KR101309039B1 - Method for installation of thermal insulating material and building structure thereby - Google Patents

Abstract

The present invention relates to a method of constructing a heat insulating material is provided with a cushioning effect using an elastic body and to a construction structure using the same so as to effectively attenuate the impact sound applied to the upper layer and to exhibit a heat insulating performance. Forming an installation surface for installation of heat insulating material on an upper surface of another layer laminated on the slab bottom layer, forming a buffer layer by applying a granular elastic chip having an irregular surface to the installation surface, and Disposing a heat insulating material in the form of a sheet on top of the buffer layer; And waterproofing the upper surface of the insulating material so that moisture does not penetrate when the finishing mortar layer is poured.

Description

METHOD FOR INSTALLATION OF THERMAL INSULATING MATERIAL AND BUILDING STRUCTURE THEREBY}

The present invention relates to a method for constructing a heat insulator and a construction structure using the same, and more particularly, to a method for constructing a heat insulator between floors of a house or building, and a construction structure thereof.

Due to high oil prices and rising energy prices, improving energy performance is a major concern for consumers today. In particular, a lot of heat insulators are used to improve energy performance in multi-unit houses. Recently, floor impact noise (floor noise) transmitted from the upper floor to the lower floor of a building has become a very important problem in MDUs. In order to alleviate such a floor impact sound, a cushioning material is mainly used.

Since the cushioning material is manufactured by elastically processing the heat insulating material itself, there is a problem in that thermal conductivity is not uniform due to the difference in the degree of elasticity and the degree of elasticity due to the difference in pressure to a very small portion. On the other hand, the heat insulating material itself is uniform so that there is almost no error in thermal conductivity due to the KS standard. However, direct construction is not possible as a cushioning material whose elasticity is important due to the strength of the insulating material.

The current insulation material does not meet the standard of physical properties of the interlayer buffer designated by the Ministry of Land, Transport and Maritime Affairs, and it is likely to be a medium that delivers the impact sound generated from the upper layer to the lower layer by resonating with the bottom layer due to its rigid strength. However, as the energy performance rating of MDUs currently designated by the Ministry of Land, Transport and Maritime Affairs has been strengthened more than existing standards as of June 2010, the floors of MDUs are divided into energy performance ratings and sound insulation effects, resulting in more construction and material costs. It is a situation that has become necessary.

The present invention has been made in view of the above point, the object of the present invention is to provide a construction method and a construction structure using the same to alleviate the transmission of the impact sound of the floor applied from the upper floor to the lower floor while maintaining the insulation rating in the apartment house. There is this.

Another object of the present invention is to minimize the cost and work process required for such a construction method and construction structure.

In order to solve the above problems, the construction method of the heat insulating material according to the present invention, the step of forming an installation surface for installing the heat insulating material directly on the slab bottom layer or on the upper surface of the other layer laminated to the slab bottom layer, and the installation surface Forming a buffer layer by applying a granular elastic chip having an irregular surface to the buffer layer, arranging a sheet-shaped heat insulating material on top of the buffer layer, and preventing the moisture from penetrating during the finishing mortar layer pouring. Waterproofing the upper surface of the.

The insulation may be a foamed polystyrene insulation molded by foaming polystyrene. The expanded polystyrene insulation material is molded by a method of primary foaming a raw material of a circular shape, aged for a specific time, and then filling into a mold in a plate form and secondary foaming, or heating and melting the raw material and continuously extruding and foaming the raw material. Can be molded.

The buffer layer is arranged in a simple laminated form by non-adhesion on the installation surface. The elastomeric chip constituting the buffer layer may be scattered in an arbitrary direction by a spray device using compressed air or centrifugal force.

The construction method of the heat insulating material may include applying an adhesive to at least one of the installation surface or the surface of the elastic chip. The construction method of the heat insulating material may include the step of installing a side buffer in the vertical direction on the edge where the slab bottom layer meets the wall.

The elastic chip constituting the buffer layer includes a first elastic chip composed of crushed rubber, and a second elastic chip mixed between the first elastic chip and having a material different from that of the rubber. Structural reinforcement chips may be mixed between the first elastic chip and the second elastic chip for structural reinforcement.

The elastomeric chip may occupy an area of 12% to 20% of the installation surface. The heat insulating material may be disposed in a simple laminated form by non-adhesion to the buffer layer.

