KR101307963B1 - An array substrate of Organic Electroluminescent Display Device and the method for fabricating thereof - Google Patents

Abstract

The present invention relates to an organic light emitting device, and more particularly, to an organic light emitting device capable of preventing defects from catering and static electricity.

To this end, in the present invention, the signal wiring corresponding to the on / off pad portion on the substrate, the resistance portion, the test pad, and the shorting bar, the signal wiring corresponding to the section between the test pad and the shorting bar through which the scribe line passes through It is made of a strong transparent conductive material, and the signal wiring is composed of a material having a small resistance and a large material on the upper side and the lower side of the test pad, respectively.

In the above-described configuration, even if static electricity generated during the cutting process and the formation of the array element flows into the on / off pad part, the signal wires corresponding to the upper side of the test pad are made of a material having a low resistance compared to the lower side of the test pad. The ride has a structure that is released to the outside of the substrate.

Therefore, in the present invention, there is an advantage that can be solved at the same time the failure due to the induction of corrosion and corrosion and static electricity.

Description

An array substrate of organic electroluminescent display device and the method for fabricating

The present invention relates to an organic light emitting device, and more particularly, to an organic light emitting device capable of preventing defects from catering and static electricity.

In general, an organic light emitting diode is a device that emits electrons and holes from the electron injection electrode and the hole injection electrode into the light emitting layer, respectively, and emits light when an exciton of the injected electrons and holes falls from the excited state to the ground state. .

Due to this principle, unlike a conventional thin film liquid crystal display device, since a separate light source is not required, the volume and weight of the device can be reduced.

Hereinafter, a conventional organic light emitting diode will be described with reference to the accompanying drawings.

1 is a plan view showing an array substrate for an organic light emitting device according to the prior art.

As illustrated, the array substrate 10 for an organic light emitting diode is divided into a display area AA for implementing an image and a non-display area NAA except for the display area AA.

Although not shown in detail in the drawing, the display area AA on the substrate 10 includes a gate and data wiring (not shown) to which scan and data signals are applied, and a switching transistor configured at an intersection of the gate and data wiring. And a driving transistor (not shown) connected to the switching transistor, an anode electrode, an organic light emitting layer, and a cathode electrode (not shown) connected to the driving transistor. It is called an array element including all the electrodes and wirings which correspond to such display area AA.

The non-display area NAA on the substrate 10 includes a gate and data pad unit 20 for transmitting scan signals and data signals to gates and data lines (not shown), respectively. On / off pad units DA are disposed on both sides of the unit 20 spaced apart from each other in order to determine whether the array device is operated by the lighting test.

Although not shown in detail in the drawings, the gate and data pad units 20 may be separately designed on the left side and the upper side of the display area AA.

In this case, the test pad 50 corresponding to the on / off pad unit DA is electrically connected to each other through a signal wire 60 extending from a gate and a data wire (not shown) corresponding to the display area AA. do.

2 is a plan view illustrating an organic light emitting diode according to the related art, which will be described in detail with reference to the drawings.

As shown in the drawing, an organic light emitting diode generally includes a large first substrate 10 having a plurality of array elements formed thereon for mass production, and a seal pattern made of the first substrate 10 and a thermosetting resin (not shown). It consists of a large 2nd board | substrate 15 bonded by si).

The first and second substrates 10 and 15 may be cut along the first scribe line SL1 and the second scribe line SL2 and fabricated as individual driving panels. A jig pin (not shown) is brought into contact with the test pad 50 of DA to perform a cell lighting test to detect whether an array element is in operation.

The on / off pad unit DA is used to inspect the operation of the array element. When the cell lighting test is completed, the signal wire 60 corresponding to the on / off pad unit DA is cut by a grounding process. .

The on / off pad portion DA is connected to the signal wire 60 extending from an array element (not shown), the test pad 50 connected to the signal wire 60, and an upper side of the test pad 50. It further includes a shorting bar 80 connecting the extended signal wires 60 into one.

