KR101309759B1

KR101309759B1 - Light emitting element package of channel letter

Info

Publication number: KR101309759B1
Application number: KR1020070032262A
Authority: KR
Inventors: 이윤석
Original assignee: 서울반도체 주식회사
Priority date: 2007-04-02
Filing date: 2007-04-02
Publication date: 2013-09-23
Also published as: KR20080089732A

Abstract

The present invention relates to a light emitting device package for a channel letter, and more particularly to a light emitting device package for a channel letter provided with a rectifying circuit portion in the light emitting device assembly. The present invention can provide a light emitting device package for a channel letter having a rectifying circuit unit inside the light emitting device assembly, which can be operated by directly receiving AC power without a separate switching mode power supply. In addition, the present invention can provide a light emitting device package for a channel letter that can increase the maximum number of connections of the light emitting device assembly because it operates by directly receiving AC power of 110V or 220V.

Channel letter, light emitting device assembly, rectifier circuit, bridge circuit, alternating current

Description

Light emitting device package for channel letter {LIGHT EMITTING ELEMENT PACKAGE OF CHANNEL LETTER}

1 is a schematic plan view of a light emitting device package for a channel letter according to a first embodiment of the present invention;

FIG. 2 is a schematic cross sectional view taken on line A-A in FIG. 1; FIG.

3 is a circuit diagram of a light emitting device package for a channel letter according to the first embodiment of the present invention.

4 is a schematic cross-sectional view of a light emitting device package for a channel letter according to a second embodiment of the present invention.

100: light emitting device assembly 102: substrate

120: rectifier circuit 130: lead pattern

140: light emitting chip 150: wiring

160: connector 170: storage member

180: molding portion 190: wiring

200: light emitting diode

The present invention relates to a light emitting device package for a channel letter, and more particularly to a light emitting device package for a channel letter provided with a rectifying circuit portion in the light emitting device assembly.

In general, billboards used for outdoor advertising are billboard advertising, which is a method of designing advertising content with paint on a plane, and wrapping silk with advertising information printed on the upper part with a skeleton such as aluminum or stainless steel. And a Panaflex method having a plurality of fluorescent lamps in the skeleton so that the advertisement information is highlighted at night, and the advertisements are printed on three sides of each side having an angle of 120 degrees to visually print the effect. There is a tri-vision (Tri-Vision) method that can be three-dimensional advertising by. In addition, the advertisement using the channel or the SCSI implements the channel or SCSI according to the advertisement image and then installs a separate neon according to the image shape of the channel or SCSI. This advertising method uses advertisement information implemented in Jannel or SCSI, and when the surroundings are dark, the neon lights are turned on to enhance the visual effect.

As described above, the billboards according to the related art often use a separate light source, for example, a fluorescent lamp or neon, so that the advertisement information can be highlighted even at night. However, the fluorescent lamp emits a single color to perform a function of a simple light source, and neon can express 48 colors, but it does not match the trend of the advertisement of the times. This is because the neon advertisement bends the neon tube to express the advertisement image, and the width of the expression is limited due to the limitation of 48 colors. In recent years, in order to solve such a problem, the frequency of use of a light emitting device package for a channel letter, which can be freely arranged and free of color conversion, is increasing.

However, the light emitting device package for a channel letter according to the related art generally uses a DC power source such as 12V or 24V, and thus has a problem of having a separate converter switching mode power supply (SMPS).

In addition, since the input power source uses a low voltage such as 12V or 24V, there is a problem in that the maximum connection quantity of the light emitting device assembly constituting the light emitting device package for the channel letter is small.

An object of the present invention is to solve the above-mentioned problems of the prior art, to provide a light emitting device package for a channel letter that can be driven in an AC power supply without a separate switching mode power supply.

In addition, another object of the present invention is to provide a light emitting device package for a channel letter that can increase the maximum number of connections of the light emitting device assembly.

In order to achieve the above object, the present invention includes a plurality of light emitting device assemblies including a plurality of light emitting chips or a plurality of light emitting chips, and a plurality of light emitting device assemblies connected to each other, and provided in any of the plurality of light emitting device assemblies. It provides a light emitting device package for a channel letter comprising a rectified circuit portion.

In this case, the rectifier circuit unit may include a bridge circuit, and the plurality of light emitting device assemblies may be connected to each other by wiring.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

It will be apparent to those skilled in the art that the present invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, It is provided to let you know. Like reference numerals refer to like elements throughout.

1 is a schematic plan view of a light emitting device package for a channel letter according to a first embodiment of the present invention, FIG. 2 is a schematic cross-sectional view taken at the line AA of FIG. 1, and FIG. 3 is a channel according to the first embodiment of the present invention. It is a circuit diagram of a letter-light emitting device package.

