addition, the piezoelectric polymer preferably uses pellets of PVDF-TrFE, but not limited thereto, and pellets of PVDF, VDF-TrFE-CFE, or VDF-HFP may be used. In addition, the solution for dissolving the piezoelectric polymer may be a dimethylformamide solution in addition to the methylethylketone solution, but the solubility of the piezoelectric polymer may be lowered.

After immersing the substrate 131 in the piezoelectric polymer solution. In the step of forming the piezoelectric layer 132 by drying (S101c), to form the piezoelectric layer 132, a dip coating is preferably used, but not limited thereto. It is possible. In order to form the piezoelectric layer, the substrate 131 is immersed in a piezoelectric polymer solution for 2 to 4 minutes, preferably for 3 minutes, and then taken out and dried.

The thickness of the piezoelectric layer 132 is not particularly limited or limited, and may be formed to a thickness of about several μm.

In the step (S101d) of heating the substrate on which the piezoelectric layer is formed to 100 to 150 ° C., the substrate 131 is heated to 100 to 150 ° C. for 1 hour to 3 hours in a furnace. Preferably, the furnace is heated to 130 ° C., which is the pellet phase transition temperature of PVDF-TrFE, for 2 hours. When the heating temperature is lower than 100 ° C or higher than 130 ° C, the crystallinity of the surface of the piezoelectric layer does not increase, and the ferroelectric properties of the piezoelectric body do not increase. Therefore, in the heating step, the substrate is heated to 130 ℃ for 2 hours and the ferroelectric properties of the piezoelectric body is increased.

In step S101e of removing the piezoelectric layer 132 on one surface of the substrate 131, acetone is applied to a cotton swab to cause the piezoelectric layer film on one surface of the substrate 131 to rise from the substrate, and the piezoelectric layer film formed using tweezers is removed. Although it is preferable to peel off, this invention is not limited to this, Any method which can remove a piezoelectric layer is applicable.

Forming the electrode layer 133 on the upper surface of the piezoelectric layer 132 formed on the other surface of the substrate 131 (S101f), forming the electrode layer 133 on the surface on which the piezoelectric layer 132 of the substrate is formed Step.

Preferably, the electrode layer 133 is formed by a thermal evaporation method using aluminum (Al), but the present invention is not limited thereto, but iron (Fe), nickel (Ni), chromium (Cr), and titanium (Ti). ), E-beam evaporation of any one or more of molybdenum (Mo), silver (Ag), platinum (Pt), tungsten (W), gold (Au), iridium (Ir) or copper (Cu) It can be formed using any one of a method such as, sputter (RF or DC sputter), this beam (E-beam), electro-plating or chemical vapor deposition (Chemical vapor deposition) method. The thickness of the electrode layer 133 is not particularly limited or limited, and may be formed to a thickness of about several μm.

In the step (S101g) of forming the insulating layer 134 on the upper surface of the electrode layer 133, all of the general insulating layer forming method is applicable and is not particularly limited or limited. The thickness of the insulating layer 134 is not particularly limited or limited, and may be formed to a thickness of about several μm.

In the step (S101h) of forming the substrate on which the insulating layer 134 is formed into a multi-layer structure, preferably, the cylindrical roll is wound by winding the substrate on which the insulating layer 134 is formed once or multiple times. ) To form a multi-layer structure. In this case, the substrate on which the insulating layer 134 is formed may be wound by hand or wound in a cylindrical shape such as a roll.

However, the present invention is not limited thereto, and any method of bending or cutting the substrate 131 on which the insulating layer is formed to form an overlapping structure is possible, thereby making the substrate 131 and the piezoelectric layer 132 constituting the piezoelectric body 130. ), The electrode layer 133 and the insulating layer 134 are stacked several times, so that the piezoelectric body 130 having a multi-layer structure can be formed.

In the method of bending the substrate, a piezoelectric body 130 having a multi-layer structure may be formed by repeatedly zigzag-folding a predetermined width using a manual process or a mechanism. In addition, the piezoelectric body 130 may be cut and overlapped or positioned to have a predetermined width to form the piezoelectric body 130 having a multi-layer structure.

Therefore, the energy harvesting device 100 using the piezoelectric body 130 having a multi-layer structure formed by repeating each layer improves energy generation and mutual conversion between energies, and improves power generation per unit area and unit pressure. The density can be increased.