3 is an enlarged view of a portion A of FIG. 2 and will be described in detail with reference to the drawing.

As illustrated, the on / off pad portion DA on the first substrate 10 includes a signal wire 60 extending from an array element (not shown) of the display area (AA in FIG. 2), and the signal wire ( The shorting bar 80 connecting the test pad 50 connected to the test panel 50 and the signal wire 60 extending above the test pad 50 is located.

The signal wire 60 extends from the array element and is connected to the first signal wire 60a disposed under the test pad 50 by a shorting bar 80 above the test pad 50. The signal wiring 60b is subdivided.

In this case, the first and second signal wires 60a and 60b, the test pad 50, and the shorting bar 80 may be formed of copper (Cu), molybdenum (Mo), aluminum (AL), and aluminum alloy (AlNd) in the same layer. It is composed of a selected one of the group of the conductive metal material including a), it extends from any one of the gate line and the data line (not shown) corresponding to the display area (AA of FIG. 2).

The test pad 50 is provided with a plurality of test pad holes DPH exposing a part of the test pad 50. The test pad holes DPH are parts in which a jig pin (not shown) is contacted during the cell lighting test.

However, in the above-described configuration, when the cutting process is performed along the first scribe line SL1 corresponding to the lowering of the shorting bar 80, the second signal wire 60b is exposed to external air or moisture, and is electrically induced. Defects such as corrosion or corrosion often occur.

In this case, the above-described equation means that the first and second signal wires 60a and 60b are corroded by the oxidation / reduction reaction when the panel is driven by electrically applying a signal, and the corrosion is performed after the first scribe process. The exposed second signal wire 60b is oxidized by moisture and air.

The second signal wire 60b damaged by the corrosion and corrosion is an array corresponding to the display area (AA in FIG. 2) on the test pad 50 and the first signal wire 60a over time. It affects the device (not shown), which causes a problem that a lighting failure occurs during the cell lighting test.

The present invention has been made to solve the above-described problems, and an object thereof is to prevent damage caused by electrostatic or corrosion and damage caused by static electricity flowing into the on / off pad part.

According to an aspect of the present invention, there is provided an array substrate for an organic light emitting diode according to an embodiment of the present invention. A resistor unit, an inspection pad, and a shorting bar sequentially formed corresponding to the pad area, first and second signal wires separated into an upper side and a lower side with the resistor portion interposed therebetween, and a third signal wire configured to extend above the test pad; And a fourth signal line positioned in a section between the third signal line and the shorting bar, the fourth signal line being connected to the third signal line and configured to correspond to a portion through which a scribe line passes. And a transparent connection pattern corresponding to a section between the second signal wires.

In this case, the transparent connection pattern is composed of one selected from the group of transparent conductive materials including indium tin oxide or indium zinc oxide, and the first, second and third signal wires are copper, molybdenum, aluminum and aluminum. One selected from the group of conductive materials including alloys.

The fourth signal wire is composed of one selected from the group of transparent conductive materials including indium tin oxide or indium zinc oxide.

The resistor unit may include a semiconductor pattern including a single layer made of polycrystalline silicon, or a double layer in which pure silicon and amorphous silicon including impurities are stacked, and first and second contact holes exposing a portion of the semiconductor pattern, respectively. Include.

The semiconductor pattern connects the first and second signal wires through the first and second contact holes. The transparent connection pattern electrically connects the test pad and the second signal wire through third and fourth contact holes exposing a part of the test pad and a part of the second signal wire, respectively.

In this case, the third and fourth signal wires are connected to each other through a fifth contact hole exposing a part of the third signal wires, and the test pad further includes a plurality of test pad holes exposing each part. .

