KR101315691B1 - Flexible panel bonding method and apparatus - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a panel bonding technique, and more particularly, to a panel bonding method and apparatus for performing an alignment and bonding process of a flexible panel.
According to the present invention, the flexible panel for bonding is fixed to the right position over the upper part of the panel stage unit and the upper part of the vacuum backup unit to maintain the fixed state without moving in place until the bonding operation is completed. Aligning the flexible panel; A bonding object alignment step of displacing and aligning an object to be bonded at an upper predetermined position of the flexible panel by a pickup unit; A bonding step of performing a pressure bonding operation on the bonding object aligned in the bonding object alignment step by a pressing tool; A bonding operation completion step of displacing another object to be bonded to another predetermined position on the upper part of the flexible panel by a pickup unit, aligning the same, and performing a bonding operation repeatedly by a pressing tool to complete the bonding operation; The present invention provides a panel bonding method including a panel unloading step of unloading a flexible panel having a bonding operation completed from a panel stage unit and a vacuum backup unit, and a panel bonding apparatus for performing the method.

Description

Flexible panel bonding method and apparatus

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a panel bonding technique, and more particularly, to a panel bonding method and apparatus for performing an alignment and bonding process of a flexible panel.

In general, the alignment method that is performed before the main work is performed in the existing panel bonding work is performed by displacing the panel to the right position for the bonding work and then performing the bonding work.

Such a conventional method is difficult to position automatically precisely at the correct position due to the characteristics of the flexible panel, so when the FOG (Film on glass), COG (Chip on glass), etc., which is the main work are made, There is a problem that the defective rate is high.

That is, in the case of a flexible panel having a characteristic that it is difficult to properly align the work in place, there is always a difficulty in aligning the work of the panel, which is premised to perform the main work of bonding.

In addition, in the case of the bonding operation as a main work, a bonding operation is performed by displacing and aligning an object for bonding, for example, a chip or a film, to a predetermined position, that is, even when the flexible panel is shifted in position every bonding operation. After performing the alignment work in which the bonding position changes at that time until the displaced position where the bonding is made, the object for bonding is always performed by simply reciprocating to a constant bonding position to perform the alignment work.

Therefore, it is difficult to perform precise displacement of the flexible panel due to the alignment operation of the flexible panel in which the alignment position of the panel is changed for each bonding operation, resulting in a decrease in productivity and improvement in quality.

The present invention has been researched and developed in order to overcome such conventional problems.

An object of the present invention is to pre-prepared during the bonding operation of the panel for the alignment of the panel, and to fix it in a precise and secure position, and once it is fixed, it is lifted or released in place until the completion of the operation. It does not move as it is and does not move as it is, while aligning the bonding object such as film or chip to the position to be bonded directly to the position to be bonded, so that the bonding work, which is this work, is performed precisely. This is to be made easily, and to improve the productivity thereof.

In addition, another object of the present invention is a series of alignment process for the panel or the alignment work for the bonding object and the bonding work, which is the main work is also performed to align the precise and clear positioning by the alignment vision camera Bonding This work aims to bring about an improvement in quality by allowing the work to be performed precisely.

In order to achieve the above object, the present invention aligns the flexible panel for bonding to the right position over the upper part of the panel stage unit and the upper part of the vacuum backup unit, and does not move in place until the bonding operation is completed. Aligning the flexible panel to maintain the fixed state as it is; A bonding object alignment step of displacing and aligning an object to be bonded at an upper predetermined position of the flexible panel by a pickup unit; A bonding step of performing a pressure bonding operation on the bonding object aligned in the bonding object alignment step by a pressing tool; A bonding operation completion step of displacing another object to be bonded to another predetermined position on the upper part of the flexible panel by a pickup unit, aligning the same, and performing a bonding operation repeatedly by a pressing tool to complete the bonding operation; And it provides a panel bonding method comprising a panel unloading step of unloading the flexible panel completed the bonding operation from the panel stage unit and the vacuum backup unit.