As shown in FIGS. 1 to 3, a channel letter light emitting device package according to the first embodiment of the present invention includes a substrate 102, a plurality of light emitting chips 140 mounted on the substrate 102, and And a rectifying circuit unit 120 for rectifying currents applied to the plurality of light emitting chips 140, and a receiving member 170 for accommodating the substrate 102, the light emitting chip 140, and the rectifying circuit unit 120. And a molding unit 180 for encapsulating the light emitting chip 140.

The substrate 102 is to support and fix the light emitting chip 140 and to apply external power, and a printed circuit board (PCB) may be used. Of course, the printed circuit board may be a substrate made of a material such as FR4, BT-Resin, flexible printed circuit board (FPCB), metal core printed circuit board (MCPCB) And substrates such as the like. In addition, a single-sided printed circuit board having a lead pattern formed on one surface thereof or a multilayer printed circuit board having a lead pattern formed of multiple layers may be used.

The light emitting chip 140 uses a phenomenon that light is emitted by recombination of minority carriers (electrons or holes) as a compound semiconductor laminated structure having a p-n junction structure. The light emitting chip 140 may include an active layer formed between the first and second semiconductor layers and the first and second semiconductor layers. In this embodiment, the first semiconductor layer is a P-type semiconductor layer, and the second semiconductor layer is an N-type semiconductor layer. In addition, a P-type electrode (not shown) is formed on an upper surface of the light emitting chip 140, that is, one surface of the P-type semiconductor layer, and an N-type electrode ( Not shown) is formed. In this case, the N-type electrode and the P-type electrode are connected to a lead pattern including the first and second lead patterns 130a and 130b, and the N-type electrode is in contact with the first lead pattern 130a and the P-type electrode. The electrode may be electrically connected to the second lead pattern 130b by the wiring 190. However, the present invention is not limited thereto. The light emitting chip 140 according to the present invention can use a horizontal light emitting chip 140 in addition to the vertical light emitting chip 140, and various kinds of light emitting devices, such as visible light or ultraviolet light, The light emitting chip 140 may be used. Of course, a phosphor for converting the light emitting chip 140 into light having a specific wavelength may be used. In the present exemplary embodiment, the light emitting chip 140 is mounted on the first lead pattern 130a as an example. However, the present invention is not limited thereto, and the light emitting chip 140 may include the second lead pattern 130b. It may also be mounted on the top. Of course, the light emitting chip 140 may be mounted on the substrate 102 to connect the light emitting chip 140 and the first and second lead patterns 130b with two wires 190.

In addition, a plurality of such light emitting chips 140 are provided on the substrate 102. In this embodiment, AC voltage and voltage, for example, 110V or 220V and a voltage of the LED package for the channel letter are input from the outside. In order to align the three light emitting chips 140 into a group, the first to fourth group light emitting chips 141 to 144 are mounted in the light emitting device assembly, and the first to fourth group light emitting chips 141 to 144 respectively. Four mounted light emitting device assemblies 100 are connected by a wire 190 to configure a light emitting device package for a channel letter. In this case, in order to exactly match the voltage of the AC power input from the outside and the voltage of the light emitting device package for the channel letter may be connected to the resistor 148 in each light emitting device assembly. Of course, if the number of the light emitting chips 140 can be adjusted to match the external voltage and the voltage of the channel letter light emitting device package, the resistor 148 may be omitted.

In addition, in the present exemplary embodiment, three light emitting chips 140 are mounted in the light emitting device assembly to form one light emitting device assembly 100 by mounting one military first to fourth group light emitting chips 141 to 144. (100) Four light emitting device packages were manufactured for the channel letter, but the present invention is not limited thereto, and the number of the light emitting chips 140 mounted in the light emitting device assembly 100 and the number of the light emitting device assemblies 100 are not limited thereto. The voltage of the external power source and the use of the light emitting device package for the channel letter can be added or subtracted.

In addition, a plurality of light emitting device assemblies 100 may be mounted on the same substrate in order to connect the plurality of light emitting device assemblies 100 to form a light emitting device package for a channel letter. It is effective to use the wiring 190 to adjust the distance and angle therebetween.

In this case, a predetermined connector 160 may be used to connect the wiring 190 with each light emitting device assembly. In addition, although the connector 160 is formed on the back surface of the surface of the substrate 102 on which the light emitting chip 140 is mounted, the connector 160 is not limited thereto, and the connector 160 includes the light emitting chip 140 mounted thereon. It may be formed on the surface of the substrate 102. Of course, the wiring 190 may be directly connected to the substrate 102 without using the connector 160.