According to an aspect of the present invention, there is provided a method of manufacturing an array substrate for an organic light emitting device according to the present invention. Forming a passivation layer on the substrate on which the semiconductor pattern is formed, the passivation layer including first and second contact holes exposing a portion of the semiconductor pattern, respectively; Forming a second signal wire, a test pad spaced apart from the second signal wire, and a third signal wire extending above the test pad;

Third, fourth and fifth contact holes and a plurality of test pads exposing portions of the second signal wire, the test pad, and the third signal wire on the substrate on which the first to third signal wires and the test pad are formed. Forming a gate insulating film and an interlayer insulating film including a hole, a transparent connection pattern connecting the second signal wire and the test pad through the third and fourth contact holes on the gate insulating film and the interlayer insulating film; And forming a fourth signal wire connected to the third signal wire through a fifth contact hole, and a shorting bar extending from the fourth signal wire.

In this case, the semiconductor pattern is formed as a single layer made of polycrystalline silicon, or a double layer in which pure amorphous silicon and amorphous silicon including impurities are sequentially stacked.

The first to third signal wires and the test pad are formed of one selected from the group of conductive materials including copper, molybdenum, aluminum, and aluminum alloy, and the transparent connection pattern, the fourth signal wire and the shorting bar are indium tin oxide. Or a transparent conductive material group such as indium-zinc-oxide.

In this case, the plurality of test pad holes may be a part in which a jig pin contacts the cell lighting test.

In the present invention, first, through the design of the signal wiring material and the material having a high resistance on the upper and lower sides of the test pad, there is an advantage that can discharge the static electricity flowing into the on / off pad portion to the outside of the substrate.

Second, by forming a signal wire corresponding to the scribe line made of a transparent conductive material, it is possible to prevent corrosion and corrosion.

As a solution to this, a method of constructing a second signal wire (60b in FIG. 3) corresponding to the first scribe line with a transparent conductive material such as indium tin oxide or indium zinc oxide, which is resistant to corrosion and corrosion is proposed. With reference to the accompanying drawings will be described in detail.

FIG. 4 is a plan view illustrating an organic light emitting device capable of preventing corrosion and corrosion, and partially changes the configuration of FIG. 3. 5 is a cross-sectional view taken along the line VV of FIG. 4, and the same name as that of FIG. 3 is indicated by adding 100 to the reference numeral.

4 and 5, on the substrate 110, a signal line 160 extending from an array element (not shown) of the display area (AA of FIG. 2) corresponding to the on / off pad portion DA. And the test pad 150 and the shorting bar 180 are sequentially positioned.

In this case, the signal wire 160 extends from an array element (not shown) to connect the first signal wire 160a connected to the test pad 150 and the first contact hole exposing a part of the test pad 150. The second signal wire 160b is divided into the second signal wire 160b connected to the test pad 150 through CH1, and the second signal wire 160b is connected to the shorting bar 180 extending in the same pattern.

Here, the first signal line 160a and the test pad 150 are made of copper (Cu), molybdenum (Mo), aluminum (Al), and aluminum alloy (AlNd), and the second signal line 160b The shorting bar 180 is made of a transparent conductive material such as indium tin oxide (ITO) or indium zinc oxide (IZO) that resists corrosion and corrosion.

In addition, the test pad 150 is provided with a plurality of test pad holes DPH exposing a part of the test pad 150. The test pad holes DPH are portions in which a jig pin (not shown) is contacted when the cell is turned on. to be.

In the above-described configuration, the second signal wire 160b corresponding to the first scribe line SL1 is formed of a transparent conductive material that is resistant to electrical corrosion and corrosion, thereby cutting the scribe process along the first scribe line SL1. Even if the two signal wires 160b are exposed to moisture and air, the oxidation reaction does not occur, and thus there is an advantage of preventing the occurrence of corrosion and corrosion.

However, the above-mentioned transparent conductive material has a problem of high resistance. When static electricity occurs in the scribing process or in the process of forming an array element, the static electricity flowing into the on / off pad part escapes to the outside of the substrate through the second signal wire. Rather, it flows into the first signal line having a lower resistance than the second signal line and eventually destroys the array element connected to the first signal line.

--- Example ---

The present invention is characterized in that the signal wiring is designed so that the static electricity flowing into the on / off pad portion can escape to the outside of the substrate while preventing corrosion and corrosion.

