KR101310791B1 - Two component type epoxy resin composition - Google Patents

Two component type epoxy resin composition Download PDF

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KR101310791B1
KR101310791B1 KR1020130045862A KR20130045862A KR101310791B1 KR 101310791 B1 KR101310791 B1 KR 101310791B1 KR 1020130045862 A KR1020130045862 A KR 1020130045862A KR 20130045862 A KR20130045862 A KR 20130045862A KR 101310791 B1 KR101310791 B1 KR 101310791B1
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weight
epoxy resin
component
resin composition
amine
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KR1020130045862A
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Korean (ko)
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김재연
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신대아건업 (주)
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02Polycondensates containing more than one epoxy group per molecule
    • C08G59/04Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22Di-epoxy compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50Amines
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62Alcohols or phenols
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00Processes of treating or compounding macromolecular substances
    • C08J3/02Making solutions, dispersions, lattices or gels by other methods than by solution, emulsion or suspension polymerisation techniques
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/34Silicon-containing compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/20Diluents or solvents

Abstract

PURPOSE: A two-component epoxy resin composition is provided to have no problem of stimulating smells due to volatile materials, to be able to be coated with a roller, to be able to form a good appearance coating, and to be able to secure enough time required to do the coating task. CONSTITUTION: A two-component epoxy resin composition comprises a base component and a curing component. The base component includes 80-90 weight% of epoxy resin, 1-10 weight% of low viscosity reactive diluent epoxy resin, 1-10 weight% of non-reactive diluent, and 1-10 weight% of color pigment, but does not include the extender pigment. The curing component includes 20-30 weight% of cycloaliphatic amine, 30-40 weight% of aliphatic amine, 20-30 weight% of benzylalcohol and 1-10 weight% of a hardening accelerator. The epoxy resin is bisphenol A diglycidyl ether which is formed by a reaction of bisphenol A and epichlorohydrin.

Description

2액형 에폭시 수지 조성물{Two Component Type Epoxy Resin Composition}Two Component Type Epoxy Resin Composition

본 발명은 2액형 에폭시 수지 조성물에 관한 것으로서, 더욱 상세하게는, 유기용제를 사용하지 않는 무용제 타입이면서 체질안료를 포함하지 않는 2액형 에폭시 수지 조성물에 관한 것이다. The present invention relates to a two-component epoxy resin composition, and more particularly, to a two-component epoxy resin composition that is a solvent-free type that does not use an organic solvent and does not contain a extender pigment.

에폭시 수지는 분자 내에 에폭시기를 2개 이상 가지는 수지상 물질을 일컫는다. 에폭시 수지는 그것의 에폭시기와 경화제 간의 열경화 반응에 의하여 경화되어 바닥재, 벽재 등과 같은 각종 마감재로 형성된다. 이러한 열경화성 에폭시 수지는 굽힘강도, 굳기 등 기계적 성질이 우수하고 경화 시에 휘발성 물질의 발생 및 부피의 수축이 없고, 경화할 때 재료면에서 큰 접착력을 가지는 등의 장점으로 인하여 도료로서 폭넓게 사용되고 있다. An epoxy resin refers to a dendritic substance having two or more epoxy groups in a molecule. The epoxy resin is cured by a thermosetting reaction between its epoxy group and the curing agent to form various finishes such as flooring, walling and the like. The thermosetting epoxy resin is widely used as a coating material because of its excellent mechanical properties such as bending strength and hardness, no generation of volatile materials and no shrinkage in volume during curing, and a large adhesive strength in terms of materials when curing.

2액형 에폭시 수지 조성물은 에폭시 수지를 포함하는 주제 성분과 경화제를 포함하는 경화제 성분을 도장하기 전에 혼합하여 사용되는 것이다. 2액형 에폭시 수지 조성물은 도장 작업을 효율적으로 하기 위하여 주제 성분 및 경화제 성분에는 유기용제가 포함된 용제형 에폭시 수지 조성물 형태로 지금까지 많이 사용되어 왔으나, 용제형 에폭시 수지 조성물은 용제의 휘발에 따른 환경파괴, 생산설비의 오염, 인체에 대한 유해성 등이 문제로 대두되어 최근에는 무용제형 에폭시 수지 조성물이 개발되고 있는 실정이다. The two-component epoxy resin composition is used by mixing before coating the main component comprising the epoxy resin and the curing agent component comprising the curing agent. The two-component epoxy resin composition has been used in the form of a solvent-type epoxy resin composition in which the main component and the hardener component contain an organic solvent in order to efficiently paint, but the solvent-type epoxy resin composition has been used in an environment due to volatilization of the solvent. Destruction, pollution of production facilities, harmful to the human body, etc. have emerged as a problem in recent years, a solvent-free epoxy resin composition has been developed.

특허공개 제10-2004-0074196호(2004. 08. 23. 공개)는 저온 경화형 2액형 무용제 에폭시 바닥재 도료 조성물을 개시한다. 제시된 조성물은 에폭시 수지, 체질안료, 반응성 희석제, 비반응성 희석제, 첨가제로 된 주제 성분과 아민계 경화제와 경화촉진제를 포함하는 경화제 성분으로 이루어진다. Patent Publication No. 10-2004-0074196 (published Aug. 23, 2004) discloses a low temperature curable two-component solvent-free epoxy floor coating composition. The composition shown consists of a main component of an epoxy resin, a sieving pigment, a reactive diluent, an unreactive diluent, an additive, and a curing agent component comprising an amine-based curing agent and a curing accelerator.