The construction method of the heat insulating material includes a step of installing a base heat insulating material formed in the form of a sheet on the slab bottom layer before scattering the buffer layer. An accommodation hole may be formed in the heat insulating material or the base heat insulating material, and the elastic chip constituting the buffer layer may be accommodated in the accommodation hole.

The present invention also discloses a construction structure constructed by the above method.

The present invention effectively reduces noise and vibration due to the impact applied to the building floor by forming the buffer layer by the elastomeric chip so as to impart the buffer effect of the heat insulating material. More specifically, the heavy impact sound generated in the upper layer is absorbed without being transmitted along the elastic body connecting the upper and lower layers to the floating bottom structure, and the sound waves are reflected and refracted on the irregular surface of the elastic body, thereby exhibiting a damping effect.

In addition, since the elastic chip is formed by scattering the slab bottom layer in a predetermined ratio, the cost required for the formation of the floating floor structure can be minimized, and the work process has a simple advantage.

 In addition, the present invention can be combined with other structures to the heat insulating material, by using the heat insulating material of the KS standard can prevent the degradation of the heat insulation performance of the house, reduce energy consumption and reduce the noise between floors.

In addition, by recycling the existing waste resources can provide a buffer structure that can increase the economics of production and contribute to the recycling of resources.

1 is a conceptual view schematically showing a building employing a construction structure of the heat insulating material related to the present invention
Figure 2 is a flow chart of the construction method of the insulating material is provided with a buffer effect associated with the present invention
3 is a working state diagram showing the scattering of the elastic chip, Figure 4 is a perspective view showing an example showing a state in which the elastic chip is sprayed, Figure 5 is a perspective view showing a state in which the elastic chip and the other chip is sprayed together
Figure 6a is a cross-sectional view showing a state in which the elastomeric chip is sprayed without using an adhesive in accordance with the present invention
6B to 6D are cross-sectional views showing other examples in which an adhesive is used for an elastic chip or an object to which an elastic chip is attached.
7 is a cross-sectional view of the slab bottom layer of the completed construction of the heat insulating material according to the present invention.
8 is a cross-sectional view showing that the base insulation is further disposed in the slab bottom layer in connection with the present invention.
Figure 9 is a perspective view showing an example in which the construction structure is given a buffer effect associated with the present invention applied to a conventional single insulation
10 is a perspective view showing an example in which a construction structure given a buffer effect related to the present invention is applied to an existing composite insulation
11 and 12 are perspective views respectively showing that the new insulating material is configured by filling the heat insulating material with the elastic body according to the present invention.

Hereinafter, with reference to the accompanying drawings, the construction method and the construction structure of the interlayer noise buffer using the elastic body according to the present invention will be described in detail.

1 is a conceptual view schematically showing a building 10 employing a construction structure of the heat insulating material related to the present invention.

The building 10 may be a multi-family house such as a single house, a townhouse, or an apartment in which two or more households are adjacent to each other. In the building 10, a relationship between the upper floor 11 and the lower floor 12 is established between adjacent furniture or a room along a direction perpendicular to the ground. Between the upper layer 11 and the lower layer 12, a slab bottom layer 13 bordering the layer is constructed.

Since the slab bottom layer 13 is a dense reinforced concrete, the impact sound due to the object in the upper layer 11 is transmitted to the lower layer 12 without the cushioning material. In addition, in order to satisfy the thermal insulation performance of the multi-unit house is required to insulate. However, direct construction is not possible as a cushioning material whose elasticity is important due to the strength of the insulating material. In order to solve this problem, the construction structure 20 of the insulating material, which is provided with a cushioning effect, is applied on the slab bottom layer 13, and the mortar concrete or the mortar concrete and the bubble concrete, which are finishing agents 15, are entered thereon.

Figure 2 is a flow chart of the construction method of the insulating material is provided with a buffer effect associated with the present invention, Figure 3 is a working state showing the scattering the elastic chip, Figure 4 is a perspective view showing an example showing a state in which the elastic chip is sprayed 5 is a perspective view showing a state in which an elastomer chip and another chip are sprinkled together.

Referring to Figure 2, the construction method of the heat insulating material, first, to form a mounting surface for the installation of the heat insulating material directly on the slab bottom layer or on the upper surface of the other layer laminated on the slab bottom layer (S100).