Hereinafter, an organic light emitting diode according to the present invention will be described with reference to the accompanying drawings.

6 is a plan view showing an organic light emitting display device according to the present invention.

As shown in the drawing, an organic light emitting diode generally includes a large first substrate 210 having a plurality of array elements formed thereon for the purpose of mass production, and a seal pattern made of the first substrate 210 and a thermosetting resin. The second substrate 215 is bonded to each other by a large size.

The first and second substrates 210 and 215 may be cut along the first scribe line SL1 and the second scribe line (not shown) to form a driving panel. When the driving panel is completed, the first and second substrates 210 and 215 may be formed on the test pad 250. The jig pin (not shown) is contacted to perform the cell lighting test.

The signal wire 260 is electrically connected to the test pad 250. The signal wire 260 is an array element (not shown) corresponding to the display area AA to perform a cell lighting test. In particular, the wiring is designed to extend from the gate and the data wiring (not shown) so that the test signal can be applied to the gate wiring or the data wiring (not shown).

In this case, the on / off pad part DA includes a signal wire 260, a test pad 250 connected to the signal wire 260, and a signal wire 260 extending above the test pad 250. Shorting bar 280 is connected to the one is configured, the resistance portion (RA) is located under the test pad 250.

FIG. 7 is an enlarged view of a portion B of FIG. 6 and will be described in detail with reference to the drawing.

Hereinafter, in the present invention, the coplanar structure is described as an example, but the present invention may be applied to various structures such as a bottom gate method in which the gate electrode is located at the bottom, or a top gate method in which the gate electrode is located at the top.

As illustrated in FIG. 7, the signal line 260 and the resistor unit extended from the array element (not shown) of the display area (AA of FIG. 6) corresponding to the on / off pad portion DA on the substrate 210. RA, the test pad 250, and the shorting bar 280 are sequentially configured.

The signal wires 260 include first and second signal wires 260a and 260b separated into upper and lower sides with the resistor portion RA interposed therebetween, and a third signal extending upward of the test pad 250. A wiring 260c and a fourth signal wiring 260d connected to the third signal wiring 260c.

In this case, the resistance part RA is induced to be disconnected when excessive static electricity is generated, and serves to prevent static electricity from flowing into the display area AA of FIG. 6.

The resistor part RA includes a single layer made of poly-silicon or a double layer in which pure amorphous silicon (a-Si: H) and amorphous silicon (n + a-Si: H) containing impurities are sequentially stacked. A semiconductor pattern 272 made of the same material as the semiconductor layer (not shown) and a first and second contact holes CH1 and CH2 exposing a part of the semiconductor pattern 272, respectively. The semiconductor pattern 272 connects the first and second signal wires 260a and 260b through the first and second contact holes CH1 and CH2.

In addition, the transparent connection pattern 262 positioned in the interval between the second signal wire 260b and the test pad 250 exposes a part of each of the second signal wire 260b and the test pad 250. The second signal wire 260b and the test pad 250 are electrically connected to each other through the third and fourth contact holes CH3 and CH4.

The third signal wire 260c extending above the test pad 250 is connected to the fourth signal wire 260d through the fifth contact hole CH5 exposing a portion thereof. In this case, the shorting bar 280 extending in the same pattern as the fourth signal wire 260d serves to connect all of the signal wires 260.

In this case, the first to third signal wires 260a, 260b, and 260c and the test pad 250 are formed of copper (Cu), molybdenum (Mo), aluminum (Al), and aluminum alloy (AlNd) having low resistance. In one embodiment, the transparent connection pattern 262 and the fourth signal wire 260d have higher resistance than the above-described copper, molybdenum, aluminum, and aluminum alloy, and are resistant to corrosion and corrosion. It is characterized by consisting of one selected from the group of transparent conductive materials such as oxide (IZO).

That is, in the above-described configuration, the fourth signal wire 260d is formed of a transparent conductive material corresponding to the portion where the first scribe line SL1 passes, and the third signal wire 260 extending above the test pad 250. ) Is made of a material having a lower resistance than the transparent connection pattern 262 connecting the test pad 250 and the second signal wire 260b.