The rectifier circuit unit 120 is for half-wave rectifying the AC power applied to the light emitting chip 140. In this embodiment, a bridge circuit is used. The bridge circuit includes first to fourth diodes 120a to 120d connected to each other, and an external power source and first to fourth group light emitting chips 141 to 144 between the first to fourth diodes 120a to 120d. This is connected. At this time, the first node 121a is disposed between the first diode 120a and the second diode 120b, and the second node 121b is disposed between the second diode 120b and the fourth diode 120d. When defining the third node 121c between the 120c and the fourth diode 120d and the fourth node 121d between the third diode 120c and the first diode 120a, the first node 121a is defined. And an external power source, which is an AC power source, is applied to the third node 121c, and the first to fourth group LEDs 141 to 144 may be connected to the second node 121b and the fourth node 121d.

In addition, the rectifier circuit unit 120 according to the present embodiment is provided in the light emitting device assembly 100, and in this embodiment, is mounted on the same substrate 102 surface as the light emitting chip 140. Of course, the mounting position of the rectifier circuit unit 120 is not limited thereto and may be mounted on the rear surface of the substrate 102 on which the light emitting chip 140 is mounted. That is, if the rectifier circuit unit 120 according to the present embodiment is provided in the light emitting device assembly 100 and can perform the function of the rectifier circuit unit 120, the mounting position is mounted at any position in the light emitting device assembly 100. Can be. In addition, in the light emitting device package for the channel letter according to the present embodiment, the rectifier circuit unit 120 may be embedded only in any one of the plurality of light emitting device assemblies 100, and the light emitting device assembly in which the remaining rectifier circuit unit 120 is not embedded. The 101 may be connected to the light emitting device assembly 100 in which the rectifier circuit 120 is built in and receive the same power.

In the light emitting device package for channel letters according to the present embodiment having the above structure, when an external power source, which is an AC power source, is applied to the first node 121a and the third node 121c, the second diode 120b when the voltage is forward voltage. And the third diode 120c are turned on, and the first diode 120a and the fourth diode 120d are turned off. Therefore, since the first diode 120a is reverse biased with respect to the current applied to the first node 121a, no current flows, and the current flows to the second diode 120b. In addition, since the current flowing to the second diode 120b is reverse biased with respect to the fourth diode 120d, the current flows to the first to fourth group LEDs 141 to 144. Thereafter, the current applied to the first to fourth group light emitting chips 141 to 144 exits to the third diode 120c.

When the voltages applied to the first node 121a and the third node 121c are reverse voltages, the first diode 120a and the fourth diode 120d are turned on, and the second diode 120b and the second diode 120b are turned on. The three diodes 120c are off. Therefore, the applied current does not flow to the third diode 120c but flows to the fourth diode 120d. Since the second diode 120b is reverse biased with respect to the current flowing through the fourth diode 120d, the current flows through the second node 121b to the first to fourth group LEDs 141 to 144. The current then goes out to the first diode 120a.

That is, the second diode 120b and the third diode 120c are turned on at the forward voltage to filter the reverse voltage, and the first diode 120a and the fourth diode 120d are turned on at the reverse voltage and the reverse voltage is reversed. The voltage is converted to the forward voltage so that the external AC voltage is half-wave rectified.

As described above, the light emitting device package for the channel letter according to the present exemplary embodiment includes a rectifying circuit unit 120 inside the light emitting device assembly 100 to directly receive 110V or 220V AC power without a separate switching mode power supply. can do. In addition, since the present invention operates by directly receiving AC power of 110V or 220V, the maximum connection quantity of the light emitting device assembly can be increased.

The accommodating member 170 accommodates and protects the substrate 102 on which the plurality of light emitting device assemblies and the rectifier circuit unit 120 are mounted. The accommodating member 170 includes a flat base portion and sidewalls bent from the edge of the base portion, respectively. In addition, an opening for connecting the connector 160 and the wire 190 may be formed at one side wall and the other side wall facing the side wall. In this case, it is preferable that the accommodation member 170 is sealed so as to seal a portion of the light emitting device assembly 100 except for an area in which the molding part 180 is to be formed. In addition, it is effective that a predetermined fixing portion 171 is formed in the housing member 170 so that the channel element light emitting device package can be fixed with a screw or the like when mounted on a place such as a signboard.

In this embodiment, a housing made of a resin such as polyphthalamide (PPA) or liquid crystal polymer (LCP) may be used instead of the accommodating member 170. In this case, when the housing is used as described above, the substrate 102 on which the light emitting chip 140 is mounted may be omitted, and the housing may replace the substrate 102 and the accommodating member 170.