3 and 4, the bottom layer 21 inside the building to which the heat insulating material is to be applied may be a slab or a heat insulating structure substrate pre-installed on the slab. An installation surface for installing a heat insulating material is provided on the top surface of the slab bottom layer or another layer laminated on the slab bottom layer. The side buffer member 23 is attached in the vertical direction to the edge where the bottom layer 21 meets the wall 22. However, the present invention is not limited thereto, and the side buffer 23 may be replaced with a side insulation.

Next, a buffer layer is formed by applying a granular elastic chip having an irregular surface to the installation surface (S200).

Referring to FIGS. 3 and 4 again, when the attachment of the side buffer 23 is completed, the buffer layer is formed by directly scattering the elastic chip 24 at a predetermined ratio onto the bottom layer 21. The elastic chip 24 constituting such a buffer layer is in a granular state having an irregular surface, and waste tire chips, resin pellets having elasticity, and the like may be used. In particular, in the case of using waste tire chips, it is highly economically and environmentally valuable because it recycles resources that can increase pollution for treatment.

The elastic chip 24 is directly scattered on the bottom layer 21 at a predetermined ratio, and the sprinkled elastic chips 24 are sprinkled so that a horizontal separation can be formed so that the bottom layer 21 is partially visible. do. More specifically, the elastic chip 24 constituting the buffer layer may have a grain shape having a size of 3 to 15 mm, and the occupancy ratio with respect to the mounting surface of the elastic chip 24 may be 12 to 20%.

The elastic chip 24 may be a single type made of only rubber chips on the bottom layer 21 as shown in FIG. FIG. 5 illustrates an example in which the elastic chip 21 includes a second elastic chip 31 formed of a different material, that is, rubber and a different elastic resin from the first elastic chip 21 made of rubber. Furthermore, a structural reinforcement chip 32 for structural reinforcement may be included between the first elastic chip 21 and the second elastic chip 31 to be sprinkled together.

Elastomer chip 24 is sprayed using the device 25, the device 25 may be an injector using compressed air, a motor using a centrifugal force, or by hand using a hand. In addition, the elastic chip 24 is sparse and scattered so as to scatter in any direction. The scattered elastomeric chips 24 are self-supporting superstructures, which can block the transmission of heavy impact sound by a density lower than the slab bottom layer 21, and also generate vibrations by reflecting or scattering sound waves through irregular surfaces. Attenuate

Referring to FIG. 2, in a next step, a heat insulating material having a sheet shape is disposed on the buffer layer (S300).

The insulation may be a foamed polystyrene insulation molded by foaming polystyrene. As an example of such expanded polystyrene heat insulating material, the heat insulating material may be a heat insulating plate or heat insulating tube of KS standard.

More specifically, the expanded polystyrene insulation may be molded by a method of primary foaming a circular raw material, aging for a specific time, and then filling the mold in a plate form and then secondary foaming. As an example of such molding, one bead method of the KS standard is possible. The present invention is not limited to this, and molding by two kinds of bead methods of foaming and molding using a polystyrene raw material modified by an additive is also possible.

In addition, the expanded polystyrene insulation may be molded by a method of heating and melting the raw material and continuously extruding and foaming. As an example of such molding, it may be an extrusion method of the KS standard.

In general, it can be used as a buffer when the physical properties of the following Table 1 is carried out to meet the criteria shown in Table 1.

Test Items and Test Regulations Evaluation standard Test Items and Test Regulations Evaluation standard density
KS M ISO 845 - Absorption amount
KS M ISO 4898 4% (v / v) or less Dynamic modulus
KS F 2868 40 N / ㎥ or less Dynamic modulus of elasticity after heating
KS F 2868 20% or less before heating Loss factor
KS F 2868 0.1 to 0.3 range Loss factor after heating
KS F 2868 0.1 to 0.3 range Dimensional stability after heating
KS M ISO 4898 Less than 5% Thermal conductivity
KS F 2463 According to the insulation standard.

As a result of the test, when the rubber chip of 5 mm size was sprayed and the heat insulating material (iso pink 20T) manufactured by extrusion method was installed, the dynamic modulus was measured to be 7.57 N / m 3, and the loss coefficient was detected to be 0.19. The construction structure of the present invention can be used as a cushioning material.