The terms used throughout the specification of the present invention have been defined in consideration of the functions of the embodiments of the present invention and can be sufficiently modified according to the intentions and customs of the user or operator. It should be based on the contents of.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. .

100: energy harvesting element
110: metal plate
120: elastomer
130: piezoelectric
131: substrate
132: piezoelectric layer
133: electrode layer
134: Insulation layer

Claims (15)

A piezoelectric body comprising a substrate, a piezoelectric layer formed on one surface of the substrate, an electrode layer formed on an upper surface of the piezoelectric layer, and an insulating layer formed on an upper surface of the electrode layer;
To face both ends of the piezoelectric body A plurality of metal plates positioned; And
A plurality of elastic bodies positioned between the metal plates;
Including;
The piezoelectric body,
An energy harvesting device having a high power density, characterized in that a plurality is inserted between the plurality of metal plates. delete The method of claim 1, wherein the piezoelectric body,
An energy harvesting device having a high power density, characterized in that it can be formed in a multi-layer structure of a cylindrical roll type, a rectangular folding type, or a rectangular stacked type. The substrate processing apparatus according to claim 1,
A metal plate made of at least one of copper (Cu), zinc (Zn), magnesium (Mg), aluminum (Al), iron (Fe), tin (Sn), nickel (Ni), stainless steel or bronze. An energy harvesting device having high power density. The method of claim 1, wherein the electrode layer,
Aluminum (Al), Iron (Fe), Nickel (Ni), Chromium (Cr), Titanium (Ti), Molybdenum (Mo), Silver (Ag), Platinum (Pt), Tungsten (W), Gold (Au), Energy harvesting device having a high power density, characterized in that made of at least one material of iridium (Ir) or copper (Cu). delete The method of claim 1, wherein the elastic body,
An energy harvesting device having a high power density, which is made of rubber, silicon, latex, or iron, and has a spring, spiral, ball, or sponge shape. The metal plate according to claim 1,
Energy harvesting element having a high power density, characterized in that consisting of a plurality of metal layers. Preparing a piezoelectric material having a multilayer structure;
Preparing a plurality of metal plates;
Positioning a plurality of elastic bodies between the plurality of metal plates; And
Inserting the piezoelectric body between a plurality of metal plates;
Lt; / RTI >
Preparing the piezoelectric material of the multi-layer structure,
Preparing a substrate;
Preparing a piezoelectric polymer solution;
Immersing the substrate in the piezoelectric polymer solution and then drying to form a piezoelectric layer;
Heating the substrate on which the piezoelectric layer is formed to 100 to 150 ° C;
Removing the piezoelectric layer on one surface of the substrate;
Forming an electrode layer on an upper surface of the piezoelectric layer formed on the other surface of the substrate;
Forming an insulating layer on an upper surface of the electrode layer; And
Making a substrate having the insulating layer formed into a multi-layer structure;
Energy harvesting device manufacturing method having a high power density consisting of. delete The method of claim 9, wherein preparing the piezoelectric polymer solution comprises:
A method of manufacturing an energy harvesting device having a high power density, wherein the piezoelectric polymer is dissolved in a methylethylketone or dimethylformamide solution to form a piezoelectric polymer solution of 10 to 20 wt%. The method of claim 11, wherein the piezoelectric polymer,
Method for manufacturing an energy harvesting device having a high power density, characterized in that any one of the pellets of PVDF, PVDF-TrFE, VDF-TrFE-CFE or VDF-HFP. The method of claim 9, wherein the forming of the electrode layer on the upper surface of the piezoelectric layer formed on the other surface of the substrate,
Thermal evaporation, E-beam evaporation, RF or DC sputter, E-beam, Electro-plating, or Chemical Vapor Deposition Energy harvesting device manufacturing method having a high power density, characterized in that formed in any one way. The method of claim 11, wherein the substrate is immersed in the piezoelectric polymer solution and then dried to form a piezoelectric layer.
A method of manufacturing an energy harvesting device having a high power density, characterized in that it is made of either a dip coating or a dip-drawing coating. The method of claim 11, wherein the forming of the substrate on which the insulating layer is formed has a multi-layer structure.
Energy harvesting device, characterized in that to form a multi-layer structure by winding the substrate on which the insulation layer is formed to form a cylindrical roll (roll) type or to be a rectangular folding type or a rectangular stacked layer type. Manufacturing method.

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