In this configuration, even when static electricity generated in the scribing process or the process of forming the array element flows into the on / off pad unit DA, a transparent connection pattern 262 made of a material having a high resistance is formed under the test pad 250. Since the static electricity flowed into the on / off pad part DA may be discharged to the outside of the substrate 210 on the third signal wire 260c having low resistance.

That is, in the present invention, the fourth signal wire 260d is made of a transparent conductive material to prevent electrical corrosion and corrosion, and the static electricity generated during the scribing process and the static electricity flowing into the on / off pad portion DA are transferred to the third. The transparent connection pattern 262 is formed of a transparent conductive material that is larger than the resistance of the signal wire 260c, and the static electricity flowing into the on / off pad part DA is transferred on the third signal wire 260c having a low resistance. It is characterized in that it is designed to be discharged to the outside of the 210.

Therefore, in the present invention, there is an advantage that can be prevented at the same time damage due to corrosion and static electricity.

Hereinafter, the method of manufacturing the organic light emitting device according to the present invention will be described in detail.

8A to 8D are cross-sectional views illustrating a process sequence by cutting along the line VII-VII of FIG. 7, showing a portion corresponding to an on / off pad portion and briefly explaining an array element formed in a display area. Explain it.

As shown in FIG. 8A, a polycrystalline silicon layer (not shown) made of polycrystalline silicon is formed on the substrate 210 and patterned to form a semiconductor pattern 272 corresponding to one side of the on / off pad area DA. ). In this case, a semiconductor layer (not shown) is formed in the display area AA of FIG. 6.

Although not shown in the drawings, the semiconductor pattern 272 and the semiconductor layer (not shown) include an active layer (not shown) made of pure amorphous silicon (a-Si: H), and an impurity amorphous silicon layer (n + a-Si: The ohmic contact layer (not shown) made of H) may be formed in a stacked structure.

Next, a passivation layer 245 is formed on the substrate 210 on which the semiconductor pattern 272 is formed by using one selected from the group of inorganic insulating materials including silicon oxide (SiO ₂ ) and silicon nitride (SiNx).

Subsequently, the passivation layer 245 corresponding to both sides of the semiconductor pattern 272 is patterned to form first and second contact holes CH1 and CH2 exposing portions of the semiconductor pattern 272, respectively. In this case, source and drain holes (not shown) are formed in the semiconductor layer (not shown) corresponding to the display area AA of FIG. 6.

As shown in FIG. 8B, copper (Cu), molybdenum (Mo), aluminum (Al), and aluminum alloy (AlNd) are formed on the protective film 245 including the first and second contact holes CH1 and CH2. Forming a source and drain metal layer (not shown) with one selected from the group of conductive materials including and patterning the same, the data line of the display area (AA of FIG. 6) corresponding to the on / off pad area DA is formed. The first signal wire 260a extending from the second signal wire, the second signal wire 260b connected to the first signal wire 260a, the test pad 250 spaced apart from the second signal wire 260b, and The third signal wires 260c extending from the test pad 250 are formed, respectively.

In this case, the semiconductor pattern 272 connects the first and second signal wires 260a and 260b through the first and second contact holes CH1 and CH2. The semiconductor pattern 272 and the first and second contact holes CH1 and CH2 may be formed to form a resistor RA.

The resistance part RA is induced to be disconnected when excessive static electricity is generated, and serves to prevent static electricity from flowing into the display area AA of FIG. 2.

Although not shown in the drawings, the display area AA may include data wirings in one direction, source electrodes extending from the data wirings and contacting the semiconductor layers through source holes of the semiconductor layers, and drain holes. Drain electrodes in contact with the semiconductor layer are formed, respectively.