In addition, the insulation structure for the building floor according to the present invention structure configured as the above test results, the elastic body is dispersed and contacted to the substrate of the existing insulation material to prevent the progress of the existing impact sounds, and also create a space that can absorb and consume energy. Therefore, the intensity of noise or vibration propagating to the lower layer can be reduced and alleviated.

In addition, by recycling waste tire chips, waste plastics and waste foam resins in which tires are crushed with elastomers, they have an economic advantage that can compensate for the limitations that cannot be covered with existing insulation materials at low cost. It can lead to a reduction in dry season and cost.

Referring back to FIG. 2, finally, the upper surface of the heat insulator is waterproofed to prevent moisture from penetrating during finishing mortar layer (S400). For example, the upper surface of the heat insulating material is waterproofed by a waterproof tape or the like.

Hereinafter, each step of the construction method will be described in more detail.

6A is a cross-sectional view showing a state in which an elastic chip is sprayed without an adhesive in relation to the present invention, and FIGS. 6B to 6D are cross-sectional views showing other examples in which an adhesive is used on an elastic chip or an object to which an elastic chip is attached.

As shown in FIG. 6A, the elastic chip 24 sprayed directly on the slab bottom layer 21 without using an adhesive forms a first buffer layer in a simple laminated form by non-adhesion.

In contrast, FIGS. 6B to 6D may apply an adhesive 51 to the bottom layer 21 and spray the elastomeric chip 24 or mix the elastomeric chip 24 with the adhesive 51 and include both. Is being sown.

7 is a cross-sectional view of the slab bottom layer of the completed construction of the heat insulating material according to the present invention, Figure 8 is a cross-sectional view showing that the base heat insulating material is further disposed in the slab bottom layer in accordance with the present invention.

After the elastomeric chip 24 is sprayed onto the slab bottom layer 21 to form the buffer layer 61, the heat insulating material 62 in the form of a sheet is disposed on the buffer layer 61. The heat insulating material 62 may be a heat insulating plate made of a foamed resin or the like as a heat insulating material used as an existing heat insulating structure.

Referring to FIG. 7, the heat insulating material 62 has a shape in which particles of random sizes are bonded to each other. In addition, the heat insulating material 62 is firmly fused between the particles to form a flat surface. However, the present invention is not limited thereto, and the heat insulating material 62 may include a plurality of uniform independent bubbles.

The insulation 62 is formed in the form of a standard sheet or plate may be used that can be waterproof by itself. Further, when the finishing mortar layer is poured, the heat insulating material 62 waterproofs the upper surface of the heat insulating material 62 by waterproof tape or the like so that moisture does not penetrate between the connection gaps of the heat insulating material 62.

The foamed concrete 63 foams cement by using a foaming agent, thereby forming a lightweight and horizontal structure of the bottom structure. Foamed concrete 63 shown in Figure 7 shows that the wet method is applied. Alternatively, the structure and construction method of the present invention can be applied to dry construction methods. Mortar concrete (64) by kneading cement and sand to harden the heating pipe is installed in the mortar concrete (64).

By adding the elastic structure to the basic structure, the slab bottom layer 21-the buffer layer 61 of the elastic structure-the heat insulating material 62-the foam concrete 63-the mortar concrete 64, which greatly affects the height difference, In addition, it is possible to double the effect of the existing floor impact sound structure at low cost without any difficulty in the error of the existing construction drawings.

In addition, as shown in FIG. 8, the elastomer chip 24 may be sprayed after the base insulation 65 is formed in a sheet form without being installed on the slab bottom layer 21. In this case, the installation surface becomes a cleaner state, the elastic chip 24 may be evenly scattered, and the thermal insulation performance may be improved.

9 is a perspective view showing an example in which the construction structure is given a buffer effect associated with the present invention applied to a conventional single insulation, Figure 10 is applied to the existing composite insulation material provided a buffer effect associated with the present invention. It is a perspective view showing an example.

As shown in Figure 9, the application structure of the heat insulating material using the elastic body related to the present invention can be applied by attaching the elastic chip 24 to the existing heat insulating material (71). That is, the existing heat insulating material 71 is formed by a foamed resin such as styrofoam or compressed styrofoam, exerts a heat insulating effect by the heat insulating material 71, and can block the impact sound by the elastic chip 24.

