KR101296642B1 - Organic Lighting Emmiting Device - Google Patents

Abstract

The present invention relates to an organic light emitting device capable of preventing light leakage by changing a material forming a seal pattern formed on an outer portion of a panel. The present invention defines a plurality of pixel regions, and includes a first substrate and a second substrate facing each other. A thin film transistor formed corresponding to each pixel region on the first substrate, a plurality of first electrodes connected to the thin film transistors, an organic light emitting layer formed on the first electrode of each pixel region, A sealant and a light absorbing light from an upper portion of the organic emission layer or corresponding to a non-display area between the second electrode formed on the emission layer and the first and second substrates; It characterized in that it comprises a seal pattern formed by including a glass fiber to be delivered to the side.

Glass fiber, reflective layer, seal pattern

Description

Organic Lighting Emmiting Device

1 is a cross-sectional view showing a conventional organic light emitting device

Figures 2a to 2b is a schematic diagram showing the transmission and reflection of light according to whether the reflective layer is formed on the glass fiber surface of the seal pattern

3 is a cross-sectional view of an organic light emitting diode according to a first exemplary embodiment of the present invention.

4 is a cross-sectional view of an organic light emitting diode according to a second exemplary embodiment of the present invention.

5 is a cross-sectional view of an organic light emitting diode according to a third exemplary embodiment of the present invention.

Description of the Related Art [0002]

100: first substrate 200: second substrate

350: sealant 400: organic light emitting layer

500, 700, 900: Fiberglass

The present invention relates to an organic light emitting device, and more particularly, to an organic light emitting device capable of preventing light leakage by changing a material forming a seal pattern formed on an outer portion of a panel, and a manufacturing method thereof.

The organic light emitting device, which is one of the flat panel displays, has a better viewing angle, contrast, and the like than the liquid crystal display, and is lightweight and thinner because it does not require a backlight, and is advantageous in terms of power consumption. .

In addition, since it can be driven by DC low voltage, has a fast response speed, and is entirely solid, it is resistant to external impact, has a wide operating temperature range, and is especially advantageous in terms of manufacturing cost. In particular, unlike the liquid crystal display device and the plasma display panel (PDP), the deposition and encapsulation equipment are all in the manufacturing process of the organic light emitting device, so the process is very simple.

In addition, when the organic light emitting diode is driven by an active matrix method having a thin film transistor as a switching element for each pixel, the same luminance is displayed even when a low current is applied, and thus, low power consumption, high definition, and large size can be obtained.

Such an organic light emitting device displays a video image by exciting a fluorescent material using carriers such as electrons and holes.

Hereinafter, a conventional organic light emitting diode will be described with reference to the accompanying drawings.

1 is a cross-sectional view showing a conventional organic light emitting device.

As shown in FIG. 1, a conventional organic light emitting device has a display area at its center and a non-display area at its periphery, and opposes the first and second substrates 10 and 20 and the first substrate 10. R, G, B organic light emitting layers 40: 40a, 40b, and 40c emitting light of a predetermined color on the upper and lower sides of the R, G, and B organic light emitting layers 40: 40a, 40b, and 40c. First and second electrodes (not shown) for driving the R, G, and B organic emission layers 40, 40a, 40b, and 40c, and the first and second substrates 10 corresponding to the non-display area. , 20 includes a seal pattern 30 formed therebetween. Here, the seal pattern 30 includes an epoxy resin or the like to adhere the first and second substrates 10 and 20 to each other, and is applied on the first substrate 10 or the second substrate 20. In order to cure after bonding between the first and second substrates 10 and 20, a photocuring initiator is included and cured by light entering the rear surface of the first substrate 10 or the second substrate 20.

Here, the second substrate 20 is made of a transparent glass substrate for light emitting display.

In this structure, the light emitted through the organic light emitting layer 40 is not emitted 100% through the light emitting surface (the second substrate 20 side in the light emitting surface in Figure 1), the R, G, B organic The light reflected from the interface of the organic light emitting layers 40a, 40b, and 40c or the surface of the second substrate 20 by the difference in refractive index of the light emitting layers 40a, 40b, and 40c is trapped inside the organic light emitting device. More than 80%.

As such, the light contained in the organic light emitting device is extinguished or exits to the side through the seal pattern 30 to reduce the light efficiency of the organic light emitting device.

The conventional organic light emitting device as described above has the following problems.