As illustrated in FIG. 8C, silicon nitride (SiNx) and silicon oxide (I) may be formed on the entire upper surface of the substrate 210 on which the first, second, and third signal wires 260a, 260b, and 260c and the test pad 250 are formed. The gate insulating film 255 is formed of one selected from the group of inorganic insulating materials including SiO ₂ ), or one selected from the group of organic insulating materials including acrylic resin and benzocyclobutene (BCB).

Although not shown in the drawings, a gate line (not shown) and a gate electrode (not shown) extending from the gate line are formed on the gate insulating layer 255 in a direction perpendicular to the data line (not shown). .

Next, an interlayer insulating layer 256 is formed on the substrate 210 on which the gate electrode and the wiring (not shown) are selected from a group of inorganic insulating materials including silicon oxide (SiO ₂ ) and silicon nitride (SiNx). Next, the interlayer insulating layer 256 and the gate insulating layer 255 corresponding to a portion of the second signal wire 260b, one end of the test pad 250, and a portion of the third signal wire 260c are removed. By patterning, third, fourth, and fifth contact holes CH3, CH4, and CH5 are formed to expose portions of the second signal wire 260a, the test pad 250, and the third signal wire 260c, respectively. do.

At the same time, the interlayer insulating film 256 and the gate insulating film 255 corresponding to the central portion of the test pad 250 are patterned to form a plurality of test pad holes DPH exposing a part of the test pad 250. . In this case, the test pad hole DPH is a part in which a jig pin (not shown) is contacted during the cell lighting test.

As shown in FIG. 8D, indium-tin-oxide (ITO) or indium- is formed on the substrate 210 on which the third to fifth contact holes CH3, CH4 and CH5 and the plurality of test pad holes DPH are formed. A transparent metal layer (not shown) is formed with one of selected transparent conductive metal groups such as zinc oxide (IZO) and patterned to form second and third signal wires through the third and fourth contact holes CH3 and CH4. The transparent connection pattern 262 connecting the second and second signals 260b and 260c, the fourth signal wire 260d connected to the third signal wire 260c through the fifth contact hole CH5, and the fourth signal wire ( Each of the shorting bars 280 extending at 260d are formed.

In the present invention, the first to third signal wires 260a, 260b, and 260c and the test pad 250 are made of copper (Cu), molybdenum (Mo), aluminum (Al), and aluminum alloy (AlNd) having low resistance. The transparent connection pattern 262 and the fourth signal wire 260d may be formed of one selected from a group of materials such as indium tin oxide (ITO) or indium zinc oxide (IZO), which have high resistance and resist corrosion and corrosion. Characterized in that.

That is, in the present invention, damages due to corrosion and corrosion through the fourth signal wire 260d may be prevented during the cutting process, and static electricity flowing into the on / off pad unit DA and static electricity generated during the cutting process may be removed. The transparent connection pattern 262 larger than the resistance of the three signal wires 260c may be emitted to the outside of the substrate 210 on the third signal wires 260c.

Therefore, in the present invention, there is an advantage that can be prevented at the same time damage due to corrosion and static electricity.

As described above, the array substrate for the organic light emitting device according to the present invention, in particular, the array element corresponding to the on / off pad portion can be formed.

Until now, in the present invention, the first to third signal wires and the test pads are formed of the same material as the data wire as an example, but the present invention is not limited thereto, and the gate wires or the gate wires and the data wires are designed in combination. It will be apparent to those skilled in the art that the present invention can be variously applied.

Therefore, the present invention is not limited to the above embodiments, and it will be well known that various modifications and changes can be made without departing from the spirit and spirit of the invention.

1 is a plan view showing an array substrate for an organic light emitting device according to the prior art.

2 is a plan view showing an organic light emitting device according to the prior art.

3 is an enlarged view of a portion A of FIG. 2;

4 is a plan view showing an organic EL device capable of preventing corrosion and corrosion.

5 is a cross-sectional view taken along the line V-V in Fig.

6 is a plan view showing an organic light emitting device according to the present invention.

7 is an enlarged view of a portion B of FIG. 6.

8A to 8D are cross sectional views taken along a line VII-VII of FIG. 7, according to a process sequence.