상기한 특허 이외에도 특허등록 제10-0630439호(2006. 09. 25. 등록), 특허등록 제10-0848812호(2008. 07. 22. 등록), 특허등록 제10-1173837호(2012. 08. 08. 등록), 특허공개 제10-2011-0135617호(2011. 12. 19. 공개), 특허공개 제10-2012-0032769호(2012. 04. 06. 공개), 특허등록 제10-1046212호(2011. 06. 28. 등록), 특허등록 제10-1115011호(2012. 02. 03. 등록) 등도 무용제 타입의 에폭시 수지 조성물을 개시하였다. In addition to the above patents, Patent Registration No. 10-0630439 (registered on September 25, 2006), Patent Registration No. 10-0848812 (registered on July 22, 2008), Patent Registration No. 10-1173837 (2012. 08. 08. Registration), Patent Publication No. 10-2011-0135617 (published Dec. 19, 2011), Patent Publication No. 10-2012-0032769 (published Apr. 06, 2012), Patent Registration No. 10-1046212 (2011. 06. 28. registration), Patent Registration No. 10-1115011 (2012. 02. 03. registration), etc. also disclosed the epoxy resin composition of a solvent-free type.

상기와 같이 종래에 제안된 무용제 타입의 에폭시 수지 조성물은 체질안료를 포함하고 있어 롤러 도장에 의하여 도장 작업을 할 수 없기 때문에 건물의 바닥, 벽 등의 외관을 아름답게 장식하기 어렵다는 문제점이 있었다. 이러한 문제점을 해결하기 위해서는 그러한 도장작업 후에 용제형 에폭시 수지 조성물로 마감처리를 할 필요가 있지만, 용제형 에폭시 수지 조성물을 사용하게 되면 위에서 지적한 문제점이 발현되어 무용제형 에폭시 수지 조성물을 사용하는 의미가 퇴색하게 된다. As described above, the conventionally proposed solvent-free type epoxy resin composition contains a extender pigment, and thus, paint cannot be painted by roller coating, which makes it difficult to beautifully decorate the exterior of the building's floor, walls, and the like. In order to solve this problem, it is necessary to finish the coating with a solvent-type epoxy resin composition after such a painting work. However, when the solvent-type epoxy resin composition is used, the above-mentioned problems are manifested and the meaning of using a solvent-free epoxy resin composition is faded. Done.

한편, 체질안료를 포함하지 않으면 주제 성분에 에폭시 수지가 70 중량% 이상, 바람직하게는 80 중량% 이상의 함량으로 많이 포함되어야 하는데, 그러한 경우에는 가사시간이 짧아져서 도장작업을 할 시간적 여유가 없어지게 되고 또한 작업성도 나빠진다는 문제점이 있다. On the other hand, if it does not contain the extender pigment, the epoxy resin should be included in the main component in a content of 70% by weight or more, preferably 80% by weight or more. In such a case, the pot life is shortened so that there is no time for painting work. There is also a problem that the workability worsens.

이에, 본 발명은 상기한 문제점을 해결하기 위하여 안출되었다. 따라서, 본 발명의 목적은 유기용제를 사용하지 않는 무용제 타입이기 때문에 휘발성 물질로 인한 자극적인 냄새 등의 문제가 없으면서 롤러 도장이 가능하여 외관이 아름다운 도장을 형성할 수 있고, 도장작업을 하는데 요구되는 가사시간을 충분히 확보할 수 있어 우수한 작업성을 가지는 2액형 에폭시 수지 조성물을 제공하는 것이다.Accordingly, the present invention has been made to solve the above problems. Therefore, an object of the present invention is a solvent-free type that does not use an organic solvent, so that roller coating is possible without problems such as irritating odor due to volatile substances, so that a beautiful appearance can be formed, which is required for painting. It is to provide a two-component epoxy resin composition having a sufficient pot life and having excellent workability.

또한 본 발명의 목적은 체질안료를 포함하지 않으므로 에폭시 수지 조성물에 의하여 형성된 바닥재 및 벽재의 마모에 의하여 발생하는 분진을 최소화할 수 있는 2액형 에폭시 수지 조성물을 제공하는 것이다. In addition, an object of the present invention is to provide a two-component epoxy resin composition that can minimize the dust caused by the wear of the flooring and wall material formed by the epoxy resin composition because it does not contain a extender pigment.

상기한 목적을 달성하기 위한 본 발명에 따른 2액형 에폭시 수지 조성물은 에폭시 수지 80~90 중량%, 저점도 반응성 희석제 에폭시 수지 1~10 중량%, 비반응성 희석제 1~10 중량%, 및 색상 안료 1~10 중량%를 포함하되 체질안료는 포함하지 않는 주제 성분과 지환족 아민 20~30 중량%, 지방족 아민 30~40 중량%, 벤질알콜 20~30 중량% 및 경화촉진제 1~10 중량%를 포함하는 경화제 성분으로 이루어진다. The two-component epoxy resin composition according to the present invention for achieving the above object is 80 to 90% by weight epoxy resin, 1 to 10% by weight low viscosity reactive diluent epoxy resin, 1 to 10% by weight non-reactive diluent, and color pigment 1 Includes ~ 10% by weight of the main ingredient, but not including the extender pigment 20-30% by weight of alicyclic amine, 30-40% by weight of aliphatic amine, 20-30% by weight of benzyl alcohol and 1-10% by weight of curing accelerator It consists of a hardening | curing agent component.