In addition, the present invention provides a panel alignment unit comprising a panel stage unit and a vacuum backup unit; An alignment vision camera unit for checking an alignment state of a panel, an alignment state of a panel connector, and an alignment state of a bonding object, respectively; Pick-up unit for holding the bonding object and feeding it to the right position; And a pressing tool for bonding operations for bonding each other in a state in which the bonding objects are aligned in the panel connector at the correct position. The panel alignment fixing unit supports the panel from the bottom and maintains a horizontal state. In order to provide a panel stage unit and a vacuum backup unit to be fixed in place without moving the connector portion of the panel in a position adjacent to the panel stage unit, the vacuum backup unit is a plurality of The alignment vision camera unit includes a panel alignment camera unit for checking the alignment state of the panel, a panel connector and a chip for checking the alignment state of the panel connector and the bonding object. Separate to check the alignment of the alignment camera unit and panel connector A panel connector alignment camera unit, wherein the panel alignment camera unit, the panel connector and chip alignment camera unit, and the panel connector alignment camera unit have the panel stage unit fixed to a fixed position, The position of the panel and the panel alignment camera unit and the panel are configured to be positioned so that the vacuum backup unit, and the pick-up unit holding the bonding object and the pick-up unit to be fed to the right position at mutually corresponding positions. The connector and the chip alignment camera unit are each formed in the form of a pair of assemblies, and the pair of assemblies are configured such that their widths can be varied with each other, and the pair of assemblies are each guided and moved horizontally and horizontally. It is installed so that, and the distance between the pair of assembly adjustment mechanism for The panel bonding apparatus comprising return mechanism is provided respectively for returning to the position is provided.

delete

delete

delete

delete

delete

In addition, the adjustment device for distance adjustment is provided with a panel bonding device which is configured to be spaced apart from the pair of assemblies provided with a pair of revolving rollers are driven by a drive motor and installed in a predetermined distance apart.

In addition, the return mechanism is provided with a panel bonding device is configured by installing in the form of a return spring between the pair of assemblies.

Thus, according to the present invention, when the bonding operation of the panel as a preliminary preparation for the alignment of the panel to be fixed in a precise and accurate position to be fixed, and once the fixing is made in place until the completion of this operation or Bonding objects, such as films or chips, to be bonded directly to the position where they are to be bonded while maintaining their exact position without moving, without being separated, allowing precise bonding at the correct position. The work can be easily performed, and the productivity can be improved, and a series of alignment processes for these panels, alignment work on the bonding objects, and bonding work, which is the main work, are also precisely performed by the alignment vision camera unit. Align and bond with clear positioning By allowing you to precisely perform this task, it is possible to improve the quality.

1 is a schematic schematic diagram showing a panel bonding method of the present invention;
2 is an overall schematic view showing a preferred example of the panel bonding apparatus of the present invention;
3 is a partially enlarged view of FIG. 2;
4 is an enlarged view of a part of FIG. 3;
5 is a schematic longitudinal cross-sectional view for illustrating the main concept of FIG. 4;
6 is a partially omitted side view illustrating the vision camera unit in FIG. 2;
FIG. 7 is an enlarged perspective view showing a part of the configuration of the vision camera unit in FIG. 6;
8 is a longitudinal cross-sectional view of the main portion of FIG.

Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings.

First, a panel bonding apparatus of the present invention will be described in detail. The present invention provides a panel alignment fixing unit (1) comprising a panel stage unit (10) and a vacuum backup unit (12); An alignment vision camera unit 5 for checking the alignment state of the panel 8, the alignment state of the panel connector, and the alignment state of the bonding object 9, respectively; Pick-up unit (6) for holding the bonding object (9) and feeding it to the right position; And a pressing tool 7 for bonding to each other in a state where the bonding objects 9 are aligned in the correct position of the panel connector.

At this time, the panel alignment fixing unit (1) provides a panel stage unit (10) to support the panel from the bottom and maintain a horizontal state and the connector of the panel (8) in a position adjacent to the panel stage unit (10) It is made by providing a vacuum backup unit 12 so that the part can be fixed in place without moving, the vacuum backup unit 12 is formed in the form of a vacuum chuck having a plurality of vacuum holes 14 therein.