In addition, as shown in FIG. 10, a complex structure, that is, a structure that maximizes sound insulation performance by interposing the elastic chip 24 between two sheets of heat insulating materials 71 and 72 may be provided.

11 and 12 are perspective views respectively showing a new heat insulating material by filling the heat insulating material with the elastic body according to the present invention. That is, the elastomer chip 24 related to the present invention may be utilized as a filler having an existing structure. As shown in Fig. 11, the receiving grooves 81a, 81b, and 81c having arbitrary shapes are formed in the substrate 80, and the elastic chips 24 are filled in the receiving grooves 81a, 81b, and 81c. Get The substrate 80 may be a bottom insulation material, a side insulation material, and may be a modified and molded product of a product used as an existing insulation structure material.

In addition, the elastic chip 24 may be completely embedded in the substrate 90 as shown in FIG. To this end, it is possible to cover and shape the cover substrate after filling the elastic chip 24 in each receiving groove shown in FIG.

The construction method and the construction structure using the insulation provided with the buffer effect described above is not limited to the configuration and method of the embodiments described above. The above embodiments may be configured by selectively combining all or some of the embodiments so that various modifications can be made.

Claims (14)

Forming an installation surface for installation of heat insulator directly on the slab bottom layer or on an upper surface of another layer laminated to the slab bottom layer;
Forming a buffer layer by applying a granular elastomeric chip having an irregular surface to the installation surface;
Disposing a heat insulating material in the form of a sheet on top of the buffer layer; And
Comprising the step of waterproofing the upper surface of the heat insulating material so that moisture does not penetrate when the finishing mortar layer is poured,
The elastic chip is a construction method of the heat insulating material, characterized in that occupies an area of 12% to 20% of the installation surface. The method of claim 1,
The heat insulator is a foamed polystyrene heat insulating material molded by foaming polystyrene. The method of claim 2,
The expanded polystyrene insulation,
It is molded by the method of primary foaming of the raw material of a circular shape, aging for a specific time, and then filling the mold in the form of a plate and secondary foaming,
A method of constructing a heat insulator, characterized in that it is molded by a method of heating and melting raw materials and continuously extruding and foaming. The method of claim 1,
The buffer layer is a construction method of the heat insulating material, characterized in that arranged in a simple laminated form by the non-adhesive on the installation surface. 5. The method of claim 4,
The elastomeric chip constituting the buffer layer is scattered in an arbitrary direction by a spray device using compressed air or centrifugal force, the construction method of the insulating material. The method of claim 1,
And applying an adhesive to at least one of the installation surface or the surface of the elastic chip. The method of claim 1,
The elastomeric chip constituting the buffer layer includes a first elastomeric chip composed of crushed rubber and a second elastomeric chip mixed between the first elastomeric chip and having a material different from that of the rubber. Way. The method of claim 7, wherein
Method for constructing a heat insulating material, characterized in that the structural reinforcement chip is mixed between the first elastic chip and the second elastic chip for structural reinforcement. delete The method of claim 1,
The heat insulating material is a construction method of the heat insulating material, characterized in that arranged in a simple laminated form by the non-adhesive to the buffer layer. The method of claim 1,
Construction method of the heat insulating material further comprising the step of installing a base heat insulating material formed in the form of a sheet on the slab bottom layer. Forming an installation surface for installation of heat insulator directly on the slab bottom layer or on an upper surface of another layer laminated to the slab bottom layer;
Forming a buffer layer by applying a granular elastomeric chip having an irregular surface to the installation surface;
Disposing a heat insulating material in the form of a sheet on top of the buffer layer; And
Comprising the step of waterproofing the upper surface of the heat insulating material so that moisture does not penetrate when the finishing mortar layer is poured,
Further comprising the step of installing a base insulation formed in the form of a sheet on the slab bottom layer,
Forming a receiving hole in the heat insulating material or the base heat insulating material, the construction method of the heat insulating material, characterized in that to accommodate the elastic chip constituting the buffer layer in the receiving hole. 13. The method according to claim 1 or 12,
And installing a side cushioning material in a vertical direction at the edge where the slab bottom layer meets the wall. It is constructed by the method of any one of Claims 1-8, 10-12, The buffer layer which has an elastic chip in an installation surface is formed, The heat insulating material is arrange | positioned on the said buffer layer, It is characterized by the above-mentioned. Construction structure made of.

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