상기 에폭시 수지는 비스페놀 A와 에피클로로히드린의 반응에 의하여 생성되는 비스페놀 A 디글리시딜 에테르로서, 185~192 g/eq의 당량, 11500~13500 cps(25℃)의 점도를 가지는 것이고, 상기 저점도 반응성 희석제 에폭시 수지는 버사틱 에시드 10(versatic acid 10)의 글리시딜 에스테르이며, 상기 지방족 아민은 분자구조내에 옥시프로필렌(oxypropylene) 구조를 가지는 폴리에테르아민으로서 중량평균 분자량 230, 아민가 240~270 mgKOH/g, 비중 0.95 및 점도 9.5 cps를 가지는 것이고, 상기 지환족 아민은 이소포론디아민(isophorondiamine)과 비스페놀 A 에폭시수지가 반응하여 형성된 지환족 디아민으로서, 아민가 260~285 mgKOH/g, 점도 350~600 cps 및 비중 1.03을 가지는 것이다.The epoxy resin is a bisphenol A diglycidyl ether produced by the reaction of bisphenol A and epichlorohydrin, having an equivalent weight of 185 to 192 g / eq and a viscosity of 11500 to 13500 cps (25 ° C). The low viscosity reactive diluent epoxy resin is a glycidyl ester of versatic acid 10. The aliphatic amine is a polyetheramine having an oxypropylene structure in its molecular structure, and has a weight average molecular weight of 230 and an amine value of 240 to 240. 270 mgKOH / g, specific gravity 0.95 and viscosity 9.5 cps, the cycloaliphatic amine is an alicyclic diamine formed by the reaction of isophorondiamine and bisphenol A epoxy resin, the amine is 260 ~ 285 mgKOH / g, viscosity 350 600 cps and specific gravity 1.03.

상기 비반응성 희석제는 2,2,4-트리메틸펜탄디올 디이소부티레이트인 것이 바람직하다.The non-reactive diluent is preferably 2,2,4-trimethylpentanediol diisobutyrate.

상기 경화촉진제는 2,4,6-트리스((메틸아미노)메틸)페놀인 것이 바람직하다.The curing accelerator is preferably 2,4,6-tris ((methylamino) methyl) phenol.

상기 조성물은 상기 주제 성분에서 실리콘계 소포제 0.1~1 중량%, 실리콘계 레벨링제 0.1~1 중량% 및 고분자형 분산제 0.1~1 중량%를 더 포함할 수 있다. The composition may further comprise 0.1 to 1% by weight of the silicone-based antifoaming agent, 0.1 to 1% by weight of the silicone-based leveling agent and 0.1 to 1% by weight of the polymeric dispersant.

본 발명의 2액형 에폭시 수지 조성물은 용제를 포함하지 않으므로 용제의 휘발에 따른 환경파괴, 생산설비의 오염, 인체에 대한 유해성 등의 문제가 없으며, 체질안료를 포함하지 않으므로 롤러 도장에 의한 도장 작업을 할 수 있어 그것에 의하여 형성되는 바닥재, 벽재 등의 외관을 아름답게 형성할 수 있으며, 그러한 바닥재, 벽재 등이 마모될 때 발생하는 분진을 최소화할 수 있다. 또한 본 발명의 2액형 에폭시 수지 조성물은 주제 성분에서 에폭시 수지의 높은 함량을 가지면서도 도장작업을 하기에 충분한 가사시간을 확보할 수 있어 우수한 작업성을 가진다. Since the two-component epoxy resin composition of the present invention does not contain a solvent, there is no problem such as environmental damage, pollution of production equipment, or harmful effects to human body due to volatilization of the solvent. It is possible to form a beautiful appearance of the flooring material, the wall material and the like thereby formed, it is possible to minimize the dust generated when such flooring material, the wall material and the like. In addition, the two-component epoxy resin composition of the present invention has a high content of the epoxy resin in the main component, while ensuring sufficient pot life for painting work, it has excellent workability.

이하 본 발명을 상세하게 설명한다. Hereinafter, the present invention will be described in detail.

본 발명의 2액형 에폭시 수지 조성물은 주제 성분과 경화제 성분으로 이루어진다.The two-component epoxy resin composition of the present invention consists of a main component and a curing agent component.

주제 성분은 에폭시 수지 80~90 중량%, 저점도 반응성 희석제 에폭시 수지 1~10 중량%, 비반응성 희석제 1~10 중량%, 및 색상 안료 1~10 중량%를 포함하되 체질안료는 포함하지 않는다.The main components include 80 to 90% by weight epoxy resin, 1 to 10% by weight low viscosity reactive diluent epoxy resin, 1 to 10% by weight non-reactive diluent, and 1 to 10% by weight color pigment, but do not include extender pigments.

본 발명에서 사용되는 에폭시 수지는 비스페놀 A와 에피클로로히드린의 반응에 의하여 생성되는 비스페놀 A 디글리시딜 에테르로서, 아래 화학식 1과 같은 구조를 가진다.Epoxy resin used in the present invention is a bisphenol A diglycidyl ether produced by the reaction of bisphenol A and epichlorohydrin, and has a structure as shown in the following formula (1).

화학식 1Formula 1

Figure 112013036371200-pat00001
Figure 112013036371200-pat00001

(여기에서, n은 0 또는 1이고, 평균적으로는 0.11~0.15이며, 그래서 아래 물성을 가지게 된다.)(Here, n is 0 or 1, on average is 0.11 to 0.15, so it has the following properties.)