Due to the difference in the refractive index of the organic light emitting layer or the refractive index of the glass substrate, the reflection occurs at the interface of the organic light emitting layer or the surface of the glass substrate on the light emitting surface side, and the organic light emission is higher than the light emitted through the light emitting surface during actual driving. The amount of light trapped inside the device becomes large. In this case, the light trapped inside the organic light emitting device is extinguished or exited to the side through the seal pattern, which causes the light efficiency of the organic light emitting device to decrease. Therefore, it is important to control the light emitted from the side surface.

An object of the present invention is to provide an organic light emitting device capable of preventing light leakage by changing a material forming a seal pattern formed on the outside of a panel, and a method of manufacturing the same. .

In order to achieve the above object, the organic light emitting diode of the present invention defines a plurality of pixel regions, and includes a thin film transistor formed to correspond to each of the first and second substrates formed to face each other, and each pixel region on the first substrate. A plurality of first electrodes connected to each of the thin film transistors, an organic emission layer formed on the first electrode of each pixel region, a second electrode formed on the organic emission layer, and the first and second substrates; And a seal pattern formed to include a sealant corresponding to a non-display area between and a glass fiber that absorbs light from an upper portion of the organic light emitting layer or transmits the light to an upper side of the display area of the second substrate. It is characterized by him.

The material layer reflecting or absorbing is further formed on the surface of the glass fiber.

The material layer is a reflective material reflecting light incident from the organic light emitting layer through the seal pattern. In this case, the reflective material may be made of silver (Ag) or aluminum (Al).

Alternatively, the material layer may include a light absorbing material that absorbs light incident from the organic light emitting layer through the seal pattern. In this case, the light absorbing material may be a light blocking metal.

In addition, the sealant includes an epoxy polymer, an epoxy acrylic prepolymer, and a photo polymerization initiator.

In addition, a metal cover layer covering the entire surface of the first substrate may be further formed on the rear surface of the first substrate.

In addition, the organic light emitting device of the present invention for achieving the same object defines a plurality of pixel regions, a thin film transistor formed to correspond to each of the formed first substrate and second substrate, and each pixel region on the first substrate A plurality of first electrodes connected to each of the thin film transistors, an organic emission layer formed on the first electrode of each pixel region, a second electrode formed on the organic emission layer, and the first and second substrates; Another feature is that the seal pattern is formed to include a sealant corresponding to a non-display area between and a glass fiber coated with a reflective layer on the surface thereof.

In addition, the organic light emitting device of the present invention for achieving the same object defines a plurality of pixel regions, a thin film transistor formed to correspond to each of the formed first substrate and second substrate, and each pixel region on the first substrate And a plurality of first electrodes connected to the thin film transistors, a light emitting layer formed on the first electrode of each pixel region, a second electrode formed on the light emitting layer, and the first and second substrates. Another feature is that the seal pattern is formed to include a sealant and a glass fiber coated with a material that absorbs light on a surface of the non-display area.

Hereinafter, an organic light emitting diode and a method of manufacturing the same will be described in detail with reference to the accompanying drawings.

2A to 2B are schematic views showing the transmission and reflection of light depending on whether a reflective layer is formed on a glass fiber surface of a seal pattern.

As shown in FIG. 2A, for example, a glass fiber 90 made of silicon dioxide (SiO 2) as a main material in a seal pattern may have different degrees of refraction at the interface of its surface when light is incident. The amount of light incident on the glass fiber 90 is transmitted as it is. Therefore, as in the conventional organic light emitting device, when the light is reflected at the interface of the organic light emitting layer, the glass fiber 90 does not function much in that a part of the reflected light exits to the side. Here, the glass fiber 90 is formed so as to maintain the height of the seal pattern, the glass fiber 90 is included in the seal pattern to support the gap between the upper and lower substrates.

In the organic light emitting device of the present invention, as shown in FIG. 2B, the reflective layer 91 is coated on the surface of the glass fiber 90 to form the light reflective glass fiber 900, and the incident light is applied at the interface to the reflective layer 91. Although not shown or coated, a light absorption layer capable of absorbing light is coated on the surface of the glass fiber 90 so that the light absorption layer absorbs the incident light so that light is emitted to the side of the organic light emitting device. It helps me to prevent light leakage.

In addition, when the glass fiber is manufactured, light reflecting or light absorbing materials are formed together so that the glass fiber itself can reflect light or absorb light from the display area of the organic light emitting device into the seal pattern without coating. You can also achieve your purpose.