The molding part 180 encapsulates the light emitting chip 140 and fixes the wiring 190 connected to the light emitting chip 140. The molding part 180 receives the light emitted from the light emitting chip 140. Since it is to be transmitted to the outside, it can be generally formed of a transparent resin such as epoxy resin or silicone resin. In addition, the molding unit 180 according to the present embodiment is preferably formed to seal the light emitting device assembly 100 together with the accommodation member 170 to enable waterproof.

In addition, the light emitting device package for a channel letter according to the present invention further includes a diffusion agent (not shown) for uniformly emitting light by diffusing the light emitted from the light emitting chip 140 into the molding unit 180 by scattering. can do. As the diffusion agent, barium titanate, titanium oxide, aluminum oxide, silicon oxide, or the like can be used. In addition, the molding unit 180 may further include a phosphor (not shown). The phosphor absorbs a part of the light emitted from the light emitting chip 140 and emits light of a wavelength different from that of the absorbed light. The phosphor is composed of active ions mixed with impurities at appropriate positions of the host lattice. The role of the active ions determines the emission color by determining the energy level involved in the light emission process, and the emission color is determined by the energy gap between the ground state and the excitation state of the active ion in the crystal structure.

Next, a light emitting device package for a channel letter according to a second embodiment of the present invention will be described with reference to the accompanying drawings. Among the contents to be described later, the description overlapping with the description of the channel letter light emitting device package according to the first embodiment of the present invention will be omitted or briefly described.

As shown in FIG. 4, a channel letter light emitting device package according to a second embodiment of the present invention includes a substrate 102, a plurality of light emitting diodes 200 mounted on the substrate 102, and the plurality of light emitting device packages. A rectifying circuit unit 120 for rectifying a current applied to the light emitting diodes 200 of the light emitting diode 200, an accommodating member 170 for accommodating the substrate 102, the light emitting diodes 200, and the rectifying circuit unit 120, and A molding unit 180 for encapsulating the light emitting diode 200 is included.

The light emitting diode 200 is a package in which a light emitting chip is packaged, and is a compound semiconductor stacked structure having a pn junction structure. The light emitting chip 200 uses a phenomenon of emitting light by recombination of minority carriers (electrons or holes), and the A lead frame for supporting the light emitting chip and applying an external power source, a wiring (not shown) for connecting the light emitting chip and the lead frame, a part of the lead frame and a molding part for encapsulating the light emitting chip and wiring Can be.

Of course, in the present embodiment, the lamp type light emitting diode as described above is used as the light emitting diode 200, but is not limited thereto. The chip type light emitting diode 200 having the light emitting chip 140 mounted on the substrate 102 may be used. The same light emitting diode 200 may be used. That is, the light emitting diode 200 used in the present invention may use various types of light emitting diodes 200 according to the purpose and purpose of the channel letter light emitting device package.

In this embodiment, a plurality of such light emitting diodes 200 are mounted, and a plurality of light emitting device assemblies 100 equipped with the plurality of light emitting diodes 200 are provided. In addition, the light emitting device package for the channel letter may be manufactured by connecting the plurality of light emitting device assemblies 100.

Although described above with reference to the drawings and embodiments, those skilled in the art can be variously modified and changed within the scope of the invention without departing from the spirit of the invention described in the claims below. I can understand.

For example, in the illustrated embodiment, the light emitting chip 140 is mounted on the substrate 102 or the light emitting diode 200 is mounted, and the rectifying circuit unit 120 is formed, but is not limited thereto. May be formed and etched to simultaneously form the light emitting chip 140 and the rectifier circuit unit 120.

As described above, the present invention may provide a light emitting device package for a channel letter having a rectifying circuit unit inside the light emitting device assembly and capable of operating by directly receiving AC power without a separate switching mode power supply.

In addition, the present invention can provide a light emitting device package for a channel letter that can increase the maximum number of connections of the light emitting device assembly because it operates by directly receiving AC power of 110V or 220V.

Claims

A plurality of light emitting device assemblies including a plurality of light emitting chips or a light emitting diode packaged with a plurality of light emitting chips, and connected to each other;

A rectifier circuit unit provided in any of the plurality of light emitting device assemblies;

The light emitting device assembly that does not include the rectifier circuit unit is connected to the light emitting device assembly including the rectifier circuit unit for a light emitting device package, characterized in that supplied with the same power.

The method according to claim 1,

The rectifier circuit portion of the channel letter light emitting device package, characterized in that it comprises a bridge circuit.

The method according to claim 1 or 2,

The plurality of light emitting device assembly is a channel letter light emitting device package, characterized in that connected to each other by wiring.

The light emitting device package of claim 1, further comprising a substrate on which the plurality of light emitting chips or a plurality of light emitting chips are packaged, and the rectifier circuit part is mounted together on the substrate.

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