사용되는 에폭시 수지는 185~192 g/eq의 당량, 11500~13500 cps(25℃)의 점도를 가지는 것이며, 주제 성분에서 80~90 중량%의 범위로 포함된다. 주제 성분에서 에폭시 수지가 너무 적게 포함되는 경우에는 본 발명의 에폭시 수지 조성물은 체질안료를 포함하지 않으므로 다른 성분들이 대응하여 많이 포함되어야 하는데, 그러면 에폭시 수지 조성물에 요구되는 물성을 충족시키기 어려워진다. 반면에 에폭시 수지의 함량이 너무 많게 되면 가사시간이 짧아지고 작업성이 나빠지게 되기 때문에 좋지 않다. 따라서, 상기한 범위가 적절하다. 본 발명에서 사용되는 에폭시 수지는 상온(25℃)에서 액상으로 존재하는 것이다. 통상적으로 많은 에폭시 수지가 사용되지만, 본 발명의 조성에 의하여 요구되는 물성을 만족시키기 위해서는 상기한 바와 같은 특정 에폭시 수지가 사용되어야 한다. The epoxy resin used has an equivalent of 185 to 192 g / eq, a viscosity of 11500 to 13500 cps (25 ° C), and is included in the range of 80 to 90% by weight in the main component. When too few epoxy resins are included in the main component, the epoxy resin composition of the present invention does not include the extender pigment, and thus, other components must be included correspondingly, which makes it difficult to meet the physical properties required for the epoxy resin composition. On the other hand, too much content of the epoxy resin is not good because the pot life is shortened and workability is worse. Therefore, the above range is appropriate. Epoxy resin used in the present invention is present in the liquid phase at room temperature (25 ℃). Typically, many epoxy resins are used, but specific epoxy resins as described above must be used to satisfy the physical properties required by the composition of the present invention.

본 발명에서 사용되는 저점도 반응성 희석제 에폭시 수지는 버사틱 애시드 10(versatic acid 10)의 글리시딜 에스테르이다. 버사틱 애시드 10은 아래 화학식 2에 나타낸 바와 같이, 매우 분지화된 탄소 10개의 터셔리 카복실산이다. The low viscosity reactive diluent epoxy resin used in the present invention is a glycidyl ester of versatic acid 10. Versatic acid 10 is a highly branched 10 carbonic acid carboxylic acid, as shown in Formula 2 below.

화학식 2(2)

Figure 112013036371200-pat00002
Figure 112013036371200-pat00002

(여기에서, R1과 R2는 알킬 그룹이고, 전체 탄소의 갯수는 10개임)Where R 1 and R 2 are alkyl groups and the total number of carbons is 10

이러한 버사틱 애시드 10의 글리시딜 에스테르는 주제 성분에서 에폭시 수지의 고점도를 낮추어서 유연성을 부여하는 역할을 하면서 경화제와의 경화반응에 참여하는 반응성을 가진다. 이 성분은 주제 성분에서 1~10 중량%의 범위로 포함되는데, 너무 적게 함유되는 경우에는 그것에 의하여 달성하고자 하는 효과가 미미하게 되고, 너무 많은 양으로 함유되는 경우에는 다른 성분들의 함량이 적어져야 하는데 그렇게 되면 전체적으로 균형잡힌 물성을 얻을 수 없게 된다. The glycidyl ester of the versatic acid 10 has a reactivity to participate in the curing reaction with the curing agent while serving to give flexibility by lowering the high viscosity of the epoxy resin in the main component. This ingredient is included in the range of 1 to 10% by weight in the main ingredient, if too small, the effect to be achieved by it is insignificant, and if it is contained in too much amount, the content of other ingredients should be less. If you do so, you will not be able to obtain a balanced property.

본 발명에서 사용되는 비반응성 희석제로는 일반적으로 사용되는 가소제가 사용될 수 있다. 예를 들어, 프탈레이트계 가소제로서 DOP(Dioctylphthalate), DBP(Dibutylphthalate) 등이 사용될 수 있지만, 이러한 물질들은 환경유해물질로 규제되고 있는 실정이므로 가급적 사용하지 않는 것이 바람직하고, 그 대신에 2,2,4-트리메틸펜탄디올 디이소부티레이트를 사용하는 것이 바람직하다. 이러한 비반응성 희석제는 경화제와의 경화반응에는 전혀 참여하지 않으면서 점도를 낮추고 도막에 유연성을 부여하는 역할을 한다. 이 성분은 주제 성분에서 1~10 중량%의 범위로 포함되는데, 너무 적게 함유되는 경우에는 그것에 의하여 달성하고자 하는 효과가 미미하게 되고, 너무 많은 양으로 함유되는 경우에는 다른 성분들의 함량이 적어져야 하는데 그렇게 되면 전체적으로 균형잡힌 물성을 얻을 수 없게 된다.As the non-reactive diluent used in the present invention, a plasticizer generally used may be used. For example, DOP (Dioctylphthalate), DBP (Dibutylphthalate), etc. may be used as the phthalate-based plasticizer, but since these substances are regulated as environmentally harmful substances, it is preferable not to use them. Preference is given to using 4-trimethylpentanediol diisobutyrate. These non-reactive diluents serve to lower the viscosity and impart flexibility to the coating film without any participation in the curing reaction with the curing agent. This ingredient is included in the range of 1 to 10% by weight in the main ingredient, if too small, the effect to be achieved by it is insignificant, and if it is contained in too much amount, the content of other ingredients should be less. If you do so, you will not be able to obtain a balanced property.

본 발명에서 사용되는 색상 안료는 색상을 내기 위한 것이다. 이산화티타늄, 시아닌 그린, 시아닌 블루, 카본블랙 등과 같이 색상을 내기 위하여 일반적으로 사용되는 무기안료가 본 발명에서 사용될 수 있다. 색상 안료는 주제 성분에서 1~10 중량%로 함유되는데, 너무 적게 함유되는 경우에는 발색의 효과가 미미하게 되고, 너무 많은 경우에는 다른 성분들의 함량이 적어져야 하는데 그렇게 되면 전체적으로 균형잡힌 물성을 얻을 수 없게 된다.The color pigments used in the present invention are for producing color. Inorganic pigments generally used for producing colors such as titanium dioxide, cyanine green, cyanine blue, carbon black, and the like may be used in the present invention. Color pigments are contained in the main components in an amount of 1 to 10% by weight. If they are contained too little, the effect of color development is insignificant, and in too many cases, the content of other components should be reduced, so that overall balanced properties can be obtained. There will be no.