Hereinafter, an organic light emitting diode according to the present invention will be described in detail with reference to the accompanying drawings.

First Embodiment

3 is a cross-sectional view of an organic light emitting diode according to a first exemplary embodiment of the present invention.

As shown in FIG. 3, the organic light emitting diode according to the first exemplary embodiment of the present invention defines a plurality of pixel regions, and forms the first substrate 100 and the second substrate 200 facing each other, and the first substrate ( A thin film transistor (not shown, formed below 400) corresponding to each pixel region on 100, a plurality of first electrodes (not shown, formed below 400) connected to each of the thin film transistors, and each pixel R, G, B organic light emitting layers 400: 400a, 400b, 400c formed on the first electrode in the region, and second electrodes (not shown) formed on the R, G, B organic light emitting layers 400a, 400b, 400c. And a seal pattern 1000 corresponding to the non-display area between the first and second substrates 100 and 200.

Here, the seal pattern 1000 absorbs light from the sealant 350 and the R, G, and B organic emission layers 400a, 400b, and 400c or displays the second substrate 200. It comprises a glass fiber 500 that delivers to the upper side of the region.

Here, the glass fiber 500 may further include a material having a property of absorbing or reflecting light in addition to silicon dioxide (SiO 2), which is a main material, or a surface of such a functional material is coated on the surface thereof. It may be formed.

The sealant 350 includes an epoxy polymer, an epoxy acrylic prepolymer, and a photo polymerization initiator, and a plurality of sealants 350 are formed in the seal pattern 1000. The glass fiber 500 is crosslinked, and the seal pattern 1000 is bonded on the first and second substrates 100 and 200 so as not to fall off.

In addition, a metal cover layer (not shown) covering the entire surface of the first substrate 100 is further formed on the rear surface (lower surface) of the first substrate 100, so that the light reflected or emitted from the organic emission layer 400 is emitted. It helps to be conveyed upwards without facing outwards.

Here, the second substrate 200 serves as a light emitting surface (display surface), and the first electrode formed under the light emitting organic layer 400 is a metal electrode, and is formed above the light emitting organic side 400. The second electrode is a transparent electrode.

In the drawing, the glass fiber 500 is shown as being formed in a plurality of spherical shape is not limited to this, the glass fiber 500 is a bar type (bar type) the first, second substrates (100, 200) It is made to have the height of the space | interval which has between. For example, the bar-shaped glass fibers form a height of about 12 μm.

Second embodiment

4 is a cross-sectional view of an organic light emitting diode according to a second exemplary embodiment of the present invention.

As shown in FIG. 4, the organic light emitting diode according to the second embodiment of the present invention defines a plurality of pixel regions, and forms the first substrate 100 and the second substrate 200 facing each other, and the first substrate ( A thin film transistor (not shown) formed corresponding to each pixel region on the substrate 100, a plurality of first electrodes (not shown) formed in connection with each of the thin film transistors, and R formed on the first electrode of each pixel region. , G, B organic light emitting layer 400 (400a, 400b, 400c), between the second electrode (not shown) formed on the organic light emitting layer (400: 400a, 400b, 400c) and the first, second substrate The seal pattern 1100 includes a sealant 350 corresponding to the non-display area and a glass fiber 900 coated with a reflective layer (91 of FIG. 2B) on a surface thereof.

The reflective layer 91 is a reflective material that reflects light incident through the seal pattern 1000 from the R, G, and B organic emission layers 400 (400a, 400b, and 400c). In this case, the reflective material may be made of silver (Ag) or aluminum (Al). Here, the reflective material is not limited to the silver or aluminum presented, and may be changed as long as it can reflect light and can be coated on the surface of the glass fiber 900.

Third embodiment

5 is a cross-sectional view of an organic light emitting diode according to a third exemplary embodiment of the present invention.

As illustrated in FIG. 5, the organic light emitting diode according to the third embodiment of the present invention defines a plurality of pixel regions, and forms the first substrate 100 and the second substrate 200 facing each other, and the first substrate ( A thin film transistor formed corresponding to each pixel region on the substrate 100, a plurality of first electrodes (not shown) connected to each of the thin film transistors, and R, G, and B formed on the first electrode of each pixel region. Sealant corresponding to the non-display area between the organic light emitting layer 400 (400a, 400b, 400c), the second electrode (not shown) formed on the organic light emitting layer and the first and second substrates 100, 200 and a seal pattern 1200 including a sealant 350 and a glass fiber 700 coated with a light absorbing layer that absorbs light on a surface thereof.