In addition, the alignment vision camera unit 5 is used to check the alignment state of the panel alignment camera unit 2 for checking the alignment state of the panel 8 and the panel connector and the bonding object 9. The panel connector and chip alignment camera unit 3, and a separate panel connector alignment camera unit 4 for checking the alignment state of the panel connector is made.

In addition, the panel alignment camera unit 2, the panel connector and chip alignment camera unit 3, and the panel connector alignment camera unit 4 are the panel stage unit in which the panel is fixed at a fixed position ( 10), the vacuum backup unit 12, and the position of the displacement so that the position can be configured to be located at the corresponding position to each other up to the pick-up unit (6) for holding the bonding object and feeding the fixed position do.

In this case, the panel alignment camera unit 2, the panel connector and the chip alignment camera unit 3 are formed in the form of a pair of assemblies 20 and 30, respectively, and the pair of assemblies 20 and 30, respectively. The configuration is made so that the mutual width is variable.

In addition, the pair of assemblies 20 and 30 are installed to move horizontally in the horizontal direction by taking the guides 22 and 32, respectively, and the distance adjustment adjusting mechanism between each of the pair of assemblies 20 and 30 ( 24 and 34 and return mechanisms 26 and 36 for returning to the original position are respectively provided to constitute the configuration.

At this time, the distance adjustment control mechanism (24,34) is driven by the drive motors (24a, 34a) and provided with a pair of idle rollers (24b, 34b) installed in a predetermined distance apart, respectively, the pair of The configuration is made so as to space apart the assemblies 20, 30.

In addition, the return mechanisms 26 and 36 may be configured by installing a return spring between the pair of assemblies 20 and 30.

Next will be described in detail based on the principle of the method of the present invention the process in which the device of the present invention is made as described above.

First of all, as the present invention, as shown in the present invention, the bonding operation is performed by aligning the flexible panel for bonding to the right position over the upper portion of the panel stage unit 10 and the upper portion of the vacuum backup unit 12. Flexible panel alignment step to maintain the fixed state without moving in place until the completion; A bonding object alignment step of displacing and aligning an object to be bonded at an upper predetermined position of the flexible panel by the pickup unit 6; A bonding step of performing a pressure bonding operation on the bonding object aligned in the bonding object alignment step by a pressing tool; Bonding work completion step of displacing and aligning another object to be bonded to the other predetermined position on the upper part of the flexible panel by the pick-up unit 6 and performing the bonding work repeatedly by the pressing tool 7 to complete the bonding work. ; In addition, the work is sequentially performed according to the panel bonding method including a panel unloading step of unloading the flexible panel having the bonding operation completed from the panel stage unit 12 and the vacuum backup unit 12.

In other words, each step is divided into a more detailed and detailed look as follows.

Flexible Panel Align  step

This step aligns the flexible panel for bonding to the right position over the upper part of the panel stage unit 10 and the upper part of the vacuum backup unit 12, without moving in place until the bonding operation is completed. As a flexible panel alignment step to maintain the fixed state, the panel alignment camera unit 2, the panel connector and the chip alignment camera unit 3, and the panel connector alignment camera unit 4 are actually observed while observing the panel. Alignment is performed to position the flexible panel 8 in the right position over the stage unit 10 and the vacuum backup unit 12, and the position of the panel connector is positioned at the position for bonding the bonding object 9. Check whether it is in the right position and perform the preparation work for bonding work by positioning it in the right position.

In addition, the panel alignment camera unit 2, the panel connector and the chip alignment camera unit 3 are provided with a distance adjustment adjusting mechanism 24 and 34 and a return mechanism 26 and 36 so that the flexible panel 8 is positioned in position. ) By the interaction of the guide (22,32) is carried out to adjust the distance between the assembly (20,30) is made to check the position so that accurate alignment can be made.