한편, 주제 성분은 실리콘계 소포제 0.1~1 중량%, 실리콘계 레벨링제 0.1~1 중량% 및 고분자형 분산제 0.1~1 중량%를 더 포함하는 것이 바람직하다. 주제 성분에서 소포제, 레벨링제, 분산제는 통상적으로 사용되는 것이므로 그것들에 대한 상세한 설명은 생략하기로 한다. On the other hand, it is preferable that the main component further contains 0.1-1 weight% of a silicone type antifoamer, 0.1-1 weight% of a silicone type leveling agent, and 0.1-1 weight% of a polymeric type dispersing agent. Antifoaming agents, leveling agents, and dispersants in the subject ingredients are commonly used, and thus detailed descriptions thereof will be omitted.

한편, 경화제 성분은 지환족 아민 20~30 중량%, 지방족 아민 30~40 중량%, 벤질알콜 20~30 중량% 및 경화촉진제 1~10 중량%를 포함한다.On the other hand, the curing agent component includes 20 to 30% by weight of alicyclic amine, 30 to 40% by weight of aliphatic amine, 20 to 30% by weight of benzyl alcohol and 1 to 10% by weight of curing accelerator.

지방족 아민은 분자구조내에 옥시프로필렌(oxypropylene) 구조를 가지는 폴리에테르아민으로서 중량평균 분자량 230, 아민가 240~270 mgKOH/g, 비중 0.95 및 점도 9.5 cps를 가지는 것이 바람직하다. 예를 들어 지방족 아민은 아래 화학식 3과 같은 구조를 가질 수 있다. The aliphatic amine is a polyetheramine having an oxypropylene structure in its molecular structure, and preferably has a weight average molecular weight of 230, an amine value of 240 to 270 mgKOH / g, a specific gravity of 0.95, and a viscosity of 9.5 cps. For example, the aliphatic amine may have a structure as shown in Formula 3 below.

화학식 3(3)

Figure 112013036371200-pat00003
Figure 112013036371200-pat00003

(여기에서, x는 대략 2.5이다.)(Where x is approximately 2.5)

지환족 아민은 이소포론디아민(isophorondiamine)과 비스페놀 A 에폭시수지가 반응하여 형성된 지방족 디아민으로서, 아민가 260~285 mgKOH/g, 점도 350~600 cps 및 비중 1.03을 가지는 것이 바람직하다. 여기에서 비스페놀 A 에폭시 수지는 비스페놀 A와 에피클로로히드린의 반응에 의하여 형성되는 것으로서, 상기 주제 성분에 사용되는 것과 동일한 것일 수 있으며, 또한 하기 화학식 1에서 n이 0인 것이 사용될 수 있다. The alicyclic amine is an aliphatic diamine formed by the reaction of isophorondiamine and bisphenol A epoxy resin, and preferably has an amine value of 260 to 285 mgKOH / g, a viscosity of 350 to 600 cps, and a specific gravity of 1.03. Here, the bisphenol A epoxy resin is formed by the reaction of bisphenol A and epichlorohydrin, and may be the same as that used for the main component, and in the following Chemical Formula 1, n may be 0.

화학식 1Formula 1

Figure 112013036371200-pat00004
Figure 112013036371200-pat00004

사용되는 지환족 아민은 양말단에 아민그룹을 가지는 것으로서, 비스페놀 A 에폭시 수지의 말단에 형성된 2개의 에폭시 그룹이 2개의 이소포론디아민의 한 아민 그룹과 반응하여 결합함에 의하여 형성되는 것이다. The cycloaliphatic amines used are those having an amine group at the end of the sock, formed by reacting and bonding two epoxy groups formed at the ends of the bisphenol A epoxy resin with one amine group of two isophorone diamines.

상기한 지환족 아민과 지방족 아민은 상기한 조성의 비율로 경화제 성분에 포함되면 그것들의 특성이 조화롭게 형성되어 본 발명의 조성물에 적절한 물성을 제공하게 되며, 특히 적합한 가사시간을 얻을 수 있게 해준다. 지환족 아민과 지방족 아민은 각각 20~30 중량% 및 30~40 중량%의 범위로 경화제 성분에 포함되는데, 그것들이 너무 적게 포함되거나 너무 많이 포함되면 본 발명에서 요구하는 균형있는 물성을 얻을 수 없게 되므로 상기한 범위로 포함되는 것이 바람직하다. When the cycloaliphatic amine and the aliphatic amine are included in the curing agent component in the ratio of the above-mentioned composition, their properties are formed in harmony to provide appropriate physical properties to the composition of the present invention, and particularly, it is possible to obtain suitable pot life. Alicyclic amines and aliphatic amines are included in the curing agent component in the range of 20 to 30% by weight and 30 to 40% by weight, respectively, if they are contained too little or too much, the balanced physical properties required by the present invention cannot be obtained. It is therefore preferred to be included in the above range.

본 발명에서 사용되는 벤질알콜은 경화제 성분에서 점도를 낮추는 역할을 하면서 또한 주제 성분과 경화제 성분이 혼합될 때 비반응성 희석제로 작용함으로써 본 발명의 조성물에 도장 작업성을 부여하는 역할을 한다. 벤질알콜은 경화제 성분에 20~30 중량%의 범위로 포함되는데, 너무 적게 포함되는 경우에는 그것에 의하여 달성하고자 하는 효과, 즉 도장 작업성 향상효과가 미약하게 되고, 너무 많은 경우에는 도장 작업성은 좋아지나 요구되는 물성을 얻기 어려워진다. Benzyl alcohol used in the present invention serves to lower the viscosity in the hardener component and also to impart coating workability to the composition of the present invention by acting as a non-reactive diluent when the main component and the hardener component are mixed. Benzyl alcohol is included in the curing agent component in the range of 20 to 30% by weight. If it is included too little, the effect to be achieved by it, that is, the effect of improving the paintability becomes weak, and in many cases the paintability is improved. It becomes difficult to obtain the required physical properties.