For example, the light absorbing layer may include a light blocking metal, and in some cases, the light absorbing layer may be coated on the glass fiber 700 and may be a material that absorbs light.

In the seal pattern 1200, a light absorbing layer capable of absorbing light is provided, and a glass fiber 700 capable of absorbing incident light is absorbed to absorb light entering the seal pattern side at the interface of the organic light emitting layer inside the display area. In addition, by preventing light from being emitted to the outside of the panel, light leakage may be relatively prevented from appearing on the outside of the panel, thereby improving light efficiency.

As described above, the glass fiber 500, 700, 900 capable of absorbing or reflecting light in the seal pattern is provided to reflect the light reflected from the interface of the organic light emitting layer inside the display area and enter the seal pattern. By passing through, so that the light can finally be emitted to the light emitting surface, it is possible to fully utilize the amount of light emitted to the organic light emitting layer.

In addition, in the related art, a black sheet is formed to correspond to a portion corresponding to the non-display area of the second substrate in order to prevent light leakage defects caused by light leakage from the side portion of the seal pattern side. In this case, when the black sheet is expensive and is inserted in the apparatus forming process, the black sheet may not be completely adhered to the panel including the first and second substrates, so that the black sheet is not exactly aligned with the non-display area of the panel. Could not get a significant effect of light leakage prevention.

Instead of omitting such a black sheet, the organic light emitting device of the present invention processes the inside or the surface of the glass fiber used to support the gap between the first and second substrates 100 and 200 in a seal pattern, thereby forming the organic light emitting layer. The amount of light emitted from 400 can be utilized to the maximum, thereby increasing the luminous efficiency.

The present invention described above is not limited to the above-described embodiment and the accompanying drawings, and it is common in the art that various substitutions, modifications, and changes can be made without departing from the technical spirit of the present invention. It will be evident to those who have knowledge of.

The organic light emitting device of the present invention as described above has the following effects.

First, in the conventional case, a black sheet was formed to correspond to a portion corresponding to the non-display area of the second substrate in order to prevent light leakage defects caused by light leakage from the side portion of the seal pattern side. In this case, when the black sheet is expensive and is inserted in the apparatus forming process, the black sheet may not be completely adhered to the panel including the first and second substrates, so that the black sheet is not exactly aligned with the non-display area of the panel. Could not get a significant effect of light leakage prevention.

Instead of omitting such a black sheet, the organic light emitting device of the present invention processes the inside or the surface of the glass fiber used to support the gap between the first and second substrates in a seal pattern to maximize the amount of light emitted from the organic light emitting layer. It can utilize, and can improve luminous efficiency.

Second, light leakage may be prevented by absorbing light reflected from the outside of the panel or reflecting the inside of the panel.

Third, as a result, high light efficiency can be exhibited at the same current value, and power consumption can be lowered if the same light efficiency is adopted.

Claims (10)

A formed first substrate and a second substrate that define a plurality of pixel regions and face each other; A thin film transistor formed corresponding to each pixel area on the first substrate; A plurality of first electrodes connected to the thin film transistors; An organic emission layer formed on the first electrode of each pixel area; A second electrode formed on the organic emission layer; And A sealant corresponding to the non-display area between the first and second substrates, and a glass fiber that absorbs light from the upper portion of the organic emission layer or transmits the light to the upper side of the display area of the second substrate. Includes a formed seal pattern, The glass fiber includes a material capable of reflecting or absorbing light therein and an organic light emitting device characterized in that a surface is coated with a material layer for reflecting or absorbing light. delete delete The method of claim 1, The reflective material is an organic light emitting device, characterized in that silver (Ag) or aluminum (Al). delete The method of claim 1, The light absorbing material is an organic light emitting device, characterized in that the light-shielding metal. The method of claim 1, The sealant is an organic light emitting device, characterized in that comprises an epoxy polymer (epoxy polymer), epoxy acrylic prepolymer (epoxy acrilic prepolymer) and a photo polymerization initiator (photo polymerization initiator). The method of claim 1, An organic light emitting device, characterized in that the bottom of the first substrate is further formed with a metal cover layer covering the entire first substrate. delete delete

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