At this time, when the flexible panel 8 is positioned as described above, the vacuum negative pressure acts on the vacuum hole 14 of the vacuum backup unit 12 to complete the bonding operation in which the panel connector portion of the flexible panel 8 is described later. It will stay in a fixed position until it moves in place.

Bonding Object Align  step

The next step is to align the object to be bonded to the upper predetermined position of the flexible panel by the pickup unit 6 to align the bonding object. While gripping and aligning to the desired position on the top of the panel connector is aligned to the correct position in the above-described flexible panel alignment step, using the panel connector and chip alignment camera unit (3) to adjust the distance adjustment By the interaction of the mechanism 34 and the return mechanism 36, the distance between the assembly 30 is adjusted by the guide 32 and the check of the position is performed so that accurate alignment can be performed. Perform the preparation work.

Bonding Step

The next step is a bonding step of performing a pressure bonding operation on the bonding object aligned in the bonding object alignment step by the pressing tool 7, wherein the flexible panel alignment step and the bonding object alignment step are respectively performed in the flexible panel alignment step. (8) and the pressing tool (7) is lowered in place while the preparation work by the aligning work for the bonding object (9) is pressed in place by pressing the chips of the bonding object (9) in the upper position of the panel connector. Will do the job.

Bonding work  Completion step

The next step is to bond the object to be bonded to another predetermined position on the upper part of the flexible panel by the pickup unit 6 to align it, and then perform the bonding operation repeatedly by the pressing tool 7 to complete the bonding operation. As a work completion step, it repeats the steps of preparing and bonding work by aligning the flexible panel 8 and the bonding object 9 in the above-described flexible panel alignment step and bonding object alignment step, respectively. Perform the steps to complete the entire bonding operation in sequence.

panel Unloading Step

And finally, the next step is a panel unloading step of unloading the flexible panel, which has been bonded, from the panel stage unit 12 and the vacuum backup unit 12. The operation is completed by releasing the vacuum negative pressure state from the backup unit 12, separating it from the unloading state, and unloading it.

As described above, according to the present invention, it is fixed by the panel alignment fixing part 1 to align the panel 8 as a preliminary preparation during bonding operation of the panel so that the panel 8 is positioned accurately and securely. Bonding objects such as films or chips to be bonded while being held in place without being lifted or released in place until the work is completed by the vacuum backup unit 12 once the fixing is made (9). ) By directing the vision camera unit (2) to the position to be bonded directly, so that the bonding work is done, so that precise bonding work can be easily made at the correct position, and the productivity can be improved. A series of alignment procedures for such panels 8 or alignment work for the bonding objects 9 and bone work Operation is possible to also align vision camera section 5 refined and improved the quality and allow for adequate clear positioning to precisely perform this alignment and bonding operation by.

1: panel alignment fixing unit, 2: panel alignment camera unit,
3: panel connector and chip align camera unit, 4: panel connector align camera unit,
5: vision camera unit, 6: pickup unit,
7: pressing tool, 8: panel,
9: bonding object, 10: panel stage unit,
12: vacuum backup unit, 14: vacuum hole,
20, 30: pair of assemblies, 22, 32: guides,
24, 34: adjusting mechanism for distance adjustment, 24a, 34a: drive motor,
24b, 34b: idle roll body, 26, 36: return mechanism

Claims (10)