본 발명에서 사용되는 경화촉진제로는 2액형 에폭시 수지 조성물의 경화제 성분에 사용되는 일반적인 경화촉진제를 사용하는 것도 가능하지만, 바람직하게는 2,4,6-트리스((메틸아미노)메틸)페놀을 사용한다. 2,4,6-트리스((메틸아미노)메틸)페놀을 경화촉진제로 사용하게 되면, 가사시간의 조절 및 원하는 기계적 물성을 얻는데 유리하게 된다. 경화촉진제는 경화제 성분에서 1~10 중량%로 사용하게 되는데, 너무 적은 양을 사용하게 되면 경화촉진제의 효과가 미미하게 되고 너무 많이 사용하게 되면 너무 빠른 경화를 진행시켜 가사시간의 조절을 만족스럽게 달성할 수 없고 또한 다른 성분, 즉 벤질알콜의 함량이 줄어드는 결과가 되어 원하는 물성을 만족시키기 어렵게 된다.
As the curing accelerator used in the present invention, it is also possible to use a general curing accelerator used for the curing agent component of the two-component epoxy resin composition, but preferably 2,4,6-tris ((methylamino) methyl) phenol is used. do. When 2,4,6-tris ((methylamino) methyl) phenol is used as a curing accelerator, it is advantageous to control pot life and to obtain desired mechanical properties. The curing accelerator is used in the amount of 1 to 10% by weight in the curing agent component. If the amount is used too small, the effect of the curing accelerator is insignificant. If the curing accelerator is used too much, the curing time is progressed too fast to satisfactorily control the pot life. In addition, the content of other components, that is, benzyl alcohol, is reduced, which makes it difficult to satisfy the desired physical properties.

이하, 본 발명을 실시예를 통하여 구체적으로 제시한다.
Hereinafter, the present invention will be described in detail through examples.

실시예Example

실시예Example 1 One

에폭시 수지로서 비스페놀 A 디글리시딜 에테르 85 중량%, 버사틱 애시드 10의 글리시딜 에스테르 5 중량%, 비반응성 희석제로서 2,2,4-트리메틸펜탄디올 디이소부티레이트 4 중량%, 실리콘계 소포제 0.3 중량%, 실리콘계 레벨링제 0.3 중량%, 고분자형 분산제 0.4 중량%, 및 색상안료로서 이산화티타늄 5 중량%로 이루어진 주제 성분과 이소포론디아민과 비스페놀 A 에폭시 수지가 반응하여 형성된 지환족 디아민 28 중량%, 화학식 3으로 표시된 지방족 디아민 38 중량%, 벤질알콜 27 중량% 및 경화촉진제로서 2,4,6-트리스((메틸아미노)메틸)페놀 7 중량%로 이루어진 경화제 성분을 혼합하고 도장하여 바닥재로 시공하였다. 이때, 주제 성분과 경화제 성분의 배합비율은 주제 성분에 포함된 에폭시 수지 성분과 반응성 희석제인 버사틱 애시드 10의 글리시딜 에스테르가 가지는 에폭시기의 당량과 경화제 성분에 포함된 지환족 디아민, 지방족 디아민 및 경화촉진제가 가지는 아민기의 당량을 동일한 비율이 되도록 설정하였다.
85% by weight of bisphenol A diglycidyl ether as epoxy resin, 5% by weight of glycidyl ester of versatic acid 10, 4% by weight of 2,2,4-trimethylpentanediol diisobutyrate as non-reactive diluent, silicone antifoam 0.3 28% by weight of a cycloaliphatic diamine formed by reacting a main component consisting of 5% by weight of a titanium-based leveling agent, 0.3% by weight of a silicone-based leveling agent, 0.4% by weight of a polymeric pigment, and isophoronediamine and a bisphenol A epoxy resin, 38% by weight of aliphatic diamine represented by the formula (3), 27% by weight of benzyl alcohol, and 7% by weight of 2,4,6-tris ((methylamino) methyl) phenol as a curing accelerator were mixed and painted to prepare a flooring material. . At this time, the blending ratio of the main component and the curing agent component is equivalent to the epoxy group of the epoxy resin component included in the main component and the glycidyl ester of the versatic acid 10, which is a reactive diluent, and the alicyclic diamine, aliphatic diamine and The equivalent of the amine group which the hardening accelerator has was set to be the same ratio.

비교예Comparative example 1 One

실시예 1과 동일한 방법으로 주제 성분과 경화제 성분을 혼합하고 도장하여 바닥재로 시공하였다. 이때, 주제 성분은 에폭시 수지로서 비스페놀 A 디글리시딜 에테르 85 중량%, 반응성 희석제로서 2-에틸헥실글리시딜에테르(2-ethylhexyl glycidyl ether) 5 중량%, 비반응성 희석제로서 디옥틸프탈레이트(dioctyl phthalate) 4 중량%, 실리콘계 소포제 0.3 중량%, 실리콘계 레벨링제 0.3 중량%, 고분자형 분산제 0.4 중량%, 및 색상안료로서 이산화티타늄 5 중량%로 구성하였고, 경화제 성분으로서 지환족 변성아민으로서 이소포론디아민 첨가형 지환족 변성아민(isophrondiamine adduct) 66 중량%, 벤질알콜 27 중량% 및 경화촉진제로서 2,4,6-트리스((메틸아미노)메틸)페놀 7 중량%로 구성하였다.
In the same manner as in Example 1, the main component and the hardener component were mixed and coated to prepare a flooring material. At this time, the main component is 85% by weight of bisphenol A diglycidyl ether as an epoxy resin, 5% by weight of 2-ethylhexyl glycidyl ether as a reactive diluent, and dioctylphthalate as a non-reactive diluent. phthalate) 4% by weight, silicone antifoam 0.3% by weight, silicone leveling agent 0.3% by weight, polymer type dispersant 0.4% by weight, and titanium dioxide 5% by weight as color pigment, and isophoronediamine as alicyclic modified amine as hardener component. 66 wt% of the added type of alicyclic modified amine (isophrondiamine adduct), 27 wt% of benzyl alcohol and 7 wt% of 2,4,6-tris ((methylamino) methyl) phenol as a curing accelerator.