Description of the Related Art [0002]

210: substrate 250: inspection pad

260a to 260d: first to fourth signal wires 260: signal wires

262: transparent connection pattern 272: semiconductor pattern

280: shorting bar DPH: inspection pad hole

CH1 to CH5: First to fifth contact holes RA: Resistance part

SL1: First scribe line

Claims (14)

A substrate divided into a display area representing an image and a non-display area including an on / off pad area, A resistor unit, an inspection pad, and a shorting bar sequentially formed corresponding to the on / off pad area; The first and second signal wires separated by an upper side and a lower side with the resistor unit interposed therebetween, a third signal wire configured to extend above the test pad, and a section between the third signal wire and the shorting bar; A signal wire connected to the third signal wire and including a fourth signal wire configured to correspond to a portion through which a scribe line passes; A transparent connection pattern corresponding to a section between the lower side of the test pad and the second signal line; Array substrate for an organic light emitting device comprising a. The method of claim 1, The transparent connection pattern is an array substrate for an organic light emitting device, characterized in that consisting of one selected from the group of transparent conductive materials including indium tin oxide or indium zinc oxide. The method of claim 1, And the first, second and third signal lines are selected from the group of conductive materials including copper, molybdenum, aluminum, and aluminum alloys. The method of claim 1, And the fourth signal line is selected from the group of transparent conductive materials including indium tin oxide or indium zinc oxide. The method of claim 1, The resistor unit includes a semiconductor pattern including a single layer made of polycrystalline silicon, or a double layer in which pure silicon and amorphous silicon including impurities are stacked, and first and second contact holes exposing a portion of the semiconductor pattern, respectively. An array substrate for an organic light emitting device, characterized in that. 6. The method of claim 5, And said semiconductor pattern connects said first and second signal wires through said first and second contact holes. The method of claim 1, The transparent connection pattern may be configured to electrically connect the test pad and the second signal wire through third and fourth contact holes exposing a part of the test pad and a part of the second signal wire, respectively. Array substrate for light emitting device. The method of claim 1, And the third and fourth signal wires are connected to each other through a fifth contact hole exposing a part of the third signal wires. The method of claim 1, The test pad further comprises a plurality of test pad holes for exposing a portion of the organic light emitting device array substrate. Preparing a substrate; Forming a semiconductor pattern on a resistive portion corresponding to one side of an on / off pad region on the substrate; Forming a protective layer on the substrate on which the semiconductor pattern is formed, the protective layer including first and second contact holes respectively exposing a portion of the semiconductor pattern; Forming first and second signal wires connected to the semiconductor pattern, a test pad spaced apart from the two signal wires, and a third signal wire extending above the test pad on the passivation layer, respectively; Third, fourth and fifth contact holes and a plurality of test pads exposing portions of the second signal wire, the test pad, and the third signal wire on the substrate on which the first to third signal wires and the test pad are formed. Forming a gate insulating film and an interlayer insulating film including holes; A transparent connection pattern connecting the second signal wire and the test pad through the third and fourth contact holes on the gate insulating film and the interlayer insulating film; and a fourth connected to the third signal wire through the fifth contact hole. Forming a signal line and a shorting bar extending from the fourth signal line Method of manufacturing an array substrate for an organic light emitting device comprising a. 11. The method of claim 10, The semiconductor pattern is a method of manufacturing an array substrate for an organic light emitting device, characterized in that formed of a single layer made of polycrystalline silicon, or a double layer in which pure amorphous silicon and amorphous silicon containing impurities are sequentially stacked. 11. The method of claim 10, And the first to third signal wires and the test pad are formed of one selected from a group of conductive materials including copper, molybdenum, aluminum, and an aluminum alloy. 11. The method of claim 10, The transparent connection pattern, the fourth signal wire and the shorting bar are formed of one selected from the group of transparent conductive materials such as indium tin oxide or indium zinc oxide. 11. The method of claim 10, And a plurality of test pad holes are portions in which a jig pin is contacted during a cell lighting test.

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