Align the flexible panel for bonding to the top of the panel stage unit and the upper part of the vacuum backup unit in the correct position so that the flexible panel stays in place without moving until the bonding operation is completed. Phosphorus step; A bonding object alignment step of displacing and aligning an object to be bonded at an upper predetermined position of the flexible panel by a pickup unit; A bonding step of performing a pressure bonding operation on the bonding object aligned in the bonding object alignment step by a pressing tool; A bonding operation completion step of displacing another object to be bonded to another predetermined position on the upper part of the flexible panel by a pickup unit, aligning the same, and performing a bonding operation repeatedly by a pressing tool to complete the bonding operation; And a panel unloading step of unloading the flexible panel in which the bonding operation is completed from the panel stage unit and the vacuum backup unit.
The flexible panel alignment step is actually performed by the panel alignment camera unit 2, the panel connector and the chip alignment camera unit 3, and the panel connector alignment camera unit 4, and the panel stage unit 10 and the panel alignment unit. Align the flexible panel 8 to the right position over the upper portion of the vacuum backup unit 12, and check whether the position of the panel connector is located at the position for bonding the bonding object 9 Perform the preparatory work for the bonding operation by positioning to the position, the panel alignment camera unit (2) and the panel connector and chip alignment camera unit (3) to adjust the distance so that the flexible panel (8) is in place By adjusting the mechanisms 24 and 34 and the return mechanisms 26 and 36, the distance between the assemblies 20 and 30 is adjusted by riding the guides 22 and 32 to check the position and to perform accurate alignment. Can be opened When the panel 8 is in position, the vacuum negative pressure is applied in the vacuum hole 14 of the vacuum backup unit 12, and the panel connector portion of the flexible panel 8 is not moved in place until the bonding operation is completed. Keep it in a fixed position,
In the bonding object alignment step, the pick-up unit 6 grips the bonding object 9 and performs alignment in a desired position on the panel connector on which the alignment operation is performed at the correct position in the flexible panel alignment step. By using the panel connector and the chip aligning camera unit 3, the distance between the assembly 30 is adjusted by the guide 32 by the interaction of the distance adjusting mechanism 34 and the return mechanism 36. A panel bonding method comprising performing a preparatory work for a bonding operation by allowing a check to be performed and an accurate alignment operation.
delete A panel alignment fixing unit (1) consisting of a panel stage unit (10) and a vacuum backup unit (12); An alignment vision camera unit 5 for checking an alignment state of a panel, an alignment state of a panel connector, and an alignment state of a bonding object, respectively; Pick-up unit (6) for holding the bonding object and feeding it to the right position; And a pressurizing tool 7 for bonding to each other in a state where the bonding objects are aligned in the panel connector at the correct position.
The panel alignment fixing unit (1) provides a panel stage unit (10) to support the panel at the bottom and maintain a horizontal state, and the connector portion of the panel does not move in a position adjacent to the panel stage unit (10). The vacuum backup unit 12 is provided to be fixed in position, and the vacuum backup unit 12 is formed in the form of a vacuum chuck having a plurality of vacuum holes 14 formed therein,
The alignment vision camera unit 5 includes a panel alignment camera unit 2 for checking the alignment state of the panel 8, and a panel connector for checking the alignment state of the panel connector and the bonding object 9. And a chip alignment camera unit 3, and a separate panel connector alignment camera unit 4 for checking the alignment state of the panel connector, wherein the panel alignment camera unit 2, The panel connector and chip align camera unit 3, and the panel connector align camera unit 4 are the panel stage unit 10, the vacuum backup unit 12, and the bonding in which the panel is fixed in position. The displacement of the position is made so that it can be located at a mutually corresponding position until the pick-up unit 6 which grasps the object 9 and feeds it to a fixed position,
The panel alignment camera unit 2, the panel connector and the chip alignment camera unit 3 are each formed in the form of a pair of assemblies 20 and 30, and the pair of assemblies 20 and 30 are mutually mutual. The configuration is made to be variable in width,
The pair of assemblies 20 and 30 are installed to move horizontally in the horizontal direction by taking the guides 22 and 32, respectively, and the distance adjustment adjusting mechanism 24 between the pair of assemblies 20 and 30, respectively. And 34) and return mechanisms (26, 36) for returning to the original position, respectively. delete delete delete delete delete The method of claim 3,
The distance adjusting control mechanisms 24 and 34 are each provided with a pair of revolving roll bodies 24b and 34b which are driven by the driving motors 24a and 34a and are installed at a predetermined distance from each other. Panel bonding apparatus characterized in that the configuration is made to be spaced apart 20,30.
The method of claim 3,
The return mechanism (26,36) is a panel bonding device, characterized in that the configuration is made by installing the return spring between the pair of assemblies (20,30) each other.

Images