비교예Comparative example 2 2

실시예 1과 동일한 방법으로 주제 성분과 경화제 성분을 혼합하고 도장하여 바닥재로 시공하였다. 이때, 주제 성분은 에폭시 수지로서 비스페놀 A 디글리시딜 에테르 40 중량%, 비반응성 희석제로서 벤질알콜 10 중량%, 체질안료로서 탄산칼슘 45 중량%, 색상안료로서 이산화티타늄 3 중량% 및 기타 첨가제 2 중량%로 구성하였고, 경화제 성분으로서 지방족 변성아민으로서 메타자일렌디아민(meta-xylene diamine) 20 중량%, 폴리에테르아민 75중량%와 경화촉진제로서 2,4,6-트리스((메틸아미노)메틸)페놀 5 중량%로 구성하였다.
In the same manner as in Example 1, the main component and the hardener component were mixed and coated to prepare a flooring material. At this time, the main component is 40% by weight of bisphenol A diglycidyl ether as an epoxy resin, 10% by weight of benzyl alcohol as a non-reactive diluent, 45% by weight of calcium carbonate as a sieving pigment, 3% by weight of titanium dioxide as a color pigment and other additives 2 It is composed of weight percent, 20% by weight of meta-xylene diamine as aliphatic modified amine as a hardener component, 75% by weight of polyetheramine and 2,4,6-tris ((methylamino) methyl as a curing accelerator. 5% by weight of phenol.

시험결과Test result

1) 롤러도장 가능 여부1) Whether roller painting is possible

실시예 1 및 비교예 1의 조성물은 롤러도장작업이 가능하였으며, 그 결과 0.7 mm 두께의 바닥재를 형성할 수 있었다. 실시예 1 및 비교예 1 조성물은 롤러도장이 가능함에 따라 평활성 및 은폐력이 우수하여 형성된 바닥재의 외관이 매우 아름다운 수준이었다. 반면에 비교예 2의 조성물은 롤러도장이 불가능하였고, 통상의 도장방법을 사용하여 3 mm 두께의 바닥재를 형성할 수 있었다. 비교예 2 조성물은 평활성 및 은폐력이 좋지 못하여 형성된 바닥재의 외관은 좋지 못한 편이었다.
The compositions of Example 1 and Comparative Example 1 were capable of roller coating, and as a result, it was possible to form a floor covering 0.7 mm thick. The composition of Example 1 and Comparative Example 1 was excellent in the smoothness and hiding power as the roller coating is possible, the appearance of the flooring formed was very beautiful. On the other hand, the composition of Comparative Example 2 was impossible to coat the roller, it was possible to form a flooring thickness of 3 mm using a conventional coating method. Comparative Example 2 The composition was not good smoothness and hiding power was poor appearance of the flooring formed.

2) 가사시간2) housework time

비교예 1 조성물의 가사시간은 상온(25℃)에서 작업하였을 때, 약 15~20분 정도였고, 실시예 1 조성물의 가사시간은 약 25~30분 정도였으며, 비교예 2 조성물의 가사시간은 약 30~40분 정도였다. 본 발명의 실시예 조성물은 비교예 1 조성물에 비하여 약 10분 정도의 가사시간이 연장되어 작업할 시간을 충분하게 확보하였음을 확인할 수 있었다.
The pot life of the composition of Comparative Example 1 was about 15 to 20 minutes when operating at room temperature (25 ° C.), the pot life of the composition of Example 1 was about 25 to 30 minutes, and the pot life of the composition of Comparative Example 2 was It took about 30-40 minutes. Example composition of the present invention compared to the composition of Comparative Example 1 was confirmed that the pot life of about 10 minutes is extended to ensure sufficient time to work.

3) 기계적 물성3) Mechanical Properties

도막경도(shore 'D' type, ASTM D2240 방법)는 비교예 1의 것은 대략 80 정도, 비교예 2의 것은 75~80 정도 그리고 실시예 1의 것은 78~84 정도였다.
The coating hardness (shore 'D' type, ASTM D2240 method) was about 80 for Comparative Example 1, about 75 to 80 for Comparative Example 2, and about 78 to 84 for Example 1.

이상의 시험결과에 의하여 본 발명에 따른 조성물은 경도 등 기계적 물성은 동일한 수준으로 유지하면서도 비교예 1 제품에 비하여 가사시간을 상당히 늘림으로써 작업성을 향상시켰으며, 또한 비교예 2 제품에 비하여 롤러도장을 가능하게 함으로써 얇은 도막을 형성할 수 있어 아름다운 외관을 형성할 수 있음을 확인하였다.
According to the above test results, the composition according to the present invention improved workability by significantly increasing pot life compared to Comparative Example 1 product while maintaining mechanical properties such as hardness, and also improved roller coating compared to Comparative Example 2 product. By making it possible, it was confirmed that a thin coating film can be formed and a beautiful appearance can be formed.

Claims (4)

에폭시 수지 80~90 중량%, 저점도 반응성 희석제 에폭시 수지 1~10 중량%, 비반응성 희석제 1~10 중량%, 및 색상 안료 1~10 중량%를 포함하되 체질안료는 포함하지 않는 주제 성분과 지환족 아민 20~30 중량%, 지방족 아민 30~40 중량%, 벤질알콜 20~30 중량% 및 경화촉진제 1~10 중량%를 포함하는 경화제 성분으로 이루어지고,
상기 에폭시 수지는 비스페놀 A와 에피클로로히드린의 반응에 의하여 생성되는 비스페놀 A 디글리시딜 에테르로서, 185~192 g/eq의 당량, 11500~13500 cps(25℃)의 점도를 가지는 것이고, 상기 저점도 반응성 희석제 에폭시 수지는 버사틱 에시드 10(versatic acid 10)의 글리시딜 에스테르이며, 상기 지방족 아민은 분자구조내에 옥시프로필렌(oxypropylene) 구조를 가지는 폴리에테르아민으로서 중량평균 분자량 230, 아민가 240~270 mgKOH/g, 비중 0.95 및 점도 9.5 cps를 가지는 것이고, 상기 지환족 아민은 이소포론디아민(isophorondiamine)과 비스페놀 A 에폭시수지가 반응하여 형성된 지환족 디아민으로서, 아민가 260~285 mgKOH/g, 점도 350~600 cps 및 비중 1.03을 가지는 것임을 특징으로 하는 2액형 에폭시 수지 조성물.
Subject matter and alicyclic containing 80-90 wt% epoxy resin, low viscosity reactive diluent 1-10 wt% epoxy resin, 1-10 wt% non-reactive diluent, and 1-10 wt% color pigment, but no extender pigment It consists of a curing agent component comprising 20 to 30% by weight of the group amine, 30 to 40% by weight of the aliphatic amine, 20 to 30% by weight of benzyl alcohol and 1 to 10% by weight of the curing accelerator,
The epoxy resin is a bisphenol A diglycidyl ether produced by the reaction of bisphenol A and epichlorohydrin, having an equivalent weight of 185 to 192 g / eq and a viscosity of 11500 to 13500 cps (25 ° C). The low viscosity reactive diluent epoxy resin is a glycidyl ester of versatic acid 10. The aliphatic amine is a polyetheramine having an oxypropylene structure in its molecular structure, and has a weight average molecular weight of 230 and an amine value of 240 to 240. 270 mgKOH / g, specific gravity 0.95 and viscosity 9.5 cps, the cycloaliphatic amine is an alicyclic diamine formed by the reaction of isophorondiamine and bisphenol A epoxy resin, the amine is 260 ~ 285 mgKOH / g, viscosity 350 A two-component epoxy resin composition, characterized in that it has a ~ 600 cps and specific gravity 1.03.
제1항에 있어서,
상기 비반응성 희석제는 2,2,4-트리메틸펜탄디올 디이소부티레이트인 것을 특징으로 하는 2액형 에폭시 수지 조성물.
The method of claim 1,
The non-reactive diluent is 2,2,4-trimethylpentanediol diisobutyrate, two-component epoxy resin composition.
제1항 또는 제2항에 있어서,
상기 경화촉진제는 2,4,6-트리스((메틸아미노)메틸)페놀인 것을 특징으로 하는 2액형 에폭시 수지 조성물.
The method according to claim 1 or 2,
The curing accelerator is a two-component epoxy resin composition, characterized in that 2,4,6-tris ((methylamino) methyl) phenol.
제3항에 있어서,
상기 조성물은 상기 주제 성분에서 실리콘계 소포제 0.1~1 중량%, 실리콘계 레벨링제 0.1~1 중량% 및 고분자형 분산제 0.1~1 중량%를 더 포함하는 것을 특징으로 하는 2액형 에폭시 수지 조성물.
The method of claim 3,
The composition is a two-component epoxy resin composition, characterized in that further comprises 0.1 to 1% by weight of the silicone-based antifoaming agent, 0.1 to 1% by weight of the silicone-based leveling agent and 0.1 to 1% by weight of the polymeric dispersant.
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KR20190136340A (en) * 2018-05-30 2019-12-10 주식회사 이원그린텍 Odorless epoxy resin composition
CN113355004A (en) * 2020-03-06 2021-09-07 Kcc公司 Solvent-free epoxy coating composition and marine structure having coating film thereof
KR20210113025A (en) * 2020-03-06 2021-09-15 한국조선해양 주식회사 solvent-free epoxy type paint composition and offshore structure comprising coating film of thereof
CN116769279A (en) * 2023-05-30 2023-09-19 江苏恒隆通新材料科技有限公司 Ultraviolet-resistant epoxy lamination resin capable of being rapidly cured at normal temperature

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KR100873048B1 (en) 2008-03-27 2008-12-09 (주)카스종합건축사사무소 Solvent free epoxy paint composition for flooring system and construction method using same
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KR20190136340A (en) * 2018-05-30 2019-12-10 주식회사 이원그린텍 Odorless epoxy resin composition
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CN113355004A (en) * 2020-03-06 2021-09-07 Kcc公司 Solvent-free epoxy coating composition and marine structure having coating film thereof
KR20210113025A (en) * 2020-03-06 2021-09-15 한국조선해양 주식회사 solvent-free epoxy type paint composition and offshore structure comprising coating film of thereof
CN113355004B (en) * 2020-03-06 2022-05-24 Kcc公司 Solvent-free epoxy coating composition and marine structure having coating film thereof
KR102594979B1 (en) * 2020-03-06 2023-10-30 에이치디한국조선해양 주식회사 solvent-free epoxy type paint composition and offshore structure comprising coating film of thereof
CN116769279A (en) * 2023-05-30 2023-09-19 江苏恒隆通新材料科技有限公司 Ultraviolet-resistant epoxy lamination resin capable of being rapidly cured at normal temperature

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